CN102480880A - Metal shell and preparation method and application thereof - Google Patents

Metal shell and preparation method and application thereof Download PDF

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Publication number
CN102480880A
CN102480880A CN2010105664034A CN201010566403A CN102480880A CN 102480880 A CN102480880 A CN 102480880A CN 2010105664034 A CN2010105664034 A CN 2010105664034A CN 201010566403 A CN201010566403 A CN 201010566403A CN 102480880 A CN102480880 A CN 102480880A
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CN
China
Prior art keywords
metal shell
fomale
male
preparation
base substrate
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CN2010105664034A
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Chinese (zh)
Inventor
苏俊守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN QINGHE GLUING PRODUCTS CO Ltd
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SHENZHEN QINGHE GLUING PRODUCTS CO Ltd
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Priority to CN2010105664034A priority Critical patent/CN102480880A/en
Priority to PCT/CN2010/079538 priority patent/WO2012071744A1/en
Publication of CN102480880A publication Critical patent/CN102480880A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/04Metal casings
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention discloses a metal shell and a preparation method thereof. The preparation method comprises the following steps: preparing a metal shell blank; processing the surface of the metal shell blank to be processed into a concave-convex surface; and anodizing the metal shell blank with the concave-convex surface to obtain the metal shell. The metal shell can be applied in production of electronic products. Since the surface of the metal shell blank is processed into the concave-convex surface and is then anodized, the surface area of the metal shell can be increased effectively, the contact area of the metal shell can also be increased, and the further processing of the metal shell can be facilitated. Meanwhile, when the preparation method of the metal shell is adopted, the follow-up processing procedures can be reduced effectively, and the production cost can be decreased.

Description

A kind of metal shell and preparation method thereof and application
Technical field
The invention belongs to the accessory technical field, concrete relate to a kind of housing and preparation method thereof and application.
Background technology
Along with developing rapidly and the raising day by day of people's living standard of wireless communication technology, the information processing technology; Mobile phone, personal digital assistant (personal digital assistant; PDA) etc. portable electron device competitively emerges in large numbers; Enter into huge numbers of families, make the consumer can enjoy all facilities that high-tech brings whenever and wherever possible, make these portable electron devices become the indispensable part of modern's daily life.Housing is as one of main spare part of electronic installation, and it is widely used on the electronic installations such as phone, calculator, computer.
In electronic installation, all be provided with the holding section usually so that said housing is installed in electronics on the diapire of housing or the perimeter side walls.Traditional housing all is to adopt that plastic material is one-body molded to be processed, and in recent years, in order to satisfy the individual demand of consumer to case of electronic device, more and more portable electron devices begin to adopt metal shell.But said metal shell is difficult to that punching press forms said holding section on the diapire of this metal shell or perimeter side walls in the stamped process, and, promptly enabling to stamp out said metal holding section, its cost is also than higher; The said metal holding section that stamps out is not because its elasticity is fine, after long-time the use, can make between said metal shell and the electronics install built on the sand,, disengaging loosening easily with body, make troubles to use.This has just caused the appearance that is combined as a whole of metal shell and plastic cement.
In order to prevent the oxidation of above-mentioned electronic installation metal shell, increase the service life.At present, the method that addresses this problem is that metal shell is carried out anodization earlier, carries out the PUR processed again.This processing technology is owing to carry out anodization to the metal shell outer surface earlier, and the oxide skin(coating) that forms at the metal shell outer surface has reduced its surperficial pulling capacity.The way that solves this difficult problem at present is to after the metal shell anodization, or again in processing such as its faying face scratch, removes the oxide layer that anodization generates; But this method causes follow-up complex procedures; Production cost increases, and formation efficiency reduces, and properties of product are unstable.
Summary of the invention
The purpose of the embodiment of the invention is to overcome the above-mentioned deficiency of prior art, and providing a kind of can effectively increase surface area, reduces metal shell of following process operation and preparation method thereof.
And above-mentioned metal shell is in the application of producing electronic product.
In order to realize the foregoing invention purpose, technical scheme of the present invention is following:
A kind of metal shell preparation method comprises the steps:
Obtain the metal shell base substrate;
The surface to be processed processing of said metal shell base is male and fomale(M&F);
Said metal shell base substrate with male and fomale(M&F) is carried out anodization, obtain said metal shell.
And, a kind of metal shell, this metal shell is made by above-mentioned metal shell preparation method.
The present invention also provides the application of above-mentioned metal shell in producing electronic product.
Processing is male and fomale(M&F) to above-mentioned metal shell to the metal shell billet surface through carrying out earlier; Carry out anodization again; Effectively increased the surface area on metal shell surface, strengthened the contact area of this metal shell, helped further processed simultaneously this metal shell.For example, after this metal shell is carried out further PUR processed, because of the surface of this metal shell is able to increase; Thereby can increase PUR in its surperficial pulling capacity, make with this metal shell more firm, thereby prolonged life-span of this housing; Simultaneously; Through in anodization process, can change flexibly by the male and fomale(M&F) color after the anodization, thereby enrich the metal shell appearance colour.In addition, this metal shell preparation method has also effectively reduced follow-up manufacturing procedure, has practiced thrift production cost.
Description of drawings
Fig. 1 is a metal shell preparation method process flow diagram of the present invention;
Fig. 2 is first kind of structure partial sketch map of metal shell male and fomale(M&F) of the present invention;
Fig. 3 is second kind of structure partial sketch map of metal shell male and fomale(M&F) of the present invention;
Fig. 4 is the third structure partial sketch map of metal shell male and fomale(M&F) of the present invention;
Fig. 5 is the 4th a kind of structure partial sketch map of metal shell male and fomale(M&F) of the present invention;
Fig. 6 is the local structural representation of metal shell of the embodiment of the invention 4 preparations;
Fig. 7 is the structural representation of the handset shell of the embodiment of the invention 5 preparations;
Fig. 8 is the amplification and the decomposing schematic representation of A part in the handset shell of the embodiment of the invention 5 preparation.
Embodiment
Clearer for technical problem, technical scheme and beneficial effect that the present invention will be solved, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The embodiment of the invention provides a kind of can effectively increase surface area, reduces the shell preparation method of following process operation, and as shown in Figure 1, this shell is the preparation method comprise the steps:
S1: obtain metal shell base substrate 1;
S2: the processing of metal shell base substrate 1 work surface is male and fomale(M&F) 11;
S3: the metal shell base substrate 1 that will have male and fomale(M&F) 11 carries out anodization, obtains this metal shell.
Like this; Processing is male and fomale(M&F) to the invention described above embodiment metal shell to metal shell base substrate work surface through carrying out earlier; Carry out anodization again; Effectively increased the surface area on metal shell surface, strengthened the contact area of this metal shell, helped further processed simultaneously this metal shell.For example, after this metal shell is carried out further PUR processed, because of the surface of this metal shell is able to increase; Thereby can increase PUR in its surperficial pulling capacity, make with this metal shell more firm, thereby prolonged life-span of this housing; Simultaneously; Through in anodization process, can change flexibly by the male and fomale(M&F) color after the anodization, thereby enrich the metal shell appearance colour.In addition, this metal shell preparation method has also effectively reduced follow-up manufacturing procedure, has practiced thrift production cost.
Particularly, among above-mentioned metal shell preparation method's the step S1, the structure of metal shell base substrate 1 and shape are decided according to concrete needs, and this metal shell base substrate 1 can be this area shape and structure commonly used.Its material is preferably aluminum or aluminum alloy.Can certainly select for use fields such as steel, iron other metal or alloy commonly used to substitute.The thickness of this metal shell 1 is preferably 0.4mm.
Among above-mentioned metal shell preparation method's the step S2, before processing was male and fomale(M&F) to metal shell base substrate 1 work surface, pre-process is cleaned and/or polished in preferred elder generation with metal shell base substrate 1.Wherein, cleaning way is preferably successively and cleans with liquid detergent, alkali lye, acid soak, uses the foreign matter of clear water rinsing with thorough removing metal shell base substrate 1 surface at last, makes farthest cleaning of metal shell base substrate 1 surface; Metal shell base substrate 1 can also carry out sanding and polishing to it after clean, it mainly acts on is attachment that is difficult to remove and the corrosion layer of removing the surface, is convenient to next step anodization.
Among this step S2, the processing method of male and fomale(M&F) 11 is preferably chemical method for etching, laser carved method or draws the hair method.This method can effectively be produced male and fomale(M&F) 11, the simple and easy control of technology, male and fomale(M&F) 11 quality accords with production requirements.The concave bottom of the male and fomale(M&F) of producing 11 is preferably 0.01~0.02mm with the spacing at protrusion top.The bottom of this male and fomale(M&F) 11 and the spacing at top can effectively guarantee the mechanical strength of metal shell, can reasonably increase the surface area of male and fomale(M&F) 11 simultaneously again.
Among this step S2, this male and fomale(M&F) 11 is preferably groove-like or/and the pit shape.This groove-like or/male and fomale(M&F) 11 of pit shape can effectively increase the surface area of male and fomale(M&F) 11.Wherein, the male and fomale(M&F) 11 of pit shape is as shown in Figure 2, and the pit rule on this male and fomale(M&F) 11 is arranged, and pit also can be irregular arranging certainly.The degree of depth of this pit 111 is preferably 0.01~0.02mm.
When above-mentioned male and fomale(M&F) 11 was groove-like, groove 112 had following several kinds of shapes at least:
First kind: as shown in Figure 3, this groove is sinusoidal waveform.
Second kind: as shown in Figure 4, this groove is square wave type.
The third: as shown in Figure 5, this groove is the sawtooth wave mode.
Above-mentioned Fig. 3 is convenient to processing to the preferred three kinds of shapes of groove shown in Figure 5, can reasonably increase the surface area of male and fomale(M&F) 11 simultaneously again.Certainly except above-mentioned three kinds,, reach the surface area that increases metal shell base substrate 1 surface, all within the technological frame of the embodiment of the invention so long as metal shell base substrate 1 Surface Machining is become male and fomale(M&F) 11.In the preferred three kinds of shapes of above-mentioned groove, the height of crest and trough is preferably 0.01~0.02mm, and this distance can effectively guarantee the mechanical strength of metal shell.
Among above-mentioned metal shell preparation method's the step S3; It is to place dilute sulfuric acid to switch on as anode earlier metal shell base substrate 1 that metal shell base substrate 1 carries out the anodization method; Generate surface oxide layer, this oxide layer is colourless micropore shape, the processing of dyeing again; Adopt heating perhaps to fix then, make the hole sealing of surface oxide layer with chromate.This anodized technological parameter adopts commonly used the getting final product in this area.
Further, after above-mentioned housing preparation method's step S3, also preferably be provided with the PUR procedure of processing, concrete grammar is following:
The metal shell of above-mentioned preparation is put into mould, on the male and fomale(M&F) 11 ' of the generation oxide layer of metal shell, place PUR, plastic cement successively, then to mold heated, and pressing metal shell and plastic cement, make metal shell and plastic cement be bonded as one.
Its structure is as shown in Figure 6, and metal shell comprises the male and fomale(M&F) 11 ' of metal shell base substrate 1 and its work surface and the adhesive linkage 2 and plastic layer 3 that combines successively with male and fomale(M&F) 11 '.The metal shell of this structure adds a plastic layer 3; Can effectively protect this metal shell, stop contacting of metal shell base substrate 1 in the metal shell and atmosphere, further prolong housing useful life; Effectively embodiment of the invention housing insulation has strengthened its security performance simultaneously.Because metal shell base substrate 1 surface is male and fomale(M&F) 11; After it carries out anodization; The surface generates has the male and fomale(M&F) 11 ' surface of oxide layer still to have great surface area; Increase in the hot melt adhesive layer 2 PUR in the pulling capacity of male and fomale(M&F) 11 ', thereby strengthened plastic layer 3 and the bonding intensity of metal shell, prolonged the life-span of housing.
Above-mentioned plastic cement can adopt makes electronic product casing plastic cement commonly used, for example, can be the Merlon (PC) of 20000-60000, polymethyl methacrylate (PMMA), ABS and/or the polyvinyl chloride (PVC) etc. that molecular weight is 20000-200000 for molecular weight.Its thickness can be according to the actual conditions setting.PUR is in order to bonding plastic cement and metal shell, and the PUR use amount can be decided according to product size and actual needs, preferably at 0.1~0.2 millimeter.This PUR is a kind of solvent, solid meltability polymer of moisture free 100% of not needing, and it is solid at normal temperatures, and heating and melting becomes and can flow to uniform temperature, and the liquid of certain viscosity is arranged.The embodiment of the invention does not have special qualification for the component of PUR, produces the excessive glue phenomenon of product for fear of the superfusion of PUR in follow-up Shooting Technique, and said PUR need have certain thermal endurance, and the thermal endurance of said PUR is greater than 220 ℃.In above-mentioned process for pressing, the PUR melted by heating, and fill up in the male and fomale(M&F) 11 ' on metal shell surface at pressure following, thereby realization and metal shell and plastic cement is bonding.
Above-mentioned temperature to mold heated is preferably 100~150 ℃.This temperature range can make PUR have good engaging respectively with the male and fomale(M&F) 11 ' of plastic cement and metal shell.After pressing was accomplished, PUR formed adhesive linkage 2, and adhesive linkage 2 is with plastic cement 3 and firm respectively being bonded as one of metal shell base substrate 1, thereby formation has the embodiment of the invention metal shell of plastic layer.
The embodiment of the invention also provides a kind of metal shell, and this metal shell is prepared from above-mentioned metal shell preparation method, preferred construction such as Fig. 2 to Fig. 6 any.In order to practice thrift length, repeat no more at this.
The embodiment of the invention further also provides the application of above-mentioned metal shell.Because this metal shell has above-mentioned advantage, therefore, the invention described above embodiment metal shell can be used in producing electronic product.
Combine instantiation at present, the present invention is further elaborated.
Embodiment 1
The preparation method of present embodiment metal shell comprises the steps, simultaneously referring to Fig. 1 and Fig. 2:
S11: obtain metal shell base substrate 1;
S12: after will getting metal shell base substrate 1 and cleaning, adopt chemical method for etching processing pit, form male and fomale(M&F) 11 at metal shell base substrate 1 work surface;
S13: said metal shell base substrate 1 with male and fomale(M&F) is carried out anodization, obtain this metal shell.
Embodiment 2
The preparation method of present embodiment metal shell comprises the steps, simultaneously referring to Fig. 1 and Fig. 3:
S21: obtain metal shell base substrate 1;
S22: after will getting metal shell base substrate 1 and cleaning, adopt laser carved method to be processed into the male and fomale(M&F) 11 of sinusoidal waveform at metal shell base substrate 1 work surface;
S23: said metal shell base substrate 1 with male and fomale(M&F) is carried out anodization, obtain this housing.
Embodiment 3
The preparation method of present embodiment metal shell comprises the steps, simultaneously referring to Fig. 1 and Fig. 4:
S31: obtain metal shell base substrate 1;
S32: adopt laser carved method to be processed into the male and fomale(M&F) 11 of square wave type said metal shell base substrate 1 work surface;
S33: after the metal shell base substrate 1 that will be processed with male and fomale(M&F) 11 cleans, polishes, carry out anodization again, obtain this housing.
Embodiment 4
The preparation method of present embodiment metal shell comprises the steps, simultaneously referring to Fig. 1:
S41: obtain metal shell base substrate 1;
S42: draw the hair method to be processed into the male and fomale(M&F) 11 of sinusoidal waveform said metal shell base substrate 1 outer surface employing to be processed;
S43: after the metal shell base substrate 1 that will be processed with male and fomale(M&F) 11 cleans, polishes, carry out anodization again;
S44: the metal shell base substrate 1 after the anodization is put into mould, on metal shell base substrate 1 male and fomale(M&F) 11 ', place PUR, plastic cement successively, again to 100 ℃ of mold heated; And pressing metal shell base substrate 1 and plastic cement, make metal shell base substrate 1 and plastic cement be bonded as one, then cooling, the demoulding; Obtain metal shell as shown in Figure 6; Wherein, PUR forms adhesive linkage 2, and plastic cement forms plastic layer 3.
Embodiment 5
The preparation method of present embodiment handset shell comprises the steps, simultaneously referring to Fig. 1, Fig. 7 and Fig. 8:
S51: obtain mobile phone metal shell base substrate 1;
S52: draw the hair method to be processed into the male and fomale(M&F) 11 of sawtooth wave mode said mobile phone metal shell base substrate 1 work surface employing;
S53: after the mobile phone metal shell base substrate 1 that will be processed with male and fomale(M&F) 11 cleans, polishes, carry out anodization again;
S54: the mobile phone metal shell base substrate 1 after the anodization is put into mould, on mobile phone metal shell base substrate 1 male and fomale(M&F) 11 ', place PUR, plastic cement successively, again to 150 ℃ of mold heated; And pressing mobile phone metal shell base substrate 1 and plastic cement, make mobile phone metal shell base substrate 1 and plastic cement be bonded as one, then cooling, the demoulding; Obtain mobile phone metal shell as shown in Figure 7; Wherein, PUR forms adhesive linkage 2, and plastic cement forms plastic layer 3.
The above is merely preferred embodiment of the present invention, and its structure is not limited to the above-mentioned shape of enumerating, and all any modifications of within spirit of the present invention and principle, being done, is equal to replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. a metal shell preparation method comprises the steps:
Obtain the metal shell base substrate;
Said metal shell base substrate work surface processing is male and fomale(M&F);
Said metal shell base substrate with male and fomale(M&F) is carried out anodized, obtain said metal shell.
2. metal shell preparation method according to claim 1; It is characterized in that: also comprise said metal shell is put into mould; On the male and fomale(M&F) of said metal shell, place PUR, plastic cement more successively; Then to mold heated, and pressing metal shell and plastic cement, make metal shell and plastic cement be bonded as one.
3. metal shell preparation method according to claim 2 is characterized in that: said temperature to mold heated is 100~150 ℃.
4. metal shell preparation method according to claim 1; It is characterized in that: to said metal shell billet surface processing be male and fomale(M&F) and/or to said metal shell base substrate anodization before, also comprise said metal shell base substrate cleaned pre-process.
5. metal shell preparation method according to claim 1 is characterized in that: the height at the bottom of the depression of said male and fomale(M&F) and the top of protrusion is 0.01~0.02mm.
6. metal shell preparation method according to claim 1 is characterized in that: said male and fomale(M&F) is groove-like or/and the pit shape.
7. metal shell preparation method according to claim 6 is characterized in that: said groove is sinusoidal waveform, square wave type or sawtooth wave mode.
8. metal shell preparation method according to claim 1 is characterized in that: the method that said metal shell billet surface processing is male and fomale(M&F) is chemical method for etching, laser carved method or draws the hair method.
9. metal shell, it is characterized in that: said metal shell is made by the arbitrary said method of claim 1~8.
10. the application of metal shell according to claim 9 in producing electronic product.
CN2010105664034A 2010-11-30 2010-11-30 Metal shell and preparation method and application thereof Pending CN102480880A (en)

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CN2010105664034A CN102480880A (en) 2010-11-30 2010-11-30 Metal shell and preparation method and application thereof
PCT/CN2010/079538 WO2012071744A1 (en) 2010-11-30 2010-12-07 Metal housing and preparation process thereof

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Application Number Priority Date Filing Date Title
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WO (1) WO2012071744A1 (en)

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CN106848538A (en) * 2017-01-17 2017-06-13 广东欧珀移动通信有限公司 Method for producing shell and mobile terminal
CN108990345A (en) * 2018-08-24 2018-12-11 Oppo(重庆)智能科技有限公司 The decoration and installation method of shell and shell
CN109475056A (en) * 2017-09-08 2019-03-15 苹果公司 For polymer material to be bonded to the etching of anodized metal
CN109552721A (en) * 2018-11-21 2019-04-02 Oppo(重庆)智能科技有限公司 The method of logo is processed on mobile terminal and its shell and shell
CN112203444A (en) * 2019-07-08 2021-01-08 苹果公司 Titanium component with etched surface
US11178781B2 (en) 2017-09-08 2021-11-16 Apple Inc. Etching for bonding polymer material to a metal surface
US11511519B2 (en) 2019-07-08 2022-11-29 Apple Inc. Titanium part having an etched surface

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CN114679874A (en) * 2020-12-24 2022-06-28 富联裕展科技(深圳)有限公司 Metal composite part, preparation method of metal composite part and shell of electronic device

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CN106848538A (en) * 2017-01-17 2017-06-13 广东欧珀移动通信有限公司 Method for producing shell and mobile terminal
CN106848538B (en) * 2017-01-17 2020-03-24 Oppo广东移动通信有限公司 Shell manufacturing method and mobile terminal
US10931800B2 (en) 2017-01-17 2021-02-23 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Method for manufacturing housing and mobile terminal
CN109475056A (en) * 2017-09-08 2019-03-15 苹果公司 For polymer material to be bonded to the etching of anodized metal
US11178781B2 (en) 2017-09-08 2021-11-16 Apple Inc. Etching for bonding polymer material to a metal surface
US11547005B2 (en) 2017-09-08 2023-01-03 Apple Inc. Etching for bonding polymer material to anodized metal
CN108990345A (en) * 2018-08-24 2018-12-11 Oppo(重庆)智能科技有限公司 The decoration and installation method of shell and shell
CN109552721A (en) * 2018-11-21 2019-04-02 Oppo(重庆)智能科技有限公司 The method of logo is processed on mobile terminal and its shell and shell
CN112203444A (en) * 2019-07-08 2021-01-08 苹果公司 Titanium component with etched surface
US11511519B2 (en) 2019-07-08 2022-11-29 Apple Inc. Titanium part having an etched surface

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