CN102541714A - Implementation method and device for chip monitoring - Google Patents
Implementation method and device for chip monitoring Download PDFInfo
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- CN102541714A CN102541714A CN2011104590697A CN201110459069A CN102541714A CN 102541714 A CN102541714 A CN 102541714A CN 2011104590697 A CN2011104590697 A CN 2011104590697A CN 201110459069 A CN201110459069 A CN 201110459069A CN 102541714 A CN102541714 A CN 102541714A
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Abstract
The invention discloses an implementation method and device for chip monitoring. The implementation method is used for detecting a detected chip of a computer by using a management module, wherein the management module and the detected chip are located on the same substrate; and the implementation method comprises the following steps: the management module detects the detected chip according to configuration information, wherein the configuration information is used for configuring the management module so as to detect the detected chip; and the management module receives detection information from the detected chip through a management configuration bus of the substrate. According to the implementation method and device disclosed by the invention, as the management module is arranged on the substrate where the chip needed to be monitored is located, the computer can be monitored simply and conveniently under the condition that complexity of the computer is not increased, so that internal design of the computer is optimized; and moreover, the implementation method and device for the chip monitoring are beneficial for realizing the design of a high-density computer structure.
Description
Technical field
The present invention relates to computer realm, and especially, relate to a kind of implementation method and device of chip monitoring.
Background technology
But blade server is meant the server unit of a plurality of cassettes of plug-in mounting in the rack cabinet of calibrated altitude; It is the high available highdensity low-cost server platform of a kind of realization; In the prior blade server, blade server is provided with dozens of (perhaps greater number) calculating blade usually.The ethernet switching module feature of conventional blades server is single, can't realize functions such as any type of communication check, system management, can't satisfy the requirement of client to extensive High-Performance Computing Cluster like this.
To this, though the duty that has had manufacturer to propose in the cabinet of blade server plate of configuration separately to be specifically designed to blade, monitoring temperature etc. are managed.But independent monitor board is provided with and can reduces the blade server utilization of space, is unfavorable for the highdensity design aim of blade server.
To can not be effectively in the correlation technique, the problem that detects of blade server easily, effective solution is not proposed at present as yet.
Summary of the invention
To can not be effectively in the correlation technique, the problem that detects of blade server easily; The present invention proposes a kind of implementation method and device of chip monitoring; Can under the prerequisite that does not increase the computing machine complexity, computing machine be carried out simply and monitoring easily.
Technical scheme of the present invention is achieved in that
According to an aspect of the present invention, a kind of implementation method of chip monitoring is provided, has been used for detecting through the chip under test of administration module to computing machine.
Wherein, administration module and chip under test are positioned at same substrate, and said method can comprise: administration module detects chip under test according to configuration information, and wherein, configuration information is used for administration module is configured, so that chip under test is detected; Administration module receives the detection information from chip under test through the administration configuration bus of substrate.
Wherein, through in advance administration module being write, administration module is configured according to configuration information.
In addition, configuration information is sent to administration module by detection system another administration configuration bus through substrate.
This method may further include: administration module will be sent to detection system from the detection information of chip under test another administration configuration bus through substrate.
In addition, administration module and chip under test all are connected to the netting twine interface and the serial ports of substrate, need carry out under the situation of debugging bottom most substrate, and this method further comprises: through serial ports and/or netting twine interface substrate is carried out debugging bottom most.
Preferably, above-mentioned netting twine interface is the Rj45 interface.
In addition, above-mentioned management configuration bus can be I
2The C bus.
In addition, above-mentioned chip under test can be the exchange chip of computing machine.
According to a further aspect in the invention, a kind of implement device of chip monitoring is provided, has been used for the chip under test of computing machine is detected.
Wherein, this device and chip under test are positioned at same substrate, and this device comprises: detection module, be used for chip under test being detected according to configuration information, and wherein, configuration information is used for administration module is configured, so that chip under test is detected; Receiver module is used for receiving the detection information from chip under test through the administration configuration bus of substrate.
This device may further include: sending module is used for will being sent to detection system from the detection information of chip under test through another administration configuration bus of substrate; And device and chip under test all are connected to the netting twine interface and the serial ports of substrate, and the netting twine interface is the Rj45 interface, and the administration configuration bus is I
2The C bus.
The present invention is through being provided with administration module on the substrate at the chip place of needs monitoring; Can be under the prerequisite that does not increase the computing machine complexity; Computing machine is carried out simply and monitoring easily, thereby optimized the indoor design of computing machine, help to realize the design of high density computer organization.
Description of drawings
Fig. 1 is the process flow diagram according to the implementation method of the chip monitoring of the embodiment of the invention;
Fig. 2 is the block diagram according to the implement device of the chip monitoring of the embodiment of the invention;
Fig. 3 is the structured flowchart that the implement device according to the monitoring of the chip of the embodiment of the invention is arranged in the computing machine and the Switching Module of computing machine is monitored.
Embodiment
The present invention is directed to the high density designs requirement of existing blade server; The situation that can't detect and manage switch communication state, blade running status; The object of the present invention is to provide a kind of blade server gigabit switch with management function; With the management of realization to the communication check and the blade running status of switch, and complete exchange configuration feature.
According to embodiments of the invention; A kind of implementation method of chip monitoring is provided, has been used for detecting through the chip under test of administration module to computing machine (for example, can be server, blade server etc.); Wherein, administration module and chip under test are positioned at same substrate.
As shown in Figure 1, the implementation method of monitoring according to the chip of the embodiment of the invention comprises:
Step S101, administration module detects chip under test according to configuration information, and wherein, configuration information is used for administration module is configured, so that chip under test is detected;
Step S103, administration module receives the detection information from chip under test through the administration configuration bus of substrate.
On the one hand, can write administration module in advance, administration module is configured according to configuration information, thereby make the administration module after the configuration to monitor chip under test.
On the other hand, configuration information is sent to administration module by the detection system of outside another administration configuration bus through substrate, thereby through detection system (host computer) administration module is managed and disposed, and makes administration module to monitor chip under test.
And no matter adopt what mode that administration module is configured, administration module can will be sent to detection system through another of substrate from the detection information of chip under test through the administration configuration bus that is connected with detection system.
Administration module and chip under test all are connected to the netting twine interface and the serial ports of substrate, need carry out under the situation of debugging bottom most substrate, can carry out debugging bottom most to substrate through serial ports and/or netting twine interface.
Alternatively, the netting twine interface can be the Rj45 interface.The administration configuration bus is I
2The C bus.Chip under test can be polytype chip, for example, can be the exchange chip in the server.
According to embodiments of the invention, a kind of implement device of chip monitoring also is provided, be used for the chip under test of computing machine is detected, this device can be positioned at same substrate with chip under test.
As shown in Figure 2, the implement device of monitoring according to the chip of the embodiment of the invention comprises:
Detection module 21 is used for according to configuration information chip under test being detected, and wherein, configuration information is used for administration module is configured, so that chip under test is detected;
Receiver module 22 is connected to detection module 21, is used for receiving the detection information from chip under test through the administration configuration bus of substrate.
In addition, this can install further and comprise: the sending module (not shown) is used for will being sent to detection system from the detection information of chip under test through another administration configuration bus of substrate; And device and chip under test all are connected to the netting twine interface and the serial ports of substrate, and for example, the netting twine interface is the Rj45 interface, and the administration configuration bus is I
2The C bus.
As shown in Figure 3, can integratedly be designed to administration module according to the detection module and the receiver module of the embodiment of the invention.Like this, for example, the exchange chip (also can be described as Switching Module) of computing machine when monitoring, is being comprised Switching Module and administration module in a substrate.Switching Module is made up of an exchange chip and peripheral circuit, draws internal interface that is connected with blade and the external interface that is connected with outer net by this chip.Administration module is made up of two BMC chips and peripheral circuit, draws I by this module
2The C signal wire is to other module in the server and respectively calculate the blade running status and manage, and to outer net Ethernet interface is provided simultaneously, to make things convenient for the user server is carried out remote monitoring and management.
The interface that is adopted can comprise: the internal interface that 1) is connected with blade (for example, the quantity of internal interface can be 14); 2) external interface that is connected with outer net (for example, the quantity of external interface can be 6); 3) I that is connected with middle plate
2C interface; 4) serial line interface that is connected with computing machine.
Administration module and Switching Module can be connected to serial ports through the UART interface, and administration module can be connected to network interface Rj45 through Physical layer (PHY) interface, and Switching Module can be connected with external interface with internal interface.
Through technical scheme of the present invention; Can in a substrate, realize the exchange of blade data and outer net data; Simultaneously each blade system running state information is read and manages; And can link to each other with 14 calculating blades respectively through 14 internal interfaces, link to each other with external network through 6 external interfaces.After process was authorized, external network can be visited any one and calculated blade like this.The built-in administration module of exchange chip then passes through I with parameters such as the connection of exchange chip and operation informations
2In the administration module of C bus transfer to the same substrate, by the administration module unified management.
Administration module in the substrate passes through I
2The C bus is calculated blade and is connected with each feature board with each, with the operational factor of monitoring blade server.KVM functional module in the administration module is connected with exchange chip, carries out exchanges data through exchange chip and calculating blade, is used to provide the interface function of keyboard, display and mouse, to realize the management and the Long-distance Control of blade.
Switching Module can be realized following function: (1) system power supply and cooling system switching on and shutting down and running state information read; (2) Switching Module switching on and shutting down and running state information read; (3) memory module ultimate system data read; (4) respectively calculating blade switching on and shutting down and running state information reads.
Pass through such scheme; Just can carry out effective monitoring to Switching Module; Realize reading and managing of blade server running state information; And have the complete exchange configuration feature of traditional exchange module simultaneously, and can not influence the computer-internal structure Design, help to realize the design of high density blade server; And the operation of managing blade server in several ways for example, can be managed serial line interface or Ethernet interface.
The monitoring of above blade server (scheme of the present invention can realize having the gigabit switch of monitoring function) and Switching Module only is a concrete implementation of the present invention; And be not used in qualification the present invention; In fact; The present invention can be applied to various computing machines and wherein each kind of module (chip) monitored, simply, effectively the running status of computing machine is monitored and grasped.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the implementation method of a chip monitoring is used for detecting through the chip under test of administration module to computing machine, it is characterized in that said administration module and said chip under test are positioned at same substrate, and said method comprises:
Said administration module detects said chip under test according to configuration information, and wherein, said configuration information is used for said administration module is configured, so that said chip under test is detected;
Said administration module receives the detection information from said chip under test through the administration configuration bus of said substrate.
2. implementation method according to claim 1 is characterized in that, through in advance said administration module being write, said administration module is configured according to said configuration information.
3. implementation method according to claim 1 is characterized in that, said configuration information is sent to said administration module by detection system another administration configuration bus through said substrate.
4. implementation method according to claim 1 is characterized in that, further comprises:
Said administration module will be sent to detection system from the detection information of said chip under test another administration configuration bus through said substrate.
5. implementation method according to claim 1 is characterized in that, said administration module and said chip under test all are connected to the netting twine interface and the serial ports of said substrate, need carry out under the situation of debugging bottom most said substrate, and said method further comprises:
Through said serial ports and/or said netting twine interface said substrate is carried out debugging bottom most.
6. implementation method according to claim 5 is characterized in that, said netting twine interface is the Rj45 interface.
7. according to each described implementation method in the claim 1 to 6, it is characterized in that the administration configuration bus is I
2The C bus.
8. according to each described implementation method in the claim 1 to 6, it is characterized in that said chip under test is the exchange chip of computing machine.
9. the implement device of a chip monitoring is used for the chip under test of computing machine is detected, and it is characterized in that said device and said chip under test are positioned at same substrate, and said device comprises:
Detection module is used for according to configuration information said chip under test being detected, and wherein, said configuration information is used for said administration module is configured, so that said chip under test is detected;
Receiver module is used for receiving the detection information from said chip under test through the administration configuration bus of said substrate.
10. implement device according to claim 8 is characterized in that, said device further comprises:
Sending module is used for will being sent to detection system from the detection information of said chip under test through another administration configuration bus of said substrate;
And said device and said chip under test all are connected to the netting twine interface and the serial ports of said substrate, and said netting twine interface is the Rj45 interface, and the administration configuration bus is I
2The C bus.
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| CN104978252A (en) * | 2014-04-02 | 2015-10-14 | 华为技术有限公司 | Sensor scanning method and substrate management controller |
| CN110413484A (en) * | 2019-08-02 | 2019-11-05 | 西安微电子技术研究所 | A kind of cluster monitoring method for supporting heterogeneous platform |
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| CN102541714B (en) | 2015-08-26 |
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Effective date of registration: 20200426 Address after: 100082 335, floor 3, building 25, yard 8, Dongbei Wangxi Road, Haidian District, Beijing Patentee after: Ningchang information industry (Beijing) Co., Ltd Address before: 300384 Tianjin city Xiqing District Huayuan Industrial Zone (outer ring) Haitai Huake Street No. 15 1-3 Patentee before: DAWNING INFORMATION INDUSTRY Co.,Ltd. |