CN102529123A - Sheet molding compound (SMC) process preparation method of electromagnetic wave absorbing composite material - Google Patents
Sheet molding compound (SMC) process preparation method of electromagnetic wave absorbing composite material Download PDFInfo
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- CN102529123A CN102529123A CN2011103810168A CN201110381016A CN102529123A CN 102529123 A CN102529123 A CN 102529123A CN 2011103810168 A CN2011103810168 A CN 2011103810168A CN 201110381016 A CN201110381016 A CN 201110381016A CN 102529123 A CN102529123 A CN 102529123A
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- epoxy resin
- glass cloth
- composite material
- electromagnetic wave
- wave absorbing
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- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 238000010132 sheet moulding compound process Methods 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 claims abstract description 102
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 102
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 70
- 239000003677 Sheet moulding compound Substances 0.000 claims abstract description 40
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000000465 moulding Methods 0.000 claims abstract description 33
- 239000006096 absorbing agent Substances 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052742 iron Inorganic materials 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 239000007822 coupling agent Substances 0.000 claims abstract description 4
- 239000000945 filler Substances 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims abstract description 3
- 239000004744 fabric Substances 0.000 claims description 72
- 239000011521 glass Substances 0.000 claims description 72
- 229920006267 polyester film Polymers 0.000 claims description 48
- 238000010521 absorption reaction Methods 0.000 claims description 28
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 25
- 229910000077 silane Inorganic materials 0.000 claims description 25
- 238000005520 cutting process Methods 0.000 claims description 24
- 239000012467 final product Substances 0.000 claims description 24
- 238000004898 kneading Methods 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 24
- 239000000206 moulding compound Substances 0.000 claims description 24
- 238000005303 weighing Methods 0.000 claims description 24
- 230000002708 enhancing effect Effects 0.000 claims description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 2
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 239000006229 carbon black Substances 0.000 abstract 1
- 230000008602 contraction Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 12
- 238000011161 development Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- -1 enhancing body Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to a sheet molding compound (SMC) process preparation method of an electromagnetic wave absorbing composite material, which comprises the following materials that: wave absorbing agent is at least one type of iron-based amorphous powder Fe78Si9B13 and iron-based amorphous nanocrystalline powder Fe73.5Cu1Nb3Si13.5B9, a reinforcing body is made of high-modulus glass fibers, a matrix is epoxy resin and comprises E-51, E-44, E-42, E-20, E-12 and other brands, curing agent is micronization dicyandiamide, coupling agent is silane coupling agent KH-550, and filler is white carbon black. A preparation process comprises the following three steps that: the preparation of wave absorbing agent paste resin in different types and proportion, sheet pressing and curing moulding. The SMC process preparation method of the electromagnetic wave absorbing composite material has the advantages that: (1) the preparation cost is low, and the mass production of composite materials with different sizes and different thicknesses can be realized; (2) the contraction is low, and a plurality of defects of unsaturated polyester resin in the SMC preparation process can be effectively overcome; and (3) the defects that normal temperature curing agent reacts too quickly at room temperature and a product cannot be stored for a long time are effectively overcome.
Description
Technical field
The present invention relates to a kind of SMC its preparation process of electromagnetic wave Wave suction composite material, belong to the absorbing material field.
Background technology
Electromagnetic-wave absorbent is stealth technology development key place, is one of emphasis direction of contemporary stealth technology research and development, has application widely in national defence and civil area.SMC technology is a kind of very promising method of forming materials, has boundless development prospect.The moulding process of electromagnetic wave absorption material mainly contains hand pasting forming, injection molding and RTM etc. at present, does not find the pertinent literature report as yet and prepare electromagnetic-wave absorbent with the SMC moulding process.
We replace unsaturated polyester resin in traditional SMC technology as matrix resin with epoxy resin; Its temperature tolerance, intensity, the relative unsaturated polyester resin of insulation effect have had large increase; And shrinkage is low, has solved the shortcoming that in the SMC moulding process, exists at unsaturated polyester resin effectively.In addition; The curing of epoxy resin is the technology of most critical in the preparation process, through exploration for a long time, and final definite a kind of special curing agent that adopts; Can effectively solve the normal temperature cure agent; Like ethylenediamine, diethylenetriamine, triethylene tetramine etc., curing reaction is too fast at normal temperatures, the deficiency that goods can not store for a long time.Through SMC prepared electromagnetic wave Wave suction composite material is carried out exploratory development, grasped a kind of new method for preparing the electromagnetic wave Wave suction composite material.But the advantage of utilizing the SMC moulding process is prepared a kind of long-term storage at normal temperatures; Only at the sheet mold pressing Wave suction composite material goods of the curable moulding in certain condition heating and pressurizing rear; Finally reach and to produce in batches; Ready access upon use, purpose conveniently is for large-scale industrial production in the future provides a new approach and the reference of corresponding techniques technology.
Summary of the invention
The purpose of this invention is to provide a kind of method of SMC prepared electromagnetic wave Wave suction composite material, be mainly used in the radar absorption of electromagnetic wave, is one of stealth technology development key technology.
The present invention realizes that like this it comprises following raw material: wave absorbing agent, enhancing body, matrix, curing agent, coupling agent, filler.Wherein, wave absorbing agent is Fe-based amorphous powder Fe
78Si
9B
13, Fe-based amorphous/nanometer crystal powder Fe
73.5Cu
1Nb
3Si
13.5B
9At least a, the enhancing body is a high-modulus glass fiber, matrix is an epoxy resin, comprises the trades mark such as E-51, E-44, E-42, E-20, E-12, curing agent is the micronizing dicyandiamide, coupling agent is that filler is a white carbon.
Its step of preparation process is following:
Step 1: contain the preparation that variety classes and ratio wave absorbing agent are stuck with paste resin: be that the ratio of 0.5:1-7:1 takes by weighing wave absorbing agent and epoxy resin in mass ratio respectively; The addition of curing agent micronizing dicyandiamide is the 1-20% of epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10-30%;
Step 2: the sheet material compacting: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 10-80MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: curing molding: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking; Tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
The invention has the advantages that: Fe is adopted in (1)
78Si
9B
13Fe-based amorphous powder or Fe
73.5Cu
1Nb
3Si
13.5B
9The iron-based amorphous nanometer crystalline powder is as wave absorbing agent; Can successfully prepare well behaved electromagnetic wave absorption material composite panel with SMC technology; Whole preparation moulding process is simple, and preparation cost is low, can realize the batch process of different size, different-thickness composite; (2) adopt epoxy resin to replace unsaturated polyester resin in traditional SMC technology as matrix resin; Its temperature tolerance, intensity, the relative unsaturated polyester resin of insulation effect have had large increase; And shrinkage is low, can effectively solve the numerous deficiencies of unsaturated polyester resin in SMC preparation technology; (3) adopt the micronizing dicyandiamide as curing agent, curing reaction is too fast at normal temperatures to efficiently solve the normal temperature cure agent, the deficiency that goods can not store for a long time.
Description of drawings
Fig. 1 is electromagnetic wave absorption composite material plate cross section metallograph among the present invention.
Fig. 2 is the reflection of electromagnetic wave attenuation curve of different wave absorbing agent content sheet materials among the present invention.
The specific embodiment
Like Fig. 1, shown in 2;
Step 1: in mass ratio is that the ratio of 0.5:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 1:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 2:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 4:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 5:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 7
Step 1: in mass ratio is that the ratio of 6:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 8
Step 1: in mass ratio is that the ratio of 7:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 9
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 1% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 20% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 11
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 20%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 12
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 30%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 13
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 10MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing the Fe-based amorphous powder Fe of wave absorbing agent
78Si
9B
13With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 80MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 15
Step 1: in mass ratio is that the ratio of 0.5:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 1:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 17
Step 1: in mass ratio is that the ratio of 2:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 3:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 19
Step 1: in mass ratio is that the ratio of 4:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 5:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Embodiment 21
Step 1: in mass ratio is that the ratio of 6:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Step 1: in mass ratio is that the ratio of 7:1 takes by weighing wave absorbing agent iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9With E-51 epoxy resin, the addition of curing agent micronizing dicyandiamide is 10% of an epoxy resin quality, and the addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality.After mixing four, add white carbon, rub, accomplish tack-free, for use to dough with respect to epoxy resin quality 10%;
Step 2: the mixture that kneading in the step 1 is good is placed between the layer glass cloth, and the two sides is placed on pressure forming machine central authorities, at 75MPa pressure pressed slabbing moulding compound sample after covering with two-layer glass cloth and polyester film again;
Step 3: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking, tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
Claims (2)
1. the SMC its preparation process of an electromagnetic wave Wave suction composite material is characterized in that processing step is: (1) is that the ratio of 0.5:1-7:1 takes by weighing wave absorbing agent and epoxy resin in mass ratio respectively, and the addition of curing agent micronizing dicyandiamide is the 1-10% of epoxy resin quality; The addition of silane resin acceptor kh-550 is 1% of an epoxy resin quality; After mixing four, add white carbon, rub to dough with respect to epoxy resin quality 10-30%; Accomplish tack-free, for use; (2) sheet material compacting: the mixture that kneading is good in the step 1 is placed between the layer glass cloth; After the two sides covers with layer glass cloth and polyester film again; Be placed on pressure forming machine central authorities, at 10-80MPa pressure pressed slabbing moulding compound sample; (3) curing molding: the sheet molding compound sample that step 2 is made on the sulfidization molding machine through the process conditions of 160 ℃ * 1h * 5MPa; Be solidified into the electromagnetic wave absorption composite material plate; Goods are taken out in die sinking; Tear the glass cloth and the polyester film that cover the two sides off, get final product behind the cutting burr required goods.
2. the SMC its preparation process of a kind of electromagnetic wave Wave suction composite material according to claim 1 is characterized in that wave absorbing agent is Fe-based amorphous powder Fe
78Si
9B
13, iron-based amorphous nanometer crystalline powder Fe
73.5Cu
1Nb
3Si
13.5B
9At least a, the enhancing body is a high-modulus glass fiber, matrix is an epoxy resin; Comprise the trades mark such as E-51, E-44, E-42, E-20, E-12; Curing agent is a latency Q curing agent micronizing dicyandiamide, and coupling agent is a silane resin acceptor kh-550, and filler is a white carbon.
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| CN104558973A (en) * | 2014-12-16 | 2015-04-29 | 惠州力王佐信科技有限公司 | High-performance wave-absorbing and heat-dissipating composite material |
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| CN102529123B (en) | 2014-08-06 |
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