CN102454898A - Light emitting diode lamp bulb - Google Patents

Light emitting diode lamp bulb Download PDF

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Publication number
CN102454898A
CN102454898A CN2010105268564A CN201010526856A CN102454898A CN 102454898 A CN102454898 A CN 102454898A CN 2010105268564 A CN2010105268564 A CN 2010105268564A CN 201010526856 A CN201010526856 A CN 201010526856A CN 102454898 A CN102454898 A CN 102454898A
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CN
China
Prior art keywords
light emitting
emitting diode
heat
diode bulb
radiator structure
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Pending
Application number
CN2010105268564A
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Chinese (zh)
Inventor
傅恒扬
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Ray Wang
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傅恒扬
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 傅恒扬 filed Critical 傅恒扬
Priority to CN2010105268564A priority Critical patent/CN102454898A/en
Publication of CN102454898A publication Critical patent/CN102454898A/en
Pending legal-status Critical Current

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention relates to a light emitting diode lamp bulb, comprising a circuit board with a first surface and a second surface, which are opposite, a plurality of light emitting diodes which are arranged on the first surface and a heat radiating structure which comprises a heat radiating plate with a third surface and a forth surface, wherein the first surface and the second surface are opposite and the third surface and the forth surface are opposite; the third surface of the heat radiating plate is attached to the second surface of the circuit board, the forth surface is provided with a plurality of heat-radiating convex bumps, the lengths of the heat-radiating convex bumps are gradually reduced from the center of the forth surface to the edge of the forth surface. In the invention, the heat-radiating convex bumps for heat radiation are designed into shapes with different heights, and the air convection around the heat-radiating convex bumps is smooth, thereby increasing the whole heat radiating efficiency and being beneficial to increasing the luminous efficiency and the service life of the light emitting diode lamp bulb.

Description

Light emitting diode bulb
Technical field
The present invention relates to a kind of light emitting diode bulb, relate in particular to a kind of light emitting diode bulb in bulb shell set inside radiator structure.
Background technology
Because light emitting diode (light emitting diode is called for short LED) possess long service life, power consumption low, need not warm up the lamp time, with excellent in performance such as the reaction time is quick, so the application product of light emitting diode grows with each passing day.And along with the successful development of white light-emitting diode, the illumination application epoch of more opening light emitting diode.Trend in energy-saving and carbon-saving continues under the situation of rising, and the illumination market of light emitting diode is expanded gradually, and replaces light sources such as traditional Halogen lamp LED or incandescent lamp bulb gradually.
See also Fig. 1, be the stereogram of the light emitting diode bulb of the novel patent of TaiWan, China M389826 case " the mask locking structure that comprises the lamp device of radiating module is made improvement ".As shown in the figure; The surface structure of this light emitting diode bulb 1 is made up of spherical light cover 11, lamp socket 12 and 13 of the electric connections of light-permeable; This lamp socket 12 and light cover 11 set inside light emitting diodes, circuit board and transformer circuit of light sources assemblies such as (not icons); These lamp socket 12 peripheries are provided with the radiator structure of being made up of a plurality of fins 120 with a plurality of louvres that run through 121; The heat energy that is produced with the aforementioned lights source circuit assembly with set inside conducts to the outside through this fin 120, and also promotes heat energy dissipation effect through the louvre 121 on this fin 120 with convection type.
The generation of aforementioned heat energy is in light emitting diode bulb 1 inside, and is even if desire to produce convection action with the louvre on this fin 120 121, right; This louvre 121 also only can reach the thermal convection current of holder surface; The convection action of this louvre 121 also can't assist the bulb internal heat energy is discharged rapidly, therefore, adopts the light emitting diode bulb 1 of aforementioned radiator structure will make the effectively dissipation of its internal heat energy; Thereby under the influence of high heat; With the luminous efficiency that reduces light emitting diode, and cause the quick deterioration of circuit board, and shorten the service life of whole bulb.
Therefore, in view of the above-mentioned problems, how to make the radiating efficiency of light emitting diode bulb promote, so the luminous efficiency and the service life of improving light emitting diode bulb, the real problem of desiring most ardently solution at present that become.
Summary of the invention
In view of the disappearance of above-mentioned prior art, technical problem to be solved by this invention is, discloses a kind of light emitting diode bulb, and this light emitting diode bulb can have the radiating efficiency of lifting, improve luminous efficiency and then improve characteristics such as service life.
To achieve these goals, the present invention discloses a kind of light emitting diode bulb, comprising: circuit board has opposite first and second surface; A plurality of light emitting diodes are located on this first surface; And radiator structure; Comprise heat sink with relative the 3rd surface with the 4th surface; The 3rd surface of this heat sink is attached to the second surface of this circuit board, has a plurality of heat radiation projections on the 4th surface, and the length of this heat radiation projection is shortened to edge by the 4th centre of surface place gradually.
According to above-mentioned light emitting diode bulb, also comprise housing, be located on this circuit board and radiator structure around, this housing locates to have a plurality of perforates all around to the projection that should dispel the heat.
According to above-mentioned light emitting diode bulb, this housing forms heat-dissipating space near thermal source generation place of these a plurality of light emitting diodes, so that this radiator structure to be set in this heat-dissipating space.
According to above-mentioned light emitting diode bulb, the 4th surface of this heat sink can have jut, and the rising height of this jut is reduced to edge by the 4th centre of surface place gradually.
According to above-mentioned light emitting diode bulb, the material of this radiator structure can be metal.
According to above-mentioned light emitting diode bulb, this radiator structure is processed through die casting (die casting) molding mode.
According to above-mentioned light emitting diode bulb, this heat radiation projection be shaped as triangular pyramidal, quadrangular pyramid shape, polygonal taper, triangular pyramid shape, quadrangular pyramid cylindricality, polygonal awl cylindricality, cylindrical, square column type or polygonal cylindricality.
According to above-mentioned light emitting diode bulb, also comprise nm radiation heat radiation lacquer, be arranged on this heat radiation projection.
But the effect by last knowledge capital invention is that light emitting diode bulb of the present invention is the heat radiation projection that utilizes height to arrange, and makes that the hot-air that is positioned at the heating center can not stopped; And the ability quick heat radiating; In addition, through the passage that 360 degree around this radiator structure distribute, can further help the dissipation of heat; Finally make light emitting diode bulb can maintain the state of non high temperature, and the luminous efficiency and the service life that help promoting light emitting diode bulb.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is the stereogram of existing light emitting diode bulb;
Fig. 2 A and Fig. 2 B are respectively the three-dimensional explosive view and the three-dimensional combination figure of light emitting diode bulb of the present invention;
Fig. 3 is the side view of an embodiment of the radiator structure of light emitting diode bulb of the present invention;
Fig. 4 is the side view of another embodiment of the radiator structure of light emitting diode bulb of the present invention.
Wherein, Reference numeral
1,2 light emitting diode bulbs, 11 light covers
12 lamp sockets, 120 fins
121 louvres, 13 electric connections
21 circuit board 21a first surfaces
21b second surface 22 light emitting diodes
23,23 ' radiator structure, 231,231 ' heat sink
231a the 3rd surperficial 231b, 231b ' the 4th surface
2311 juts, 232 heat radiation projections
24 housings, 25 lampshades
26 power drives parts, 27 electric connections
240 perforates of 28 heat-dissipating spaces
241,242 grooves
The specific embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
See also Fig. 2 A and Fig. 2 B, be the stereogram of light emitting diode bulb of the present invention, wherein, Fig. 2 A is an explosive view, and Fig. 2 B is a constitutional diagram.
Shown in Fig. 2 A and Fig. 2 B, light emitting diode bulb 2 of the present invention comprises: circuit board 21 has opposite first 21a and second surface 21b; A plurality of light emitting diodes 22 are located on this first surface 21a; And radiator structure 23; Comprise and have the 3rd relative surperficial 231a and the heat sink 231 of the 4th surperficial 231b; The 3rd surperficial 231a of this heat sink 231 is attached to the second surface 21b of this circuit board 21, has a plurality of heat radiation projections 232 on the 4th surperficial 231b, and the length of these a plurality of heat radiation projections 232 is shortened to edge by the 4th surperficial 231b center gradually; As shown in Figure 3, it shows the side view of radiator structure 23 of the present invention.
The radiator structure 23 of aforesaid light emitting diode bulb 2 can be processed through the die cast mode.
According to above-mentioned structure; Also can comprise housing 24; Be located on around this circuit board 21 and the radiator structure 23,24 pairs of this housings should dispel the heat and locate to have a plurality of perforates 240 around the projection 232, particularly; This housing 24 forms heat-dissipating space 28 near thermal source generation place of these a plurality of light emitting diodes 22, so that this radiator structure 23 to be set in this heat-dissipating space 28.In light emitting diode bulb 2 of the present invention, the material preferably of this radiator structure 23 is a metal, and the second surface 21b of this circuit board 21 is connected with heat-conducting cream (not shown) with the 3rd surperficial 231a of heat sink 231, with the conduction efficiency of accelerated heat.
With Fig. 2 A is the example explanation; The circuit board 21 of light emitting diode bulb 2 of the present invention is to snap in the groove 241 of housing 24 inside with the edge of radiator structure 23; And the edge of this lampshade 25 is to snap in the groove 242 of housing 24 outsides, can be convenient to assembling by this, simultaneously escapable cost.What specify is because the lampshade 25 that is shown among Fig. 2 A and Fig. 2 B, power drives part 26, and part such as electric connection 27 can use general prior art, thereby will not give unnecessary details for literary composition at this.
By on can know; The heat that the present invention is produced circuit board 21 and light emitting diode 22 earlier conducts to the heat radiation projection 232 of radiator structure 23; Because the length of the heat radiation projection 232 of this radiator structure 23 is that edge is shorter than growing in the center; And the temperature of the center of circuit board 21 is higher usually, thereby can length increase outside the area of dissipations than long heat radiation projection 232 through being positioned at radiator structure 23 centers, again because heat radiation projection 232 length of edge are shorter; Thereby can not stop or hinder flowing of center air, so the heat of the heat radiation projection 232 of center can the convection current dissipation via air promptly; In addition, perforate 240 that also can be through this housing 24, make the hot-air that carries heat can be apace in the light emitting diode bulb to around (360 degree) outer discharge, and then lifting radiating efficiency.
Again can be as shown in Figure 4; The side view of another embodiment of radiator structure of the present invention; Be simplified illustration, only just propose explanation with not existing together of Fig. 3 here, promptly the 4th of the heat sink 231 ' of the radiator structure 23 ' of present embodiment the surperficial 231b ' has jut 2311; And the rising height of this jut 2311 is to be reduced to edge gradually by the 4th surperficial 231b ' center, increases area of dissipation through this jut 2311.
In the light emitting diode bulb of present embodiment; The shape of this heat radiation projection 232 can be triangular pyramidal, quadrangular pyramid shape, polygonal taper, triangular pyramid shape, quadrangular pyramid cylindricality, polygonal awl cylindricality, cylindrical, square column type or polygonal cylindricality etc., and is not limited to the shape that is shown in graphic.
In addition, the present invention also can comprise nm radiation heat radiation lacquer, is arranged on this heat radiation projection 232 with the mode that for example sprays, with further lifting radiating effect.
In sum; Light emitting diode bulb of the present invention is near its inside and generation place of light emitting diode thermal source, to form heat-dissipating space; So that the radiator structure that contacts with the circuit board that is provided with light emitting diode to be set in this heat-dissipating space; And this radiator structure side of this LED source transmit direction dorsad is provided with the heat radiation projection of a plurality of heat transmissions; Because the length of these a plurality of heat radiation projections is that edge arranges than short ground mode so that this circuit board center is long; And this light emitting diode bulb surrounds on the housing of this heat-dissipating space and also is provided with a plurality of passages, thereby can further assist outside the dissipation of light-emitting diodes tubular heat through this radiator structure, through this heat-dissipating space, enclose within a plurality of passages on the housing of this heat-dissipating space and a plurality of heat radiation projection length are by heat-dissipating space, outwards to shorten and arrange; More provide preferable thermal convection current to handle; With the integral heat sink effect of lifting light emitting diode bulb, thereby can make light emitting diode bulb can maintain the state of normal temperature, and the luminous efficiency and the service life that help promoting light emitting diode bulb.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (7)

1. a light emitting diode bulb is characterized in that, comprising:
Circuit board has opposite first and second surface;
A plurality of light emitting diodes are located on this first surface; And
Radiator structure; Comprise heat sink with relative the 3rd surface with the 4th surface; The 3rd surface of this heat sink is attached to the second surface of this circuit board, has a plurality of heat radiation projections on the 4th surface, and the length of this heat radiation projection is shortened to edge by the 4th centre of surface place gradually.
2. light emitting diode bulb according to claim 1 is characterized in that, also comprises housing, be located on this circuit board and radiator structure around, this housing locates to have a plurality of perforates around the projection to dispelling the heat.
3. light emitting diode bulb according to claim 1 is characterized in that, the 4th surface of this heat sink has jut, and the rising height of this jut is reduced to edge by the 4th centre of surface place gradually.
4. light emitting diode bulb according to claim 1 is characterized in that, the material of this radiator structure is a metal.
5. light emitting diode bulb according to claim 1 is characterized in that this radiator structure is processed through the die cast mode.
6. light emitting diode bulb according to claim 1 is characterized in that, this heat radiation projection be shaped as triangular pyramidal, quadrangular pyramid shape, polygonal taper, triangular pyramid shape, quadrangular pyramid cylindricality, polygonal awl cylindricality, cylindrical, square column type or polygonal cylindricality.
7. light emitting diode bulb according to claim 1 is characterized in that, also comprises nm radiation heat radiation lacquer, is arranged on this heat radiation projection.
CN2010105268564A 2010-10-21 2010-10-21 Light emitting diode lamp bulb Pending CN102454898A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105268564A CN102454898A (en) 2010-10-21 2010-10-21 Light emitting diode lamp bulb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010105268564A CN102454898A (en) 2010-10-21 2010-10-21 Light emitting diode lamp bulb

Publications (1)

Publication Number Publication Date
CN102454898A true CN102454898A (en) 2012-05-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105268564A Pending CN102454898A (en) 2010-10-21 2010-10-21 Light emitting diode lamp bulb

Country Status (1)

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CN (1) CN102454898A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109659418A (en) * 2018-12-08 2019-04-19 中山大学 LED upside-down mounting integration packaging mould group

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1824990A (en) * 2005-06-09 2006-08-30 陈邦汉 Efficient high-brightness semiconductor illuminating light source
CN2859203Y (en) * 2005-12-23 2007-01-17 吴文锋 Power-type LED light projector
CN201096286Y (en) * 2007-11-20 2008-08-06 王文汶 Modularized led lamp structure
US20080212336A1 (en) * 2006-12-11 2008-09-04 Chae Joon Seok Light emitting diode light source
JP2008218761A (en) * 2007-03-06 2008-09-18 Sumitomo Metal Electronics Devices Inc Light emitting element storage package
CN201555052U (en) * 2009-10-21 2010-08-18 苏州中泽光电科技有限公司 Low-heat resistance LED light source module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1824990A (en) * 2005-06-09 2006-08-30 陈邦汉 Efficient high-brightness semiconductor illuminating light source
CN2859203Y (en) * 2005-12-23 2007-01-17 吴文锋 Power-type LED light projector
US20080212336A1 (en) * 2006-12-11 2008-09-04 Chae Joon Seok Light emitting diode light source
JP2008218761A (en) * 2007-03-06 2008-09-18 Sumitomo Metal Electronics Devices Inc Light emitting element storage package
CN201096286Y (en) * 2007-11-20 2008-08-06 王文汶 Modularized led lamp structure
CN201555052U (en) * 2009-10-21 2010-08-18 苏州中泽光电科技有限公司 Low-heat resistance LED light source module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109659418A (en) * 2018-12-08 2019-04-19 中山大学 LED upside-down mounting integration packaging mould group

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ASS Succession or assignment of patent right

Owner name: LEIWANG COMPANY

Free format text: FORMER OWNER: FU HENGYANG

Effective date: 20120625

C41 Transfer of patent application or patent right or utility model
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Address after: American California

Applicant after: Ray Wang

Address before: Taipei City, Taiwan, China

Applicant before: Fu Hengyang

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120516