CN102495505A - Electrostatic protection method used in process of assembling liquid crystal display - Google Patents
Electrostatic protection method used in process of assembling liquid crystal display Download PDFInfo
- Publication number
- CN102495505A CN102495505A CN2011104387912A CN201110438791A CN102495505A CN 102495505 A CN102495505 A CN 102495505A CN 2011104387912 A CN2011104387912 A CN 2011104387912A CN 201110438791 A CN201110438791 A CN 201110438791A CN 102495505 A CN102495505 A CN 102495505A
- Authority
- CN
- China
- Prior art keywords
- protection method
- bonding pad
- electrostatic protection
- testing cushion
- electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
The invention provides an electrostatic protection method used in the process of assembling a liquid crystal display, which comprises the following steps of: providing an adapter bonding pad and connecting common voltage ends of array substrates to a common voltage end of a color filter glass substrate by the adapter bonding pad; providing a plurality of test cushions, wherein each test cushion comprises a plurality of signal wires and each signal wire is correspondingly connected to an input/output terminal of a control chip of the corresponding array substrate; connecting the adapter bonding pad with the plurality of test cushions by electric leads; and cutting an integral blade formed by the plurality of array substrates into pieces of array substrates so as to electrically disconnect the adapter bonding pad with the plurality of test cushions. Due to the adoption of the electrostatic protection method, the adapter bonding pad which is electrically connected to the common voltage ends of the array substrates is connected with the test cushions which comprise the plurality of signal wires of the input/output terminals of the control chips by one electric lead, so that electrostatic energy formed in the transport, friction and wear process are shared by the plurality of signal wires and no voltage difference is formed on crossover lines between signals, and thus, the ESD (Electronic Static Discharge) damage cannot be caused.
Description
Technical field
The present invention relates to a kind of package technique of LCD, the electrostatic protection method when relating in particular to this LCD assembling.
Background technology
Current, low temperature polycrystalline silicon technology (LTPS, Low Temperature Poly-silicon) has obtained being widely used.Especially; Organic light emission liquid crystal panel of new generation by LTPS derives is also formally gone on the practical stage, and its sharpest edges are to be, ultra-thin, in light weight, low power consumption; Meanwhile; Can luminous these characteristics based on himself, thereby more gorgeous color and image more clearly can be provided, and manufacturing cost has only 1/3rd of normal liquid crystal panel.
In the prior art, LTPS type LCD comprises an array basal plate and a colored filter glass substrate.The V of the thin film transistor (TFT) on the array base palte (TFT)
COMSignal generally is electrically connected to the V of colored filter glass substrate by testing cushion (Test Pad)
COMSignal end, therefore, after array base palte was finished, before the corresponding assembling with the colored filter glass substrate, this testing cushion was in naked state usually.As everyone knows, transporting and to friction or wear phenomenon that when group occurs, all be easy to cause static to discharge and take place, this static is from V
COMThe testing cushion of signal gets in the liquid crystal panel, and then makes and V
COMOther signal wires of signal cross-line cause damage because of static.
In order to solve this puzzlement, one of traditional technical implementation way is to adopt the electrostatic defending diode, the path that stops static release through the unidirectional conduction of diode.But friction, wearing and tearing or array base palte and colored filter glass substrate release energy bigger to the static in when group, and the diode that is used for electrostatic defending is breakdown probably, the forfeiture safeguard function.In addition, also can avoid V
COMRCA and other power lead or RCA have the cross-line chance, but in practice, and the client needs assigned I C or during with other products share I C, and the exhaust position of signal is had certain restriction or requirement, and this just causes can't avoid V really
COMCross-line situation between signal and other power lead or the RCA, and then static damage problem also can appear.
In view of this, how to design a kind of LCD electrostatic protection method in when assembling that is used for, make V
COMWhen cross-line appears in RCA and power lead or RCA, can't produce too high energy, satisfy preset ESD requirement of shelter, be a problem needing to be resolved hurrily of person skilled in the industry.
Summary of the invention
Existing above-mentioned defective during to LCD of the prior art assembling, the invention provides a kind of novelty be used for the LCD assembling time electrostatic protection method.
According to one aspect of the present invention, a kind of LCD electrostatic protection method in when assembling that is used for is provided, said LCD comprises an array basal plate and a colored filter glass substrate, wherein, said electrostatic protection method comprises:
One switching bonding pad is provided, the common electric voltage end of said array base palte is electrically connected to the common electric voltage end of said colored filter glass substrate by said switching bonding pad;
A plurality of testing cushion are provided, and each testing cushion comprises many signal line, and every signal line is electrically connected to the input/output terminal in the control chip of said array base palte accordingly;
Connect said switching bonding pad and said a plurality of testing cushion by conductor wire, so that the common electric voltage terminal of many signal line in said each testing cushion and said array base palte keeps same current potential; And
To cut into each array base palte by the full wafer that said a plurality of array base paltes constitute, with said switching bonding pad and the said a plurality of testing cushion of electrically disconnecting.
Preferably, the input/output terminal of said control chip also comprises an electrostatic test node to the cabling of corresponding testing cushion, and said electrostatic test node is connected to the two ends of a power supply respectively via one first diode and one second diode.
Preferably; Said power supply is a bipolar power supply; And the forward voltage that said electrostatic test node is connected to said power supply via the anode and the negative electrode of said first diode successively, and the said electrostatic test node negative voltage that is connected to said power supply via the negative electrode and the anode of said second diode successively.
Preferably, the cabling of each signal line from said electrostatic test node to corresponding testing cushion is set in parallel in vertical direction.
Preferably, the conductor wire that connects said switching bonding pad and said testing cushion is processed by ITO (indium tin oxide) or IZO (indium-zinc oxide) material.More preferably, said conductor wire is positioned at a precut district, after said a plurality of array base paltes are separated from each other by said precut district, electrically disconnects between said each signal line and the said common electric voltage terminal.
Preferably, said LCD is low-temperature polysilicon film transistor (LTPS-TFT, a Low Temperature Poly-Silicon Thin Film Transistor) LCD.
Adopt the LCD electrostatic protection method in when assembling that is used for of the present invention; The switching bonding pad that will be electrically connected on array base palte common electric voltage end by a conductor wire links together with the testing cushion of many signal line of the input/output terminal that comprises control chip; So that the electrostatic energy that transports, forms in the friction, wear process is shared to many RCAs jointly; And no-voltage is poor on the cross-line between signal, thereby can not cause ESD to damage.In addition; This conductor wire is arranged on the precut district on the full wafer that a plurality of array base paltes constitute; When being cut into littler array base palte, many cablings and the common electric voltage end of the input/output terminal of the control chip that had before linked together electrically disconnect, to avoid the circuit situation that is short-circuited.
Description of drawings
The reader with reference to advantages after the embodiment of the present invention, will become apparent various aspects of the present invention.Wherein,
Circuit when the array base palte that Fig. 1 illustrates LCD is used for electrostatic defending with the colored filter glass substrate during to group is connected synoptic diagram;
Fig. 2 illustrates according to one aspect of the present invention, the FB(flow block) of the electrostatic protection method when being used for the LCD assembling.
Embodiment
For technology contents that the application is disclosed is more detailed and complete, can be with reference to accompanying drawing and following various specific embodiments of the present invention, identical mark is represented same or analogous assembly in the accompanying drawing.Yet the embodiment that those of ordinary skill in the art should be appreciated that hereinafter to be provided is used for limiting the scope that the present invention is contained.In addition, accompanying drawing only is used for schematically explaining, does not draw according to its life size.
With reference to the accompanying drawings, the embodiment of various aspects of the present invention is done further to describe in detail.
Circuit when the array base palte that Fig. 1 illustrates LCD is used for electrostatic defending with the colored filter glass substrate during to group is connected synoptic diagram.With reference to Fig. 1; On the full wafer that is made up of a plurality of array base paltes, the common electric voltage end of each array base palte is connected to the common electric voltage end of colored filter glass substrate via switching bonding pad, for example; The common electric voltage end of array base palte is by switching bonding pad 100; Utilize conductor wire 104 to be electrically connected to testing cushion 102, and the common electric voltage end of array base palte utilize conductor wire 204 to be electrically connected to testing cushion 202 by switching bonding pad 200.
To testing cushion 102 and 202, be example with testing cushion 102, it comprises many signal line, every signal line is electrically connected to the input/output terminal in the control chip (ASIC) on the array base palte accordingly.Preferably; The input/output terminal of this ASIC also comprises an electrostatic test node (ESD) to the cabling of corresponding testing cushion; This electrostatic test node is connected to the two ends of a power supply respectively via one first diode and one second diode; As, this power supply is a bipolar power supply, comprises positive voltage terminal VDD and negative voltage side VSS; The negative voltage end VSS that the electrostatic test node forward voltage end VDD that is connected to power supply via the anode and the negative electrode of first diode successively then, this electrostatic test node are connected to power supply via the negative electrode and the anode of second diode successively.In addition, meet cabling requirement in order to guarantee the spacing distance between every signal line, the cabling of each signal line from electrostatic test node to corresponding testing cushion is set in parallel in vertical direction.
In one embodiment, the conductor wire 104 that connects switching bonding pad 100 and testing cushion 102 is processed by ITO (indium tin oxide) or IZO (indium-zinc oxide) material.Preferably, this conductor wire 104 is positioned at a precut district, after a plurality of array base paltes are separated from each other by precut district, electrically disconnects between each signal line and the common electric voltage terminal, to avoid the generation of short circuit situation.
In another specific embodiment, this LCD is low-temperature polysilicon film transistor (LTPS-TFT, a Low Temperature Poly-Silicon Thin Film Transistor) LCD.
Fig. 2 illustrates according to one aspect of the present invention, the FB(flow block) of the electrostatic protection method when being used for the LCD assembling.
With reference to Fig. 2, in electrostatic protection method of the present invention, at first execution in step S21 provides a switching bonding pad, the common electric voltage end of said array base palte is electrically connected to the common electric voltage end of said colored filter glass substrate by said switching bonding pad.Then, in step S23, a plurality of testing cushion are provided, each testing cushion comprises many signal line, and every signal line is electrically connected to the input/output terminal in the control chip of said array base palte accordingly.Then, in step S25, connect said switching bonding pad and said a plurality of testing cushion, so that the common electric voltage terminal of many signal line in said each testing cushion and said array base palte keeps same current potential by conductor wire.At last, execution in step S27 will cut into each array base palte by the full wafer that said a plurality of array base paltes constitute, with said switching bonding pad and the said a plurality of testing cushion of electrically disconnecting.
Adopt the LCD electrostatic protection method in when assembling that is used for of the present invention; The switching bonding pad that will be electrically connected on array base palte common electric voltage end by a conductor wire links together with the testing cushion of many signal line of the input/output terminal that comprises control chip; So that the electrostatic energy that transports, forms in the friction, wear process is shared to many RCAs jointly; And no-voltage is poor on the cross-line between signal, thereby can not cause ESD to damage.In addition; This conductor wire is arranged on the precut district on the full wafer that a plurality of array base paltes constitute; When being cut into littler array base palte, many cablings and the common electric voltage end of the input/output terminal of the control chip that had before linked together electrically disconnect, to avoid the circuit situation that is short-circuited.
In the preceding text, illustrate and describe embodiment of the present invention.But those skilled in the art can understand, and under situation without departing from the spirit and scope of the present invention, can also specific embodiments of the invention do various changes and replacement.These changes and replacement all drop in claims of the present invention institute restricted portion.
Claims (7)
1. one kind is used for the LCD electrostatic protection method in when assembling, and said LCD comprises an array basal plate and a colored filter glass substrate, it is characterized in that said electrostatic protection method comprises:
One switching bonding pad is provided, the common electric voltage end of said array base palte is electrically connected to the common electric voltage end of said colored filter glass substrate by said switching bonding pad;
A plurality of testing cushion are provided, and each testing cushion comprises many signal line, and every signal line is electrically connected to the input/output terminal in the control chip of said array base palte accordingly;
Connect said switching bonding pad and said a plurality of testing cushion by conductor wire, so that the common electric voltage terminal of many signal line in said each testing cushion and said array base palte keeps same current potential; And
To cut into each array base palte by the full wafer that said a plurality of array base paltes constitute, with said switching bonding pad and the said a plurality of testing cushion of electrically disconnecting.
2. electrostatic protection method according to claim 1; It is characterized in that; The input/output terminal of said control chip also comprises an electrostatic test node to the cabling of corresponding testing cushion, said electrostatic test node is connected to the two ends of a power supply respectively via one first diode and one second diode.
3. electrostatic protection method according to claim 2; It is characterized in that; Said power supply is a bipolar power supply; And the forward voltage that said electrostatic test node is connected to said power supply via the anode and the negative electrode of said first diode successively, and the said electrostatic test node negative voltage that is connected to said power supply via the negative electrode and the anode of said second diode successively.
4. electrostatic protection method according to claim 2 is characterized in that, the cabling of each signal line from said electrostatic test node to corresponding testing cushion is set in parallel in vertical direction.
5. electrostatic protection method according to claim 1 is characterized in that, the conductor wire that connects said switching bonding pad and said testing cushion is processed by ITO (indium tin oxide) or IZO (indium-zinc oxide) material.
6. electrostatic protection method according to claim 5; It is characterized in that; Said conductor wire is positioned at a precut district, after said a plurality of array base paltes are separated from each other by said precut district, electrically disconnects between said each signal line and the said common electric voltage terminal.
7. electrostatic protection method according to claim 1 is characterized in that, said LCD is low-temperature polysilicon film transistor (LTPS-TFT, a Low Temperature Poly-Silicon Thin Film Transistor) LCD.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104387912A CN102495505A (en) | 2011-12-21 | 2011-12-21 | Electrostatic protection method used in process of assembling liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104387912A CN102495505A (en) | 2011-12-21 | 2011-12-21 | Electrostatic protection method used in process of assembling liquid crystal display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102495505A true CN102495505A (en) | 2012-06-13 |
Family
ID=46187341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104387912A Pending CN102495505A (en) | 2011-12-21 | 2011-12-21 | Electrostatic protection method used in process of assembling liquid crystal display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102495505A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104267553A (en) * | 2014-07-30 | 2015-01-07 | 友达光电股份有限公司 | Component substrate and alignment method thereof |
| CN105785239A (en) * | 2016-03-09 | 2016-07-20 | 深圳市华星光电技术有限公司 | ESD testing apparatus and ESD testing method |
| CN109785746A (en) * | 2018-12-28 | 2019-05-21 | 友达光电（昆山）有限公司 | A kind of display device |
| WO2020259318A1 (en) * | 2019-06-26 | 2020-12-30 | 滁州惠科光电科技有限公司 | Assembling test circuit, array substrate, and liquid crystal display apparatus |
-
2011
- 2011-12-21 CN CN2011104387912A patent/CN102495505A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104267553A (en) * | 2014-07-30 | 2015-01-07 | 友达光电股份有限公司 | Component substrate and alignment method thereof |
| CN104267553B (en) * | 2014-07-30 | 2017-04-12 | 友达光电股份有限公司 | Component substrate and alignment method thereof |
| CN105785239A (en) * | 2016-03-09 | 2016-07-20 | 深圳市华星光电技术有限公司 | ESD testing apparatus and ESD testing method |
| CN105785239B (en) * | 2016-03-09 | 2018-10-26 | 深圳市华星光电技术有限公司 | ESD test devices and ESD test methods |
| CN109785746A (en) * | 2018-12-28 | 2019-05-21 | 友达光电（昆山）有限公司 | A kind of display device |
| WO2020259318A1 (en) * | 2019-06-26 | 2020-12-30 | 滁州惠科光电科技有限公司 | Assembling test circuit, array substrate, and liquid crystal display apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11430932B2 (en) | Driving backplane, micro-LED display panel and display devices | |
| US10796648B2 (en) | Smart pixel lighting and display microcontroller | |
| EP3487266A1 (en) | Micro led array display device | |
| CN100423061C (en) | Organic electroluminescent device with stand-by driving unit | |
| US11594456B2 (en) | Display module with improved electrical test and manufacturing method of the display module | |
| US10720086B2 (en) | Display device using semiconductor light-emitting diode | |
| CN207852672U (en) | A kind of tetrad RGB-LED encapsulation modules and its display screen | |
| TW201944677A (en) | ESD protection circuit, related display panel with protection against ESD, and ESD protection structure | |
| CN109920334A (en) | A kind of array substrate and display device | |
| TW201923728A (en) | Display and repair method therof | |
| US10312165B1 (en) | Micro lighting device | |
| CN104882451B (en) | A kind of array base palte and preparation method thereof, display panel and display device | |
| CN109801936B (en) | Display panel and repairing method thereof | |
| TWI689092B (en) | Micro led display module having light transmissive substrate and manufacturing method thereof | |
| CN102495505A (en) | Electrostatic protection method used in process of assembling liquid crystal display | |
| TW201904048A (en) | Micro light emitting diode display module and manufacturing method thereof | |
| TW201926668A (en) | Micro lighting device | |
| TWI611573B (en) | Micro led display module and manufacturing method thereof | |
| CN202259302U (en) | Electrostatic protection circuit, array substrate and display device | |
| TWI796970B (en) | Semiconductor device and display device | |
| CN217822040U (en) | Pixel circuit of display device and display device | |
| CN113228286B (en) | LED display module, repairing method and display device | |
| CN216849936U (en) | Light emitting device package structure and display device | |
| US11854493B2 (en) | Display substrate and display device | |
| CN102468449A (en) | Method for eliminating electrode short circuit of organic electroluminescent display |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120613 |