CN102509833B - Device for converting substrate integrated waveguide to coaxial waveguide - Google Patents
Device for converting substrate integrated waveguide to coaxial waveguide Download PDFInfo
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- CN102509833B CN102509833B CN 201110328765 CN201110328765A CN102509833B CN 102509833 B CN102509833 B CN 102509833B CN 201110328765 CN201110328765 CN 201110328765 CN 201110328765 A CN201110328765 A CN 201110328765A CN 102509833 B CN102509833 B CN 102509833B
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Abstract
The invention discloses a device for converting substrate integrated waveguide to coaxial waveguide, belonging to the technical field of microwave and millimeter wave devices. The device comprises a substrate integrated waveguide connector and a coaxial waveguide connector; a row of short-circuit through holes are arranged in one end of the substrate integrated waveguide on which the substrate integrated waveguide connector is located to connect two metal layers; the upper metal layer of a dielectric substrate close to one end of the short-circuit through hole is provided with a round window with the size equal to the diameter of an outer conductor of the coaxial waveguide; and the circle center of the round window is located on the central axis of the substrate integrated waveguide; a rectangular groove is arranged at the center of a round dielectric substrate exposed outside the round window; the front end of an inner conductor of the coaxial waveguide connector is processed into a slice probe which is inserted into the rectangular groove; and the outer conductor of the coaxial waveguide is contacted and fixed with the upper metal layer of the dielectric substrate. The inter-conversion between substrate integrated waveguide and coaxial waveguide with low reflection and low loss is realized. The device is small in size and easy and convenient to assemble and disassemble and can be used repeatedly, which is convenient for the testing and the utilization of substrate integrated waveguide devices and systems.
Description
Technical field
The invention belongs to microwave and millimeter wave device technology field, relate to the connection conversion equipment between a kind of waveguiding structure, be specifically related to the conversion equipment of a kind of substrate integration wave-guide and coaxial line waveguide.
Background technology
Substrate integration wave-guide (siw) is a kind of novel waveguiding structure, and it comes from rectangular waveguide and microstrip line, but has the advantage of low cost, low-loss, high Q value and high density integrated micro millimetre-wave circuit and subsystem thereof.The substrate integrated waveguide technology development is swift and violent, and its product has substrate integral wave guide filter, substrate integrated waveguide directioning coupler, substrate integration wave-guide circulator, substrate integration wave-guide-passive devices such as microstrip line adapter.Substrate integration wave-guide becomes an important development direction of microwave transmission line and device gradually.In the microwave and millimeter wave system; through regular meeting a large amount of use the device that these are made based on substrate integration wave-guide; particularly in some relevant test macros of substrate integrated wave guide structure; testing equipment is the coaxial line structure normally, and this must run into substrate integration wave-guide to the transfer problem of coaxial line waveguide.Existing substrate integration wave-guide all is by substrate integration wave-guide-microstrip line-such transition of coaxial line ball to coaxial conversion, the adding of microstrip line not only causes the resistance of miniaturization, and waste resource and increase insertion loss, therefore, substrate integration wave-guide has important Research Significance to the direct conversion of coaxial line waveguide.
Summary of the invention
The object of the present invention is to provide a kind of substrate integration wave-guide to the conversion equipment of coaxial waveguide, to realize low reflection and low-loss mutual conversion of substrate integration wave-guide and coaxial waveguide.
Technical solution of the present invention is as follows:
A kind of substrate integration wave-guide as shown in Figures 1 to 3, comprises a substrate integration wave-guide joint 1 and a coaxial waveguide joint 2 to the conversion equipment of coaxial waveguide.Wherein, described substrate integration wave-guide joint 1 comprises a segment base sheet integrated waveguide; Described substrate integration wave-guide is left two row's connection medium substrates, 3 two sides metal levels by the rectangle medium substrate 3 of two sides covering metal level along two long edges plated-through holes 4 form, have the metallization short circuit through hole 7 that a row connects medium substrate 3 two sides metal levels at an end of substrate integration wave-guide, metal level has a circular window 6 near the medium substrate 3 of metallization short circuit through hole 7 one ends; The size of described circular window 6 is suitable with coaxial waveguide outer conductor diameter, and the center of circle of described circular window 6 is positioned on the axis of described substrate integration wave-guide.The circular medium substrate center that described circular window 6 exposes has one perpendicular to the rectangular recess 5 of the axis of described substrate integration wave-guide.The coaxial inner conductor front end of described coaxial waveguide joint 2 is processed into thin slice probe 8 and inserts in the described rectangular recess 5; The coaxial outer conductor of described coaxial waveguide joint 2 contacts with the last metal level of described medium substrate 3 and is fixing.
In the technique scheme, the cross sectional shape of described rectangular recess 5 and thin slice probe 8 preferably is consistent, and the center position of the two metallization short circuit through hole 7 is 1/4 λ (wavelength of frequency centered by the λ); The coaxial outer conductor of described coaxial waveguide joint 2 contacts with the last metal level of described medium substrate 3 and fixing mode can adopt the mode of conductive adhesive or welding; Pitch of holes P between the described adjacent metal short circuit through hole 7 is far smaller than the wavelength X of centre frequency, forms a short circuit electricity wall of substrate integration wave-guide to guarantee all metallization short circuit through holes 7; In like manner, the pitch of holes P between the described adjacent metal through hole 4 is far smaller than the wavelength X of centre frequency, forms two electric walls of substrate integration wave-guide to guarantee all plated-through holes 4.
Substrate integration wave-guide provided by the invention compared with prior art, is example with the X-band to the conversion equipment of coaxial waveguide, and its advantage is as follows:
(1) return loss is better than 20dB in X-band, and the absolute bandwidth of 25dB surpasses 3G, and the absolute bandwidth of 30dB surpasses 2.5G, inserts loss and is lower than 0.15dB, can realize high performance ultrabroad band, as described in specific embodiments.
(2) realized low reflection, low-loss conversion between substrate integration wave-guide and the coaxial waveguide.
(3) device size is smaller, and loads and unloads easyly, can reuse, and is convenient to test and utilization to substrate integration wave-guide device and system.
Description of drawings
Fig. 1 is that substrate integration wave-guide provided by the invention is to the structural representation of the conversion equipment of coaxial waveguide.
Fig. 2 be substrate integration wave-guide provided by the invention in the conversion equipment of coaxial waveguide, vertical semi-section structural representation of substrate integration wave-guide joint 1.
Fig. 3 be substrate integration wave-guide provided by the invention in the conversion equipment of coaxial waveguide, the planar structure schematic diagram of substrate integration wave-guide joint 1.
Fig. 4 be substrate integration wave-guide provided by the invention in the conversion equipment of coaxial waveguide, the structural representation of coaxial waveguide joint 2.
Fig. 5 is that substrate integration wave-guide provided by the invention is to the simulation result figure of the Ansoft/hfss12 of the conversion equipment specific embodiment 1 of coaxial waveguide.
Fig. 6 is that substrate integration wave-guide provided by the invention is to the simulation result figure of the Ansoft/hfss12 of the conversion equipment specific embodiment 2 of coaxial waveguide.
Fig. 7 is that substrate integration wave-guide provided by the invention is to the simulation result figure of the Ansoft/hfss12 of the conversion equipment specific embodiment 3 of coaxial waveguide.
Fig. 8 is that substrate integration wave-guide provided by the invention is to the simulation result figure of the Ansoft/hfss12 of the conversion equipment specific embodiment 4 of coaxial waveguide.
Embodiment
Specific embodiment 1
In conjunction with Fig. 1 and Fig. 3, be example with the X-band, the thickness of the medium substrate 3 of substrate integration wave-guide joint 1 is 3mm, the aperture of two row's plated-through holes 4 is 0.4mm, the adjacent holes spacing of every row's plated-through hole 4 is 1.9mm, and the distance between two row's plated-through holes 4 is 22mm, and the broadside of medium substrate 3 is 24mm, rectangular recess 5 is of a size of 1.6mm * 0.1mm, and the degree of depth is 2.9mm; 7 apertures, short circuit metal hole are 0.4mm, and pitch of holes is 2mm, and the diameter of circular window 6 is 7mm.The sectional dimension of the thin slice probe 8 of the coaxial inner conductor front end of coaxial waveguide joint 2 is 1.6mm * 0.1mm, and probe is long to be 2.9mm.The coaxial line of coaxial waveguide joint 2 is 50 Ω standard coaxial lines, and the inner wire diameter is 3.04mm, and the outer conductor diameter is 7mm.The dielectric constant of medium substrate 3 is 2.2, and loss angle tangent is 0.002.The thin slice probe 8 of coaxial waveguide joint 2 is inserted in the rectangular recess 5, stick the outer conductor of coaxial waveguide joint 2 and the edge of circular window 6 tight with conducting resinl.By having realized simulation software Finite Element Method, " Ansoft/HFSS12 " by name, present embodiment is carried out the 3D Electromagnetic Simulation, simulation result such as Fig. 4.
Return loss is better than 20dB in 8.2G～12.05G, be better than 25dB in 8.7G～11.8G, and bandwidth reaches 3.1G, is better than 30dB in 9.1G～11.6G, and bandwidth reaches 2.5G, inserts loss and all be lower than 0.14dB in 8G～12G, has realized high performance broadband.
In conjunction with Fig. 2 and Fig. 3, be example with the X-band, the thickness of the medium substrate 3 of substrate integration wave-guide joint 1 is 3mm, the aperture of two row's plated-through holes 4 is 0.5mm, the adjacent holes spacing of every row's plated-through hole 4 is 1.9mm, and the distance between two row's plated-through holes 4 is 22mm, and the broadside of medium substrate 3 is 23.56mm, rectangular recess 5 is of a size of 1.6mm * 0.1mm, and the degree of depth is 2.9mm; 7 apertures, short circuit metal hole are 0.5mm, and pitch of holes is 2mm, and the diameter of circular window 6 is 7mm.The sectional dimension of the thin slice probe 8 of the coaxial inner conductor front end of coaxial waveguide joint 2 is 1.6mm * 0.1mm, and probe is long to be 2.9mm.The coaxial line of coaxial waveguide joint 2 is 50 Ω standard coaxial lines, and the inner wire diameter is 3.04mm, and the outer conductor diameter is 7mm.The dielectric constant of medium substrate 3 is 2.2, and loss angle tangent is 0.002.The thin slice probe 8 of coaxial waveguide joint 2 is inserted in the rectangular recess 5, stick the outer conductor of coaxial waveguide joint 2 and the edge of circular window 6 tight with conducting resinl.By having realized simulation software Finite Element Method, " Ansoft/HFSS12 " by name, present embodiment is carried out the 3D Electromagnetic Simulation, simulation result is as shown in Figure 5.
Return loss is better than 20dB in 8.1G～12.1G, be better than 25dB in 8.6G～11.86G, and bandwidth reaches 3.26G, 8.95G be better than 30dB in the～11.68G, bandwidth reaches 2.73G, inserts in loss 8G～12G all to be lower than 0.12dB, has realized high performance ultrabroad band.
In conjunction with Fig. 1 and Fig. 3, be example with the X-band, the thickness of the medium substrate 3 of substrate integration wave-guide joint 1 is 3mm, and the apertures of two row's plated-through holes 4 are 0.6mm, the adjacent holes spacing of every row's plated-through hole 4 is 1.5mm, distance between two row's plated-through holes 4 is 22mm, and the broadside of medium substrate 3 is 23.56mm, and rectangular recess 5 is of a size of 1.5mm * 0.1mm, the degree of depth is 2.9mm, 7 apertures, short circuit metal hole are 0.6mm, and pitch of holes is 1mm, and the diameter of circular window 6 is 7mm.The sectional dimension of the thin slice probe 8 of the coaxial inner conductor front end of coaxial waveguide joint 2 is 1.5mm * 0.1mm, and probe is long to be 2.9mm.The coaxial line of coaxial waveguide joint 2 is 50 Ω standard coaxial lines, and the inner wire diameter is 3.04mm, and the outer conductor diameter is 7mm.The dielectric constant of medium substrate 3 is 2.2, and loss angle tangent is 0.002.The thin slice probe 8 of coaxial waveguide joint 2 is inserted in the rectangular recess 5, stick the outer conductor of coaxial waveguide joint 2 and the edge of circular window 6 tight with conducting resinl.By having realized simulation software Finite Element Method, " Ansoft/HFSS12 " by name, embodiment is carried out the 3D Electromagnetic Simulation, simulation result is as shown in Figure 6.
Return loss is better than 20dB in 8.24G～12.3G, be better than 25dB in 8.74G～12.06G, and bandwidth reaches 3.32G, 9.07G be better than 30dB in the～11.9G, bandwidth reaches 2.83G, inserts loss and be lower than 0.14dB in whole X-band, has realized high performance ultrabroad band.
Specific embodiment 4
In conjunction with Fig. 1 and Fig. 3, be example with the X-band, the thickness of the medium substrate 3 of substrate integration wave-guide joint 1 is 3mm, and the apertures of two row's plated-through holes 4 are 0.4mm, the adjacent holes spacing of every row's plated-through hole 4 is 1.9mm, distance between two row's plated-through holes 4 is 22mm, and the broadside of medium substrate 3 is 24mm, and rectangular recess 5 is of a size of 1.7mm * 0.1mm, the degree of depth is 2.9mm, 7 apertures, short circuit metal hole are 0.4mm, and pitch of holes is 1mm, and the diameter of circular window 6 is 7mm.The sectional dimension of the thin slice probe 8 of the coaxial inner conductor front end of coaxial waveguide joint 2 is 1.7mm * 0.1mm, and probe is long to be 2.9mm.The coaxial line of coaxial waveguide joint 2 is 50 Ω standard coaxial lines, and the inner wire diameter is 3.04mm, and the outer conductor diameter is 7mm.The dielectric constant of medium substrate 3 is 2.2, and loss angle tangent is 0.002.The thin slice probe 8 of coaxial waveguide joint 2 is inserted in the rectangular recess 5, stick the outer conductor of coaxial waveguide joint 2 and the edge of circular window 6 tight with conducting resinl.By having realized simulation software Finite Element Method, " Ansoft/HFSS12 " by name, embodiment is carried out the 3D Electromagnetic Simulation, simulation result is as shown in Figure 7.
Return loss is better than 20dB in 8.03G～12.03G, be better than 25dB in 8.56G～11.76G, and bandwidth reaches 3.2G, 8.93G be better than 30dB in the～11.58G, bandwidth reaches 2.65G, inserts loss and all be lower than 0.12dB in 8G～12G, has realized high performance ultrabroad band.
Claims (4)
1. a substrate integration wave-guide comprises a substrate integration wave-guide joint (1) and a coaxial waveguide joint (2) to the conversion equipment of coaxial waveguide; It is characterized in that: described substrate integration wave-guide joint (1) comprises a segment base sheet integrated waveguide; Described substrate integration wave-guide is left two row's connection rectangle medium substrate (3) two sides metal levels by the rectangle medium substrate (3) of two sides covering metal level along two long edges plated-through holes (4) form, have the metallization short circuit through hole (7) that a row connects rectangle medium substrate (3) two sides metal level at an end of substrate integration wave-guide, have a circular window (6) at the last metal level near the rectangle medium substrate (3) of metallization short circuit through hole (7) one ends; The size of described circular window (6) is suitable with coaxial waveguide outer conductor diameter, and the center of circle of described circular window (6) is positioned on the axis of described substrate integration wave-guide; The circular medium substrate center that described circular window (6) exposes has a rectangular recess perpendicular to the axis of described substrate integration wave-guide (5); The coaxial inner conductor front end of described coaxial waveguide joint (2) is processed into thin slice probe (8) and inserts in the described rectangular recess (5); The coaxial outer conductor of described coaxial waveguide joint (2) contacts with the last metal level of described rectangle medium substrate (3) and is fixing.
2. substrate integration wave-guide according to claim 1 is to the conversion equipment of coaxial waveguide, it is characterized in that, described rectangular recess (5) is consistent with the cross sectional shape of thin slice probe (8), and the center position of the two metallization short circuit through hole (7) is 1/4 λ, wherein the wavelength of frequency centered by the λ.
3. substrate integration wave-guide according to claim 1 is to the conversion equipment of coaxial waveguide, it is characterized in that the coaxial outer conductor of described coaxial waveguide joint (2) contacts with the last metal level of described rectangle medium substrate (3) and fixing mode is the mode of conductive adhesive or welding.
4. substrate integration wave-guide according to claim 1 is to the conversion equipment of coaxial waveguide, it is characterized in that, pitch of holes P between the adjacent metal short circuit through hole (7) is far smaller than the wavelength X of centre frequency, forms a short circuit electricity wall of substrate integration wave-guide to guarantee all metallization short circuit through holes (7).
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110328765 CN102509833B (en) | 2011-10-26 | 2011-10-26 | Device for converting substrate integrated waveguide to coaxial waveguide |
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| CN 201110328765 CN102509833B (en) | 2011-10-26 | 2011-10-26 | Device for converting substrate integrated waveguide to coaxial waveguide |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103094646B (en) * | 2013-01-25 | 2015-07-08 | 上海交通大学 | Substrate integration waveguide load dielectric resonator filter |
| CN104218296B (en) * | 2014-09-05 | 2017-10-24 | 西安空间无线电技术研究所 | A kind of waveguide based on multi-sheet printed technology and preparation method thereof |
| KR101621480B1 (en) * | 2014-10-16 | 2016-05-16 | 현대모비스 주식회사 | Transit structure of waveguide and dielectric waveguide |
| CN106487353B (en) * | 2015-08-28 | 2021-09-28 | 香港城市大学深圳研究院 | Device, method and system for converting single-end signal into differential signal |
| CN105680133B (en) * | 2016-01-11 | 2018-08-10 | 中国电子科技集团公司第十研究所 | Vertical interconnection circuit structure between substrate integrated ridge waveguide plate |
| CN108183299A (en) * | 2017-12-20 | 2018-06-19 | 北京遥感设备研究所 | A kind of compact substrate integration wave-guide is to the transition structure of coaxial line |
| JP6723412B1 (en) * | 2019-05-10 | 2020-07-15 | 株式会社フジクラ | Mode converter |
| TWI737109B (en) | 2019-12-31 | 2021-08-21 | 財團法人工業技術研究院 | Circuit structure |
| CN112886169B (en) * | 2021-03-29 | 2021-10-26 | 电子科技大学 | Rectangular waveguide-to-coaxial converter |
| CN113219222B (en) * | 2021-07-08 | 2021-09-03 | 航天科工通信技术研究院有限责任公司 | Radio frequency probe for micro-packaging application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0700114A2 (en) * | 1994-08-30 | 1996-03-06 | Murata Manufacturing Co., Ltd. | High-frequency integrated circuit |
| CN201270276Y (en) * | 2008-08-28 | 2009-07-08 | 电子科技大学 | Novel conversion apparatus for integrated waveguide and rectangular waveguide |
| CN202275909U (en) * | 2011-10-26 | 2012-06-13 | 电子科技大学 | Device for converting substrate integrated waveguide into coaxial waveguide |
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2011
- 2011-10-26 CN CN 201110328765 patent/CN102509833B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0700114A2 (en) * | 1994-08-30 | 1996-03-06 | Murata Manufacturing Co., Ltd. | High-frequency integrated circuit |
| CN201270276Y (en) * | 2008-08-28 | 2009-07-08 | 电子科技大学 | Novel conversion apparatus for integrated waveguide and rectangular waveguide |
| CN202275909U (en) * | 2011-10-26 | 2012-06-13 | 电子科技大学 | Device for converting substrate integrated waveguide into coaxial waveguide |
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