CN102533198A - Adhesive composition for circuit boards - Google Patents
Adhesive composition for circuit boards Download PDFInfo
- Publication number
- CN102533198A CN102533198A CN2010106090770A CN201010609077A CN102533198A CN 102533198 A CN102533198 A CN 102533198A CN 2010106090770 A CN2010106090770 A CN 2010106090770A CN 201010609077 A CN201010609077 A CN 201010609077A CN 102533198 A CN102533198 A CN 102533198A
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- CN
- China
- Prior art keywords
- circuit card
- sticking agent
- agent composition
- flame retardant
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to an adhesive composition for circuit boards. The adhesive is used on the circuit boards so as to provide functions of fixation, insulation and protection for electronic components, and the adhesive comprises the following components by weight percentage: 60-75% of isocyanate prepolymer, 9-25% of fire retardants containing no phosphorus or halogen, 15-22% of insulation materials and 1-3% of surfactants.
Description
Technical field
The present invention relates to a kind of sticking agent, particularly a kind of be used for circuit card on the relevant sticking agent of insulativity.
Background technology
Press; Electronic package on the circuit card is after accomplishing welding operation; Its part except that solder joint is not if fix, then very easily because of collision or shake and pin fracture, short circuit take place or situation such as come off, so generally all need be coated with sticking agent with the electronic package on the holding circuit plate; The coating of sticking agent is usually located between two electronic packages or between electronic package and the circuit card, promptly like Fig. 1 and shown in Figure 2.
This type of sticking agent that is applied to circuit card should possess following properties:
1) high flame retardant (through U.S. UL94V-0 standard);
2) to the high tackyness of multiple unlike material;
3) elasticity;
4) high-insulativity;
5) high thermal resistance (constant temperature 80 ℃ under the carbonization situation can not take place);
The sticking agent that more often is used at present can be divided into three major types, i.e. solvent-borne type, hot melt adhesive and silica gel.Wherein solvent-borne type can be further divided into X 050 and polyester synthetic resin again, and X 050 has high tackyness and advantage such as cheap, but the harmful HUMAN HEALTH of its solvent, high thermal resistance is not good, be prone to carbonization takes place, and its solvent has corrodibility to plastics.Though and polyester synthetic resin is difficult for carbonization than X 050, still have and the same harmful and corrodibility of X 050, its tackyness is relatively poor in addition, and more not shock-resistant.
The setting rate of hot melt adhesive is fast, operational tool is cheap, and after curing, can not shrink, but hot melt adhesive can influence tack strength with glue rifle temperature variation, thereby makes tack strength inhomogeneous, and the colloid poor flexibility, and is not shock-resistant.On the other hand, because hot melt adhesive operation at high temperature, the higher operator that makes of service temperature is injured easily.
Compared to above-mentioned two types of sticking agents; Silica gel has preferable physical property, low like shrinkability, do not have hazardous property, elasticity is good and high thermal resistance is good, but that its shortcoming is a price is higher; Be difficult for preserving (promptly being prone to solidify) because of moisture; Moreover the tackyness between silica gel and many materials is not good, and situation easily comes off.
Hence one can see that, and existing all kinds of circuit cards all respectively have its relative merits with sticking agent, and the space still is significantly improved.
Summary of the invention
Main purpose of the present invention; Promptly be the sticking agent composition that provides a kind of circuit card to use; It has the cost lower than silica gel and resin, the tackyness stronger than silica gel, hot melt adhesive and resin, than the better elasticity of X 050, resin and hot melt adhesive, than X 050 and the lower shrinking percentage of resin, and high-insulativity.
A time purpose of the present invention promptly is the sticking agent composition that provides a kind of circuit card to use, and it does not contain solvent, can not encroach on human body, and can operate at normal temperatures, and is unlikely as the risk of high-temperature service is arranged as the hot melt adhesive.
A purpose more of the present invention promptly is the sticking agent composition that provides a kind of circuit card to use, and it has the moisture-reactive that is superior to silica gel, though still need use the packaging means identical with silica gel, is difficult for solidifying because of moisture.
For reaching above-mentioned purpose; The sticking agent composition that the present invention provides a kind of circuit card to use; Flame retardant 9%-25%, insulation material 15%-22% and interfacial agent 1%-3% that it comprises isocyanate pre-polymer 60%-75%, not phosphorous and halogen more than are all weight percent.
Description of drawings
Fig. 1 and Fig. 2 are application scenario of the present invention synoptic diagram.
Embodiment
Sticking agent composition of the present invention will be further specified as follows.
The sticking agent composition; Flame retardant 9%-25%, insulation material 15%-22% and interfacial agent 1%-3% that it comprises isocyanate pre-polymer (MDI-based polyisocyanate prepolymer) 60%-75%, not phosphorous and halogen more than are all weight percent.
The prepolymer of cyanate has good electrical impedance; Then property is high; No matter follow the suitable then property of tool between organism and inorganics, the metal (like copper, aluminium), and its solvent resistance, high temperature resistance (120 ℃) and frost resistance (40 ℃) all have good performance.
Flame retardant adopts the environment-friendly type flame retardant of without phosphorus (P) and halogen (X), does not belong to phosphide class or halogen compounds, the preferable Antimony Trioxide: 99.5Min (Sb that can be
2o
3) mixture.It act as when burning, to produce and reduces temperature and produce non-flammable gases, and then blocks the combustion-supporting effect of oxygen.
The insulation material, like mica or silicates mineral (SiLicate-Mineral) etc., it can make resin under high-tension impact, form and block the electric current effect, reaches higher electric insulation effect.
Interfacial agent increases its wettability in order to eliminate the surface tension that two kinds of unlike materials stick together face, and then makes between inorganic, the organism then better.Preferable environment-friendly type terephthalate (Di-(2-ethylhexyl)-Terephthalate) or the organosilicon of can be.
Sticking agent of the present invention utilizes in the air moisture and isocyanic acid prepolymer to produce sclerosis and forms, thus very convenient on using, and its physical properties is following:
| Viscosity (CPS) | 25℃/60,000～100,000 |
| Proterties | Shake-change property body (thixotropy) |
| Thermal denaturation temperature | More than 80 ℃ |
| Heatproof | -40℃～150℃ |
| Thermal conductivity | ＞0.81W/m.k |
| The volume impedance | ＞10 14Ωcm |
| Water-absorbent | ＜0.1％ |
| Tensile strength | 100kg/cm 2 |
| Follow intensity | 50kg/cm 2(aluminium) |
| Flame resistivity | Meet UL 94V-0 |
| Dielectric strength | 20KV/mm |
The above person is the specifying an of preferred embodiment of the present invention, and non-in order to limitation protection scope of the present invention, all equivalent transformations that other uses creation spirit of the present invention to do all should all belong in protection scope of the present invention.
Claims (7)
1. sticking agent composition that circuit card is used comprises:
Isocyanate pre-polymer 60%-75%;
The flame retardant 9%-25% of without phosphorus and halogen;
Insulation material 15%-22%; And
Interfacial agent 1%-3%;
More than be weight percentage.
2. the sticking agent composition that circuit card as claimed in claim 1 is used, wherein this flame retardant is the flame retardant of no phosphide class and halogen.
3. the sticking agent composition that circuit card as claimed in claim 1 is used, wherein this flame retardant is the Antimony Trioxide: 99.5Min mixture.
4. the sticking agent composition that circuit card as claimed in claim 1 is used should the insulation material be like mica wherein.
5. the sticking agent composition that circuit card as claimed in claim 1 is used, wherein this insulation material is the silicates mineral.
6. the sticking agent composition that circuit card as claimed in claim 1 is used, wherein this interfacial agent is the environment-friendly type terephthalate.
7. the sticking agent composition that circuit card as claimed in claim 1 is used, wherein this interfacial agent is an organosilicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106090770A CN102533198A (en) | 2010-12-21 | 2010-12-21 | Adhesive composition for circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106090770A CN102533198A (en) | 2010-12-21 | 2010-12-21 | Adhesive composition for circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102533198A true CN102533198A (en) | 2012-07-04 |
Family
ID=46341269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106090770A Pending CN102533198A (en) | 2010-12-21 | 2010-12-21 | Adhesive composition for circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102533198A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6440588A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Cable | Flame-retardant polyurethane composition for filling in penetrating part of wire cable |
| CN1141940A (en) * | 1994-05-12 | 1997-02-05 | 陈仕廉 | Engineering decorative binder |
| CN101402845A (en) * | 2008-11-11 | 2009-04-08 | 北京市化学工业研究院 | Process for producing flame-proof fluid sealant for construction |
-
2010
- 2010-12-21 CN CN2010106090770A patent/CN102533198A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6440588A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Cable | Flame-retardant polyurethane composition for filling in penetrating part of wire cable |
| CN1141940A (en) * | 1994-05-12 | 1997-02-05 | 陈仕廉 | Engineering decorative binder |
| CN101402845A (en) * | 2008-11-11 | 2009-04-08 | 北京市化学工业研究院 | Process for producing flame-proof fluid sealant for construction |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120704 |