CN102497734A - Processing method of aluminum surface of aluminum base copper clad laminate - Google Patents
Processing method of aluminum surface of aluminum base copper clad laminate Download PDFInfo
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- CN102497734A CN102497734A CN2011103899665A CN201110389966A CN102497734A CN 102497734 A CN102497734 A CN 102497734A CN 2011103899665 A CN2011103899665 A CN 2011103899665A CN 201110389966 A CN201110389966 A CN 201110389966A CN 102497734 A CN102497734 A CN 102497734A
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Abstract
The invention discloses a processing method of an aluminum surface of an aluminum base copper clad laminate. Oil removing processing is conducted on the surface of an aluminum plate through acid solution, alkaline degreasing processing is conducted on the surface of the aluminum plate through caustic solution, impurities, greasy dirt, oxide and the like on the surface of the aluminum plate are removed, and simultaneously the aluminum surface is coarsened. The surface of the aluminum plate is washed by using pressurization deionized water, a layer of surface finishing agent is coated evenly on the surface of the aluminum plate after the aluminum plate is dried, and then the surface of the aluminum plate is dried so as to finish processing of the aluminum surface of the aluminum base copper clad laminate. The processing method is high in processing efficiency, low in cost, stable in performance and small in environment pollution, and phenomena of falling of medium layers and edge breaking do not occur after testing of mechanical processing. The surface of the aluminum plate is processed by means of the processing method so as to fully meet requirements of mechanical machining in a PCB manufacture process.
Description
Technical field
The present invention relates to the surface of aluminum plate cleaning, relate in particular to the processing method on a kind of aluminium base copper-clad plate aluminium surface.
Background technology
Along with electronic product develops to light, thin, little, high density, multifunction; Element packaging density and integrated level are increasingly high in the printed board; Power consumption is increasing, and is more and more urgent to the thermal diffusivity requirement of PCB substrate, if the thermal diffusivity of substrate is bad; Will cause on the printed circuit board components and parts overheated, thereby whole aircraft reliability is descended; The aluminium base copper-clad plate of heat dissipation type high of under this background, being born.To the structure and the performance characteristics of aluminium base copper-clad plate, when machining, because the adhesion of dielectric layer and aluminium face is not enough, easy generation is fallen dielectric layer, is collapsed the phenomenon on limit.
The dielectric layer of aluminium base copper-clad plate and aluminium face adhesion are not enough, can have a strong impact on making and the performance thereof of PCB, even cause and scrap.In the process for treating surface of existing aluminium sheet, adopt sandblast or anodized usually.Use blasting treatment, cost is low, but unstable properties; Use anodized, though stable performance, efficient is low, cost is high, big to the pollution of environment.
Therefore, prior art awaits improving and development.
Summary of the invention
The object of the present invention is to provide that a kind of efficient is high, cost is low, the processing method on stable performance, aluminium base copper-clad plate aluminium surface that environmental pollution is little.
Technical scheme of the present invention is following:
The processing method on a kind of aluminium base copper-clad plate aluminium surface may further comprise the steps:
A, at least a strongly acidic solution of use carry out oil removal treatment to surface of aluminum plate, washing then;
B, at least a strong alkali solution of use carry out the alkali erosion to surface of aluminum plate and handle washing then;
C, use pressurization deionized water clean oven dry then to surface of aluminum plate;
D, evenly coating layer of surface inorganic agent, oven dry then on surface of aluminum plate.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, described step B also comprises
After B1, alkali erosion are handled, use at least a strongly acidic solution that surface of aluminum plate is carried out neutralisation treatment, then washing.
The processing method on described aluminium base copper-clad plate aluminium surface wherein, among described steps A and the B, after the washing, is carried out the overflow washing again.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, the hot water that is not less than 40 degrees centigrade is used in the washing among described steps A and the B.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, described steps A and B carry out on the vertical cleaning line.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, described step C carries out on horizontal Cleaning Line.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, described step D carries out on the surface-coated machine.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, described strongly acidic solution is that sulfuric acid, nitric acid and sodium peroxydisulfate are formed, described strong alkali solution is a NaOH.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, described surface conditioning agent joins agent for the silane lotus root.
The processing method on described aluminium base copper-clad plate aluminium surface, wherein, described surface conditioning agent joins agent by the silane lotus root and deionized water is prepared according to the mass ratio of 1:19.
The present invention carries out oil removal treatment through strongly acidic solution to surface of aluminum plate, through strong alkali solution surface of aluminum plate is carried out alkali erosion and handles, and removes the impurity, greasy dirt, oxide of surface of aluminum plate etc., the aluminium of alligatoring simultaneously face.Use the pressurization deionized water that surface of aluminum plate is cleaned then; The oven dry back evenly applies the layer of surface inorganic agent on surface of aluminum plate; Oven dry can be accomplished the processing on aluminium base copper-clad plate aluminium surface then; Treatment effeciency of the present invention is high, cost is low, stable performance, environmental pollution are little, after the machining test, dielectric layer does not occur falling, collapses the phenomenon on limit.Handle surface of aluminum plate with the method, can satisfy the requirement of machining in the PCB manufacturing process fully.
Description of drawings
Fig. 1 is the vertical cleaning sketch map of the processing method on a kind of aluminium base copper-clad plate aluminium of the present invention surface.
Embodiment
The invention provides the processing method on a kind of aluminium base copper-clad plate aluminium surface, clearer, clear and definite for making the object of the invention, technical scheme and effect, below with reference to accompanying drawing and give an actual example to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The invention discloses the processing method on a kind of aluminium base copper-clad plate aluminium surface, may further comprise the steps:
After the aluminium sheet of aluminium base copper-clad plate fixes, preferentially be fixed on the carrying out that is beneficial to steps A and B on the vertical cleaning line.At first it is cleaned, steps A, at least a strongly acidic solution of use carry out oil removal treatment to surface of aluminum plate, washing then; Further; Described strongly acidic solution is that sulfuric acid, nitric acid and sodium peroxydisulfate are formed; Shown in liquid medicine preparation table (table 1); Be the preferred embodiment of the component and the degree of depth of various cleaning liquid medicine, wherein each component concentrations is respectively sulfuric acid and the nitric acid of 5g/L in the strongly acidic solution of oil removal treatment, and concentration is the sodium peroxydisulfate of 4g/L.
After the oil removal treatment, just carry out step B, use at least a strong alkali solution that surface of aluminum plate is carried out alkali erosion processing, washing then; Described strong alkali solution is a NaOH.Preferred embodiment is shown in liquid medicine preparation table.It is the NaOH of 30g/L that strong alkali solution adopts concentration.Through the cleaning of steps A and B, can effectively remove the impurity, greasy dirt, oxide of surface of aluminum plate etc., while alligatoring aluminium face.
Preferred embodiment is after described step B comprises that also step B1, alkali erosion are handled, to use at least a strongly acidic solution that surface of aluminum plate is carried out neutralisation treatment, then washing.Shown in liquid medicine preparation table.It is the sulfuric acid of 20g/L that neutralisation treatment adopts concentration.With the purpose of NaOH, as shown in Figure 2, the washing of neutralization uses normal-temperature water to get final product in can reaching fast, and the employed strongly acidic solution of neutralisation treatment also is a normal temperature.
Better embodiment; As shown in Figure 1; Be the cleaning process on the vertical cleaning line of the present invention, the technological process of steps A and step B is: upper plate → oil removing → hot water wash → secondary overflow washing → alkali erosion → hot water wash → secondary overflow washing → neutralization → secondary overflow washing → lower plate, among promptly described steps A and the step B; After the washing, carry out the overflow washing again.Shown in process parameter table (table 2), the hot water that is not less than 40 degrees centigrade is used in the washing among said steps A and the B.Further, said hot water is 50 degrees centigrade, further; The used strongly acidic solution temperature of described oil removal treatment is 50 degrees centigrade; The oil removing time is 60 seconds, and the strong alkali solution temperature that described alkali erosion is handled is 60 degrees centigrade, and the oil removing time is 60 seconds; The used sulfuric acid tool of described neutralisation treatment is used normal temperature, and the time also is 60 seconds.
After the alkali erosion is handled, just aluminium sheet is moved on on the horizontal Cleaning Line, carry out next step flow process.Step C, use pressurization DI water (deionized water) clean surface of aluminum plate, then oven dry.The preferred scheme of step C dries up with high wind, and then uses hot blast drying after being to use three grades of pressurization DI washing, so just can both effectively protect surface of aluminum plate, prevents to break, again can be air-dry fast, raise the efficiency.
After the washed with de-ionized water; Aluminium sheet is moved on on the surface-coated machine,, can promote effectively to apply on the surface of aluminum plate evenly owing to have the vacuum of suction platform on the surface-coated machine; Enter into step D then, on surface of aluminum plate, evenly apply the layer of surface inorganic agent; Described surface conditioning agent can improve the bonding force of surface of aluminum plate, and the coating thickness of described surface conditioning agent is 2-5UM, then oven dry.Described surface conditioning agent joins agent for the silane lotus root.More specifically, described surface conditioning agent is prepared according to the mass ratio of 1:19 by couplet agent of silane lotus root and deionized water.The concentration that is surface conditioning agent is 5%.
After the oven dry of coating surface inorganic agent, promptly accomplished the processing on aluminium base copper-clad plate aluminium of the present invention surface.Through test.Machining test is carried out in aluminium base copper-clad plate after the pressing, dielectric layer do not occurred falling, collapse the phenomenon on limit.Handle surface of aluminum plate with the method, can satisfy the requirement of machining in the PCB manufacturing process fully.And the present invention also has following advantage: efficient is high, cost is low, stable performance, environmental pollution are little.
Above-mentioned scavenging period, temperature and chemical concentration etc. are a kind of selection mode wherein, and other time and ratio etc. also can reach effect equally preferably.
Should be understood that, concerning those of ordinary skills, can improve or conversion, and all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.
Claims (10)
1. the processing method on an aluminium base copper-clad plate aluminium surface may further comprise the steps:
A, at least a strongly acidic solution of use carry out oil removal treatment to surface of aluminum plate, washing then;
B, at least a strong alkali solution of use carry out the alkali erosion to surface of aluminum plate and handle washing then;
C, use pressurization deionized water clean oven dry then to surface of aluminum plate;
D, evenly coating layer of surface inorganic agent, oven dry then on surface of aluminum plate.
2. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 1 surface is characterized in that described step B also comprises
After B1, alkali erosion are handled, use at least a strongly acidic solution that surface of aluminum plate is carried out neutralisation treatment, then washing.
3. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 1 surface is characterized in that, among described steps A and the B, after the washing, carries out the overflow washing again.
4. like the processing method on the arbitrary described aluminium base copper-clad plate aluminium of claim 1～3 surface, it is characterized in that the hot water that is not less than 40 degrees centigrade is used in the washing among described steps A and the B.
5. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 1 surface is characterized in that described steps A and B carry out on the vertical cleaning line.
6. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 1 surface is characterized in that described step C carries out on horizontal Cleaning Line.
7. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 1 surface is characterized in that described step D carries out on the surface-coated machine.
8. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 1 surface is characterized in that described strongly acidic solution is that sulfuric acid, nitric acid and sodium peroxydisulfate are formed, and described strong alkali solution is a NaOH.
9. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 1 surface is characterized in that described surface conditioning agent joins agent for the silane lotus root.
10. the processing method on aluminium base copper-clad plate aluminium as claimed in claim 9 surface is characterized in that described surface conditioning agent joins agent by the silane lotus root and deionized water is prepared according to the mass ratio of 1:19.
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| CN201110389966.5A CN102497734B (en) | 2011-11-30 | 2011-11-30 | Processing method of aluminum surface of aluminum base copper clad laminate |
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| CN201110389966.5A CN102497734B (en) | 2011-11-30 | 2011-11-30 | Processing method of aluminum surface of aluminum base copper clad laminate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916227A (en) * | 2012-07-31 | 2013-02-06 | 武汉银泰科技电源股份有限公司 | Manufacturing method of lead-carbon battery used for pure electric vehicle |
| CN104270893A (en) * | 2014-08-27 | 2015-01-07 | 无锡长辉机电科技有限公司 | PCB surface processing technology |
| CN108012438A (en) * | 2017-11-24 | 2018-05-08 | 江门市奔力达电路有限公司 | A kind of pcb board ink cleaning |
| CN113291035A (en) * | 2020-02-21 | 2021-08-24 | 东莞市立基电子材料有限公司 | Laminating method of aluminum-based copper-clad plate |
Citations (4)
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| JPH01208480A (en) * | 1988-02-17 | 1989-08-22 | Elna Co Ltd | Production of laminated substrate with aluminum base clad with copper |
| JPH10296908A (en) * | 1997-04-25 | 1998-11-10 | Hitachi Chem Co Ltd | Manufacture of aluminum-sheet-base copper-clad laminated sheet |
| CN1388009A (en) * | 2001-05-30 | 2003-01-01 | 富士胶片株式会社 | Supporting body for lithographic printing plate and lithographic printing plate originals |
| CN102181866A (en) * | 2011-04-14 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Method for roughening surface of aluminum substrate |
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2011
- 2011-11-30 CN CN201110389966.5A patent/CN102497734B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01208480A (en) * | 1988-02-17 | 1989-08-22 | Elna Co Ltd | Production of laminated substrate with aluminum base clad with copper |
| JPH10296908A (en) * | 1997-04-25 | 1998-11-10 | Hitachi Chem Co Ltd | Manufacture of aluminum-sheet-base copper-clad laminated sheet |
| CN1388009A (en) * | 2001-05-30 | 2003-01-01 | 富士胶片株式会社 | Supporting body for lithographic printing plate and lithographic printing plate originals |
| CN102181866A (en) * | 2011-04-14 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Method for roughening surface of aluminum substrate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916227A (en) * | 2012-07-31 | 2013-02-06 | 武汉银泰科技电源股份有限公司 | Manufacturing method of lead-carbon battery used for pure electric vehicle |
| CN102916227B (en) * | 2012-07-31 | 2015-07-29 | 武汉银泰科技电源股份有限公司 | A kind of manufacture method of pure electric vehicle lead-carbon battery |
| CN104270893A (en) * | 2014-08-27 | 2015-01-07 | 无锡长辉机电科技有限公司 | PCB surface processing technology |
| CN108012438A (en) * | 2017-11-24 | 2018-05-08 | 江门市奔力达电路有限公司 | A kind of pcb board ink cleaning |
| CN108012438B (en) * | 2017-11-24 | 2019-09-24 | 江门市奔力达电路有限公司 | A kind of pcb board ink cleaning process |
| CN113291035A (en) * | 2020-02-21 | 2021-08-24 | 东莞市立基电子材料有限公司 | Laminating method of aluminum-based copper-clad plate |
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| CN102497734B (en) | 2014-04-16 |
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