CN102492884B - Preparation method of novel tungsten-copper-zinc alloy material - Google Patents
Preparation method of novel tungsten-copper-zinc alloy material Download PDFInfo
- Publication number
- CN102492884B CN102492884B CN 201110406530 CN201110406530A CN102492884B CN 102492884 B CN102492884 B CN 102492884B CN 201110406530 CN201110406530 CN 201110406530 CN 201110406530 A CN201110406530 A CN 201110406530A CN 102492884 B CN102492884 B CN 102492884B
- Authority
- CN
- China
- Prior art keywords
- tungsten
- copper
- powder
- preparation
- alloy material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Powder Metallurgy (AREA)
Abstract
The invention discloses a preparation method of a tungsten-copper-zinc alloy material. The preparation method comprises the specific processes of: burdening and mixing micro-scale pure tungsten powder, tungsten powder coated by pure copper on the surface as well as micro-scale copper powder and zinc powder, and carrying out cold isostatic extrusion, spark plasma sintering (SPS) and other methods to prepare the tungsten-copper-zinc alloy material with relative density more than 95%. The preparation method has the advantages that: by virtue of the preparation method, the tungsten-copper-zinc composite material with the relative density more than 95%, high hardness and higher strength can be prepared; brass has higher strength and hardness than pure copper; and through combing high strength and high density of tungsten as well as high conductivity, high thermal conductivity, higher strength and hardness and other performances of brass, the high-temperature-resistant and corrosion-resistant tungsten-copper-zinc alloy material suitable for electric spark machining, electronic packaging and aerospace materials are prepared.
Description
Technical field
The present invention relates to the preparation technology of refractory metal and metal composite, belong to metallurgical technology field, especially a kind of preparation method of tungsten copper zinc alloy material.
Background technology
The tungsten-based composite material that the present invention relates to is tungsten-copper zinc alloy material.Tungsten-copper composite material has high-density, the low thermal coefficient of expansion of tungsten concurrently, the electric-conductivity heat-conductivity high that copper is arranged again, its heat conduction, conductivity and thermal expansivity can be designed by adjusting the tungsten copper component concentration, therefore are widely used in the fields such as broken first material in microwave device, integrated circuit packaging material, contact material and war industry.
The technical matters of preparation tungsten-copper composite material has the molten two kinds of methods such as method and powder metallurgy sintered method of oozing usually.
Although Tungsten-copper Composites has the advantage of tungsten and copper concurrently, its corresponding shortcoming is arranged also.Because the intensity of fine copper is lower, generally lower than 200MPa, causes no matter adopting and moltenly ooze method or standby tungsten-copper composite material intensity and the toughness of powder metallurgy sintered legal system is difficult to reach service requirements.
The invention solves the problem that tungsten-copper composite material intensity is low, hardness is low, make simultaneously freshly prepd tungsten copper zinc alloy material possess the high-density of tungsten and the higher hardness of brass, higher intensity and thermal conductivity, conductivity performance.
Summary of the invention
The object of the invention is to overcome tungsten-copper composite material intensity and the low shortcoming of hardness, provide a kind of and have tungsten and copper advantage concurrently and have tungsten copper zinc alloy composites of higher-strength, high rigidity and preparation method thereof.
The present invention solves the problems of the technologies described above the technical scheme of taking: utilize brass to replace fine copper as the Binder Phase in tungsten-copper composite material, brass and tungsten coat mutually, connect, wherein the content of tungsten is 60%～80%, all the other are brass, and utilize discharging plasma sintering equipment to carry out electricimpulse thermal treatment to material, control the phase structure of the inner brass Binder Phase of tungsten copper zinc alloy material and adjust Fracture of Material And.
Mass percentage content for above-mentioned tungsten can be 60-80%; In the brass Binder Phase, the mass percent of copper can be 59-70%.
Preparation method for above-mentioned tungsten copper zinc alloy material comprises the steps:
(1) prepare burden according to the component content of above-mentioned tungsten copper zinc alloy material, utilize " V " type blender that metal tungsten powder or copper coating tungsten powder, copper powder and metal zinc are mixed by certain mass percent.
(2) alloying element powder that mixes in step (1) is reduced in nitrogen atmosphere, obtain mixing fully and the mechanical mixture of few oxidized three kinds of pure metal powders.
(3) metal-powder after reducing is packed in graphite jig; utilize discharge plasma to carry out sintering, sintering temperature is 800 ℃～1200 ℃, and exerting pressure is 20MPa～50MPa; the sintered heat insulating time is 1min～5min, and sintering atmosphere is vacuum or argon shield.
(4) alloy material after the sintering preparation is carried out the electricimpulse vacuum heat treatment in discharging plasma sintering equipment, precipitated phase pattern and composition in the regulation and control alloy structure, it is 400 ℃～800 ℃ that temperature is adopted in thermal treatment, and soaking time is 2h～4h, cools to room temperature with the furnace.
With respect to existing tungsten-copper composite material, the New Tungsten of the present invention's preparation-brass matrix material has following advantage:
The tungsten copper zinc alloy material of the present invention preparation has high thermal conductivity and the high conductivity of copper concurrently except the high-melting-point, high-density and the low characteristics such as thermal expansivity that possess tungsten, and this material also has the characteristics such as high rigidity that brass material has, high strength simultaneously.Can carry out vacuum heat treatment by discharging plasma sintering equipment, adjust intensity and the hardness of material by the phase composite of controlling the brass Binder Phase.
Description of drawings
Fig. 1 is the whole pattern of tungsten copper zinc alloy;
Fig. 2 is the local pattern that amplifies of tungsten copper zinc alloy.
Embodiment
Below in conjunction with six specific embodiments, the present invention is further understood in exemplary illustration and help.But the embodiment detail is only for the present invention is described, does not represent the whole technical schemes of the present invention under conceiving, and therefore can not be interpreted as the restriction to technical solution of the present invention.Some do not depart from the unsubstantiality of the present invention's design changes, and for example simple the change or replacement of technical characterictic to have same or similar technique effect, all belong to rights protection scope of the present invention.
Embodiment 1
A kind of tungsten copper zinc alloy material comprises following component and content (weight percent): tungsten 80%, and in the brass Binder Phase, copper 59%, zinc 41%, the preparation method comprises the following steps:
Step 1, selecting median size is tungsten powder, copper powder and the zinc powder of 2～4 μ m, utilizes hydrogen to reduce after utilization " V " type blender mixing 24h, obtains purity at the mixture of three kinds of metal-powders more than 95%.
Step 2 is put into graphite jig with the powder that mixes, and carries out vacuum sintering in discharging plasma sintering equipment.Sintering process adopts 800 ℃ of sintering temperatures, and temperature rise rate is 50 ℃/min, and soaking time 5min carries out solid state sintering.
Step 3, the tungsten copper zinc alloy material that sintering is prepared continues to heat-treat in discharging plasma sintering equipment, and thermal treatment temp adopts 600 ℃, and soaking time is 3h, then cool to room temperature with the furnace, namely be regulated the tungsten that Binder Phase forms-copper zinc alloy material.
Embodiment 2
A kind of tungsten copper zinc alloy material comprises following component and content (weight percent): tungsten 80%, and in the brass Binder Phase, copper 68%, zinc 32%, preparation technology comprises the following steps:
Step 1, selecting median size is tungsten powder, copper powder and the zinc powder of 2～4 μ m, utilizes hydrogen to reduce after utilization " V " type blender mixing 24h, obtains purity at the mixture of three kinds of metal-powders more than 95%.
Step 2 is put into graphite jig with the powder that mixes, and carries out vacuum sintering in discharging plasma sintering equipment.Sintering process adopts 800 ℃ of sintering temperatures, and temperature rise rate is 50 ℃/min, and soaking time 5min carries out solid state sintering.
Step 3, the tungsten copper zinc alloy material that sintering is prepared continues to heat-treat in discharging plasma sintering equipment, and thermal treatment temp adopts 600 ℃, and soaking time is 3h, then cool to room temperature with the furnace, namely be regulated the tungsten copper zinc alloy material that Binder Phase forms.
Embodiment 3
A kind of tungsten copper zinc alloy material comprises following component and content (weight percent): tungsten 80%, and in the brass Binder Phase, copper 59%, zinc 41%, the preparation method comprises the following steps:
Step 1, utilize the mode of electroless plating to coat layer of copper at tungsten powder surface, thickness of coating is 50nm, be to utilize hydrogen to reduce after copper facing tungsten powder, copper powder and zinc powder utilization " V " the type blender mixing 24h of 2～4 μ m with median size, obtain purity at the mixture of three kinds of metal-powders more than 95%.
Step 2 is put into graphite jig with the powder that mixes, and carries out vacuum sintering in discharging plasma sintering equipment.Sintering process adopts 800 ℃ of sintering temperatures, and temperature rise rate is 50 ℃/min, and soaking time 5min carries out solid state sintering.
Step 3, the tungsten that sintering is prepared-brass material continues to heat-treat in discharging plasma sintering equipment, and thermal treatment temp adopts 600 ℃, and soaking time is 3h, then cool to room temperature with the furnace, namely be regulated the tungsten copper zinc alloy material that Binder Phase forms.
Embodiment 4
A kind of tungsten copper zinc alloy material comprises following component and content (weight percent): tungsten 80%, and in the brass Binder Phase, copper 59%, zinc 41%, the preparation method comprises the following steps:
Step 1, selecting median size is tungsten powder, copper powder and the zinc powder of 2～4 μ m, utilizes hydrogen to reduce after utilization " V " type blender mixing 24h, obtains purity at the mixture of three kinds of metal-powders more than 95%.
Step 2 is put into graphite jig with the powder that mixes, and carries out vacuum sintering in discharging plasma sintering equipment.Sintering process adopts 1200 ℃ of sintering temperatures, and temperature rise rate is 50 ℃/min, and soaking time 5min carries out liquid phase sintering.
Step 3, the tungsten copper zinc alloy material that sintering is prepared continues to heat-treat in discharging plasma sintering equipment, and thermal treatment temp adopts 400 ℃, and soaking time is 3h, then cool to room temperature with the furnace, namely be regulated the tungsten copper zinc alloy material that Binder Phase forms.
Embodiment 5
A kind of tungsten copper zinc alloy material comprises following component and content (weight percent): tungsten 80%, and brass Binder Phase copper 68%, zinc 32%, preparation technology comprises the following steps:
Step 1, selecting median size is tungsten powder, copper powder and the zinc powder of 2～4 μ m, utilizes hydrogen to reduce after utilization " V " type blender mixing 24h, obtains purity at the mixture of three kinds of metal-powders more than 95%.
Step 2 is put into graphite jig with the powder that mixes, and carries out vacuum sintering in discharging plasma sintering equipment.Sintering process adopts 1200 ℃ of sintering temperatures, and temperature rise rate is 50 ℃/min, and soaking time 5min carries out liquid phase sintering.
Step 3, the tungsten copper zinc alloy material that sintering is prepared continues to heat-treat in discharging plasma sintering equipment, and thermal treatment temp adopts 400 ℃, and soaking time is 3h, then cool to room temperature with the furnace, namely be regulated the tungsten copper zinc alloy material that Binder Phase forms.
Embodiment 6
A kind of tungsten copper zinc alloy material comprises following component and content (weight percent): tungsten 80%, and in the brass Binder Phase, copper 59%, zinc 41%, the preparation method comprises the following steps:
Step 1, utilize the mode of electroless plating to coat layer of copper at tungsten powder surface, thickness of coating is 50nm, be to utilize hydrogen to reduce after copper facing tungsten powder, copper powder and zinc powder utilization " V " the type blender mixing 24h of 2～4 μ m with median size, obtain purity at the mixture of three kinds of metal-powders more than 95%.
Step 2 is put into graphite jig with the powder that mixes, and carries out vacuum sintering in discharging plasma sintering equipment.Sintering process adopts 1200 ℃ of sintering temperatures, and temperature rise rate is 50 ℃/min, and soaking time 5min carries out liquid phase sintering.
Step 3, the tungsten copper Zinc material that sintering is prepared continues to heat-treat in discharging plasma sintering equipment, and thermal treatment temp adopts 400 ℃, and soaking time is 3h, then cool to room temperature with the furnace, namely be regulated the tungsten copper zinc alloy material that Binder Phase forms.
Claims (6)
1. the preparation method of a tungsten copper zinc alloy material, it is characterized in that: in described tungsten copper zinc alloy material, the content of tungsten is 60-80%, and all the other are Binder Phase brass, and wherein the mass percent of copper is 59-70%; Its preparation method comprises the steps:
(1) prepare burden according to the component content of above-mentioned tungsten copper zinc alloy material, utilize " V " type blender that metal tungsten powder or copper coating tungsten powder, copper powder and metal zinc are mixed by certain mass percent;
(2) alloying element powder that mixes in step (1) is reduced in nitrogen atmosphere, obtain mixing fully and the mechanical mixture of few oxidized three kinds of pure metal powders;
(3) metal-powder after reducing is packed in graphite jig, utilize discharge plasma to carry out sintering, sintering temperature is 800 ℃～1200 ℃, and exerting pressure is 20MPa～50MPa, the sintered heat insulating time is 1min～5min, and sintering atmosphere is vacuum or argon shield;
(4) alloy material after the sintering preparation is carried out the electricimpulse vacuum heat treatment in discharging plasma sintering equipment, precipitated phase pattern and composition in the regulation and control alloy structure, it is 400 ℃～800 ℃ that temperature is adopted in thermal treatment, and soaking time is 2h～4h, cools to room temperature with the furnace.
2. the preparation method of tungsten copper zinc alloy material according to claim 1, it is characterized in that: in described step (1), the mean particle size of tungsten powder and copper coating tungsten powder, copper powder and zinc powder is 2～4 μ m, and the copper-plated thickness of coating of tungsten powder surface is 20nm～200nm; In described step (2), hydrogen reduction method is adopted in reduction.
3. the preparation method of tungsten copper zinc alloy material according to claim 1 and 2, it is characterized in that: the discharge plasma that utilizes in step (3) is sintered to solid state sintering, liquid phase sintering or step sintering.
4. the preparation method of tungsten copper zinc alloy material according to claim 1 and 2, it is characterized in that: powder mixes more than 24h in " V " type blender, powder is mixed fully, and after sinter molding, the brass Binder Phase can be distributed between tungsten particle uniformly.
5. the preparation method of tungsten copper zinc alloy material according to claim 4 is characterized in that: in step (4), the composition of the α of thermal treatment control brass Binder Phase, β phase in discharging plasma sintering equipment is controlled the component content of precipitated phase.
6. the preparation method of tungsten copper zinc alloy material according to claim 1 is characterized in that: after sintering, the density of material is more than 95%, and the median size of tungsten grain is at 3～6 μ m, and the material hardness after the sintering preparation is more than HRC40.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110406530 CN102492884B (en) | 2011-12-07 | 2011-12-07 | Preparation method of novel tungsten-copper-zinc alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110406530 CN102492884B (en) | 2011-12-07 | 2011-12-07 | Preparation method of novel tungsten-copper-zinc alloy material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102492884A CN102492884A (en) | 2012-06-13 |
| CN102492884B true CN102492884B (en) | 2013-06-05 |
Family
ID=46184745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110406530 Expired - Fee Related CN102492884B (en) | 2011-12-07 | 2011-12-07 | Preparation method of novel tungsten-copper-zinc alloy material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102492884B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102925727B (en) * | 2012-11-14 | 2015-03-04 | 武汉理工大学 | Preparation method for high-performance Zn@W-Cu heat composite |
| CN104014792B (en) * | 2014-06-20 | 2016-09-28 | 阮秀仕 | The method using discharge plasma sintering high-performance copper tungsten electric contact material |
| CN105256159B (en) * | 2015-10-22 | 2018-05-29 | 清华大学 | A kind of tungsten-copper composite material and its application |
| CN106048301A (en) * | 2016-07-21 | 2016-10-26 | 安徽旭晶粉体新材料科技有限公司 | Spray method for preparing tungsten-containing copper alloy powder |
| CN106756159B (en) * | 2016-12-28 | 2018-06-15 | 北京有色金属研究总院 | A kind of preparation method of multilevel hierarchy tungsten particle reinforced aluminum matrix composites |
| CN107245594B (en) * | 2017-06-23 | 2019-02-26 | 歌尔股份有限公司 | The preparation method of powdered metallurgical material |
| CN107475995A (en) * | 2017-07-27 | 2017-12-15 | 巢湖市荣达塑业有限公司 | A kind of balancing weight for being adapted to rotary drum washing machine roller |
| CN112877577B (en) * | 2021-01-12 | 2022-02-08 | 中国人民解放军国防科技大学 | Tungsten/zirconium-zinc alloy and preparation method thereof |
| CN113430439B (en) * | 2021-06-28 | 2022-03-01 | 北京理工大学 | Phase distribution uniformity control method of high-toughness active tungsten alloy |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101406955A (en) * | 2008-11-27 | 2009-04-15 | 于洋 | Method for preparing powder deformed composite material |
| CN102031411A (en) * | 2010-12-01 | 2011-04-27 | 武汉理工大学 | Method for preparing compact W-Cu composite material at low temperature |
-
2011
- 2011-12-07 CN CN 201110406530 patent/CN102492884B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101406955A (en) * | 2008-11-27 | 2009-04-15 | 于洋 | Method for preparing powder deformed composite material |
| CN102031411A (en) * | 2010-12-01 | 2011-04-27 | 武汉理工大学 | Method for preparing compact W-Cu composite material at low temperature |
Non-Patent Citations (2)
| Title |
|---|
| 变密宽Cu-W梯度材料的烧结致密化;姜洪义等;《硅酸盐通报》;20011231(第2期);第48-50页 * |
| 姜洪义等.变密宽Cu-W梯度材料的烧结致密化.《硅酸盐通报》.2001,(第2期),第48-50页. |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102492884A (en) | 2012-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102492884B (en) | Preparation method of novel tungsten-copper-zinc alloy material | |
| Dong et al. | Recent progress in development of tungsten-copper composites: Fabrication, modification and applications | |
| Ibrahim et al. | An experimental investigation on the W–Cu composites | |
| Hamidi et al. | Tungsten–copper composite production by activated sintering and infiltration | |
| Zhang et al. | Influence of Ti content on the microstructure and properties of graphite flake/Cu-Ti composites fabricated by vacuum hot pressing | |
| Shi et al. | Enhancing copper infiltration into alumina using spark plasma sintering to achieve high performance Al2O3/Cu composites | |
| Raza et al. | Optimization of sintering parameters for diamond–copper composites in conventional sintering and their thermal conductivity | |
| CN106756376B (en) | Tungsten-copper alloy and its processing method and application | |
| Chen et al. | Effect of interface modification by Cu-coated W powders on the microstructure evolution and properties improvement for Cu–W composites | |
| CN100478467C (en) | Activated sintering preparation method of fine crystalline non-magnetic wolfram-copper alloy | |
| Li et al. | Effect of vacuum heat treatment on microstructure and microhardness of cold-sprayed TiN particle-reinforced Al alloy-based composites | |
| Amirjan et al. | Evaluation of microstructure and contiguity of W/Cu composites prepared by coated tungsten powders | |
| Huang et al. | Effects of TiN nanoparticles on the microstructure and properties of W–30Cu composites prepared via electroless plating and powder metallurgy | |
| Huang et al. | Effects of simplified pretreatment process on the morphology of W–Cu composite powder prepared by electroless plating and its sintering characterization | |
| Li et al. | Fabrication and microstructure of W-Cu composites prepared from Ag-coated Cu powders by electroless plating | |
| Yusefi et al. | Fabrication of three layered W-Cu functionally graded composite via spark plasma sintering | |
| Wei et al. | Effect of diamond surface treatment on microstructure and thermal conductivity of diamond/W-30Cu composites prepared by microwave sintering | |
| CN108149059A (en) | A kind of TiC enhances the preparation method of copper-based electric contact composite material | |
| Leon et al. | Pulsed electric current sintering of Cu matrix composites reinforced with plain and coated alumina powders | |
| Dong et al. | W–Cu system: synthesis, modification, and applications | |
| Li et al. | Low-temperature densification and microstructure of W–Cu composites with Sn additives | |
| Zangeneh-Madar et al. | Improvement of physical properties of Cu-infiltrated W compacts via electroless nickel plating of primary tungsten powder | |
| Yusefi et al. | WCu functionally graded material: Low temperature fabrication and mechanical characterization | |
| Zhou et al. | Densification, microstructure, and properties of W-Mo-Cu alloys prepared with nano-sized Cu powders via large electric current sintering | |
| Liu et al. | Microstructure and properties of silver-added W-Cu prepared by infiltration sintering |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20131207 |