CN102492264A - Low-voltage bus synthetic resin composition for connecting cable - Google Patents
Low-voltage bus synthetic resin composition for connecting cable Download PDFInfo
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- CN102492264A CN102492264A CN2011104187776A CN201110418777A CN102492264A CN 102492264 A CN102492264 A CN 102492264A CN 2011104187776 A CN2011104187776 A CN 2011104187776A CN 201110418777 A CN201110418777 A CN 201110418777A CN 102492264 A CN102492264 A CN 102492264A
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Abstract
The invention discloses a low-voltage bus synthetic resin composition for a connecting cable. The low-voltage bus synthetic resin composition consists of the following components in percentage by weight: 35 to 40 percent of epoxy resin, 5 to 8 percent of polyamide hardener, 4 to 8 percent modified amine hardener, 1 to 3 percent of ST thiokol, 15 to 20 percent of quartz sand of which the particle size is 10 to 50 meshes, 6 to 10 percent of quartz sand of which the particle size is 50 to 80 meshes and 25 to 30 percent of quartz sand of which the particle size is 80 to 150 meshes, wherein the particle size of the quartz sand is between 10 and 150 meshes. The low-voltage bus synthetic resin composition can be poured outside a copper conductor of a bus at the position of the connecting cable on site, and a cured insulating layer has high impact resistance and peeling resistance.
Description
Technical field
The present invention relates to a kind of insulating material, particularly be used to be cast in the outer a kind of compound resin composition of low-voltage bus bar.
Background technology
In the existing power transmission technology, bus uses in electrical meanss such as power distribution cabinet, compensating tank, because its spacing is little; Do not reach insulating requirements by air isolation, therefore, need insulation layer be set on its surface; Epoxy resin is a kind of good insulation performance material of generally acknowledging at present, and its molecular structure is to be characteristic to contain active epoxide group in the molecular chain, after it mixes with corresponding curing agent; Can be cast in the bus surface, epoxide group and solidifying agent generation crosslinking reaction and form and have the cancellated superpolymer of three-dimensional, treat that it solidifies after; Can form good binding with bus, can play the good insulation performance effect.Not enough below it exists, one of which is because the coefficient of expansion of epoxy resin itself and be discrepant as the coefficient of expansion of the copper conductor of bus; When temperature rises; Can produce bigger internal stress between the two, cause epoxy resin cracking, distortion easily, influence the work reliability of electricinstallation.Its two, the fragility of epoxy resin is big, shock-resistant damage ability, resistance toheat is relatively poor relatively, is generally less than 170 ℃.
The Chinese patent DB discloses a kind of compound resin composition that is used for the cast-in-site low-voltage bus bar, and its application number is: 201010539312.1, and it is made up of epoxy resin, polyamide curing agent, modified amine curing agent and silica sand; The weight percent of epoxy resin in compsn is 35%-40%; The weight percent of polyamide curing agent in compsn is 6-9%; The weight percent of modified amine curing agent in compsn is 4-7%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 18-22%; The weight percent of 50-80 order silica sand in compsn is 8-12%, and the weight percent of 80-150 order silica sand in compsn is 16-20%.Said composition is poured into a mould at the scene, and the shock resistance of the composition epoxy resin after the curing is still not ideal enough, can only reach 75KJ/m
- 2About, in addition, its peel strength is relatively low.
Summary of the invention
To the deficiency of prior art, the present invention provides a kind of low-voltage bus bar compound resin composition that is used for tie cable, makes set time short, and the insulation layer after the cast is difficult for tearing, shock-resistant strong.
For solving the problems of the technologies described above, technical scheme of the present invention is following: be used for the low-voltage bus bar compound resin composition of tie cable, it is made up of epoxy resin, polyamide curing agent, modified amine curing agent, ST type thiorubber and silica sand; The weight percent of epoxy resin in compsn is 35%-40%; The weight percent of polyamide curing agent in compsn is 5-8%; The weight percent of modified amine curing agent in compsn is 4-8%; The weight percent of ST type thiorubber in compsn is 1-3%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 15-20%; The weight percent of 50-80 order silica sand in compsn is 6-10%, and the weight percent of 80-150 order silica sand in compsn is 25-30%.
As preferred version of the present invention, the weight percent of epoxy resin in compsn is 35.37%; The weight percent of polyamide curing agent in compsn is 6.38%; The weight percent of modified amine curing agent in compsn is 5.15%; The weight percent of ST type thiorubber in compsn is 1.34%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 15.75%; The weight percent of 50-80 order silica sand in compsn is 8.21%, and the weight percent of 80-150 order silica sand in compsn is 27.8%.
The polyamide curing agent product type can be Aradur 100; The modified amine curing agent product type can be Aradur 3229.Above-mentioned solidifying agent all can obtain from the public offering channel.
In the compsn of the present invention; But epoxy resin model GY783 gets through commercially available, and epoxy resin GY783 is a bisphenol A type epoxy resin; A kind of for the glycidyl ether based epoxy resin; Its oxirane value is 5.10-5.40 Eq/kg, and epoxy equivalent (weight) is 185-196 g/Eq, 25 ℃ of (mPa s): 800-1100 of viscosity.Bus according to the composition production of this prescription can obtain best mechanical property; Its insulation layer good toughness, shock-resistant, have good alkali resistance, acid resistance and anti-dissolubility; Simultaneously, the superior isolation characteristic that has high dielectric property, anti-surface leakage, anti-electric arc.
Said ST thiorubber model is LP-32JLY-215, gets through commercially available.
The compsn that prescription of the present invention forms can be cast in outside the copper conductor after the on-the-spot allotment; Form insulation layer; Insulation layer after the curing is the cancellated superpolymer of three-dimensional; Silica sand is dispersed in the epoxy resin, fills good bonding between epoxy resin and the quartz sand particle via epoxy resin between big footpath particle and the path particle; The proportionlity of silica sand makes that most of quartz sand particles can be approaching each other; Compare with simple epoxy resin, transferring heat energy better is so that help the bus heat radiation at work; Make the temperature of the each several part of insulation layer reach consistent as early as possible simultaneously; Insulation layer self internal layer and outer field having a narrow range of temperature, internal stress is little, can guarantee that insulation layer can not ftracture; Because the mixing of silica sand of multiple different size arranged, make its coefficient of expansion receive to equate that with the coefficient of expansion of copper conductor it can expand with heat and contract with cold with copper conductor synchronously, also can not produce internal stress between the two when being heated, can guarantee that insulation layer can not peel off with copper conductor.Thiorubber is the viton that is got by the polysulfide polycondensation of saturated dihalide and basic metal or earth alkali metal.Excellent oil resistant and solvent resistance are arranged.ST type thiorubber end has sulfydryl, is a kind of low-molecular weight polymer, and it has excellent properties such as low temperature kindliness, solvent resistance, stress relaxation.When thiorubber with after epoxy resin mixes, terminal thiol group and epoxy resin generation chemical reaction, thus get in the epoxy resin structural after the curing, make the epoxy resin good flexible after crosslinked, high shearing resistance and stripping strength.Can overcome the thiol group and the slow shortcoming of epoxy resin speed of reaction of thiorubber.Compared with prior art, this compsn can directly carry out site operation, has reduced difficulty of construction, and the insulation layer after the curing has; Favorable shock resistance can reach 100 KJ/m
- 2, improve more than 30% than the shock resistance of prior art, in addition, its peel strength is big, can reach more than the 2.3KN/m; Said composition can be used for the link position of low-voltage bus bar and cable.The present invention has strengthened the anti-stripping performance and the resistance to impact shock of composition epoxy resin, can effectively guarantee bonding with cable, can be directly and the cable cast, increase degree of protection, and convenient the use can be used in the low-voltage distribution system below the 3KV.
Embodiment
Embodiment 1
Be the preferred assembly side of the present invention: the weight percent of epoxy resin in compsn is 35.37%; The weight percent of polyamide curing agent in compsn is 6.38%; The weight percent of modified amine curing agent in compsn is 5.15%; The weight percent of ST type thiorubber in compsn is 1.34%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 15.75%; The weight percent of 50-80 order silica sand in compsn is 8.21%, and the weight percent of 80-150 order silica sand in compsn is 27.8%.
The polyamide curing agent product type is that Aradur 100, modified amine curing agent product type are that Aradur 3229, epoxy resin model are GY783, and Kai Mike Electron Material Co., Ltd in Wuxi is on sale; ST thiorubber model is LP-32JLY-215, and Tonghua, Louis, Shanghai worker ltd is on sale.Above-mentioned materials not only is confined to above-mentioned company and sells, and has many companies to produce or manage the product of above-mentioned model on the market.
Carry out low-voltage bus bar when cast at the scene, need carry out the configuration of feed liquid earlier, at the scene under the environment with each component thorough mixing, stirred 15-20 minute, mix afterwards in mould the copper conductor periphery of its cast, this copper conductor is an oxygen free copper, treats to take out behind the curing molding; 4-5 hour set time.
Synthetic resins after the curing is for having the superior isolation material of high dielectric property, anti-surface leakage, anti-electric arc, and its alkali resistance, acid resistance and anti-dissolubility are all very strong, in the solution of PH=11, soaks the variation that physical chemical mechanism did not take place in 13 hours; Its impact strength can reach 112KJ/m
- 2Tearing toughness is 2.42 KN/m.
Embodiment 2
Another is used for the low-voltage bus bar compound resin composition of tie cable; Form by epoxy resin, polyamide curing agent, modified amine curing agent, ST type thiorubber and silica sand; Said epoxy resin is epoxy resin GY783; Polyamide curing agent is Aradur 100, and modified amine curing agent is Aradur 3229; ST type thiorubber adopts LP-32JLY-215; The weight percent of epoxy resin in compsn is 35%; The weight percent of polyamide curing agent in compsn is 5%; The weight percent of modified amine curing agent in compsn is 4%; The weight percent of ST type thiorubber in compsn is 1%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 20%, and the weight percent of 50-80 order silica sand in compsn is 10%, and the weight percent of 80-150 order silica sand in compsn is 25%.
Its method of use is identical with embodiment 1.
Embodiment 3
The third is used for the low-voltage bus bar compound resin composition of tie cable; Form by epoxy resin, polyamide curing agent, modified amine curing agent, ST type thiorubber and silica sand; Said epoxy resin is epoxy resin GY783; Polyamide curing agent is Aradur 100, and modified amine curing agent is Aradur 3229; ST type thiorubber adopts LP-32JLY-215; The weight percent of epoxy resin in compsn is 35%; The weight percent of polyamide curing agent in compsn is 5%; The weight percent of modified amine curing agent in compsn is 8%; The weight percent of ST type thiorubber in compsn is 3%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 15%, and the weight percent of 50-80 order silica sand in compsn is 6%, and the weight percent of 80-150 order silica sand in compsn is 28%.
Its method of use is identical with embodiment 1.
Embodiment 4
The 4th kind of low-voltage bus bar compound resin composition that is used for tie cable; Form by epoxy resin, polyamide curing agent, modified amine curing agent, ST type thiorubber and silica sand; Said epoxy resin is epoxy resin GY783; Polyamide curing agent is Aradur 100, and modified amine curing agent is Aradur 3229; ST type thiorubber adopts LP-32JLY-215; The weight percent of epoxy resin in compsn is 40%; The weight percent of polyamide curing agent in compsn is 5%; The weight percent of modified amine curing agent in compsn is 4%; The weight percent of ST type thiorubber in compsn is 2%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 15%, and the weight percent of 50-80 order silica sand in compsn is 9%, and the weight percent of 80-150 order silica sand in compsn is 25%.
Its method of use is identical with embodiment 1.
Embodiment 5
The 5th kind of low-voltage bus bar compound resin composition that is used for tie cable; Form by epoxy resin, polyamide curing agent, modified amine curing agent, ST type thiorubber and silica sand; Said epoxy resin is epoxy resin GY783; Polyamide curing agent is Aradur 100, and modified amine curing agent is Aradur 3229; ST type thiorubber adopts LP-32JLY-215; The weight percent of epoxy resin in compsn is 35%; The weight percent of polyamide curing agent in compsn is 5%; The weight percent of modified amine curing agent in compsn is 4%; The weight percent of ST type thiorubber in compsn is 1%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 19%, and the weight percent of 50-80 order silica sand in compsn is 6%, and the weight percent of 80-150 order silica sand in compsn is 30%.
Embodiment 6
The 6th kind of low-voltage bus bar compound resin composition that is used for tie cable; Form by epoxy resin, polyamide curing agent, modified amine curing agent, ST type thiorubber and silica sand; Said epoxy resin is epoxy resin GY783; Polyamide curing agent is Aradur 100, and modified amine curing agent is Aradur 3229; ST type thiorubber adopts LP-32JLY-215; The weight percent of epoxy resin in compsn is 38%; The weight percent of polyamide curing agent in compsn is 7%; The weight percent of modified amine curing agent in compsn is 6%; The weight percent of ST type thiorubber in compsn is 2%; Quartz sand particle size is the 10-150 order, and wherein the weight percent of 10-50 order silica sand in compsn is 16%, and the weight percent of 50-80 order silica sand in compsn is 6%, and the weight percent of 80-150 order silica sand in compsn is 25%.
To detect after compsn among above-mentioned each embodiment and the sampling of the composition epoxy resin in the prior art curing, can obtain the listed various parameters of following table:
Table one (physicals)
| ? | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Prior art |
| Dielectric strength in the time of 100 ℃ (KV/mm) | 30.4 | 29.6 | 29.9 | 30.3 | 29.2 | 29.3 | 29.6 |
| Thermal conductivity (100 ℃) | 4.02 | 3.91 | 3.86 | 3.88 | 3.81 | 3.83 | 3.90 |
| The coefficient of expansion (1/K) | 1.76×10 -5 | 1.77×10 -5 | 1.76×10 -5 | 1.75×10 -5 | 1.75×10 -5 | 1.75×10 -5 | 1.75×10 -5 |
| Resistance to impact shock (KJ/m 2） | 112.2 | 104.6 | 104.3 | 107 | 103.8 | 104.6 | 75.6 |
| Tearing toughness (KN/m) | 2.42 | 2.35 | 2.34 | 2.38 | 2.35 | 2.36 | 2.1 |
From above table, can find out; The compsn of embodiments of the invention 1 has more outstanding electric and physicals; The compsn of all the other proportion relations is slightly poorer than the compsn among the embodiment 1; But compare with composition epoxy resin in the prior art, resistance to impact shock and tearing toughness obviously strengthen.
The present invention is not limited to the foregoing description; Epoxy resin in the foregoing description can be substituted by other epoxy resin and solidifying agent commonly used in the prior art, and for example epoxy resin can adopt other model in glycidyl ether based epoxy resin, the glycidyl ester based epoxy resin to replace; Polyamide curing agent, modified amine curing agent can adopt the corresponding solidifying agent of other brands to replace, and its effect is suitable basically.
Claims (5)
1. the low-voltage bus bar compound resin composition that is used for tie cable is characterized in that being made up of epoxy resin, polyamide curing agent, modified amine curing agent, ST type thiorubber and silica sand; The weight percent of epoxy resin in compsn is 35%-40%; The weight percent of polyamide curing agent in compsn is 5-8%; The weight percent of modified amine curing agent in compsn is 4-8%; The weight percent of ST type thiorubber in compsn is 1-3%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 15-20%; The weight percent of 50-80 order silica sand in compsn is 6-10%, and the weight percent of 80-150 order silica sand in compsn is 25-30%.
2. the compound resin composition that is used for the cast-in-site low-voltage bus bar according to claim 1 is characterized in that the weight percent of epoxy resin in compsn is 35.37%; The weight percent of polyamide curing agent in compsn is 6.38%; The weight percent of modified amine curing agent in compsn is 5.15%; The weight percent of ST type thiorubber in compsn is 1.34%; Quartz sand particle size is the 10-150 order; Wherein the weight percent of 10-50 order silica sand in compsn is 15.75%; The weight percent of 50-80 order silica sand in compsn is 8.21%, and the weight percent of 80-150 order silica sand in compsn is 27.8%.
3. the compound resin composition that is used for the cast-in-site low-voltage bus bar according to claim 1 and 2 is characterized in that said polyamide curing agent product type is Aradur 100; The modified amine curing agent product type is Aradur 3229.
4. the compound resin composition that is used for the cast-in-site low-voltage bus bar according to claim 1 and 2 is characterized in that said epoxy resin model is GY783.
5. the compound resin composition that is used for the cast-in-site low-voltage bus bar according to claim 1 and 2, the model that it is characterized in that said ST type thiorubber is LP-32JLY-215.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104187776A CN102492264A (en) | 2011-12-15 | 2011-12-15 | Low-voltage bus synthetic resin composition for connecting cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104187776A CN102492264A (en) | 2011-12-15 | 2011-12-15 | Low-voltage bus synthetic resin composition for connecting cable |
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| Publication Number | Publication Date |
|---|---|
| CN102492264A true CN102492264A (en) | 2012-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104187776A Pending CN102492264A (en) | 2011-12-15 | 2011-12-15 | Low-voltage bus synthetic resin composition for connecting cable |
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| Country | Link |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6548189B1 (en) * | 2001-10-26 | 2003-04-15 | General Electric Company | Epoxy adhesive |
| CN102030969A (en) * | 2010-11-11 | 2011-04-27 | 镇江西门子母线有限公司 | Synthetic resin composition for pouring low-voltage bus on site |
-
2011
- 2011-12-15 CN CN2011104187776A patent/CN102492264A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6548189B1 (en) * | 2001-10-26 | 2003-04-15 | General Electric Company | Epoxy adhesive |
| CN102030969A (en) * | 2010-11-11 | 2011-04-27 | 镇江西门子母线有限公司 | Synthetic resin composition for pouring low-voltage bus on site |
Non-Patent Citations (1)
| Title |
|---|
| 刘建铭等: "液体聚硫橡胶的性能与应用", 《云南化工》, vol. 27, no. 4, 31 August 2000 (2000-08-31) * |
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Application publication date: 20120613 |