CN102530841B - Processing method of high depth-width ratio microstructure of optical glass - Google Patents
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- 239000005304 optical glass Substances 0.000 title claims abstract description 24
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 238000007373 indentation Methods 0.000 claims abstract description 34
- 229910017855 NH 4 F Inorganic materials 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 238000003491 array Methods 0.000 abstract description 5
- 238000001039 wet etching Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 238000010998 test method Methods 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
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- 238000011031 large-scale manufacturing process Methods 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
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- 239000010703 silicon Substances 0.000 description 1
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Abstract
本发明公开一种光学玻璃的高深宽比微结构加工方法,其特征在于,以高精光学玻璃元件为研究对象,在采用不同形状压头显微硬度计制作出不同压痕形状和压痕阵列图案的机械加工方法基础上,结合湿法腐蚀工艺,采用不同浓度的BOE溶液(HF和NH4F溶液的混合液)对样品进行不同时间间隔的腐蚀,从而产生出不同形状和不同高深宽比结构的高精光学玻璃微结构。
The invention discloses a high-aspect-ratio microstructure processing method for optical glass, which is characterized in that high-precision optical glass components are used as research objects, and different indentation shapes and indentation arrays are produced by using different-shaped indenter microhardness testers Based on the mechanical processing method of the pattern, combined with the wet etching process, the samples are etched at different time intervals with different concentrations of BOE solutions (a mixture of HF and NH 4 F solutions), resulting in different shapes and different height-to-width ratios. Structured high-precision optical glass microstructure.
Description
技术领域 technical field
本发明涉及一种光学玻璃微结构加工和刻蚀技术。The invention relates to an optical glass microstructure processing and etching technology.
背景技术 Background technique
随着大规模集成电路制造技术的发展,微型机械完成了从单元到系统的发展,并成功的应用到了光学领域形成了一个新型的热点-微光机电系统MOEMS(Micro-Optic-Electro-Mechanical-System),并且已经在很多方面得到了应用。由于MOEMS需要进行各种光学检测,这样就需要应用到大量的透明材质,光学玻璃首当其选。目前光学玻璃在MEMS(微机电系统)、MOEMS以及生物芯片中得到了大量应用,除了对硅材料有需求外,各种各样的以光学玻璃做基础材料的新型MEMS器件应运而生,现有的高深宽比刻蚀技术用于光学玻璃微结构加工存在以下问题:现有的技术多数是用干法刻蚀直接来加工高深宽比结构,多用于加工硅晶体等各向异性的结构,而对于光学玻璃这种各向同性的材料,很难控制其加工参数;除此之外,这种干法刻蚀加工方法成本较高,不适合大规模生产加工;而现有的湿法刻蚀技术来刻蚀光学玻璃加工微结构,在这种各向同性的材料上很难加工出具有较高的深宽比的微结构,这就就需要开发专门用于光学玻璃的高深宽比加工技术。With the development of large-scale integrated circuit manufacturing technology, micro-machinery has completed the development from unit to system, and successfully applied to the field of optics to form a new hotspot - Micro-Opto-Electro-Mechanical System MOEMS (Micro-Optic-Electro-Mechanical- System), and has been applied in many ways. Since MOEMS needs to perform various optical inspections, it needs to be applied to a large number of transparent materials, and optical glass is the first choice. At present, optical glass has been widely used in MEMS (micro-electromechanical systems), MOEMS, and biochips. In addition to the demand for silicon materials, various new MEMS devices based on optical glass have emerged. Existing The high-aspect-ratio etching technology used in the processing of optical glass microstructures has the following problems: most of the existing technologies use dry etching to directly process high-aspect-ratio structures, and are mostly used for processing anisotropic structures such as silicon crystals. For isotropic materials such as optical glass, it is difficult to control its processing parameters; in addition, this dry etching processing method has high costs and is not suitable for large-scale production and processing; while the existing wet etching It is difficult to process a microstructure with a high aspect ratio on this isotropic material, which requires the development of a high aspect ratio processing technology specially for optical glass .
发明内容 Contents of the invention
本发明的目的是通过研究不同压头对于光学玻璃微结构形状及全息特征的影响,找到机械压痕方法与刻蚀工艺条件之间的关系,提供一种采用机械和传统化学刻蚀相结合的光学玻璃高深宽比微结构加工方法。The purpose of the present invention is to find the relationship between the mechanical indentation method and the etching process conditions by studying the influence of different indenters on the shape and holographic characteristics of the optical glass microstructure, and to provide a combination of mechanical and traditional chemical etching. Optical glass high aspect ratio microstructure processing method.
为达到上述目的,本发明是采取如下技术方案予以实现的:To achieve the above object, the present invention is achieved by taking the following technical solutions:
一种光学玻璃的高深宽比微结构加工方法,其特征在于,包括下述步骤:A high aspect ratio microstructure processing method for optical glass, characterized in that it comprises the following steps:
(1)取光学玻璃片作为样品,在其一面用显微硬度计制作规则排列的二维压痕,每个压痕的四个对角线有四条放射线形裂缝,这个放射形裂缝就是用于制作高深宽比的显微结构;(1) Take an optical glass sheet as a sample, and use a microhardness tester to make regularly arranged two-dimensional indentations on one side. There are four radial cracks on the four diagonals of each indentation. This radial crack is used for Fabricate high aspect ratio microstructures;
(2)用石蜡将玻璃片样品周边包裹起来,只留下有压痕的地方不被包裹;(2) Wrap the periphery of the glass sheet sample with paraffin, leaving only the indented place unwrapped;
(3)配制BOE溶液,即HF和NH4F的混合溶液待用,其中NH4F和HF的体积浓度比是6∶1;(3) Prepare BOE solution, that is, a mixed solution of HF and NH 4 F for use, wherein the volume concentration ratio of NH 4 F and HF is 6:1;
(4)将包裹有石蜡的玻璃片样品进行超声清洗,干燥后放在盛有BOE溶液的培养皿中,使BOE溶液淹没玻璃片样品,并将培养皿放入25℃恒温水浴中进行腐蚀至少10分钟后取出;(4) Ultrasonic cleaning is performed on the glass sheet sample wrapped with paraffin, and after drying, it is placed in a petri dish filled with BOE solution, so that the BOE solution submerges the glass sheet sample, and the petri dish is etched in a constant temperature water bath at 25°C for at least Take it out after 10 minutes;
(5)重复步骤(4)直至获得所需要深宽比裂缝的微结构。(5) Repeat step (4) until the microstructure of cracks with the desired aspect ratio is obtained.
上述方法中,所述的超声清洗为三次,第一次用去离子水25℃水浴超声清洗5分钟;第二次用丙酮25℃的水浴超声清洗5分钟;第三次用无水乙醇25℃水浴超声清洗5分钟。所述的干燥采用氮气吹干。In the above method, the ultrasonic cleaning is three times, the first ultrasonic cleaning with deionized water in a 25°C water bath for 5 minutes; the second ultrasonic cleaning in a water bath with acetone at 25°C for 5 minutes; Ultrasonic cleaning in a water bath for 5 minutes. Described drying adopts nitrogen to blow dry.
本发明的优点是:The advantages of the present invention are:
1、结合了机械加工和化学刻蚀方法来制作高精光学玻璃高深宽比微结构,方法快捷,可操作性强。1. Combining mechanical processing and chemical etching methods to produce high-precision optical glass high aspect ratio microstructures, the method is fast and operable.
2、可以根据加工方法的不同选取,即显微压痕压头形状的选取,压痕的不同排列形状来制作不同的压痕阵列,产生不同的裂纹阵列,将这些具有高深宽比结构的裂纹阵列应用到其适合的微制造领域。2. It can be selected according to different processing methods, that is, the selection of the shape of the micro-indentation indenter, and the different arrangement and shape of the indentation to make different indentation arrays and produce different crack arrays. These cracks with high aspect ratio structures The array is applied to its suitable field of microfabrication.
3、将湿法刻蚀方法应用到各向同性光学玻璃表面的高深宽比微结构的制作当中,这样比起以往的干法刻蚀方法大大降低了加工成本,再结合机械加工,有进一步增强了本发明的可控性。3. Apply the wet etching method to the production of high aspect ratio microstructures on the surface of isotropic optical glass, which greatly reduces the processing cost compared with the previous dry etching method, and combined with mechanical processing, it has further enhanced controllability of the present invention.
本发明适合于在K9玻璃基底上加工较细、较深(数百微米)的微通道显微结构,由于具有良好的微加工性能和比较廉价的价格倍受青睐。但本发明不限于K9玻璃,还可用于制作脆性光学材料等的微米和纳米尺度的微结构,这些微结构可广泛应用于微波技术、传感器、光学元件等场合。The invention is suitable for processing finer and deeper (hundreds of micrometers) microchannel microstructures on the K9 glass substrate, and is favored because of its good micromachining performance and relatively cheap price. But the present invention is not limited to K9 glass, and can also be used to make micro- and nano-scale microstructures of brittle optical materials, etc. These microstructures can be widely used in microwave technology, sensors, optical elements and other occasions.
附图说明 Description of drawings
下面结合附图及具体实施方式对本发明作进一步的详细说明。The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
图1为本发明方法的压痕示意图。其中:(a)图为维氏正四棱锥形压痕阵列示意图(两行);(b)图为努普压痕阵列示意图。Fig. 1 is a schematic diagram of the indentation of the method of the present invention. Among them: (a) is a schematic diagram of a Vickers regular pyramidal indentation array (two rows); (b) is a schematic diagram of a Knoop indentation array.
图2为光学显微镜下放大1000倍的用4.903N的力制作出的压痕照片。Figure 2 is a photo of the indentation made with a force of 4.903N under an optical microscope magnified 1000 times.
图3为包裹有石蜡的玻璃样品(四个压痕裸露)。Figure 3 shows a paraffin-coated glass sample (four indentations exposed).
图4为图2的压痕力度为4.903N,保荷时间为10s的压痕经40分钟腐蚀后裂纹的激光共聚焦测量照片。Figure 4 is a confocal laser confocal measurement photo of the crack in the indentation in Figure 2 with an indentation force of 4.903N and a dwell time of 10s after 40 minutes of corrosion.
图5为图4腐蚀后压痕用激光共聚焦测得的三维示意图。FIG. 5 is a three-dimensional schematic diagram of the indentation after corrosion in FIG. 4 measured by confocal laser.
图6为图1的阵列压痕经过30分钟腐蚀后的形状。Fig. 6 is the shape of the array indentation in Fig. 1 after being etched for 30 minutes.
具体实施方式 Detailed ways
采用显微硬度计使用不同的压头在高精光学玻璃上制造出形状各异的微尺度裂纹,得到深宽比不相同微结构。可以使用正四棱锥体压头、努普压头、正三棱锥体压头、尖劈形压头、双圆锥体压头、双圆柱体压头等来制作不同形状的压痕及压痕的阵列结构,以此为基础来制作高精光学玻璃表面高深宽比微结构。如图1(a)所示,可以用维氏正四棱锥压头制作出两行压痕,周边放射性的裂纹也组成了一定规律的细小裂缝。同理可以用努普压头制作一列压痕,压痕的形状见图1(b),周边裂缝组成一组很有规律的排列,经过下一步腐蚀后就可以成为一个具有高深宽比结构的裂缝群,可以用在制作MEMS光栅、MEMS开关等微小结构中。Micro-hardness testers are used to create micro-scale cracks of various shapes on high-precision optical glass with different indenters, and obtain microstructures with different aspect ratios. Different shapes of indentations and array structures of indentations can be made by using regular quadrangular pyramid indenters, Knoop indenters, regular triangular pyramid indenters, wedge-shaped indenters, double-cone indenters, and double-cylindrical indenters. Based on this, the microstructure with high aspect ratio on the surface of high-precision optical glass is fabricated. As shown in Figure 1(a), two rows of indentations can be made with a Vickers regular pyramid indenter, and the surrounding radial cracks also form regular small cracks. In the same way, a series of indentations can be made with a Knoop indenter. The shape of the indentations is shown in Figure 1(b). The surrounding cracks form a group of regular arrangements. After the next step of corrosion, it can become a structure with a high aspect ratio. Crack groups can be used in microstructures such as MEMS gratings and MEMS switches.
采用不同浓度的BOE溶液对表面有压痕的玻璃样品进行一定时间的腐蚀,由于光学玻璃是非单晶硅材料,所以其腐蚀是各向同性腐蚀的,在向下腐蚀的同时,其裂纹的宽度也会发生变化。这样经过一定浓度比例的缓冲溶液的腐蚀,就可以使压痕腐蚀的同时也使得压痕周边的裂纹放大,这样就可以产生符合需要的高深宽比微结构。Use different concentrations of BOE solutions to corrode glass samples with indentations on the surface for a certain period of time. Since optical glass is a non-single crystal silicon material, its corrosion is isotropic. Also changes. In this way, through the corrosion of a buffer solution with a certain concentration ratio, the indentation can be corroded and the cracks around the indentation can be enlarged at the same time, so that a desired high aspect ratio microstructure can be produced.
本实施例中以K9光学玻璃为基底材料,玻璃规格为φ12mm,厚度为6mm。In this embodiment, K9 optical glass is used as the base material, the glass specification is φ12mm, and the thickness is 6mm.
实验设备:HVS-1000型数显显微硬度计由试验机主体、工作台、升降丝杠、加载系统、软键显示操作面板、高倍率光学测量系统等部分组成(见图3所示)。通过软键输入,能调节测量光源强弱,预置试验力保持时间,维氏和努氏试验方法切换。在软键面板上的LCD显示屏上,能显示试验方法、测试力、压痕长度、硬度值、试验力保持时间、测量次数等,并能键入测试时间。具体实施方案如下:Experimental equipment: HVS-1000 digital display microhardness tester is composed of the main body of the testing machine, worktable, lifting screw, loading system, soft key display operation panel, high magnification optical measurement system and other parts (see Figure 3). Through the soft key input, it can adjust the strength of the measuring light source, preset the holding time of the test force, and switch between Vickers and Knoop test methods. On the LCD display on the soft key panel, it can display the test method, test force, indentation length, hardness value, test force holding time, measurement times, etc., and can input the test time. The specific implementation plan is as follows:
(1)取φ12×6mm的K9玻璃片作为样品,在其一面用显微硬度计(维氏硬度计)制作不同载荷的四个正方形布置的正四棱锥压痕,每个压痕的四个对角线有四条放射线形裂缝,这个放射形裂缝就是本例中要用到的用来制作高深宽比的结构。采用4.903N的力制作出来的压痕如图2所示。不同载荷如表1所示。(1) Take a K9 glass sheet of φ12×6mm as a sample, and use a microhardness tester (Vickers hardness tester) to make four square pyramid indentations with different loads on one side, and four pairs of each indentation The corner line has four radial slits, and this radial slit is the structure used in this example to create a high aspect ratio. The indentation made with a force of 4.903N is shown in Figure 2. The different loads are shown in Table 1.
表1Table 1
(2)用石蜡将玻璃片样品周边包裹起来,只留下有压痕的地方不被包裹,如图3所示,这样做的目的是为了保证测量基准面不被破坏。(2) Wrap the periphery of the glass sample with paraffin, leaving only the indented area unwrapped, as shown in Figure 3. The purpose of this is to ensure that the measurement reference plane is not damaged.
(3)配制BOE溶液(HF和NH4F的混合溶液):90g的NH4F溶于130ml水,形成质量浓度为40%NH4F溶液,取180ml备用;(3) Preparation of BOE solution (mixed solution of HF and NH 4 F): 90 g of NH 4 F was dissolved in 130 ml of water to form a 40% NH 4 F solution, and 180 ml was taken for use;
再取15ml质量浓度为40%的HF酸加水17ml稀释成质量浓度为18.75%的HF酸溶液,加入到180ml NH4F溶液中混合,得BOE溶液。此时的NH4F和HF的体积浓度比是6∶1。Then take 15ml of HF acid with a mass concentration of 40% and add 17ml of water to dilute it into an HF acid solution with a mass concentration of 18.75%, add it to 180ml of NH 4 F solution and mix to obtain a BOE solution. The volume concentration ratio of NH 4 F and HF at this time was 6:1.
(4)玻璃片清洗:首先将样品放在盛有去离子水的玻璃烧杯中用25℃的水浴加超声清洗5分钟,再将其放入盛有丙酮的塑料烧杯中用25℃的水浴加超声清洗5分钟,再将其放入盛有无水乙醇的玻璃烧杯中用25℃的水浴加超声清洗5分钟,取出后,用氮气吹干。(4) Cleaning of glass slides: First, put the sample in a glass beaker filled with deionized water and use a 25°C water bath to ultrasonically clean it for 5 minutes, then put it into a plastic beaker filled with acetone and heat it in a 25°C water bath. Ultrasonic cleaning for 5 minutes, then put it into a glass beaker filled with absolute ethanol, use a water bath at 25°C and ultrasonic cleaning for 5 minutes, take it out, and dry it with nitrogen.
(5)将样品放在盛有第三步配制的BOE溶液的塑料培养皿中(使BOE溶液淹没样品玻璃片),并将培养皿放入恒温水浴(25℃)中进行腐蚀,经过10分钟后取出。(5) Put the sample in a plastic petri dish filled with the BOE solution prepared in the third step (so that the BOE solution submerges the sample glass), and put the petri dish into a constant temperature water bath (25°C) for corrosion, after 10 minutes Then take it out.
(6)用激光共聚焦显微镜观察,测得裂缝的宽度d1和深度h1,其比值是ω1=h1/d1,此时就可以得到各向同性玻璃材料表面深宽比的微结构。(6) Observing with a laser confocal microscope, the width d 1 and depth h 1 of the crack are measured, and the ratio is ω 1 =h 1 /d 1 , at this time, the microscopic depth-width ratio of the surface of the isotropic glass material can be obtained. structure.
(7)还可以重复(4)、(5)步得到深宽比进一步提高的ω2=h2/d2,ω3=h3/d3,......,ωn=hn/dn。(7) Steps (4) and (5) can also be repeated to obtain ω 2 =h 2 /d 2 , ω 3 =h 3 /d 3 , ..., ω n =h with further improved aspect ratio n /d n .
例如,其中压痕力度为4.903N,保荷时间为10s的压痕,腐蚀40分钟后取出烘干用激光共聚焦显微镜测得的裂缝宽度为d4=2.372μm,h4=24.718μm,则此时的深宽比为ω4=10.420,测量结果见图4所示。图5是此压痕的三维示意图。For example, where the indentation strength is 4.903N and the dwell time is 10s, the crack width measured by laser confocal microscope after being corroded for 40 minutes is d 4 =2.372μm, h 4 =24.718μm, then The aspect ratio at this time is ω 4 =10.420, and the measurement results are shown in FIG. 4 . Figure 5 is a three-dimensional schematic view of the indentation.
可以在加工的时候加工出各种阵列结构(图1)。这样在保证多样化的同时也扩展了其应用价值,图6是图1正四棱锥压痕的阵列经过30分钟腐蚀后在激光共聚焦显微镜下观察到的图形。得到的这种多组织的图形具有较高的深宽比,可以很好的应用于微传感器、微光学器件的加工中,这样的阵列高深宽比裂纹可以用于加工微光栅等具有阵列高深宽比结构的微器件,其应用价值得以体现。Various array structures can be processed during processing (Fig. 1). This not only ensures diversification, but also expands its application value. Figure 6 is the pattern observed under the laser confocal microscope after the array of square pyramid indentations in Figure 1 was corroded for 30 minutes. The obtained multi-tissue pattern has a high aspect ratio and can be well applied in the processing of micro-sensors and micro-optical devices. Such arrays of high-aspect-ratio cracks can be used to process micro-gratings with arrays of high depth-width The micro-devices of the specific structure can reflect its application value.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1506297A (en) * | 2002-12-12 | 2004-06-23 | 财团法人工业技术研究院 | Method for manufacturing microstructure with high aspect ratio |
CN1572738A (en) * | 2003-06-05 | 2005-02-02 | 三星钻石工业股份有限公司 | Lining method for fragile material base plate and apparatus therefor |
CN101037185A (en) * | 2007-01-12 | 2007-09-19 | 中国科学院上海微系统与信息技术研究所 | Method for making nano-groove on quartz glass |
CN102183602A (en) * | 2011-01-27 | 2011-09-14 | 电子科技大学 | Micro gas chromatographic column with high depth-to-width ratio and wet corrosion manufacturing method thereof |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN1506297A (en) * | 2002-12-12 | 2004-06-23 | 财团法人工业技术研究院 | Method for manufacturing microstructure with high aspect ratio |
CN1572738A (en) * | 2003-06-05 | 2005-02-02 | 三星钻石工业股份有限公司 | Lining method for fragile material base plate and apparatus therefor |
CN101037185A (en) * | 2007-01-12 | 2007-09-19 | 中国科学院上海微系统与信息技术研究所 | Method for making nano-groove on quartz glass |
CN102183602A (en) * | 2011-01-27 | 2011-09-14 | 电子科技大学 | Micro gas chromatographic column with high depth-to-width ratio and wet corrosion manufacturing method thereof |
Non-Patent Citations (2)
Title |
---|
玻璃微流控芯片廉价快速制作方法的研究;陈强等;《化学学报》;20070915;第65卷(第17期);第1864页1.2节及第1865页第2.2节第三段第4-6行 * |
陈强等.玻璃微流控芯片廉价快速制作方法的研究.《化学学报》.2007,第65卷(第17期),第1864页1.2节及第1865页第2.2节第三段第4-6行. |
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