CN102456585B - Solder ball transferring tool and transferring method for narrow-interval solder ball attach - Google Patents
Solder ball transferring tool and transferring method for narrow-interval solder ball attach Download PDFInfo
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- CN102456585B CN102456585B CN 201010521883 CN201010521883A CN102456585B CN 102456585 B CN102456585 B CN 102456585B CN 201010521883 CN201010521883 CN 201010521883 CN 201010521883 A CN201010521883 A CN 201010521883A CN 102456585 B CN102456585 B CN 102456585B
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Abstract
The invention discloses a solder ball transferring tool and a solder ball transferring method for narrow-interval solder ball attach. The solder ball transferring tool is an auxiliary tool for realizing the narrow-interval solder ball attach. Lower surface openings of the solder ball transferring tool correspond to soldering-pans, and upper surface openings of the solder ball transferring tool correspond to ball sucking holes of a solder ball attach device. The upper and lower surface openings are connected by inner channels. Sidewalls of part of the inner channels are provided with parts which are not vertical to the upper and lower surfaces of the solder ball transferring tool. Intervals between the upper surface openings are greater than those between the lower surface openings. The upper and lower surface openings are distributed in such a way, so that the solder ball attach of the soldering-pans at narrow intervalsis changed into greater-interval solder ball attach, the solder ball attach device with relatively greater ball sucking hole intervals also can realize the solder ball attach of the soldering-pans at the narrow intervals, and the process capabilities of the conventional solder ball attach process and the solder ball attach device are further improved.
Description
Technical field
The present invention relates to planting ball technique (solder ball attach) and planting the ball system in a kind of semiconductor packaging process, particularly relate to a kind of for soldered ball is transferred to soldered ball transfer tool and the transfer method of thin space packaging body pad from ball-planting device.
Background technology
Along with the development of electronic product technology, electronic product is towards modular future development, and layout density more and more can not meet the requirement of electronic product high density layouts development.
Since BGA Package (BGA) occurring, this kind of encapsulation technology obtained the development be exceedingly fast, for IC, encapsulate, because but BGA encapsulation has higher packaging density, less area occupied, high assembleability and higher reliability etc., the BGA encapsulation has become the mainstream technology of encapsulation technology, and the trend of continuous expansion is arranged.In the BGA encapsulation technology, plant the playing skill art and occupy consequence, planting the playing skill art is mainly on the corresponding pad of device substrate, to adopt certain technology to be formed for the soldered ball of interconnection.
With reference to Fig. 1, Fig. 2 and Fig. 3, Korean Patent KR100735517B1 discloses and has a kind ofly existingly planted the ball system and plant ball technique, its utilization is nested in the thimble 108 of inhaling in the ball hole and discharges ball, this is planted the ball system and comprises ball-planting device 101, hold the pallet 102 of soldered ball 107 and plant the ball object, plant ball to liking the pad 104 on packaging body 103, particularly packaging body.Fig. 1 illustrates the work schematic diagram that ball-planting device 101 is drawn soldered ball, and as shown in Figure 1, pallet 102, by ultrasonic vibration, causes that the soldered ball wherein held jumps, and is the partial suspended state.Ball-planting device 101 utilizes vacuum that soldered ball 107 is adsorbed onto in each suction ball hole of ball-planting device 101.Then as shown in Figure 2, ball-planting device 101 moves to packaging body 103 tops, then move down until soldered ball 107 touches pad 104, inhale afterwards the built-in thimble of ball hole 108 (referring to Fig. 3) and release soldered ball 107, the vacuum that simultaneously will inhale in the ball hole is converted to air blowing, acting in conjunction is transferred on pad 104 soldered ball, and this method is called to shift plants ball.
The suction ball hole of ball-planting device 101 and the distribution of the pad 104 on packaging body 103 are one to one, the suction ball hole spacing minimal design limit that the ball-planting device 101 of ball-establishing method is shifted in existing employing is 0.4mm, be less than 0.4mm because if inhale ball hole spacing, the probability that produces " two balls have been drawn in a hole " (double ball) and " not being drawn onto ball " (missing ball) when drawing soldered ball will increase greatly, is unsuitable for volume production and uses; The thimble 108 of inhaling in addition in the ball hole also can diminish and attenuate along with inhaling the ball hole, and easily bending, cause the high repair rate of ball-planting device when volume production is used.To sum up, the suction ball hole spacing limit of current ball-planting device 101 is 0.4mm.Therefore, be less than the ball demand of planting of the packaging body of 0.4mm for solder pad space length, existing ball-planting device and ball-establishing method can't meet.
Summary of the invention
The objective of the invention is to improve the existing ball technique of planting and thin space pad (particularly 0.4mm is following) is planted to the limitation of the ability of ball engineering.
To achieve these goals, the invention provides a kind of soldered ball transfer tool, wherein, described soldered ball transfer tool has upper surface and lower surface, there are a plurality of upper surface open on described upper surface, there are a plurality of lower surface openings on described lower surface, described a plurality of upper surface open is connected by corresponding a plurality of inner passages with described a plurality of lower surface openings, when soldered ball shifts, by described inner passage, the spacing of the soldered ball of adjacent upper surface open between falling into a little is greater than the spacing between the center of adjacent lower surface opening.
Described a plurality of upper surface open is corresponding with the suction ball hole of ball-planting device, and described a plurality of lower surface openings are corresponding with the pad of packaging body.
The spacing of the lower surface opening of soldered ball transfer tool is less than 0.4mm.
The upper surface of soldered ball transfer tool is parallel to the lower surface of ball-planting device, and the lower surface of soldered ball transfer tool is parallel to the upper surface of packaging body.
The sidewall of at least a portion inner passage in described a plurality of inner passage has the described upper surface that is not orthogonal to the soldered ball transfer tool and/or the surface portion of described lower surface.
The area of each upper surface open can be all identical with the area of each self-corresponding lower surface opening.
The area of a part of upper surface open in described a plurality of upper surface open can be greater than the area of corresponding lower surface opening.
The area of all upper surface open all can be slightly larger than or equal the area of the suction ball hole of ball-planting device.
The area of a part of upper surface open in described a plurality of upper surface open can be more than the twice of area of corresponding suction ball hole.
The number of the lower surface opening of soldered ball transfer tool can equate with the pad number of packaging body or approach.
The number of the lower surface opening of soldered ball transfer tool can be less than the number of the pad of packaging body.
The number of the lower surface opening of soldered ball transfer tool can be pad number only about half of of packaging body.
The area of soldered ball transfer tool can be less than the area of packaging body, and for example, the area of soldered ball transfer tool can be approximately half of packaging body area.
The soldered ball transfer tool can rotate, thereby can implant several times soldered ball.
To achieve these goals, the invention provides one kind and plant the ball system, comprising: foregoing soldered ball transfer tool; Ball-planting device, described ball-planting device has a plurality of suction ball holes, and described a plurality of suction ball holes are corresponding with described a plurality of upper surface open of soldered ball transfer tool.
The described ball system of planting also can comprise: pallet, for holding soldered ball, pallet, by ultrasonic vibration, makes the soldered ball wherein held be the partial suspended state.
Be provided with thimble in the suction ball hole of ball-planting device, ball-planting device utilizes vacuum that soldered ball is adsorbed onto in each suction ball hole of ball-planting device, and described thimble can be released soldered ball.
To achieve these goals, the invention provides a kind of ball-establishing method, comprise the following steps: utilize ball-planting device to draw soldered ball; The soldered ball transfer tool is placed on to the pad top of packaging body, and the soldered ball transfer tool is aimed at the whole or a part of of packaging body; Ball-planting device moves to soldered ball soldered ball transfer tool top and aims at; Ball-planting device is discharged soldered ball; Soldered ball is attached on the pad of packaging body by the inner passage of soldered ball transfer tool.
Described ball-establishing method also comprises: mobile ball-planting device is drawn soldered ball again, ball-planting device moves to soldered ball soldered ball transfer tool top and aims at, rotation soldered ball transfer tool and ball-planting device, make the soldered ball transfer tool aim at another part of packaging body, ball-planting device is discharged soldered ball, and soldered ball is attached on the pad of packaging body by the inner passage of soldered ball transfer tool.
Described ball-establishing method also comprises: mobile ball-planting device is drawn soldered ball again, ball-planting device moves to soldered ball soldered ball transfer tool top and aims at, the rotation packaging body, make another part of packaging body aim at the soldered ball transfer tool, ball-planting device is discharged soldered ball, and soldered ball is attached on the pad of packaging body by the inner passage of soldered ball transfer tool.
In described ball-establishing method, ball-planting device is discharged the step that the step of soldered ball and the soldered ball inner passage by the soldered ball transfer tool is attached on the pad of packaging body and is specially: ball-planting device is placed on soldered ball in the upper surface open of soldered ball transfer tool, then arrive the lower surface opening of soldered ball transfer tool through the soldered ball transfer tool by the thimble of ball-planting device and the promotion soldered ball of blowing, thereby soldered ball finally is placed on the packaging body pad.
The present invention has realized following effect: expanded existing process capability of planting ball technique and ball-planting device, in the situation that to the existing equipment minimum change, utilized the ball-planting device of larger suction ball hole spacing just can complete the ball of planting of thin space.
The accompanying drawing explanation
The description of being undertaken by the accompanying drawing below in conjunction with an example exemplarily is shown, above and other purpose of the present invention and characteristics will become apparent, wherein:
Fig. 1 illustrates the work schematic diagram that ball-planting device is drawn soldered ball;
Fig. 2 illustrates the working state figure that ball-planting device shifts soldered ball;
Fig. 3 is the amplification detail view of suction ball hole part A of built-in thimble that the ball-planting device of Fig. 1 is shown;
Fig. 4 is the operation principle schematic diagram of soldered ball transfer tool;
Fig. 5 A is total view of soldered ball transfer tool according to an embodiment of the invention;
Fig. 5 B is the cutaway view along the line A-B intercepting of Fig. 5 A;
Fig. 5 C is the aperture distribution figure of the upper surface (ball-planting device side) of soldered ball transfer tool according to an embodiment of the invention;
Fig. 5 D is the aperture distribution figure of the lower surface (land side) of soldered ball transfer tool according to an embodiment of the invention;
Fig. 5 E is the suction ball hole distribution figure of ball-planting device according to an embodiment of the invention;
Fig. 6 A is total view of soldered ball transfer tool according to another embodiment of the present invention;
Fig. 6 B is the aperture distribution figure of the upper surface (ball-planting device side) of soldered ball transfer tool according to another embodiment of the present invention;
Fig. 6 C is the aperture distribution figure of the lower surface (land side) of soldered ball transfer tool according to another embodiment of the present invention;
Fig. 6 D is the suction ball hole distribution figure of ball-planting device according to another embodiment of the present invention;
Fig. 6 E is the fundamental diagram of soldered ball transfer tool according to another embodiment of the present invention.
Embodiment
Below, describe embodiments of the invention in detail with reference to accompanying drawing.
As shown in Figure 4, soldered ball transfer tool 201 comprises upper and lower two surfaces to the operation principle of planting the ball system and planting ball technique of the present invention, has respectively a plurality of upper surface open and a plurality of lower surface opening.In planting the ball process, soldered ball enters from upper surface open, from the lower surface opening, shifts out.The distribution compactness of the opening of lower surface, the opening of lower surface is consistent corresponding with the distribution of each pad 104 of packaging body 103, and the opening of upper surface can be received and respectively inhales from ball-planting device 101 soldered ball that the ball hole falls, the area of the comparable suction ball of the area of upper surface open hole is much bigger (for example, can be more than the twice for the area of inhaling the ball hole), also can approach or equate with the area of inhaling the ball hole.Upper surface open is extended and expands according to the lower surface opening, makes the spacing of the gap ratio lower surface opening of upper surface open increase.More particularly, the spacing of the soldered ball of adjacent upper surface open between falling into a little is greater than the spacing between the center of adjacent lower surface opening.Described soldered ball falls into and a little refers to the soldered ball dropping process and just started the point contacted with the upper surface of soldered ball transfer tool.Spacing between the center of adjacent lower surface opening can be set to be less than 0.4mm, for example 0.2mm.
In addition, in a plurality of openings of upper surface, the area of a part of opening can be larger than the area of the corresponding opening on lower surface.The shape of part upper surface open can be circle, the shape of another part upper surface open can be the run-track shaped (shape be comprised of with the rectangle of described equal diameters at least on one side the semicircle of two equal diameters and, similar runway), oval, polygon, etc.Certainly, the area of all upper surface open all can equal the area of the lower surface opening corresponding with it.The shape of all upper surface open can be all circle.Described a plurality of upper surface open is corresponding one by one with described a plurality of lower surface openings by a plurality of inner passages.Preferably, the upper surface of soldered ball transfer tool is parallel to the lower surface of ball-planting device, and the lower surface of soldered ball transfer tool is parallel to the upper surface of packaging body.If above-mentioned four surfaces are parallel to each other, in a plurality of inner passages, have at least the sidewall of a part of inner passage can there is the surface portion of inclination, i.e. at least a portion on channel side wall surface surface non-perpendicular to the upper surface of soldered ball transfer tool and/or the lower surface of soldered ball transfer tool.
In planting the ball process, employing has the ball-planting device 101 of larger suction ball hole spacing and draws soldered ball and move to soldered ball transfer tool 201 tops, then soldered ball is discharged to the upper surface open of soldered ball transfer tool 201, soldered ball falls along inner passage due to Action of Gravity Field and discharges by the more closely spaced lower surface opening of having of soldered ball transfer tool 201, and contact with pad 104, thereby can be by the ball of planting that ball changes larger spacing into of planting of the pad of thin space, make the existing ball ability of planting with ball-planting device 101 of larger suction ball hole spacing also can meet the ball demand of planting of thin space (being less than 0.4mm) pad.
The present invention includes the soldered ball transfer tool two kinds of designs, there are corresponding two kinds and inhale the ball-planting device of ball hole distributions and adopt this instrument to be planted the technique of ball, respectively as shown in Fig. 5 A-Fig. 5 E and Fig. 6 A-Fig. 6 E.
Fig. 5 A is the total view according to the soldered ball transfer tool of the first embodiment of the present invention, and Fig. 5 B is the cutaway view along the line A-B intercepting of Fig. 5 A.
As shown in Fig. 5 A and Fig. 5 B, this soldered ball transfer tool 201 comprises upper surface 202, lower surface 203, and the opening on two sides connects one to one by inner passage.The aperture distribution of lower surface 203 distributes consistent with the pad of packaging body 103, the aperture efficiency of upper surface 202 is extended and expands according to the opening of lower surface 203, make the suction ball hole distribution 204 of ball-planting device 101 need not be limited to the pad distribution, but adopted the dispersion of larger spacing to distribute.
Fig. 5 C is the aperture distribution figure according to the upper surface of the soldered ball transfer tool of the first embodiment of the present invention (ball-planting device side); Fig. 5 D is the aperture distribution figure according to the lower surface (land side) of the soldered ball transfer tool of the first embodiment of the present invention; Fig. 5 E is the suction ball hole distribution figure according to the ball-planting device of the first embodiment of the present invention.
With reference to Fig. 4 and Fig. 5 A-Fig. 5 E, at first this soldered ball transfer tool 201 is placed on packaging body 103 tops, and lower surface 203 aligns with pad 104.All suction ball holes of ball-planting device 101 are all drawn soldered ball, then soldered ball is placed on the upper surface 202 of soldered ball transfer tool 201, by thimble and the air blowing of ball-planting device, promotes soldered ball and transfer to lower surface 203 along the passage in instrument, and fit with pad, complete and plant ball.
As shown in Figure 5A, the dotted line circle R1 representative zone corresponding with the suction ball hole of ball-planting device 101 in figure, it is also the position that soldered ball starts to fall from upper surface 202, the distribution of R1 and Fig. 5 E are in full accord, larger opening R2 represents the opening shape on upper surface 202, and the distribution of R2 also can be referring on all four Fig. 5 C, and R3 represents the opening shape on lower surface 203, the distribution of R3 also can be referring on all four Fig. 5 D, and the lower surface aperture distribution in Fig. 5 D is fully corresponding with pad.Therefore, the ball-planting device of comparison diagram 5E is inhaled the lower surface aperture distribution (distributing corresponding to pad) of the soldered ball transfer tool of ball hole distribution and Fig. 5 D, perhaps with reference to Fig. 5 A, can find out that two spacings of inhaling between the ball hole of arbitrary neighborhood all are greater than the spacing (being also the spacing between pad) between the lower surface opening, therefore can, by the ball of planting that ball changes larger spacing into of planting of thin space pad, make the existing ball ability of planting with ball-planting device 101 of larger suction ball hole spacing distribution 105 also can meet the ball demand of planting of thin space pad.
Shown in Fig. 5 A-Fig. 5 E is the project organization of corresponding single package body.In actual the use, packaging body be take array combination and is carried out the packaging technology operation as strip, and therefore corresponding tool design also should be the strip of array arrangement.
Fig. 6 A is total view of soldered ball transfer tool according to a second embodiment of the present invention.Fig. 6 B is the aperture distribution figure of the upper surface (ball-planting device side) of soldered ball transfer tool according to a second embodiment of the present invention.Fig. 6 C is the aperture distribution figure of the lower surface (land side) of soldered ball transfer tool according to a second embodiment of the present invention.Fig. 6 D is the suction ball hole distribution figure of ball-planting device according to a second embodiment of the present invention.Fig. 6 E is the fundamental diagram of soldered ball transfer tool according to a second embodiment of the present invention.
Its working method and the first embodiment are similar, difference is the ball of planting of packaging body is completed by twice, the area of soldered ball transfer tool is approximately half of area of the soldered ball transfer tool of the first embodiment, also can be approximately half of area of packaging body 103, ball-planting device suction ball hole and the aperture distribution of soldered ball transfer tool different from the first embodiment, the number of the opening of suction ball hole and soldered ball transfer tool is all few than the first embodiment, for example, and can be for only about half of.First complete for the first time the ball of planting of half, then, by ball-planting device and the equal 90-degree rotation of soldered ball transfer tool (or also can make the packaging body 90-degree rotation), make second half pad corresponding with soldered ball transfer tool and ball-planting device, then complete second half and plant ball.With reference to Fig. 5 A and Fig. 6 E, because pad has inside and outside two distributions of enclosing, so the soldered ball transfer tool also has the opening of inside and outside two circles, because the number of openings of the soldered ball transfer tool shown in Fig. 6 E of the second embodiment only has number of openings only about half of of the soldered ball transfer tool of the first embodiment (as shown in Figure 5A), therefore, in the inner ring of the soldered ball transfer tool of the second embodiment with the opening of interior edge (for example, O5) adjacent number of openings reduces, for example, as shown in Fig. 6 B and Fig. 6 E, the opening adjacent with the opening O5 of soldered ball transfer tool be the right-hand O6 at it only only, and the opening adjacent with O5 obviously has two in the inner ring of the soldered ball transfer tool shown in Fig. 5 of the first embodiment A, respectively in its right-hand (O6) and below.Therefore, the opening of the O5 of the first embodiment below can only from O5 and O6 away from (with reference to Fig. 5 A), and the second embodiment can allow the space that opening extends to increase, the opening of the upper surface of soldered ball transfer tool (ball-planting device side) particularly, the problem that this can't design because of insufficient space with regard to the opening that has solved the corresponding soldered ball transfer tool of the pad that distributes for interior edge solid matter.Comparison diagram 5A and Fig. 6 E just can know, pad corresponding to inside and outside two circles distributes, the soldered ball transfer tool also has the opening of inside and outside two circles, the inner ring pad of the first embodiment and the opening of soldered ball transfer tool are not complete circles, but respectively reduce one at four interior edges, that is, lack the O1 shown in Fig. 6 E, O2, O3 and O4, really for the inner ring soldered ball, at four interior edges, each has lacked one to cause the last chou of planting; The second embodiment plants ball by twice, has realized the complete distribution of inner ring soldered ball.
In addition, except the complete distribution that realizes the inner ring soldered ball, adopt the soldered ball transfer tool of the small size of the second embodiment can also further increase the spacing between another part opening, for example, comparison diagram 5A and Fig. 6 A can know, the suction ball hole spacing d2 of the edge of the second embodiment is greater than the suction ball hole spacing d1 of the edge of the first embodiment.
The invention is not restricted to above-described embodiment, for example, the area of pad transfer tool can be less or wherein contained number of openings can be still less, thereby by rotating three times, four times or more times realizes planting ball.In addition, the shape of pad transfer tool also is not limited to the concrete shape gone out shown in the present.
In addition, the upper surface open of the soldered ball transfer tool in two embodiment of the present invention and the shape of lower surface opening are not limited to the circle shown in figure and run-track shaped, can be also square, polygon, ellipse etc.The area of all upper surface open of the present invention all can be slightly larger than or equal the area of the suction ball hole of ball-planting device, Fig. 6 A of not certain Fig. 5 A as the first embodiment or the second embodiment is shown; Similarly, the shape of all upper surface open of the present invention and/or area all can be identical with shape and/or the area of corresponding lower surface opening; In above-mentioned two situations, as long as guarantee that the distribution of upper surface open is just fully corresponding with the distribution of inhaling the ball hole, so also can realize that larger spacing is to more closely spaced transformation.
Although with reference to exemplary embodiment of the present invention, specifically illustrate and described according to soldered ball transfer tool of the present invention and soldered ball transfer method, but what those skilled in the art will appreciate that is, in the situation that do not break away from the spirit and scope of the present invention that limit as claims, can make the various changes on form and details here.
Claims (24)
1. a soldered ball transfer tool, wherein,
Described soldered ball transfer tool has upper surface and lower surface, there are a plurality of upper surface open on described upper surface, there are a plurality of lower surface openings on described lower surface, described a plurality of upper surface open is connected by corresponding a plurality of inner passages with described a plurality of lower surface openings, when soldered ball shifts, by described inner passage, the spacing of the soldered ball of adjacent upper surface open between falling into a little is greater than the spacing between the center of adjacent lower surface opening.
2. soldered ball transfer tool according to claim 1 is characterized in that:
Described a plurality of upper surface open is corresponding with the suction ball hole of ball-planting device, and described a plurality of lower surface openings are corresponding with whole pads or the part pad of packaging body.
3. soldered ball transfer tool according to claim 1 is characterized in that:
The spacing of the lower surface opening of soldered ball transfer tool is less than 0.4mm.
4. according to the described soldered ball transfer tool of any one in claim 1-3, it is characterized in that:
The upper surface of soldered ball transfer tool is parallel to the lower surface of ball-planting device, and the lower surface of soldered ball transfer tool is parallel to the upper surface of packaging body.
5. soldered ball transfer tool according to claim 4 is characterized in that:
The sidewall of at least a portion inner passage in described a plurality of inner passage has the described upper surface that is not orthogonal to the soldered ball transfer tool and/or the surface portion of described lower surface.
6. according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The shape of described a plurality of upper surface open is circle, or the part in described a plurality of upper surface open be shaped as oval, run-track shaped or polygon.
7. according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The area of each upper surface open is identical with area and/or the shape of each self-corresponding lower surface opening.
8. soldered ball transfer tool according to claim 6 is characterized in that:
The area of each upper surface open is identical with area and/or the shape of each self-corresponding lower surface opening.
9. according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The area of a part of upper surface open in described a plurality of upper surface open is greater than the area of corresponding lower surface opening, or the shape of a part of upper surface open in described a plurality of upper surface open is different from the shape of corresponding lower surface opening.
10. soldered ball transfer tool according to claim 6 is characterized in that:
The area of a part of upper surface open in described a plurality of upper surface open is greater than the area of corresponding lower surface opening, or the shape of a part of upper surface open in described a plurality of upper surface open is different from the shape of corresponding lower surface opening.
11., according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The area of all upper surface open all is slightly larger than or equals the area of the suction ball hole of ball-planting device.
12., according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The area of a part of upper surface open in described a plurality of upper surface open is more than the twice of area of corresponding suction ball hole.
13., according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The number of the lower surface opening of soldered ball transfer tool equates with the pad number of packaging body or approaches.
14., according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The number of the lower surface opening of soldered ball transfer tool is less than the number of the pad of packaging body.
15. the soldered ball transfer tool according to claim 14 is characterized in that:
The number of the lower surface opening of soldered ball transfer tool is approximately half of pad number of packaging body.
16., according to the described soldered ball transfer tool of any one in claim 1-3,5, it is characterized in that:
The area of soldered ball transfer tool is less than the area of packaging body.
17. the soldered ball transfer tool according to claim 16 is characterized in that:
The area of soldered ball transfer tool is approximately half of packaging body area.
18., according to the described soldered ball transfer tool of any one in claim 1-3,5,14 and 16, it is characterized in that:
The soldered ball transfer tool can rotate, thereby can implant several times soldered ball.
19. plant the ball system, comprising for one kind:
Soldered ball transfer tool as described as any one in claim 1-18;
Ball-planting device, described ball-planting device has a plurality of suction ball holes, and described a plurality of suction ball holes are corresponding with described a plurality of upper surface open of soldered ball transfer tool.
Plant the ball system 20. according to claim 19, also comprise:
Pallet, for holding soldered ball, pallet, by ultrasonic vibration, makes the soldered ball wherein held be the partial suspended state.
21., according to the described ball system of planting of claim 19 or 20, also comprise:
Be provided with thimble in the suction ball hole of ball-planting device, ball-planting device utilizes vacuum that soldered ball is adsorbed onto in each suction ball hole of ball-planting device, and described thimble can be released soldered ball.
22. one kind is utilized the described soldered ball transfer tool of claim 1-18 or claim 19-21 is described plants the method that the ball system is planted ball, comprises the following steps:
Utilize ball-planting device to draw soldered ball;
The soldered ball transfer tool is placed on to the pad top of packaging body, and the soldered ball transfer tool is aimed at the whole or a part of of packaging body;
Ball-planting device moves to soldered ball soldered ball transfer tool top and aims at;
Ball-planting device is discharged soldered ball;
Soldered ball is attached on the pad of packaging body by the inner passage of soldered ball transfer tool.
23. ball-establishing method according to claim 22 also comprises:
Mobile ball-planting device is drawn soldered ball again, ball-planting device moves to soldered ball soldered ball transfer tool top and aims at, rotation packaging body or rotation soldered ball transfer tool and ball-planting device, make the soldered ball transfer tool aim at another part of packaging body, ball-planting device is discharged soldered ball, and soldered ball is attached on the pad of packaging body by the inner passage of soldered ball transfer tool.
24., according to the described ball-establishing method of claim 22 or 23, wherein ball-planting device is discharged the step that the step of soldered ball and the soldered ball inner passage by the soldered ball transfer tool is attached on the pad of packaging body and is specially:
Ball-planting device is placed on soldered ball in the upper surface open of soldered ball transfer tool, then arrive the lower surface opening of soldered ball transfer tool through the soldered ball transfer tool by the thimble of ball-planting device and the promotion soldered ball of blowing, thereby soldered ball finally is placed on the packaging body pad.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010521883 CN102456585B (en) | 2010-10-25 | 2010-10-25 | Solder ball transferring tool and transferring method for narrow-interval solder ball attach |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010521883 CN102456585B (en) | 2010-10-25 | 2010-10-25 | Solder ball transferring tool and transferring method for narrow-interval solder ball attach |
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| CN102456585A CN102456585A (en) | 2012-05-16 |
| CN102456585B true CN102456585B (en) | 2013-12-25 |
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| JP3467217B2 (en) * | 1999-11-02 | 2003-11-17 | 日本電気株式会社 | Ball transfer device and ball transfer method |
| JP3803556B2 (en) * | 2001-03-26 | 2006-08-02 | 日本電気株式会社 | Ball transfer device and ball alignment device |
| TWI280641B (en) * | 2001-12-28 | 2007-05-01 | Via Tech Inc | Chip structure |
| CA2451951A1 (en) * | 2003-12-03 | 2005-06-03 | Ibm Canada Limited-Ibm Canada Limitee | Apparatus for mounting columns for grid array electronic packages |
| TWI238483B (en) * | 2004-09-01 | 2005-08-21 | Phoenix Prec Technology Corp | Semiconductor electrical connecting structure and method for fabricating the same |
| KR20060132404A (en) * | 2005-06-18 | 2006-12-21 | 삼성테크윈 주식회사 | Method for inspecting solder ball, apparatus for inspecting solder ball of semiconductor component implementing the same, and apparatus for transmitting solder ball of semiconductor component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409268A (en) * | 2007-10-08 | 2009-04-15 | 台湾积体电路制造股份有限公司 | Bond pad design for fine pitch wire bonding |
Non-Patent Citations (1)
| Title |
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| JP特开2001-135660A 2001.05.18 |
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| CN102456585A (en) | 2012-05-16 |
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