CN102480905A - Heat radiation apparatus - Google Patents
Heat radiation apparatus Download PDFInfo
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- CN102480905A CN102480905A CN2010105703908A CN201010570390A CN102480905A CN 102480905 A CN102480905 A CN 102480905A CN 2010105703908 A CN2010105703908 A CN 2010105703908A CN 201010570390 A CN201010570390 A CN 201010570390A CN 102480905 A CN102480905 A CN 102480905A
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- fins
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- housing
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Abstract
The invention relates to a heat radiation apparatus which is suitable for being assembled on a circuit board of an electronic device. The heat radiation apparatus comprises a support, a heat pipe, a heat radiation fin group and a fan. The support is assembled on the circuit board, and a heat pipe part is assembled on the support. The heat radiation fin group comprises a pedestal, a plurality of first fins and a plurality of second fins, wherein, partial first fins and partial second fins are connected to a first terminal of the heat pipe respectively. The first fins and the second fins are mutual parallel and are provided on the pedestal, a second fin is between two first fins, and each second fin has a gap. The fan is configured at a wind inlet side of the heat radiation fin group, and the gap of the second fin is at the wind inlet side and faces the fan.
Description
Technical field
The present invention relates to a kind of heat abstractor, and particularly a kind of heat abstractor with fin of better cooling efficiency.
Background technology
Develop rapidly along with computer and semiconductor technology; The performance and the integrated level of central processing unit in the computer (CPU) and display chip main chip such as (VGA) are increasingly high; The heat that is thereupon produced is also more and more; So heat dissipation problem more and more receives people's attention, and is all the more so in mobile computer.Especially develop with the direction of existing mobile computer, therefore, how in less relatively space, solve relatively large caloric value, become the focus of industry towards slimming.
Summary of the invention
The present invention provides a kind of heat abstractor, and it has preferable radiating efficiency.
One embodiment of the invention propose a kind of heat abstractor, are suitable for being assembled on the circuit board of an electronic installation.Heat abstractor comprises a support, a heat pipe, a radiating fin group and a fan.Groups of holders is contained on the circuit board, and heat pipe section is assembled on the support.The radiating fin group comprises a pedestal, a plurality of first fin and a plurality of second fin.First fin and second fin partly are connected in one first end of heat pipe respectively.First fin and second fin are upright in parallel with each other to be located on the pedestal.Second fin is between first fin, and each second fin has a breach.Fan arrangement is in an inlet air side of radiating fin group, and wherein the breach of second fin is positioned at the inlet air side and towards fan.
In one embodiment of this invention, above-mentioned notch length is greater than the length of first fin 1/2nd.
In one embodiment of this invention, above-mentioned cut height is greater than the length of first fin 1/2nd.In one embodiment of this invention, above-mentioned first fin, second fin and pedestal are formed in one.
In one embodiment of this invention; Above-mentioned first any adjacent fin or one of them of second fin have a clasp; And wherein another of the first arbitrarily adjacent fin or second fin has a button hole; Each clasp is snapped in corresponding button hole, so that first fin and second fin interconnect.
In one embodiment of this invention, the first above-mentioned fin is positioned at the center and the opposite two ends of pedestal in fact, and second fin is configured in respectively between first fin of first fin and opposite two ends of center.
In one embodiment of this invention, above-mentioned support comprises a body, a plurality of spring secures rail to sleeper and at least one heat-conducting piece.One second end of heat pipe is assembled on the body.Spring secures rail to sleeper disposes and protrudes in the periphery of body, and body is assembled to circuit board by spring secures rail to sleeper.Heat-conducting piece is configured on the body, and when body was assembled on the circuit board by spring secures rail to sleeper, heat-conducting piece was resisted against heat pipe and is encapsulated between the heat generating component on the circuit board.
In one embodiment of this invention, each above-mentioned spring secures rail to sleeper comprises one first housing, one second housing and a rotor.First housing and second housing have one first air inlet respectively, and second housing is assembled to first housing and forms an air outlet of contiguous inlet air side, and these above-mentioned breach are right against this air outlet.Rotor set is contained between first housing and second housing and has a plurality of fan blade.
In one embodiment of this invention, the first above-mentioned housing has more a plurality of second air inlets, is distributed in by first air inlet.
Based on above-mentioned; In the above embodiment of the present invention, have breach by second fin, and make the radiating fin group can receive the more air mass flow that spreads out of from fan towards fan; And because the mutual collocation of first fin and second fin; And let first fin be able to supporting construction as second fins group, and then the radiating fin group is reached simultaneously increase radiating efficiency and strengthens the double effects of its structure, to meet the radiating requirements of electronic installation after slimming.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and conjunction with figs. elaborates as follows.
Description of drawings
Fig. 1 is the sketch map according to a kind of heat abstractor of one embodiment of the invention.
Fig. 2 is the sketch map of the heat abstractor of Fig. 1 in another visual angle.
Fig. 3 is the sketch map of heat abstractor partial interior structure among Fig. 1 and Fig. 2.
Fig. 4 is the assembling sketch map between the fin in the radiating fin group of Fig. 3.
Primary clustering symbol description in the accompanying drawing:
100: heat abstractor 110: support
112: body 114: spring secures rail to sleeper
114a: strutting piece 114b: lock the hole
114c: lock part 116A, 116B: heat-conducting piece
120: heat pipe 130: the radiating fin group
131: gas channel 132: pedestal
133: 134: the first fins of clasp
135: 136: the second fins of button hole
Embodiment
Fig. 1 is the sketch map according to a kind of heat abstractor of one embodiment of the invention.Fig. 2 is the sketch map of the heat abstractor of Fig. 1 in another visual angle.Please be simultaneously with reference to figure 1 and Fig. 2; In the present embodiment, heat abstractor 100 is suitable for being assembled on the circuit board 210 of an electronic installation 200 (only illustrating partial component at this), and wherein electronic installation 200 for example is a mobile computer; And on its circuit board 210, be packaged with two heat generating components 220,230; It for example is central processing unit and display chip, and present embodiment is only as representative, but is not limited to this.
Fig. 3 is the sketch map of heat abstractor partial interior structure among Fig. 1 and Fig. 2, at this and clipped member (coating the shell of fan) can know identification radiating fin group.Please be simultaneously referring to figs. 1 to Fig. 3, in the present embodiment, heat abstractor 100 comprises a support 110, two heat pipes 120, two radiating fin groups 130 and two fans 140.The mode that right present embodiment does not limit the quantity of above-mentioned member and arranges in pairs or groups each other.Support 110 is assembled on the circuit board 210, and heat pipe 120 is assembled on the support 110.Each radiating fin group 130 comprises a pedestal 132, a plurality of first fin 134 and a plurality of second fins 136.Pedestal 132 is connected to the first end E1 of heat pipe 120.First fin 134 and second fin 136 are upright in parallel with each other to be located on the pedestal 132.Fan 140 for example is a centrifugal fan, and it is configured in an inlet air side S1 of radiating fin group 130.It should be noted that at this each second fin 136 has a breach 136a, and these breach 136a position is at inlet air side S1 and towards fan 140.
Based on above-mentioned; In the heat abstractor 100 of present embodiment; The cold gas that fan 140 is produced fail to be convened for lack of a quorum via the inlet air side S1 of radiating fin group 130 get into each fin 134, formed gas channel 131 between 136; And because the existence of the breach 136a of second fin 136, and make that the cooling blast of fan 140 can easier being imported among the radiating fin group 130, and then let fin 134,136 carry out heat exchange and promote the effect of its heat radiation with more cooling blast.In view of the above, the heat abstractor 100 of present embodiment can be effectively by the appearance profile of the breach 136a of radiating fin group 130 be directed into the cooling blast of fan 140 in the radiating fin group 130, and then increases the radiating effect of 140 pairs of radiating fin groups 130 of fan.
Details are as follows more in addition; In the present embodiment; Each first fin 134 be positioned in fact the central C3 of pedestal 132 with away from central authorities and relative one first side C1 and one second side C2; And second fin 136 with breach 136a is configured in respectively between first fin 134 at first fin 134 and the first side C1 place at central C3 place, and is configured between first fin 134 at first fin 134 and the second side C2 place at central C3 place.
Please again with reference to figure 3, at this in illustrate the orthographic projection of second fin 136 on first fin 134 on the surface of first fin 134 with dotted line.In the present embodiment; The breach 136a of second fin 136 is projected to the profile of first fin 134; Its preferable being of a size of, the length L 1 of breach 136a be greater than 1/2nd of the length L 2 of first fin 134, and the height H 1 of breach 136a is less than 1/2nd of the height H 2 of first fin 134.
Thus; Each other first fin 134 of collocation presents the notch configuration in order to the cooling blast that receives fan 140 in shape with second fin 136, so that the cooling blast that flows out from an air outlet 141 of fan 140 is able to so notch configuration and successfully compiled and import radiating fin group 130.The heat of first fin 134 and second fin 136 will be taken away by the cooling blast that gets into from inlet air side S1 in a large number, and sends out electronic installation 200 from an air side S2 of radiating fin group 130.
Please again with reference to figure 3, in the present embodiment, the structure that first fin 134, second fin 136 and pedestal 132 are formed in one, that is radiating fin group 130 can die casting or the technology manufacturing of punching press form.Moreover in a preferred embodiment, first fin 134 and second fin 136 can be to extend from pedestal 132 extruding to form.In other words; First fin 134 and second fin 136 can be pulled out from pedestal 132 extensions by crowded type technology; Let first fin 134 and second fin 136 have thin thickness by this, decapacitation is useful in the less accommodation space, still can increase the heat sinking benefit of radiating fin group 130.
On the other hand, Fig. 4 is the assembling sketch map between the fin in the radiating fin group of Fig. 3.Please refer to Fig. 3 and Fig. 4; In the present embodiment; First adjacent arbitrarily fin 134 or one of them of second fin 136 have a clasp 133; And wherein another of this first adjacent fin 134 or second fin 136 has a button hole 135, lets first fin 134 and second fin 136 can snap together each other away from a side of pedestal 132 by clasp 133 being clipped in the button hole 135, so that fin 134,136 can be more firm with respect to the structure of pedestal.In addition, each first fin 134 is in the length of the orthographic projection on the pedestal 132 length greater than each second orthographic projection of fin 136 on pedestal 132, and first fin 134 is configured in central C1 and both sides C2, the C3 of pedestal 132.The effect that this measure lets first fin 134 that snaps together each other and second fin 136 provide second fin 136 to support by first fin 134 simultaneously.
Please again with reference to figure 1 and Fig. 2, in the present embodiment, support 110 comprises a body 112, a plurality of spring secures rail to sleeper 114 and two heat-conducting piece 116A, 116B, and wherein one second end E2 of heat pipe 120 is assembled on the body 112.Spring secures rail to sleeper 114 is configured on the body 112 and protrudes in the periphery of body 112, and by this, body 112 is able to be assembled on the circuit board 210 by spring secures rail to sleeper 114.Heat-conducting piece 116 is configured on the body 112, and heat-conducting piece 116A, the orthographic projection of 116B on heat pipe 120 are overlapped with heat pipe 120 respectively.When body 112 is assembled in 210 last times of circuit board by spring secures rail to sleeper 114, heat-conducting piece 116A, 116B are resisted against heat pipe 120 and heat generating component 220 respectively, between 230, are sent to heat pipe 120 with the heat with heat generating component 220,230.
In detail; Each spring secures rail to sleeper 114 comprises that a strutting piece 114a, locks hole 114b and locks part 114c with corresponding one of the hole 114b that locks; Wherein strutting piece 114a for example is a shell fragment; Its 3rd end E3 is riveted on the body 112, and its 4th end E4 from the 3rd end E3 towards body 112 outside extend and have this lock hole 114b.Pass and lock hole 114b and the 4th end E4 is locked on circuit board 210 by locking part 114c, and let the user when locking the 4th end E4, let heat-conducting piece 116A, 116B be able to closely contact to heat generating component 220,230 by the elasticity of strutting piece 114a.
On the other hand, fan 140 comprises one first housing 142, one second housing 144 and a rotor 146.First housing 142 and second housing 144 have one first air inlet 143 respectively; And second housing 144 is assembled to first housing 142 and forms the air outlet 141 of the inlet air side S1 of contiguous radiating fin group 130, and the breach 136a of second fin 136 is right against the air outlet 141 of fan 140.Rotor 146 is assembled between first housing 142 and second housing 144 and has a plurality of fan blade 146a.
By and large, after heat-conducting piece 116A, 116B are sent to heat pipe 120 with heat from heat generating component 220,230, make heat be sent to the first end E1 and reach radiating fin group 130 from the second end E2 via the heat exchange action of heat pipe 120.At this moment; Fan 140 is sent to first fin 134 and second fin 136 with cooling blast from first air inlet 143 by rotor 146 drives fan blade 146a rotation; By cooling air flow with the heat band from fin 134,136 and from the air side S2 send out electronic installation 200 so that heat abstractor 100 reaches the effect that heat generating component 220,230 is dispelled the heat.
Moreover first housing 142 has more a plurality of second air inlets 145, its for example be distributed in first air inlet 143 other and a plurality of openings, this measure not only can increase the intake of fan, more uses first housing 142 is produced light-weighted effect.
In sum; In the above embodiment of the present invention, have breach by second fin in the radiating fin group towards fan, and being spread out of from fan, the radiating fin group receives more air mass flow; And because the mutual collocation of first fin and second fin; And let first fin be able to supporting construction as second fins group, and then the radiating fin group is reached simultaneously increase radiating efficiency and strengthens the double effects of its structure, to meet the radiating requirements of electronic installation after slimming.
Though the present invention discloses as above with embodiment, so it is not in order to qualification the present invention, and the those of ordinary skill in any affiliated technical field is not breaking away from the spirit and scope of the present invention, when doing a little change and retouching.
Claims (10)
1. a heat abstractor is suitable for being assembled on the circuit board of an electronic installation, and this heat abstractor comprises:
One support is assembled on this circuit board;
One heat pipe, part is assembled on this support;
One radiating fin group comprises:
One pedestal;
A plurality of first fins, part connects first end of this heat pipe;
A plurality of second fins, part links first end of this heat pipe, and those first fins and those second fins stand in parallel with each other and are arranged on this pedestal, and those second fin positions are between those first fins, and respectively this second fin has a breach; And
One fan is configured in an inlet air side of this radiating fin group, and wherein those breach positions of those second fins are in this inlet air side and towards this fan.
2. heat abstractor according to claim 1, wherein respectively the length of this breach greater than 1/2nd length of this first fin respectively.
3. heat abstractor according to claim 1, wherein respectively the height of this breach less than 1/2nd height of this first fin respectively.
4. heat abstractor according to claim 1, wherein those first fins, those second fins and this pedestal are formed in one.
5. heat abstractor according to claim 4; Those wherein adjacent arbitrarily first fins or one of them of those second fins have a clasp; And wherein another of those arbitrarily adjacent first fins or those second fins has a button hole; Respectively this clasp is snapped in this corresponding button hole, so that those fins interconnect.
6. heat abstractor according to claim 1, wherein those first fins are positioned at the central authorities and relative both sides of this pedestal in fact, and those second fins are configured in respectively between those first fins.
7. heat abstractor according to claim 1, wherein this support comprises:
One body, one second end of this heat pipe is assembled on this body;
A plurality of spring secures rail to sleepers dispose and protrude in the periphery of this body, and this body is assembled to this circuit board by those spring secures rail to sleepers; And
At least one heat-conducting piece is configured on this body, and when this body was assembled on this circuit board by those spring secures rail to sleepers, this heat-conducting piece was resisted against this heat pipe and is encapsulated between the heat generating component on this circuit board.
8. heat abstractor according to claim 7, wherein respectively this spring secures rail to sleeper comprises:
One support has one the 3rd end and one the 4th end, and the 3rd end is riveted to this body, and the 4th end extends and has one towards this body exterior from the 3rd end and locks the hole; And
One locks part, passes this and locks the hole and the 4th end is locked on this circuit board.
9. heat abstractor according to claim 1, wherein this fan also comprises:
One first housing;
One second housing, this first housing and this second housing have one first air inlet respectively, and this second housing is assembled to this first housing and forms an air outlet of contiguous this inlet air side, and those breach are over against this air outlet; And
One rotor is assembled between first housing and this second housing and has a plurality of fan blade.
10. heat abstractor according to claim 9, wherein this first housing also has a plurality of second air inlets, is distributed in by this first air inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105703908A CN102480905A (en) | 2010-11-24 | 2010-11-24 | Heat radiation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105703908A CN102480905A (en) | 2010-11-24 | 2010-11-24 | Heat radiation apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102480905A true CN102480905A (en) | 2012-05-30 |
Family
ID=46093336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105703908A Pending CN102480905A (en) | 2010-11-24 | 2010-11-24 | Heat radiation apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102480905A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103677167A (en) * | 2012-08-29 | 2014-03-26 | 北京京东方光电科技有限公司 | Heat dissipation device |
| CN103838330A (en) * | 2012-11-21 | 2014-06-04 | 英业达科技有限公司 | Server |
| CN104102311A (en) * | 2013-04-02 | 2014-10-15 | 广达电脑股份有限公司 | Heat radiation module and centrifugal fan thereof |
-
2010
- 2010-11-24 CN CN2010105703908A patent/CN102480905A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103677167A (en) * | 2012-08-29 | 2014-03-26 | 北京京东方光电科技有限公司 | Heat dissipation device |
| US9436237B2 (en) | 2012-08-29 | 2016-09-06 | Beijing Boe Optoelectronics Technology Co., Ltd. | Heat dissipation device |
| CN103677167B (en) * | 2012-08-29 | 2017-10-13 | 北京京东方光电科技有限公司 | A kind of heat abstractor |
| CN103838330A (en) * | 2012-11-21 | 2014-06-04 | 英业达科技有限公司 | Server |
| CN104102311A (en) * | 2013-04-02 | 2014-10-15 | 广达电脑股份有限公司 | Heat radiation module and centrifugal fan thereof |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120530 |