CN102510661A - Anisotropic electroconductive film and circuit board using same - Google Patents
Anisotropic electroconductive film and circuit board using same Download PDFInfo
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- CN102510661A CN102510661A CN2011103028043A CN201110302804A CN102510661A CN 102510661 A CN102510661 A CN 102510661A CN 2011103028043 A CN2011103028043 A CN 2011103028043A CN 201110302804 A CN201110302804 A CN 201110302804A CN 102510661 A CN102510661 A CN 102510661A
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- resin
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Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an anisotropic electroconductive film and a circuit board using the same. The anisotropic electroconductive film disclosed by the invention is located between circuit electrodes which are arranged oppositely, and is used for applying the voltage to the oppositely arranged circuit electrodes and electrically connecting the electrodes in the voltage application direction. The anisotropic electroconductive film is characterized by being formed by laminating a first bonding film layer and a second bonding film layer, wherein the first bonding film layer contains a photo-polymerized resin, a thermosetting resin, a first a curing agent for the thermosetting resin and electromagnetic particles, which are polymerized, and the second bonding film layer contains the thermosetting resin and the curing agent for the thermosetting resin.
Description
It is that to be 200910148964.X, denomination of invention divide an application for what the application of " anisotropic conducting film and use the circuit board of this film " was submitted to for May 11, application number in 2005 that the application is based on the applying date.
Technical field
The present invention relates to circuit substrate each other or anisotropic conducting film that uses in being connected of the electronic component of integrated circuit (IC) chip etc. and circuit base plate and the circuit board that uses this film.
Background technology
For make circuit substrate each other or the electronic component of IC chip etc. and circuit substrate electricity connect, can use conducting particles to be dispersed in the anisotropic conducting film in the adhesive.This occasion is configured in anisotropic conducting film between the electrode of face-off mutually, after through heating, pressurization electrode being connected each other, makes compression aspect keep conductivity, connects thereby can carry out electricity.Anisotropic conducting film plays an important role as the connection material that the drive IC that LCD (LCD:Liquid Crystal Display) is installed is used aspect practical application.
Now; The medium and small plate that the big template of using from notebook computer or monitor and TV uses to portable machines such as portable phone or personal digital assistant (PDA:Personal Digital Assistant), game machines; LCD is applicable to diversified purposes, and these LCD use anisotropic conducting film (ACF:Anisotropic Conductive Film) installing drive IC.Drive IC among the LCD is installed, and through with drive IC carrier band packetized (TCP:Tape Carrier Packag), uses anisotropic conducting film with itself and LCD plate or the connection of printed circuit board (PCB) (PWB:Printed Wiring Board) electricity then.In addition, the medium and small LCD of portable phone etc. adopts and directly is installed in COG (the Chip on Glass) mode on the LCD plate to naked drive IC (ベ ア De ラ イ バ IC) by anisotropic conducting film.
The LCD height becomes more meticulous and develops, and the LCD plate is connected or the miniaturization of COG connection request connection spacing with TCP's.Especially COG connect since with the convexity of IC chip as connection electrode, thereby connect area and connect for a short time than TCP, so will guarantee conducting on small connection electrode, how to catch the conducting particles of sufficient amount, this obtain on the high connecting reliability very important.
Therefore; For example, the spy opens flat 8-279371 communique, discloses through forming the two-layer structure of the adhesive layer (conducting particles layer) that will be dispersed with conducting particles and single adhesive layer (adhesive layer) lamination; Compare with single layer structure in the past; Can on microelectrode (convexity), catch conducting particles expeditiously, the applicability to minute protrusions can be provided, the anisotropic conducting film that the connectivity of small connection spacing is good.
Summary of the invention
Yet; This two-layer structure ACF with compare in the past, though the capturing efficiency on microelectrode improved because conducting particles flows with adhesive when connecting; So use occasion (for example, interval, the 2600 μ m below the 15 μ m of the IC that connects the spacing miniaturization
2Below electrode size), though guarantee the electrode insulating properties to each other of adjacency, not talkatively can guarantee 2600 μ m
2Enough conducting particles numbers (more than 5) on the following electrode also have room for improvement aspect connection reliability.
The present invention is in view of above-mentioned condition and the invention accomplished, its objective is that the insulating properties when narrow interval is provided is high, and the anisotropic conducting film of the connection reliability can improve fine connection spacing time the and use the circuit board of this film.
Anisotropic conducting film of the present invention is to be present between the circuit electrode of face-off mutually; To opposed circuit electrode pressurization; Anisotropic conducting film with electricity connection between the electrode of compression aspect; It is characterized in that, this conductive film by contain by the optical polymerism resin of polymerization, thermosetting resin, thermosetting resin with the 1st adhesive film layer of curing agent and conducting particles, with contain thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate and form with curing agent.
If use this anisotropic conducting film, the insulating properties during then narrow interval is high, and the connection reliability can improve fine connection spacing the time.Moreover so-called narrow interval is meant that the interval between the circuit electrode of adjacency is narrow.
The heat release that aforementioned the 1st adhesive film layer and the 2nd adhesive film layer adopt DSC to measure begin temperature preferably more than 60 ℃ and the temperature of accomplishing 80% curing reaction be below 260 ℃.When heat release begins temperature less than 60 ℃, begin temperature with heat release and compare, the tendency that has keeping quality to reduce in the occasion more than 60 ℃.In addition, when the temperature of accomplishing 80% curing reaction surpasses 260 ℃, compare in the occasion below 260 ℃, can not connect in the short time, possibly produce infringement circuit at low temperature with this temperature.
As the aforementioned hot thermosetting resin, preferably use epoxy resin.
In addition, use curing agent,, preferably use the potentiality curing agent from the viewpoint that keeping quality improves as above-mentioned thermosetting resin.
Aforementioned the 1st adhesive film layer and the 2nd adhesive film layer preferably contain film formation property macromolecule.At this moment, form film more easily.
In addition, be dispersed in conducting particles amount 0.2～30 volume % preferably in aforementioned the 1st adhesive film layer.The conducting particles amount is compared with the occasion more than the 0.2 volume % during less than 0.2 volume %, and the tendency of conduction step-down is arranged, and when surpassing 30 volume %, compares with the occasion below the 30 volume %, and the tendency of the insulating properties step-down between the circuit electrode of adjacency is arranged.
In addition; The invention is characterized in; Be to dispose first circuit block with first binding post and second circuit parts with second binding post; And make aforementioned first binding post and aforementioned second binding post opposed, between aforementioned first binding post of arranged opposite and aforementioned second binding post, there is anisotropic conducting film, after the heating and pressurizing; Make aforementioned first binding post of arranged opposite and the circuit board that aforementioned second binding post electricity is connected, aforementioned anisotropic conducting film is above-mentioned anisotropic conducting film.
If adopt circuit board of the present invention, the connection reliability the when good insulating during then narrow interval, fine wiring spacing improves.
If adopt anisotropic conducting film of the present invention; Then form contain by the optical polymerism resin of polymerization, thermosetting resin, thermosetting resin with the 1st adhesive film layer of curing agent and conducting particles, with contain thermosetting resin and thermosetting resin ACF with the two-layer structure formation of the 2nd adhesive film layer of curing agent; And use up and make the 1st adhesive film layers of polymer that contains conducting particles; Therefore, the flowability in the time of can suppressing this layer connection.Therefore, except can on the semi-conductive convexity that connects, catching efficiently the conducting particles, flow into narrow interval owing to can also suppress conducting particles, so the good insulating during narrow interval, the connection reliability during fine connection spacing improves.
The purposes of only connecting when therefore, anisotropic conducting film of the present invention is suitable for the LCD plate is connected with the IC chip with TAB, LCD plate at the compression aspect electricity.
In addition, adopt circuit board of the present invention, the connection reliability the when good insulating during narrow interval, fine connection spacing improves.
Embodiment
Anisotropic conducting film of the present invention; It is present between the circuit electrode of face-off mutually; To opposed circuit electrode pressurization; Electricity between the electrode of compression aspect is connected, it is characterized in that, this conductive film by contain by the optical polymerism resin of polymerization, thermosetting resin, thermosetting resin with the 1st adhesive film layer of curing agent and conducting particles, with contain thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate and form with curing agent.Here; Anisotropic conductive film is by opposed circuit electrode; Promptly laying respectively at the film of the circuit electrode pressurization of these anisotropic conducting film both sides, is between the electrode with compression aspect, promptly along the electric each other film of connecting of the circuit electrode that compression aspect disposed.
Adopt this anisotropic conductive film, the insulating properties during narrow interval is high, the connection reliability in the time of can improving fine connection spacing.
The 2nd adhesive film layer preferably also contains conducting particles.
As the 1st adhesive film layer and the 2nd adhesive film layer, the preferred temperature that to use the heat release of adopting DSC to measure to begin temperature be more than 60 ℃ and accomplish 80% curing reaction is the thin layer below 260 ℃.Wherein, the 1st adhesive film layer and the 2nd adhesive film layer temperature of accomplishing 80% curing reaction can adopt DSC (programming rate: 10 ℃/min) measure.
Above-mentioned optical polymerism resin is to have to use the free radical that functional groups such as acryloyl group, methacryl are arranged to carry out the material of the functional group of polymerization; As such optical polymerism resin, can enumerate acrylic acid ester, methacrylate, maleimide compound etc.Free-radical polymerised material both can use the material that is monomer, any state of oligomer, also can monomer be used with oligomer.Concrete example as acrylic acid ester (methacrylate); Acrylic acid urethane ester, methyl acrylate, acrylic acid epoxy ester, acrylic acid polybutadiene ester, silicon Acrylote ketone ester, acrylic polyester, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diacrylate binaryglycol ester, trimethyol propane triacrylate, tetrapropylene acid tetrahydroxy methane ester, 2-hydroxyl-1 are arranged; 3-two propylene acyloxy propane; 2; Two [4-(acryloyl-oxy ylmethoxy) phenyl] propane, 2 of 2-, two [4-(the acryloyl-oxy Quito ethyoxyl) phenyl] propane of 2-, acrylic acid dicyclopentenyloxyethyl methacrylate, acrylic acid tricyclodecenyl esters, two (acryloxy ethyl) esters of isocyanuric acid, 6-caprolactone modification three (acryloxy ethyl) chlorinated isocyanurates, isocyanuric acid three (acryloxy ethyl) ester, isocyanuric acid three (acryloxy ethyl) ester etc.As required, also can suitably use the polymerization inhibitor of hydroquinones, methyl ether hydroquinone type etc.In addition, the optical polymerism resin has the occasion of double cyclopentenyl and/or tricyclic decenyl and/or triazine ring, because the raising of the thermal endurance of anisotropic conducting film, thereby preferred.Maleimide compound as maleimide compound, for example, can be enumerated 1-methyl-2 so long as in molecule, contain the compound of 2 above dimaleoyl iminos at least and get final product; 4-BMI benzene, N, N '-meta-phenylene bismaleimide, N, N '-TOPOT 2,2 maleimide, N, a N '-methylene phenyl-bismaleimide, N; N '-4,4-biphenylene BMI, N, N '-4,4-(3; 3 '-dimethyl-biphenylene) BMI, N, N '-4,4-(3,3 '-dimethyl diphenylmethane) BMI, N; N '-4,4-(3,3 '-diethyl diphenyl methane) BMI, N, N '-4; 4-diphenyl methane BMI, N, N '-4,4-diphenyl propane BMI, N; N '-4,4-diphenyl ether BMI, N, N '-3; 3 '-diphenyl sulfone BMI, 2, two (4-(the 4-maleimide phenoxy group) phenyl) propane, 2 of 2-, two (3-sec-butyl-4-8 (the 4-maleimide phenoxy group) phenyl) propane, 1 of 2-; Two (4-(the 4-maleimide phenoxy group) phenyl) decane, 4 of 1-, 4 '-cyclohexylidene-two (1-(4-maleimide phenoxy group)-2-cyclohexyl benzene, 2, two (4-(4-maleimide phenoxy group) phenyl) HFC-236fas of 2-etc.These can separately or merge use, also can use with allyl compounds such as allyl phenol, allyl phenyl ether, benzoic acid allyl esters.
Anisotropic conducting film of the present invention also can contain light trigger.As this light trigger, can use the known initator that produces free radical through rayed.Light trigger as the cracking type; Can preferably use benzoin isobutyl ether, diethoxy acetophenone, hydroxycyclohexylphenylketone, benzyl dimethyl ketal, 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone, 4-methyl mercapto-2,2-dimethyl-2-morpholino acetophenone, 4-morpholino-2-ethyl-2-dimethylamino-2-benzyl acetophenone, aminomethyl phenyl glyoxylic ester, acylphosphine oxide etc.As the light trigger of dehydrogenation type, can preferably use benzophenone, 2-EAQ, 2-clopenthixal ketone, 2-isopropyl thioxanthone, 1,7; 7-trimethyl-2,3-dioxo-bicyclo (2,2; The 1-heptane), 4,4 '-two (dimethylamino) benzophenone, 4-benzyl-4 '-methyldiphenyl thioether etc.
Before the optical polymerism resin polymerization; These light triggers are with respect to the use amount of optical polymerism resin; So long as the optical polymerism resin can polymerization amount then do not have particular determination, but can preferably use the light trigger of 0.3～5 weight portion with respect to free-radical polymerised material 100 weight portions.The use amount of light trigger is compared with the occasion more than 0.3 weight portion during less than 0.3 weight portion, and the tendency of responding property deterioration when the use amount of light trigger surpasses 5 weight portions, is compared with the occasion below 5 weight portions, and keeping quality possibly reduce.
In addition, form film more easily, the film formation property macromolecule that preferably cooperates thermoplastic resins such as phenoxy resin, mylar, polyamide to form in order to make the 1st adhesive film layer and the 2nd adhesive film layer.These films form property macromolecules at reaction resin, i.e. optical polymerism resin or the effect of stress relaxation is arranged when thermosetting resin cured.Especially, film forms the occasion that the property macromolecule has functional groups such as hydroxyl, because adhesiveness improves thereby more preferably.
The high molecular use amount of film in the 1st adhesive film layer formation property is preferably 10～150 weight portions with respect to optical polymerism resin 100 weight portions, especially preferably 20～100 weight portions.When film forms the high molecular use amount of property less than 10 weight portions; Compare with the occasion more than 10 weight portions, the tendency of self supportive deterioration is arranged, when film forms the high molecular use amount of property and surpasses 150 weight portions; Compare with the occasion below 150 weight portions, the tendency of intermiscibility deterioration is arranged.
As the thermosetting resin that uses among the present invention, preferred epoxy.As epoxy resin, the epoxy phenolics that the bisphenol-type epoxy resin that can epoxychloropropane and bisphenol-A or Bisphenol F, bisphenol-A D etc. be derived, epoxychloropropane and phenol linear phenol-aldehyde resin or cresols linear phenol-aldehyde resin are derived or have the naphthalene that contains the naphthalene nucleus skeleton be the glycidyl more than 2 arranged in 1 molecule such as epoxy resin, glycidyl amine, glycidol ether, biphenyl, ester ring type various epoxy compoundss etc. separately or mix use more than 2 kinds.These epoxy resin preferably use foreign ion (Na in order to prevent electron transfer
+, Cl
-Deng) or water-disintegrable chlorine etc. drop to the high-purity article below the 300ppm.
Thermosetting resin as using among the present invention is used curing agent, and preferred epoxy is used curing agent, can use the potentiality curing agent such as salt, dicyandiamide of imidazoles system, hydrazides system, boron trifluoride-amine complex, sulfonium salt, amine acid imide, polyamines.
The high molecular use amount of film in the 2nd adhesive film layer formation property with respect to total use amount 100 weight portions of thermosetting resin and curing agent, is preferably 30～100 weight portions, and the spy is 30～60 weight portions preferably.When film forms the high molecular use amount of property less than 30 weight portions; Compare with the occasion more than 30 weight portions, the tendency of self supportive deterioration is arranged, when film forms the high molecular use amount of property and surpasses 100 weight portions; Compare with the occasion below 100 weight portions, the tendency of intermiscibility deterioration is arranged.
In the present invention, thermosetting resin and curing agent add the use amount that together adds up to respect to the optical polymerism resin in the 1st adhesive film layer, are preferably 60～400 weight portions with respect to optical polymerism resin 100 weight portions, especially preferably 100～250 weight portions.Thermosetting resin and curing agent add and add up to respect to the use amount of optical polymerism resin 100 weight portions than 60 weight portions after a little while together; Compare with the occasion more than 60 weight portions; There is difficult tendency of removing resin from connection electrode and conducting particles interface in mobile reduction during connection.In addition; Thermosetting resin and curing agent add and add up to respect to the use amount of optical polymerism resin 100 weight portions than 400 weight portions for a long time together, compare with the occasion below 400 weight portions, and the flowability during connection is too high; Exist conducting particles to flow with resin; Capturing efficiency on the electrode is reduced, and perhaps conducting particles increases to the inflow of electrode gap portion, the tendency that short circuit generation probability increases.
The conducting particles that uses among the present invention for example is the particle of metals such as Au, Ag, Cu or scolding tin, and the particle of conductive layers such as Ni, Cu, Au, scolding tin more preferably is set on the spherical nuclear material of macromolecules such as polystyrene.Can also on the surface of electroconductive particle, form the superficial layer of Su, Au, scolding tin etc.Grain has the occasion of height tolerance through need be littler than the minimum interval of electrode of substrate on the electrode, preferable particle size is bigger than height tolerance, preferred 1～10 μ m.In addition, the conducting particles amount that is dispersed in the adhesive is 0.1～30 volume %, preferably 0.2～15 volume %.
Anisotropic conducting film can adopt the technology manufacturing that is described below.Form light trigger, optical polymerism resin, thermosetting resin, thermosetting resin the molecular adhesive compound dissolving of property high score with curing agent, film or be dispersed in the organic solvent; The dispersed electro-conductive particle prepares the 1st adhesive film and uses solution with film coated again.The organic solvent that uses this moment is in order to improve the dissolubility of material, optimization aromatic hydrocarbon system and the mixed solvent that contains oxygen system.
Then, use apparatus for coating carrying out this solution coat on the surface-treated clear PET film to the one side of thickness 50 μ m, the heated-air drying through 70 ℃, 10 minutes kinds makes the adhesive film that adhesive film thickness is 10 μ m.
Then; Use apparatus for coating; In of the preparation of aforementioned film coated with solution, except not dissolving light trigger and the optical polymerism resin, film coated that adopting the preparation that uses the same method with solution, be coated on the one side of thickness 50 μ m carried out on the white PET film of surface-treated; Heated-air drying through 70 ℃, 10 minutes, the thickness of preparation adhesive film is the 2nd adhesive film of 15 μ m.Heat the 1st adhesive film that makes and the 2nd adhesive film down at 40 ℃ again, use the roll-type laminating machine to carry out lamination simultaneously.
Then, use high-pressure uv lamps, make ultraviolet ray amount 2T/cm
2Ultraviolet ray through the clear PET on the 1st adhesive film layer, shine on the 1st adhesive film layer, with the optical polymerism resin polymerization in the 1st adhesive film layer, make the anisotropic conducting film of two-layer structure.
The optical polymerism resin of the 1st adhesive film layer is used up the occasion of carrying out polymerization; Also can with the 2nd adhesive film laminated before; Adopt ultraviolet irradiation to carry out polymerization in advance, oxygen hinders and fully polymerization but occur this moment, or the situation of lamination smoothly.On the other hand; As previously mentioned, adopt light-struck method behind the lamination, except the adhesiveness of the 1st adhesive film layer and the 2nd adhesive film layer well; Because lining PET film in both sides; So there is not oxygen to hinder, can adopt light to carry out the polymerization of optical polymerism resin fully, so this method of preferred especially employing.
Circuit board of the present invention uses the two-layer structure anisotropic conducting film that makes as stated, can adopt the technology manufacturing that is described below.Promptly; On the surface of the 1st circuit block that first binding post is arranged; Peel off the clear PET film of the 1st adhesive film layer side of this two-layer structure anisotropic conducting film, transfer printing the 1st adhesive film aspect is peeled off the white PET film on the 2nd adhesive layer; Configuration has first circuit block and the second circuit parts with second binding post of first binding post; Make the 1st binding post and the 2nd binding post opposed, anisotropic conducting film is carried out heating and pressurizing, make first binding post and the electric circuit board of connecting of second binding post that make aforementioned arranged opposite.
Moreover to the occasion that anisotropic conducting film heats, heating can be carried out under the temperature more than the thermosetting resin cured temperature in the 1st adhesive film and the 2nd adhesive film.
As first circuit block with first binding post of the present invention; The preferred semiconductor that uses the band projected electrode; As second circuit parts with second binding post; Preferred flex circuit application or the printed substrate that is formed with the glass substrate of ITO or metallic circuit or is formed with the Cu circuit of plating Ni/Au that use, the preferred especially glass substrate that is formed with ITO or metallic circuit that uses.
Embodiment
Below, through embodiment content of the present invention is described more specifically, but the present invention is not limited to these embodiment.
(embodiment 1)
Be dissolved in the phenoxy resin 20g of acrylic acid phenoxy group ester 30g, hydroxycyclohexylphenylketone 0.3g, weight average molecular weight 40,000 among the ethyl acetate 50g, make adhesive and form solution.
Then; In this solution, cooperate the liquid epoxy resin (epoxide equivalent 185 that contains bisphenol type epoxy (epoxide equivalent 180) 10g and microcapsule-type potentiality curing agent; Asahi Chemical Industry's corporate system; ノ バ キ ユ ア HX-3941) 50g, (diameter: surface 4 μ m) forms conducting particles 10 volume % (30, the 000/mm of projection population during thickness 10 μ m of Au layer to be dispersed in the polystyrene nucleome
2), make film coated solution.Then, use apparatus for coating, this solution of coating on the clear PET film that has simultaneously carried out surface-treated thickness 50 μ m, through 70 ℃, 10 minutes heated-air drying, the thickness that makes adhesive layer was the 1st adhesive film of 10 μ m.It is 80 ℃ that the reaction that the 1st adhesive film adopts DSC to measure begins temperature, and the reaction end temp of accomplishing 80% curing reaction is 200 ℃.
Then, use apparatus for coating, aforementioned film coated with in the formulations prepared from solutions; Except not dissolving acrylic acid phenoxy group ester; Beyond the hydroxycyclohexylphenylketone, adopt the film coated of the preparation that uses the same method and use solution, be coated on one side and carried out on the white PET film of surface-treated thickness 50 μ m; Through 70 ℃, 10 minutes heated-air drying, the thickness that makes the 2nd adhesive film was the 2nd adhesive film of 15 μ m.It is 80 ℃ that the reaction that the 2nd adhesive film adopts DSC to measure begins temperature, and the reaction end temp of accomplishing 80% curing reaction is 210 ℃.
In addition, again the 1st adhesive film that makes with the 2nd adhesive film with as the PET film of base material 40 ℃ of heating, carry out lamination with the roll-type laminating machine simultaneously.
Then use high-pressure uv lamps, make ultraviolet ray amount 2J/cm
2Ultraviolet ray through the clear PET on the 1st adhesive film layer, shine on the 1st adhesive film layer, the optical polymerism resin polymerization with in the 1st adhesive film layer makes the two-layer structure anisotropic conducting film.
Then; The anisotropic conducting film of the two-layer structure that use makes is as followsly with gold bump (area: 45 μ m * 45 μ m, 10 μ m, highly at interval: chip 15 μ m, protruding several 362) (1 * 10mm, thickness: 500 μ m) with the glass substrate of being with the ITO circuit (thickness: being connected 1.1mm).That is (the clear PET film of 1.5 * 12mm) the 1st adhesive film laminar surface is at 80 ℃, 10kgf/cm, to peel the two-layer structure anisotropic conducting film off
2Following the 1st adhesive film aspect of pressure stick on the band ITO circuit glass substrate after, peel the white PET film of the 2nd adhesive film laminar surface off, carry out the convexity of chip and the position alignment of band ITO circuit glass substrate.
Then, above chip, carry out heating and pressurizing under, 10 seconds the condition protruding, carry out this connection at 210 ℃, 40g/.Conducting particles number on the convexity after this connection (500) on average is 24, and minimum is 11.In addition, connecting per 1 convexity of resistance the highest is 120m Ω, on average is 58m Ω.In addition, insulation resistance is more than 108 Ω, can guarantee the insulating properties of practical necessary 108 Ω of going up.Do not change even these values also after-40～100 ℃ thermal shock test 1000 circular treatment, high temperature, high humidity (85 ℃/85%RH, 1000h) are tested, demonstrate good connection reliability.
(comparative example 1)
Acrylic acid phenoxy group ester 30g, the phenoxy resin 20g of hydroxycyclohexylphenylketone 0.3g, weight average molecular weight 40,000 is dissolved among the ethyl acetate 50g, makes adhesive and forms solution.
Then; In this solution, cooperate liquid epoxy resin (epoxide equivalent 185, Asahi Chemical Industry's corporate system, the ノ バ キ ユ ア HX-3941) 50g that contains bisphenol type epoxy (epoxide equivalent 180) 10g and microcapsule-type potentiality curing agent; (diameter: surface 4 μ m) has formed conducting particles 4 volume % (30, the 000/mm of projection population during thickness 25 μ m of Au layer to be dispersed in the polystyrene nucleome
2), make film coated solution.Then, use apparatus for coating, thickness 50 μ m one side has been carried out this solution of coating on the surface-treated PET film, through 70 ℃, 10 minutes heated-air drying, the thickness that makes adhesive layer was the adhesive film of 25 μ m.
Then, use high-pressure uv lamps, make ultraviolet ray amount 2J/cm
2Ultraviolet irradiation to this adhesive film, make the anisotropic conductive adhesive film of the optical polymerism resin polymerization in the film.This anisotropic conductive grain closes reaction that film adopts DSC to measure, and to begin temperature be 80 ℃, and the reaction end temp of accomplishing 80% curing reaction is 200 ℃.
Then; The single layer structure anisotropic conducting film that use makes, with being described below with gold bump (area: 45 * 45 μ m, 10 μ m, highly at interval: chip 15 μ m, protruding several 362) (1 * 10mm, thickness: 500 μ m) be with ITO circuit glass substrate (thickness: being connected 1.1mm).At 80 ℃, 10kg f/cm
2On band ITO circuit glass substrate, pasting the single layer structure anisotropic conducting film under the condition (behind 1.5 * 12mm) the anisotropic conductive adhesive film, peels the PET film off, carries out the convexity of chip and the position alignment of band ITO circuit glass substrate.
Then, under, 10 seconds the condition protruding, heat, pressurize, carry out this connection from the chip top at 210 ℃, 40g/.Conducting particles number on the convexity after this connection (500) on average is 14, and minimum is 1.In addition, connecting per 1 convexity of resistance the highest is 5300m Ω, on average is 3200m Ω, and these values increase-40～100 ℃ thermal shock test 1000 circular treatment, high temperature, high humidity (85 ℃/85%RH, 1000h) test back, and it is bad that conduction takes place the part connecting portion.In addition, insulation resistance shows 106 Ω, can not guarantee the practical above insulating properties of 108 necessary Ω that.
(comparative example 2)
Except not dissolving acrylic acid phenoxy group ester, hydroxycyclohexylphenylketone; And make molecular weight 40; 000 phenoxy resin becomes beyond the 50g, adopting the 1st adhesive film for preparing with embodiment 1 same method to use film coated solution, uses apparatus for coating to be coated on one side has been carried out on the PET film of surface-treated thickness 50 μ m; Through 70 ℃, 10 minutes heated-air drying, the thickness that makes adhesive film was the adhesive film A of 10 μ m.It is 80 ℃ that the reaction that this adhesive film adopts DSC to measure begins temperature, and the reaction end temp of accomplishing 80% curing reaction is 200 ℃.
Then, adopt method manufacturing another adhesive film B same with the 2nd adhesive film layer of embodiment 1.It is 80 ℃ that the reaction that this adhesive film adopts DSC to measure begins temperature, and the reaction end temp of accomplishing 80% curing reaction is 210 ℃.
Again the adhesive film A that obtains and adhesive film B 40 ℃ of heating, carry out lamination with the roll-type laminating machine simultaneously, make the anisotropic conducting film of two-layer structure.
Then; The two-layer structure anisotropic conducting film that use makes, with being described below with gold bump (area: 45 μ m * 45 μ m, 10 μ m, highly at interval: chip 15 μ m, protruding several 362) (1 * 10mm, thickness: 500 μ m) be with ITO circuit glass substrate (thickness: being connected 1.1mm).At 80 ℃, 10kgf/cm
2Pressure under (pellicular front of 1.5 * 12mm) adhesive film A sticks on the band ITO circuit glass substrate, peels the PET film then off, carries out the convexity of chip and the position alignment of band ITO circuit glass substrate the two-layer structure anisotropic conducting film.
Then, under, 10 seconds the condition protruding, heat, pressurize, carry out that this is continuous from the chip top at 210 ℃, 40g/.Conducting particles number on the convexity after this connection (500) on average is 18, and minimum is 2.In addition; Connect resistance, per 1 convexity is the highest to be 2500m Ω, on average is 1200m Ω; These values increase-40～100 ℃ thermal shock test 1000 circular treatment, high temperature, high humidity (85 ℃/85%RH, 1000h) test back, and it is bad that conduction takes place the part connecting portion.In addition, insulation resistance shows 106 Ω, can not guarantee the practical above insulating properties of 108 necessary Ω that.
Result by above embodiment 1 and comparative example 1,2 can know that if adopt anisotropic conducting film of the present invention, then the insulating properties at narrow interval is good, can improve the connection reliability of fine connection spacing.
Claims (16)
1. anisotropic conducting film, its at least one electrode size that is present in face-off mutually is 2600 μ m
2Between following circuit electrode,, electricity between the electrode of compression aspect is connected the circuit electrode pressurization of face-off mutually,
It is characterized in that, will contain by the optical polymerism resin of polymerization, thermosetting resin, thermosetting resin with the 1st adhesive film layer of curing agent and conducting particles, form with containing thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate with curing agent,
Aforementioned hot thermosetting resin in aforementioned the 1st adhesive film layer and aforementioned hot thermosetting resin add up to aforementioned by the use amount of the optical polymerism resin of polymerization with respect in aforementioned the 1st adhesive film layer with curing agent, are to be 60～400 weight portions with respect to aforementioned optical polymerism resin 100 weight portions by polymerization.
2. the described anisotropic conducting film of claim 1 is characterized in that, it is more than 60 ℃ that the heat release that aforementioned the 1st adhesive film layer and the 2nd adhesive film layer adopt DSC to measure begins temperature, and the temperature of accomplishing 80% curing reaction is below 260 ℃.
3. following anisotropic conducting film is as the purposes of the anisotropic conducting film of connecting between the circuit electrode that is present in face-off mutually, to the circuit electrode pressurization of face-off mutually, with electricity between the electrode of compression aspect,
Wherein, Said anisotropic conducting film is with to containing optical polymerism resin, light trigger, thermosetting resin, the thermosetting resin composition irradiates light with curing agent and conducting particles, make the 1st adhesive film layer that aforementioned lights polymerism resin polymerization obtains, with contain thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate and form with curing agent.
4. the described purposes of claim 3 is characterized in that, it is more than 60 ℃ that the heat release that aforementioned the 1st adhesive film layer and the 2nd adhesive film layer adopt DSC to measure begins temperature, and the temperature of accomplishing 80% curing reaction is below 260 ℃.
5. the described purposes of claim 3 is characterized in that, the aforementioned hot thermosetting resin is made up of epoxy resin.
6. the described purposes of claim 3 is characterized in that, the aforementioned hot thermosetting resin is made up of the potentiality curing agent with curing agent.
7. the described purposes of claim 3 is characterized in that, the loading that is dispersed in the aforementioned conducting particles in aforementioned the 1st adhesive film layer is 0.2～30 volume %.
8. the described purposes of claim 3 is characterized in that, contains film formation property macromolecule in aforementioned the 1st adhesive film layer and the 2nd adhesive film layer.
9. the described purposes of claim 3; It is characterized in that; Aforementioned hot thermosetting resin in aforementioned the 1st adhesive film layer and aforementioned hot thermosetting resin add up to the use amount with respect to aforementioned lights polymerism resin with curing agent, are to be 60～400 weight portions with respect to aforementioned lights polymerism resin 100 weight portions.
10. the described purposes of claim 3 is characterized in that, in the aforementioned circuit electrode, at least one electrode and and the electrode of this electrode adjacency between be spaced apart below the 15 μ m.
11. the described purposes of claim 3 is characterized in that, in the aforementioned circuit electrode, at least one electrode size is 2600 μ m
2Below.
12. the manufacturing approach of a circuit board, said circuit board are characterised in that configuration has first circuit block of first binding post and has the second circuit parts of second binding post, and make aforementioned first binding post and the aforementioned second binding post arranged opposite,
Between aforementioned first binding post of arranged opposite and aforementioned second binding post, there is anisotropic conductive film, after the heating and pressurizing, aforementioned first binding post of arranged opposite and aforementioned second binding post electricity connected,
Wherein, Said anisotropic conducting film is with to containing optical polymerism resin, light trigger, thermosetting resin, the thermosetting resin composition irradiates light with curing agent and conducting particles, make the 1st adhesive film layer that aforementioned lights polymerism resin polymerization obtains, with contain the anisotropic conducting film that thermosetting resin and thermosetting resin the 2nd adhesive film layer laminate with curing agent forms.
13. the manufacturing approach of the described circuit board of claim 12, wherein, aforementioned first binding post and aforementioned second binding post are respectively a plurality of electrodes, being spaced apart below the 15 μ m between these a plurality of electrodes.
14. the manufacturing approach of claim 12 or 13 described circuit boards, wherein, aforementioned first binding post and aforementioned second binding post have 2600 μ m
2Following electrodes sized.
15. the manufacturing approach of anisotropic conducting film, it is to be present between the circuit electrode of face-off mutually, and to the circuit electrode pressurization of face-off mutually, the manufacturing approach with the anisotropic conducting film of electricity connection usefulness between the electrode of compression aspect comprises:
The 1st adhesive film layer forms operation: the coating coating forms the 1st adhesive film layer with solution, and this coating is dissolved optical polymerism resin, light trigger, thermosetting resin, thermosetting resin or be dispersed in the organic solvent with curing agent and conducting particles with solution and forms;
The 2nd adhesive film layer forms operation: form and contain thermosetting resin and thermosetting resin the 2nd adhesive film layer with curing agent;
Lamination procedure: with aforementioned the 1st adhesive film layer and aforementioned the 2nd adhesive film layer laminate;
Photopolymerization operation:, make aforementioned lights polymerism resin polymerization to aforementioned the 1st adhesive film layer irradiates light.
16. the described manufacturing approach of claim 15 wherein, is implementing to carry out the aforementioned lights polymerization process after the aforementioned lamination procedure.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08279371A (en) * | 1995-02-07 | 1996-10-22 | Hitachi Chem Co Ltd | Connecting member and connecting structure and connecting method of electrode by using the connecting member |
| CN1339055A (en) * | 1999-02-08 | 2002-03-06 | 日立化成工业株式会社 | Adhesive, electrode-connecting structure, and method of connecting electrodes |
| WO2004055126A1 (en) * | 2002-12-13 | 2004-07-01 | Ls Cable Ltd. | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
-
2005
- 2005-05-11 CN CN201110302804.3A patent/CN102510661B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08279371A (en) * | 1995-02-07 | 1996-10-22 | Hitachi Chem Co Ltd | Connecting member and connecting structure and connecting method of electrode by using the connecting member |
| CN1339055A (en) * | 1999-02-08 | 2002-03-06 | 日立化成工业株式会社 | Adhesive, electrode-connecting structure, and method of connecting electrodes |
| WO2004055126A1 (en) * | 2002-12-13 | 2004-07-01 | Ls Cable Ltd. | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
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