CN102544339A - SMD(surface mount device) type LED short-pitch lead frame - Google Patents

SMD(surface mount device) type LED short-pitch lead frame Download PDF

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Publication number
CN102544339A
CN102544339A CN2010105941978A CN201010594197A CN102544339A CN 102544339 A CN102544339 A CN 102544339A CN 2010105941978 A CN2010105941978 A CN 2010105941978A CN 201010594197 A CN201010594197 A CN 201010594197A CN 102544339 A CN102544339 A CN 102544339A
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CN
China
Prior art keywords
lead frame
pitch
type led
smd
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2010105941978A
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Chinese (zh)
Other versions
CN102544339B (en
Inventor
李胜刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUBEI KUANGTONG ELECTRONIC CO Ltd
Original Assignee
HUBEI KUANGTONG ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUBEI KUANGTONG ELECTRONIC CO Ltd filed Critical HUBEI KUANGTONG ELECTRONIC CO Ltd
Priority to CN201010594197.8A priority Critical patent/CN102544339B/en
Priority to PCT/CN2011/081843 priority patent/WO2012079434A1/en
Publication of CN102544339A publication Critical patent/CN102544339A/en
Application granted granted Critical
Publication of CN102544339B publication Critical patent/CN102544339B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An SMD (surface mount device) type LED short-pitch lead frame comprises a support, multiple process edge units and positioning holes, wherein the support consists of a plurality of lead frame units, the process edge units are arranged on two sides of the support, and the positioning holes are arranged on the process edge units. The distance a between two adjacent positioning holes is smaller than 12.0mm, and the array pitch e between the two adjacent lead frame units is smaller than 8.0mm. The pitch and the array pitch between two adjacent central lines on the single SMD type LED short-pitch lead frame are shortened, and more SMD type LED leads can be distributed on the conventional lead frame with each support with 72 LEDs, for example, the pitch of the SMD type LED lead frame is 9.00mm, the array pitch is 6.7mm, the material usage of the SMD type LED lead frame is saved by 35.71% as compared with that of the conventional lead frame with the pitch of 12.00mm and the array pitch of 8.00mm, material consumption and production cost are reduced, and meanwhile, production efficiency is improved greatly.

Description

SMD type LED short pitch lead frame
Technical field
The present invention relates to a kind of parts of producing surface-adhered type SMD type LED, be specifically related to a kind of SMD type LED short pitch lead frame.
Background technology
Surface-adhered type SMD type LED light-emitting diode belongs to the environmental protection light source, is a kind of novel surface mounted type light emitting semiconductor device, has that energy consumption is low, luminous efficiency is high, volume is little, scattering angle is big, uniformity of luminance is good, the reliability advantages of higher.Its glow color comprises full-color, various monochrome and white light, is mainly used in the utilization of aspects such as various electronic products, large scale led are backlight, decoration, view, illumination, auto lamp, and will progressively replaces traditional lighting.
The general-purpose lead of mounted type SMD type LED encapsulation at present framework dimensions length is 144.00mm, and pitch is 12.00mm, and array pitch is 7.80mm, and the technology hem width is 5.96mm, and accurate copper alloy belt is 0.20mm.Pitch, array pitch, technology limit are all bigger, increase accurate copper alloy belt or accurate steel band consumption, and product cost is higher.
Summary of the invention
The purpose of this invention is to provide a kind of SMD type LED short pitch lead frame, solve SMD type LED lead frame cost height in the prior art, the problem that supplies consumption is big.On the basis that ensures surface mount surface-adhered type SMD type LED quality and function active zone, reduce pitch, reduce the consumptive material of SMD type LED lead frame, reduce production costs and supplies consumption.
For solving the problems of the technologies described above; The objective of the invention is to realize like this: a kind of SMD type LED short pitch lead frame; Comprise support, a plurality of technology edge elements on support both sides and the location hole that the technology edge element is provided with that a plurality of lead frames unit constitutes; Adjacent two location hole spacing a are less than 12.0mm, and the array pitch e of lead frame unit is less than 8.0mm.
The hem width degree b of technology edge element is less than 5.96mm, adjacent two lead frame Elementary Function district card muscle width c less than 1.96mm, dowel width d less than 3.0mm.
A kind of SMD type of the present invention LED short pitch lead frame has shortened pitch and array pitch between adjacent two center lines on single the SMD type LED lead frame, and using every traditional support is that 72 lead frame can be arranged more SMD type LED lead-in wire.As: SMD type LED lead frame pitch is 9.00mm; Array pitch is 6.7mm, and lead frame is 12.00mm than conventional lead frame pitch, and array pitch is that 8.00mm SMD type LED blaster fuse frame material consumption practices thrift 35.71%; Reduce supplies consumption and production cost, production efficiency improves greatly simultaneously.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is described further:
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a lead frame cellular construction sketch map of the present invention.
Embodiment
A kind of SMD type LED short pitch lead frame; Comprise support, a plurality of technology edge elements 2 on support both sides and the location hole 3 that technology edge element 2 is provided with that a plurality of lead frames unit 1 constitutes; Adjacent two location holes, 3 spacing a are less than 12.0mm, and the array pitch e of lead frame unit 1 is less than 8.0mm.The hem width degree b of technology edge element 2 is less than 5.96mm, adjacent two lead frame unit, 1 functional areas card muscle width c less than 1.96mm, dowel width d less than 3.0mm.
As shown in Figure 1: the lead frame total length L is 144.00mm among the present invention, and is identical with conventional lead frame length, and its width technology is done corresponding adjustment.Adjacent two location holes, 3 spacing a are lead frame unit 1 pitch a.
Scheme 1:
Lead frame unit 1 pitch a is less than 12.00mm, and the array pitch of lead frame unit 1 is respectively 9.0mm and 6.7mm less than 8.0mm.
Scheme 2:
Lead frame unit 1 pitch a is less than 12.00mm, and the array pitch of lead frame unit 1 is respectively 9.6mm and 7.0mm less than 8.0mm.
Satisfying try one's best under the process conditions prerequisite shortening of pitch a and array pitch e, to save material usage and to improve production capacity efficient.

Claims (2)

1. a SMD type LED short pitch lead frame comprises support, a plurality of technology edge elements (2) on support both sides and the location hole (3) that technology edge element (2) is provided with that a plurality of lead frames unit (1) constitutes, and it is characterized in that:
Adjacent two location holes (3) spacing a is less than 12.0mm, and the array pitch e of lead frame unit (1) is less than 8.0mm.
2. a kind of SMD type LED short pitch lead frame according to claim 1; It is characterized in that: the hem width degree b of technology edge element (2) is less than 5.96mm, adjacent two lead frame unit (1) functional areas card muscle width c less than 1.96mm, dowel width d less than 3.0mm.
CN201010594197.8A 2010-12-18 2010-12-18 SMD type LED short pitch lead frame Expired - Fee Related CN102544339B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201010594197.8A CN102544339B (en) 2010-12-18 2010-12-18 SMD type LED short pitch lead frame
PCT/CN2011/081843 WO2012079434A1 (en) 2010-12-18 2011-11-06 Short-pitch lead frame for smd-type led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010594197.8A CN102544339B (en) 2010-12-18 2010-12-18 SMD type LED short pitch lead frame

Publications (2)

Publication Number Publication Date
CN102544339A true CN102544339A (en) 2012-07-04
CN102544339B CN102544339B (en) 2015-08-19

Family

ID=46244069

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010594197.8A Expired - Fee Related CN102544339B (en) 2010-12-18 2010-12-18 SMD type LED short pitch lead frame

Country Status (2)

Country Link
CN (1) CN102544339B (en)
WO (1) WO2012079434A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7350942B2 (en) * 2004-01-19 2008-04-01 Shanghai Sansi Technology Co., Ltd. LED matrix display module with high luminance area ratio
EP2128689A1 (en) * 2008-05-27 2009-12-02 Barco NV A display panel with improved reflectivity
CN101344236B (en) * 2008-09-03 2010-06-02 湖北匡通电子有限公司 Short-pitch thin LED lead frame
CN201877464U (en) * 2010-12-18 2011-06-22 湖北匡通电子有限公司 SMD (surface-mounted) type LED (light-emitting diode) short pitch lead frame

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201265825Y (en) * 2008-09-03 2009-07-01 湖北匡通电子有限公司 Short-pitch thin LED lead frame
CN201608182U (en) * 2010-02-05 2010-10-13 东莞市胤腾光电科技有限公司 LED lamp support

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7350942B2 (en) * 2004-01-19 2008-04-01 Shanghai Sansi Technology Co., Ltd. LED matrix display module with high luminance area ratio
EP2128689A1 (en) * 2008-05-27 2009-12-02 Barco NV A display panel with improved reflectivity
CN101344236B (en) * 2008-09-03 2010-06-02 湖北匡通电子有限公司 Short-pitch thin LED lead frame
CN201877464U (en) * 2010-12-18 2011-06-22 湖北匡通电子有限公司 SMD (surface-mounted) type LED (light-emitting diode) short pitch lead frame

Also Published As

Publication number Publication date
WO2012079434A1 (en) 2012-06-21
CN102544339B (en) 2015-08-19

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Address after: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building

Applicant after: HUBEI KUANGTONG LIMITED BY SHARE LTD.

Address before: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building

Applicant before: HUBEI KUANGTONG ELECTRONIC Co.,Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: HUBEI KUANGTONG ELECTRONIC CO., LTD. TO: HUBEI KENTO ELECTRONIC STOCK CORPORATION

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150819

Termination date: 20211218