CN102485938B - 具有抗指纹涂层的被覆件及其制造方法 - Google Patents

具有抗指纹涂层的被覆件及其制造方法 Download PDF

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CN102485938B
CN102485938B CN201010568122.2A CN201010568122A CN102485938B CN 102485938 B CN102485938 B CN 102485938B CN 201010568122 A CN201010568122 A CN 201010568122A CN 102485938 B CN102485938 B CN 102485938B
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fingerprint coating
matrix
covering member
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aluminum oxynitride
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张新倍
陈文荣
蒋焕梧
陈正士
张娟
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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Abstract

本发明提供一种具有抗指纹涂层的被覆件，包括基体及形成于该基体上的抗指纹涂层，该抗指纹涂层包括依次形成于基体上的三氧化二铝层及氮氧化铝层，所述氮氧化铝层中还含有氟离子、硼离子和氮离子中的一种或几种。该被覆件具有良好的抗指纹性。另外，本发明还提供了一种上述被覆件的制造方法。

Description

具有抗指纹涂层的被覆件及其制造方法
技术领域
本发明涉及一种具有抗指纹涂层的被覆件及其制造方法。
背景技术
随着3C电子产品的使用越来越频繁，消费者对产品的外观也有了越来越高的要求。除了要求其色彩美观、手感舒适，还要求其表面具有较好的耐磨性、抗刮伤性、以及抗指纹性。
为了提高金属表面的抗指纹性，美国专利US006736908公开了一种抗指纹化的金属表面处理液。该表面处理液含有特殊有机树脂，可溶性钒化物，以及可溶性金属化合物，其含有Zn、Ti、Mo、W、Mn及Ce中至少一种金属元素，经此处理液处理的金属表面具有良好的抗指纹性。但是，所述特殊的有机树脂成分结构复杂，难以制造，且易对环境造成污染。因此，开发一种能实现抗指纹效果且易于制造、无环境污染的抗指纹涂层实为必要。
发明内容
有鉴于此，有必要提供一种环保的、易于制造的具有抗指纹涂层的被覆件。
另外，还有必要提供一种上述被覆件的制造方法。
一种具有抗指纹涂层的被覆件，包括基体及形成于该基体上的抗指纹涂层，该抗指纹涂层包括依次形成于基体上的三氧化二铝层及氮氧化铝层，所述氮氧化铝层中还含有氟离子、硼离子中的一种或两种。
一种具有抗指纹涂层的被覆件的制造方法，包括以下步骤：
提供一基体；
采用一真空镀膜机，于基体上形成抗指纹涂层，形成该抗指纹涂层包括如下步骤：
以氧气为反应气体，以铝靶为靶材，于所述基体上磁控溅射形成三氧化二铝层；
以氧气及氮气为反应气体，以铝靶为靶材，于所述三氧化二铝层上磁控溅射形成氮氧化铝层；
采用四氟化碳、乙硼烷及氮气中的一种或几种为气源，通过离子注入技术于所述氮氧化铝层表面注入氟离子、硼离子及氮离子中的一种或几种。
所述三氧化二铝层及氮氧化铝层的形成，在一定程度上降低了所述被覆件的表面能。更重要的是，于所述氮氧化铝层表面注入氟离子、硼离子及氮离子中的一种或几种，可提高所述氮氧化铝层的表面熵值，即增加所述氮氧化铝层表面原子的混乱程度，如此可降低所述氮氧化铝层的表面能，从而使被覆件具有良好的抗指纹效果。所述被覆件的制造方法不需要使用特殊的有机树脂，也不需经酸或碱处理，对环境及人体健康无害；且该方法简单易行。
附图说明
图1为本发明较佳实施例的被覆件的剖视图。
主要元件符号说明
基体          10
颜色层        20
抗指纹涂层    30
三氧化二铝层  31
氮氧化铝层    33
被覆件        100
具体实施方式
请参阅图1，本发明一较佳实施例的具有抗指纹涂层的被覆件100包括基体10及形成于该基体10上的透明的抗指纹涂层30。
所述基体10可由金属材料或非金属材料制成。该金属材料可包括不锈钢、铝、铝合金、铜、铜合金、镁合金等。该非金属材料可包括塑料、陶瓷、玻璃、聚合物等。该被覆件100可以为3C电子产品的壳体、家具、厨房用具或其它装潢件。
所述抗指纹涂层30包括依次形成于该基体10上的三氧化二铝(Al2O3)层31及氮氧化铝层(AlON)33。所述Al2O3层31、AlON层33可分别通过磁控溅射镀膜法形成。该Al2O3层31的厚度为200～300nm，AlON层33的厚度为200～300nm。
所述AlON层33中还含有氟离子、硼离子及氮离子中的一种或几种。上述离子可通过离子注入的方式注入到AlON层33中形成。
相较于涂覆抗指纹涂料或溶液的方式，所述的抗指纹涂层30以磁控溅射及离子注入的方式形成，环保且易于制造。
可以理解的，在沉积该抗指纹涂层30之前还可于基体10上镀覆一颜色层20，以增强该被覆件100的美观性。所述抗指纹涂层30形成于该颜色层20上。
本发明一较佳实施例的制造所述被覆件100的方法主要包括如下步骤：
提供一基体10，将基体10放入盛装有乙醇及/或丙酮溶液的超声波清洗器中进行震动清洗，以除去基体10表面的杂质和油污等。清洗完毕后烘干备用。
对经上述处理后的基体10的表面进行氩气等离子体清洗，进一步去除基体10表面的油污，以改善基体10表面与后续涂层的结合力。该等离子体清洗的具体操作及工艺参数为：采用一真空镀膜机(图未示)，将基体10放入该镀膜机的镀膜室内，于基体10上施加-500～-800V的偏压，对该镀膜室进行抽真空处理至真空度为8.0×10-3Pa，以500～800sccm的流量向镀膜室通入纯度为99.999％的氩气，对基体10表面进行等离子体清洗，清洗时间为5～10min。
所述真空镀膜机除可用以进行等离子体清洗外，还可用以多弧离子镀膜、磁控溅射镀膜以及离子注入等表面处理。
采用磁控溅射的方式在铝或铝合金基体10表面依次形成Al2O3层31及AlON层33，其具体操作方法及工艺参数为：
在所述等离子体清洗完成后，调节氩气(工作气体)流量至100～300sccm，并向镀膜室内通入流量为100～300sccm的反应气体氧气，加热所述镀膜室至50～180℃(即溅射温度为50～180℃)；开启已置于所述真空镀膜机中的铝靶的电源，并设定其功率为2～5kw，于基体10上施加-70～-180V的偏压，沉积Al2O3层31。沉积该Al2O3层31的时间为20～60min。
保持所述氩气的流量、溅射温度、铝靶的电源功率及施加于基体10上的偏压不变，并向镀膜室内通入流量为50～150sccm的反应气体氧气，于Al2O3层31上沉积AlON层33。沉积该AlON层33的时间为20～60min。
完成所述AlON层33的沉积后，于该AlON层33表面注入离子，该离子选自氟离子、硼离子及氮离子中的一种或几种。
所述的离子注入过程是：开启所述镀膜机的离子源，所述离子源将含有所需注入离子的气体进行电离，并经高压电场加速成具有几万甚至几百万电子伏特能量的离子束，射入所述AlON层33的表面，与所述AlON层33表层中及其表面的原子或分子发生一系列的物理、化学反应，最终停留在所述AlON层33表层及表面。
本实施例中注入所述氟离子的参数为：镀膜室的真空度为1×10-4Pa，气源为纯度为99.99％的四氟化碳气体(CF4)，离子源电压为30～100kV，工作气压为0.1～0.5Pa，离子束流强度为1～5mA，控制氟离子注入剂量在1×1016ions/cm2(离子数/平方厘米)到1×1018ions/cm2之间。
注入所述硼离子的参数为：镀膜室的真空度为1×10-4Pa，气源为纯度为99.99％的乙硼烷(B2H6)，离子源电压为30～100kV，工作气压为0.1～0.5Pa，离子束流强度为1～5mA，控制硼离子的剂量在1×1016ions/cm2到1×1018ions/cm2之间。
注入所述氮离子的参数为：镀膜室的真空度为1×10-4Pa，氮气的纯度为99.99％，离子源电压为30～100kV，工作气压为0.1～0.5Pa，离子束流强度为1～5mA，控制氮离子的剂量在1×1016ions/cm2到1×1018ions/cm2之间。
可以理解的，在沉积该抗指纹涂层30之前还可于基体10表面镀覆一颜色层20，以增强该被覆件100的美观性。
所述Al2O3层31及AlON层33的形成，在一定程度上降低了所述被覆件100的表面能。更重要的是，于所述AlON层33表面注入氟离子、硼离子及氮离子中的一种或几种，可提高所述AlON层33的表面熵值，即增加所述AlON层33表面原子的混乱程度，如此可降低所述AlON层33的表面能，从而使被覆件100具有良好的抗指纹效果。所述被覆件100的制造方法不需要使用特殊的有机树脂，也不需经酸或碱处理，对环境及人体健康无害；且该方法简单易行。

Claims (10)

1.一种具有抗指纹涂层的被覆件，包括基体及形成于该基体上的抗指纹涂层，其特征在于：该抗指纹涂层包括依次形成于基体上的三氧化二铝层及氮氧化铝层，所述氮氧化铝层中还含有氟离子、硼离子中的一种或两种。
2.如权利要求1所述的具有抗指纹涂层的被覆件，其特征在于：所述三氧化二铝层、氮氧化铝层分别通过磁控溅射镀膜法形成。
3.如权利要求1所述的具有抗指纹涂层的被覆件，其特征在于：所述三氧化二铝层的厚度为200～300nm，所述氮氧化铝层的厚度为200～300nm。
4.如权利要求1所述的具有抗指纹涂层的被覆件，其特征在于：所述氟离子、硼离子中的一种或两种离子通过离子注入的方式注入到氮氧化铝层中形成。
5.如权利要求1所述的具有抗指纹涂层的被覆件，其特征在于：所述被覆件还包括形成于基体与抗指纹涂层之间的颜色层。
6.一种具有抗指纹涂层的被覆件的制造方法，包括以下步骤：
提供一基体；
采用一真空镀膜机，于基体上形成抗指纹涂层，形成该抗指纹涂层包括如下步骤：
以氧气为反应气体，以铝靶为靶材，于所述基体上磁控溅射形成三氧化二铝层；
以氧气及氮气为反应气体，以铝靶为靶材，于所述三氧化二铝层上磁控溅射形成氮氧化铝层；
采用四氟化碳、乙硼烷及氮气中的一种或几种为气源，通过离子注入技术于所述氮氧化铝层表面注入氟离子、硼离子及氮离子中的一种或几种。
7.如权利要求6所述的具有抗指纹涂层的被覆件的制造方法，其特征在于：形成所述三氧化二铝层的工艺参数为：设置氧气的流量为100～300sccm，以氩气为工作气体，其流量为100～300sccm，设置铝靶的电源功率为2～5kw，对基体施加-70～-180V的偏压，溅射温度为50～180℃，溅射时间为20～60min。
8.如权利要求6所述的具有抗指纹涂层的被覆件的制造方法，其特征在于：形成所述氮氧化铝层的工艺参数为：设置氧气及氮气的流量分别为100～300sccm、50～150sccm，以氩气为工作气体，其流量为100～300sccm，设置铝靶的电源功率为2～5kw，对基体施加-70～-180V的偏压，溅射温度为50～180℃，溅射时间为20～60min。
9.如权利要求6所述的具有抗指纹涂层的被覆件的制造方法，其特征在于：于所述氮氧化铝层表面注入离子的工艺参数为：镀膜室的真空度为1×10-4Pa，离子源电压为30～100kV，工作气压为0.1～0.5Pa，离子束流强度为1～5mA，控制离子注入剂量为1×1016ions/cm2到1×1018ions/cm2。
10.如权利要求6所述的具有抗指纹涂层的被覆件的制造方法，其特征在于：所述制造方法还包括在沉积该抗指纹涂层之前于该基体上镀覆颜色层的步骤。
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