CN102480842A - Method for preparing dielectric substate - Google Patents
Method for preparing dielectric substate Download PDFInfo
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- CN102480842A CN102480842A CN2011102610003A CN201110261000A CN102480842A CN 102480842 A CN102480842 A CN 102480842A CN 2011102610003 A CN2011102610003 A CN 2011102610003A CN 201110261000 A CN201110261000 A CN 201110261000A CN 102480842 A CN102480842 A CN 102480842A
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Abstract
The embodiment of the invention provides a method for preparing a dielectric substrate. The preparation method comprises the following steps of: using a glass fiber reinforcement resin material as a substrate and coating a mixed material of dielectric ceramic and resin on the substrate to obtain a first composite layer; further forming a layer of resin on the first composite layer to obtain a second composite layer; and laminating a layer of metal on the second composite layer to obtain the dielectric substrate. Therefore, the dielectric substrate with high strength and high dielectric constant is realized.
Description
[technical field]
The present invention relates to technical field of composite materials, relate in particular to a kind of preparation method of medium substrate.
[background technology]
Ultra material is meant artificial composite structure or the composite material that some have the not available extraordinary physical property of natural material.Structurally ordered design through on the key physical yardstick of material can break through the restriction of some apparent natural law, thereby obtains to exceed the meta-materials function of the intrinsic common character of nature.The character of ultra material and function mainly come from its inner structure; Therefore be design and synthetic ultra material; People have carried out a lot of research work, and for example: the metal wire through discovering periodic arrangement and the composite construction of open loop resonator can realize that dielectric constant and magnetic permeability simultaneously for negative two negative material, also claim LHM; And make metal wire and open loop resonator composite construction on the printed circuit board (PCB), realized the two negative material of two dimension.The realization of metamaterial structure is at present mainly accomplished on the PCB substrate, to make metal wire.
In the prior art, the PCB substrate generally is based on the application requirements of PCB and designs, and in order to increase the intensity of PCB substrate, normally adopts the mode of basis material impregnated glass fiber.But the content through glass fiber in the PCB substrate of dipping preparation is still lower, is difficult to satisfy the requirement of PCB substrate to intensity.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of preparation method of medium substrate, can increase the intensity of medium substrate, and satisfies the requirement of medium substrate to dielectric constant.
For solving the problems of the technologies described above, the embodiment of the invention provides a kind of preparation method of medium substrate, comprising:
With the galss fiber reinforced resin material is substrate, on this substrate, applies the composite material of dielectric ceramic and resin, obtains first composite bed;
On said first composite bed, further form one deck resin, obtain second composite bed;
Pressing layer of metal on said second composite bed obtains medium substrate.
Technique scheme has the following advantages: adopting the galss fiber reinforced resin material is substrate, thereby can guarantee the intensity of medium substrate; Through the composite material of coating dielectric ceramic and resin on substrate, thus the dielectric constant of assurance medium substrate; Through on the composite material of dielectric ceramic and resin, applying pure resin bed, can guarantee caking property with metal level.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention; The accompanying drawing of required use is done to introduce simply in will describing embodiment below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is preparation method's flow chart of a kind of medium substrate of providing of the embodiment of the invention one;
Fig. 2 is preparation method's flow chart of a kind of medium substrate of providing of the embodiment of the invention two;
Fig. 3 is preparation method's flow chart of a kind of medium substrate of providing of the embodiment of the invention three.
[embodiment]
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making all other embodiment that obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Embodiment one,
Referring to Fig. 1, preparation method's flow chart of a kind of medium substrate that provides for the embodiment of the invention one, this preparation method comprises the steps:
S101: with the galss fiber reinforced resin material is substrate, on this substrate, applies the composite material of dielectric ceramic and resin, obtains first composite bed.
Wherein, glass fibers is a nonwoven ceramic nano glass fiber; Resin is an epoxy resin, perhaps has other resin of similar quality with epoxy resin.
S102: on first composite bed, further form one deck resin, obtain second composite bed.
Concrete, can be on first composite bed of semi-cured state hot pressing one deck resin, perhaps on the first solid-state composite bed, apply one deck liquid resin, with this liquid resin as binding agent, pressing one deck resin.
S103: pressing layer of metal on second composite bed obtains medium substrate.
Concrete, can be on second composite bed of semi-cured state the hot pressing layer of metal; Perhaps on the second solid-state composite bed, apply one deck liquid resin, with this liquid resin as binding agent, the pressing layer of metal.
Wherein, the layer of metal of pressing is copper or aluminium.
In the present embodiment, adopting the galss fiber reinforced resin material is substrate, thereby can guarantee the intensity of medium substrate; Through the composite material of coating dielectric ceramic and resin on substrate, thus the dielectric constant of assurance medium substrate; Through on the composite material of dielectric ceramic and resin, applying pure resin bed, can guarantee caking property with metal level.
Embodiment two,
Referring to Fig. 2, preparation method's flow chart of a kind of medium substrate that provides for the embodiment of the invention two, this preparation method comprises the steps:
S201: preparation galss fiber reinforced resin material, i.e. substrate.
Concrete, can in liquid resin, add the glass fiber chip, be solidified into solid-state then or semi-cured state prepares.
S202: the composite material of preparation dielectric ceramic and resin is solidified into solid-state or semi-cured state prepares then.
Concrete, can in liquid resin, add dielectric ceramic powder, curing prepares then.
S203: with the galss fiber reinforced resin material is substrate, on this substrate, applies the composite material of dielectric ceramic and resin, obtains first composite bed.
Wherein, glass fibers is a nonwoven ceramic nano glass fiber; Resin is an epoxy resin, perhaps has other resin of similar quality with epoxy resin.
S204: on first composite bed, further form one deck resin, obtain second composite bed.
Concrete, can be on first composite bed of semi-cured state hot pressing one deck resin, perhaps on the first solid-state composite bed, apply one deck liquid resin, with this liquid resin as binding agent, pressing one deck resin.
S205: at least two second composite beds are carried out lamination, obtain the 3rd composite bed.
S206: pressing layer of metal on the 3rd composite bed obtains medium substrate.
Concrete, can be on the 3rd composite bed of semi-cured state the hot pressing layer of metal; Perhaps on the 3rd solid-state composite bed, apply one deck liquid resin, with this liquid resin as binding agent, the pressing layer of metal.
Wherein, the layer of metal of pressing is copper or aluminium.
Present embodiment has carried out lamination with respect to embodiment one to second composite bed, obtains the high dielectric substrate of thickening single face metallisation.In concrete implementation process, select the execution mode that is fit to.
Embodiment three,
Referring to Fig. 3, preparation method's flow chart of a kind of medium substrate that provides for the embodiment of the invention three, this preparation method comprises the steps:
S301: preparation galss fiber reinforced resin material, i.e. substrate.
Concrete, can in liquid resin, add the glass fiber chip, be solidified into solid-state then or semi-cured state prepares.
S302: the composite material of preparation dielectric ceramic and resin is solidified into solid-state or semi-cured state prepares then.
Concrete, can in liquid resin, add dielectric ceramic powder, curing prepares then.
S303: with the galss fiber reinforced resin material is substrate, on this substrate, applies the composite material of dielectric ceramic and resin, obtains first composite bed.
Wherein, glass fibers is a nonwoven ceramic nano glass fiber; Resin is an epoxy resin, perhaps has other resin of similar quality with epoxy resin.
S304: on first composite bed, further form one deck resin, obtain second composite bed.
Concrete, can be on first composite bed of semi-cured state hot pressing one deck resin, perhaps on the first solid-state composite bed, apply one deck liquid resin, with this liquid resin as binding agent, pressing one deck resin.
S305: at least two second composite beds are carried out lamination, obtain the 3rd composite bed.
S306: upper surface and lower surface difference pressing layer of metal at the 3rd composite bed obtain medium substrate.
Concrete, can distinguish the pressing layer of metal with lower surface at the upper surface of the 3rd composite bed of semi-cured state; Perhaps on the 3rd solid-state composite bed, apply one deck liquid resin, as binding agent, distinguish the pressing layer of metal at the upper surface and the lower surface of the 3rd composite bed with this liquid resin.
Wherein, the layer of metal of pressing is copper or aluminium.
Present embodiment is with respect to embodiment two, and upper surface and lower surface difference pressing layer of metal at the 3rd composite bed obtain the high dielectric substrate of the two-sided metallisation of thickening.In concrete implementation process, select the execution mode that is fit to.
More than the embodiment of the invention has been carried out detailed introduction, used concrete example among this paper principle of the present invention and execution mode set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. the preparation method of a medium substrate is characterized in that, comprising:
With the galss fiber reinforced resin material is substrate, on this substrate, applies the composite material of dielectric ceramic and resin, obtains first composite bed;
On said first composite bed, further form one deck resin, obtain second composite bed;
Pressing layer of metal on said second composite bed obtains medium substrate.
2. method according to claim 1 is characterized in that, before hot pressing layer of metal on said second composite bed, also comprises:
At least two said second composite beds are carried out lamination, obtain the 3rd composite bed.
3. method according to claim 2 is characterized in that, said method also comprises:
At said the 3rd composite bed surface pressure unification layer metal of pressing metal level not.
4. method according to claim 1 is characterized in that, before the said method, also comprises:
Preparation galss fiber reinforced resin material.
5. according to claim 1 or 4 described methods, it is characterized in that, also comprise before the said method:
The composite material of preparation dielectric ceramic and resin.
6. method according to claim 1 is characterized in that, said resin is an epoxy resin.
7. method according to claim 1 is characterized in that, said glass fibers is a nonwoven ceramic nano glass fiber.
8. method according to claim 1 is characterized in that, said metal is copper or aluminium.
9. method according to claim 1 is characterized in that, pressing layer of metal on said second composite bed comprises:
On said second composite bed, apply one deck liquid resin, pressing layer of metal.
10. method according to claim 1 is characterized in that, pressing layer of metal on said second composite bed comprises:
Hot pressing layer of metal on said second composite bed of semi-cured state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102610003A CN102480842A (en) | 2011-09-05 | 2011-09-05 | Method for preparing dielectric substate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102610003A CN102480842A (en) | 2011-09-05 | 2011-09-05 | Method for preparing dielectric substate |
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| CN102480842A true CN102480842A (en) | 2012-05-30 |
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| CN2011102610003A Pending CN102480842A (en) | 2011-09-05 | 2011-09-05 | Method for preparing dielectric substate |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06322157A (en) * | 1993-05-10 | 1994-11-22 | Hitachi Chem Co Ltd | High-dielectric constant prepreg for interlaminar bonding |
| CN1219469A (en) * | 1992-07-21 | 1999-06-16 | 阿木普－阿克佐迭片公司 | Method of manufacturing composite laminate comprising unidirectional reinforcing fibres, for use in printed wire boards |
| US6815085B2 (en) * | 1998-11-05 | 2004-11-09 | International Business Machines Corporation | Printed circuit board capacitor structure and method |
| US20070082127A1 (en) * | 2001-09-17 | 2007-04-12 | Infineon Technologies Ag | Process for producing a structured metal layer on a substrate body |
| CN101522318A (en) * | 2006-08-08 | 2009-09-02 | 环球产权公司 | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
| CN101682995A (en) * | 2007-05-24 | 2010-03-24 | 巴斯夫欧洲公司 | Production is by the method for the substrate laminated material of washing |
| WO2010050472A1 (en) * | 2008-10-29 | 2010-05-06 | 住友ベークライト株式会社 | Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device |
| CN101973145A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | Method for preparing embedded material and embedded material prepared thereby |
-
2011
- 2011-09-05 CN CN2011102610003A patent/CN102480842A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1219469A (en) * | 1992-07-21 | 1999-06-16 | 阿木普－阿克佐迭片公司 | Method of manufacturing composite laminate comprising unidirectional reinforcing fibres, for use in printed wire boards |
| JPH06322157A (en) * | 1993-05-10 | 1994-11-22 | Hitachi Chem Co Ltd | High-dielectric constant prepreg for interlaminar bonding |
| US6815085B2 (en) * | 1998-11-05 | 2004-11-09 | International Business Machines Corporation | Printed circuit board capacitor structure and method |
| US20070082127A1 (en) * | 2001-09-17 | 2007-04-12 | Infineon Technologies Ag | Process for producing a structured metal layer on a substrate body |
| CN101522318A (en) * | 2006-08-08 | 2009-09-02 | 环球产权公司 | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
| CN101682995A (en) * | 2007-05-24 | 2010-03-24 | 巴斯夫欧洲公司 | Production is by the method for the substrate laminated material of washing |
| WO2010050472A1 (en) * | 2008-10-29 | 2010-05-06 | 住友ベークライト株式会社 | Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device |
| CN101973145A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | Method for preparing embedded material and embedded material prepared thereby |
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Application publication date: 20120530 |