CN102478435A - Thermal resistor temperature conversion method and device thereof for signal simulation - Google Patents
Thermal resistor temperature conversion method and device thereof for signal simulation Download PDFInfo
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- CN102478435A CN102478435A CN2010105555376A CN201010555537A CN102478435A CN 102478435 A CN102478435 A CN 102478435A CN 2010105555376 A CN2010105555376 A CN 2010105555376A CN 201010555537 A CN201010555537 A CN 201010555537A CN 102478435 A CN102478435 A CN 102478435A
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Abstract
The invention provides a thermal resistor temperature conversion method and a device thereof for signal simulation. A conversion speed from resistance to temperature is increased by sampling an amplified voltage to calculate a resistance value of a thermal resistor in turn and making the resistance value of the thermal resistor correspond to a temperature value under the condition of a constant current.
Description
Technical field
The present invention relates to the temperature transition technical field, relate in particular to a kind of thermal resistance temperature conversion method and device that is used for signal simulation.
Background technology
Signal simulation is Electronic Control production production run in enormous quantities, is used for various devices are carried out burn-in screen.Because signal simulation carries out under condition of different temperatures, therefore, the temperature detection of each link is most important.
Signal simulation carries out temperature detection through thermal resistance, and is then that its resistance is corresponding one by one with the test environment temperature, but because the thermal resistance slewing rate is slow, possibly cause accuracy of detection to reduce.
Therefore, it is very necessary with the conversion method and the device thereof of thermal resistance resistance to design a kind of temperature fast simple, that precision is high, is one of temperature transition technical field problem suddenly to be solved at present.
Summary of the invention
The embodiment of the invention provides a kind of thermal resistance temperature conversion method and device that is used for signal simulation; Under the situation of steady current; Calculate the resistance value of thermal resistance conversely through the voltage of sampling amplification; The resistance value of thermal resistance is corresponding with numerical value between the temperature, thus the slewing rate of resistance and temperature improved.
The embodiment of the invention provides following technical scheme:
A kind of thermal resistance temperature conversion method that is used for signal simulation comprises:
Step 1, through constant-current source circuit the voltage of thermal resistance and environment temperature to be carried out parameter corresponding.
Step 2, the voltage of thermal resistance is amplified.
Step 3, will pass through the voltage after the amplification, calculated resistance value.
The resistance value of step 4, processing thermal resistance is corresponding with the parameter between the temperature.
Preferably, in the above-mentioned steps one, the resistance and the environment temperature of thermal resistance have one-to-one relationship, and in constant-current source circuit, voltage and environment temperature have one-to-one relationship, and then it is corresponding that the voltage of thermal resistance and environment temperature are carried out parameter.
Preferably, in the above-mentioned steps one, the electric current of constant-current source circuit is 0.5mA.
Preferably, in the above-mentioned steps two, the voltage of thermal resistance is 20 through the enlargement factor of amplifying.
Preferably, in the above-mentioned steps two, through the voltage V=0.5 * 20 * R that amplifies, V=10R, wherein R is the resistance under the thermal resistance test environment temperature.
Preferably, in the above-mentioned steps three, said is to obtain through the dsp controller sampling through the voltage after amplifying.
Preferably, in the above-mentioned steps three, the voltage V that obtains through dsp controller sampling is for being accurate to behind the radix point one magnitude of voltage.
Preferably, in the above-mentioned steps four, the parameter between said resistance value and the temperature corresponds to form.
Preferably, above table is 1 ℃ of interval, adopts linear interpolation method two temperature that differ 1 ℃ of compartment.
A kind of resistance and temperature conversion equipment that is used for signal simulation comprises voltage temperature parameter processing module, voltage amplification module, resistance calculations module, resistance temperature parameter processing module.
Preferably, above-mentioned voltage temperature parameter processing module, it is corresponding to be used for through constant-current source circuit the voltage of thermal resistance and environment temperature being carried out parameter.
Preferably, above-mentioned voltage amplification module is used for the voltage of thermal resistance is amplified.
Preferably, the voltage of above-mentioned thermal resistance is 20 through the enlargement factor of amplifying, through the voltage V=0.5 * 20 * R that amplifies, and V=10R, wherein R is the resistance under the thermal resistance test environment temperature.
Preferably, above-mentioned resistance calculations module is used for the voltage after the process amplification, calculated resistance value.
Preferably, above-mentioned is to obtain through the dsp controller sampling through the voltage after amplifying.
Preferably, above-mentioned resistance temperature parameter processing module, the resistance value that is used to handle thermal resistance is corresponding with the parameter between the temperature.
A kind of thermal resistance temperature conversion method and device that is used for signal simulation provided by the invention; Under the situation of steady current; Calculate the resistance value of thermal resistance conversely through the voltage of sampling amplification; The resistance value of thermal resistance is corresponding with numerical value between the temperature, thus the slewing rate of resistance and temperature improved.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below.Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the thermal resistance temperature conversion method process flow diagram that the embodiment of the invention provides;
Fig. 2 is the thermal resistance temperature conversion method device synoptic diagram that the embodiment of the invention provides;
Embodiment
The embodiment of the invention provides a kind of thermal resistance temperature conversion method and device that is used for signal simulation; Under the situation of steady current; Calculate the resistance value of thermal resistance conversely through the voltage of sampling amplification; The resistance value of thermal resistance is corresponding with numerical value between the temperature, thus the slewing rate of resistance and temperature improved.For making the object of the invention, technical scheme and advantage clearer, the embodiment that develops simultaneously with reference to the accompanying drawings is to further explain of the present invention.
The embodiment of the invention provides a kind of thermal resistance temperature conversion method that is used for signal simulation, and as shown in Figure 1, concrete steps comprise:
Step 1, through constant-current source circuit the voltage of thermal resistance and environment temperature to be carried out parameter corresponding.
Particularly; Because the resistance and the environment temperature of thermal resistance have one-to-one relationship, so in embodiments of the present invention, have adopted constant-current source circuit; Make voltage and environment temperature have one-to-one relationship, and then it is corresponding that the voltage of thermal resistance and environment temperature are carried out parameter.
Further, the electric current of above-mentioned constant-current source circuit is 0.5mA.
Step 2, the voltage of thermal resistance is amplified.
Particularly, the voltage of thermal resistance is 20 through the enlargement factor of amplifying, above-mentioned voltage V=0.5 * 20 * R through amplifying, and V=10R, wherein R is the resistance under the thermal resistance test environment temperature.
Step 3, will pass through the voltage after the amplification, calculated resistance value.
Particularly, above-mentioned is to obtain through the dsp controller sampling through the voltage after amplifying.
Particularly, the voltage V that obtains through dsp controller sampling is for being accurate to behind the radix point one magnitude of voltage.
The resistance value of step 4, processing thermal resistance is corresponding with the parameter between the temperature.
Particularly, the parameter between above-mentioned resistance value and the temperature corresponds to form, and form is 1 ℃ of interval, adopts linear interpolation method two temperature that differ 1 ℃ of compartment.
Particularly, in embodiments of the present invention, the constant current source electric current is 0.5mA; Voltage on the thermal resistance is 20 through the enlargement factor of amplifying, this voltage V=0.5 * 20 * R through amplifying, V=10R; Wherein R is the resistance under the thermal resistance test environment temperature; The voltage V that dsp controller sampling obtains is the magnitude of voltage that is accurate to behind the radix point one, and under the situation of steady current, the voltage that amplifies through sampling calculates the resistance value of thermal resistance conversely; The resistance value of thermal resistance is corresponding with numerical value between the temperature, thus the slewing rate of resistance and temperature improved.
In addition, the embodiment of the invention also provides a kind of resistance and temperature conversion equipment that is used for signal simulation.A kind of resistance and temperature conversion equipment synoptic diagram that is used for signal simulation as shown in Figure 2, as to provide for the embodiment of the invention.
A kind of resistance and temperature conversion equipment that is used for signal simulation comprises voltage temperature parameter processing module 11, voltage amplification module 22, resistance calculations module 33, resistance temperature parameter processing module 44.
Voltage temperature parameter processing module 11, it is corresponding to be used for through constant-current source circuit the voltage of thermal resistance and environment temperature being carried out parameter.
Particularly; Because the resistance and the temperature of thermal resistance have one-to-one relationship, so in embodiments of the present invention, have adopted constant-current source circuit; Make voltage and environment temperature have one-to-one relationship, and then it is corresponding that the voltage of thermal resistance and environment temperature are carried out parameter.
Further, the electric current of above-mentioned constant-current source circuit is 0.5mA.
Particularly, the voltage of thermal resistance is 20 through the enlargement factor of amplifying, above-mentioned voltage V=0.5 * 20 * R through amplifying, and V=10R, wherein R is the resistance under the thermal resistance test environment temperature.
Particularly, above-mentioned is to obtain through the dsp controller sampling through the voltage after amplifying.
Particularly, the voltage V that obtains through dsp controller sampling is for being accurate to behind the radix point one resistance value.
Resistance temperature parameter processing module 44, the resistance value that is used to handle thermal resistance is corresponding with the parameter between the temperature.
Particularly, the parameter between above-mentioned resistance value and the temperature corresponds to form, and form is 1 ℃ of interval, adopts linear interpolation method two temperature that differ 1 ℃ of compartment.
Particularly, in embodiments of the present invention, the constant current source electric current is 0.5mA; Voltage on the thermal resistance is 20 through the enlargement factor of amplifying, this voltage V=0.5 * 20 * R through amplifying, V=10R; Wherein R is the resistance under the thermal resistance test environment temperature; The voltage V that dsp controller sampling obtains is the magnitude of voltage that is accurate to behind the radix point one, and under the situation of steady current, the voltage that amplifies through sampling calculates the resistance value of thermal resistance conversely; The resistance value of thermal resistance is corresponding with numerical value between the temperature, thus the slewing rate of resistance and temperature improved.
One of ordinary skill in the art will appreciate that and realize that all or part of step that the foregoing description method is carried is to instruct relevant hardware to accomplish through program; Described program can be stored in a kind of computer-readable recording medium; This program comprises one of step or its combination of method embodiment when carrying out.
In addition, each functional unit in each embodiment of the present invention can be integrated in the processing module, also can be that the independent physics in each unit exists, and also can be integrated in the module two or more unit.Above-mentioned integrated module both can adopt the form of hardware to realize, also can adopt the form of software function module to realize.If said integrated module realizes with the form of software function module and during as independently production marketing or use, also can be stored in the computer read/write memory medium.
In sum; This paper provides the embodiment of the invention that a kind of thermal resistance temperature conversion method and device that is used for signal simulation is provided; Under the situation of steady current; The voltage that amplifies through sampling calculates the resistance value of thermal resistance conversely, and the resistance value of thermal resistance is corresponding with numerical value between the temperature, thereby has improved the slewing rate of resistance and temperature.
More than a kind of thermal resistance temperature conversion method and device that is used for signal simulation provided by the present invention carried out detailed introduction; Used concrete example among this paper principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand scheme of the present invention; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (16)
1. a thermal resistance temperature conversion method that is used for signal simulation is characterized in that, said thermal resistance temperature conversion method comprises:
Step 1, through constant-current source circuit the voltage of thermal resistance and environment temperature to be carried out parameter corresponding.
Step 2, the voltage of thermal resistance is amplified.
Step 3, will pass through the voltage after the amplification, calculated resistance value.
The resistance value of step 4, processing thermal resistance is corresponding with the parameter between the temperature.
2. thermal resistance temperature conversion method according to claim 1; It is characterized in that; In said step 1, the resistance and the environment temperature of thermal resistance have one-to-one relationship, in constant-current source circuit; Voltage and environment temperature have one-to-one relationship, and then it is corresponding that the voltage of thermal resistance and environment temperature are carried out parameter.
3. thermal resistance temperature conversion method according to claim 1 is characterized in that, in said step 1, the electric current of constant-current source circuit is 0.5mA.
4. thermal resistance temperature conversion method according to claim 1 is characterized in that, in said step 2, the voltage of thermal resistance is 20 through the enlargement factor of amplifying.
5. thermal resistance temperature conversion method according to claim 1 is characterized in that, in said step 2, and through the voltage V=0.5 * 20 * R that amplifies, V=10R, wherein R is the resistance under the thermal resistance test environment temperature.
6. thermal resistance temperature conversion method according to claim 1 is characterized in that, in said step 3, said is to obtain through the dsp controller sampling through the voltage after amplifying.
7. thermal resistance temperature conversion method according to claim 6 is characterized in that, in said step 3, the voltage V that obtains through dsp controller sampling is for being accurate to behind the radix point one magnitude of voltage.
8. thermal resistance temperature conversion method according to claim 1 is characterized in that, in said step 4, the parameter between said resistance value and the temperature corresponds to form.
9. thermal resistance temperature conversion method according to claim 8 is characterized in that, said form is 1 ℃ of interval, adopts linear interpolation method two temperature that differ 1 ℃ of compartment.
10. a resistance and temperature conversion equipment that is used for signal simulation is characterized in that, said resistance and temperature conversion equipment comprises voltage temperature parameter processing module, voltage amplification module, resistance calculations module, resistance temperature parameter processing module.
11. resistance and temperature conversion equipment according to claim 10 is characterized in that, said voltage temperature parameter processing module, and it is corresponding to be used for through constant-current source circuit the voltage of thermal resistance and environment temperature being carried out parameter.
12. resistance and temperature conversion equipment according to claim 10 is characterized in that, the voltage amplification module is used for the voltage of thermal resistance is amplified.
13. resistance and temperature conversion equipment according to claim 12 is characterized in that, the voltage of thermal resistance is 20 through the enlargement factor of amplifying, through the voltage V=0.5 * 20 * R that amplifies, and V=10R, wherein R is the resistance under the thermal resistance test environment temperature.
14. resistance and temperature conversion equipment according to claim 10 is characterized in that, said resistance calculations module is used for the voltage after the process amplification, calculated resistance value.
15. resistance and temperature conversion equipment according to claim 14 is characterized in that, said is to obtain through the dsp controller sampling through the voltage after amplifying.
16. resistance and temperature conversion equipment according to claim 10 is characterized in that, said resistance temperature parameter processing module, and the resistance value that is used to handle thermal resistance is corresponding with the parameter between the temperature.
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Cited By (7)
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CN103017941A (en) * | 2012-12-27 | 2013-04-03 | 北京经纬恒润科技有限公司 | Thermal-resistance simulating device |
CN107144369A (en) * | 2017-06-27 | 2017-09-08 | 深圳库博能源科技有限公司 | A kind of temperature signal emulation mode being used in DCS production debuggings and device |
CN108225594A (en) * | 2017-12-25 | 2018-06-29 | 青岛海尔科技有限公司 | Obtain method, apparatus, equipment and the readable storage medium storing program for executing of NTC resistance temperatures |
CN108599634A (en) * | 2018-03-30 | 2018-09-28 | 江苏美的清洁电器股份有限公司 | Dust catcher, the control method of brshless DC motor, device and system |
CN108631657A (en) * | 2018-03-30 | 2018-10-09 | 江苏美的清洁电器股份有限公司 | Dust catcher, the control method of brshless DC motor, device and system |
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2010
- 2010-11-23 CN CN2010105555376A patent/CN102478435A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103017941A (en) * | 2012-12-27 | 2013-04-03 | 北京经纬恒润科技有限公司 | Thermal-resistance simulating device |
CN103017941B (en) * | 2012-12-27 | 2014-10-22 | 北京经纬恒润科技有限公司 | Thermal-resistance simulating device |
CN109641585A (en) * | 2016-09-22 | 2019-04-16 | 索尤若驱动有限及两合公司 | For monitor can solenoid-operated brake method and with can solenoid-operated brake vehicle |
CN109641585B (en) * | 2016-09-22 | 2021-08-27 | 索尤若驱动有限及两合公司 | Method for monitoring an electromagnetically actuable brake and vehicle having an electromagnetically actuable brake |
US11535226B2 (en) | 2016-09-22 | 2022-12-27 | Sew-Eurodrive Gmbh & Co. Kg | Method for monitoring an electromagnetically actuable brake, and vehicle having an electromagnetically actuable brake |
CN107144369A (en) * | 2017-06-27 | 2017-09-08 | 深圳库博能源科技有限公司 | A kind of temperature signal emulation mode being used in DCS production debuggings and device |
CN107144369B (en) * | 2017-06-27 | 2020-06-05 | 深圳库博能源科技有限公司 | Temperature signal simulation method and device for DCS product debugging |
CN108225594A (en) * | 2017-12-25 | 2018-06-29 | 青岛海尔科技有限公司 | Obtain method, apparatus, equipment and the readable storage medium storing program for executing of NTC resistance temperatures |
CN108599634A (en) * | 2018-03-30 | 2018-09-28 | 江苏美的清洁电器股份有限公司 | Dust catcher, the control method of brshless DC motor, device and system |
CN108631657A (en) * | 2018-03-30 | 2018-10-09 | 江苏美的清洁电器股份有限公司 | Dust catcher, the control method of brshless DC motor, device and system |
CN113885359A (en) * | 2021-10-27 | 2022-01-04 | 江西洪都航空工业集团有限责任公司 | Semi-physical simulation atmospheric temperature simulation method |
CN113885359B (en) * | 2021-10-27 | 2024-05-10 | 江西洪都航空工业集团有限责任公司 | Semi-physical simulation atmospheric temperature simulation method |
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Application publication date: 20120530 |