CN102454898A - light emitting diode bulb - Google Patents

Abstract

A light emitting diode bulb comprising: a circuit board having opposing first and second surfaces; a plurality of light emitting diodes disposed on the first surface; and the heat dissipation structure comprises a heat dissipation plate with a third surface and a fourth surface which are opposite, the third surface of the heat dissipation plate is attached to the second surface of the circuit board, the fourth surface is provided with a plurality of heat dissipation lugs, and the length of each heat dissipation lug is gradually shortened from the center of the fourth surface to the edge. The invention designs the heat dissipation convex block for heat dissipation into a mode with different heights, so that the air convection around the heat dissipation convex block is smoother, the integral heat dissipation efficiency is further improved, and the light-emitting efficiency and the service life of the light-emitting diode bulb are favorably improved.

Description

light emitting diode bulb

technical field

The invention relates to a light-emitting diode bulb, in particular to a light-emitting diode bulb with a heat dissipation structure inside the bulb shell.

Background technique

Because light emitting diodes (light emitting diodes, referred to as LEDs) have excellent performances such as long service life, low power consumption, no warm-up time, and fast response time, the application products of light emitting diodes are increasing day by day. With the successful research and development of white light-emitting diodes, the era of lighting applications of light-emitting diodes has opened. As the trend of energy saving and carbon saving continues to rise, the lighting market of light-emitting diodes is gradually expanding, gradually replacing traditional halogen lamps or incandescent bulbs and other light sources.

Please refer to FIG. 1 , which is a three-dimensional view of a light-emitting diode bulb in Taiwan's new patent No. M389826 "Improvement of frame cover tight structure of lamp device including heat dissipation module". As shown in the figure, the appearance structure of the light-emitting diode bulb 1 is composed of a light-transmitting spherical lamp cover 11, a lamp holder 12 and an electrical connector 13. The lamp holder 12 and the lamp cover 11 are provided with light-emitting diodes, circuit boards and Transformer (not shown) and other light source circuit components, the periphery of the lamp holder 12 is provided with a heat dissipation structure composed of a plurality of fins 120 with a plurality of through heat dissipation holes 121, so as to dissipate the heat generated by the aforementioned light source circuit components installed inside The heat is conducted to the outside through the fins 120 , and the cooling holes 121 on the fins 120 are used to convectively improve the heat dissipation effect.

The aforementioned thermal energy is generated inside the light-emitting diode bulb 1. Even if the cooling holes 121 on the fins 120 are intended to generate convection, the cooling holes 121 can only reach the heat convection on the surface of the lamp holder. The cooling holes 121 The convection effect cannot help to quickly discharge the heat energy inside the bulb. Therefore, the light-emitting diode bulb 1 using the aforementioned heat dissipation structure will make it unable to effectively dissipate the internal heat energy. Therefore, under the influence of high heat, the luminous efficiency of the light-emitting diode will be reduced. Circuit boards degrade rapidly and shorten overall lamp life.

Therefore, in view of the above-mentioned problems, how to improve the heat dissipation efficiency of the LED bulb, and then improve the luminous efficiency and service life of the LED bulb has become an urgent problem to be solved.

Contents of the invention

In view of the lack of the above-mentioned prior art, the technical problem to be solved by the present invention is to disclose a light emitting diode light bulb, which can have the characteristics of improving heat dissipation efficiency, improving luminous efficiency and thus prolonging service life.

In order to achieve the above object, the present invention discloses a light emitting diode light bulb, comprising: a circuit board having a first surface opposite to a second surface; a plurality of light emitting diodes disposed on the first surface; The third surface and the fourth surface of the heat dissipation plate, the third surface of the heat dissipation plate is attached to the second surface of the circuit board, the fourth surface has a plurality of heat dissipation bumps, the length of the heat dissipation bumps is determined by the first The four surfaces are gradually shortened from the center to the edge.

According to the above light emitting diode light bulb, it also includes a casing, which is arranged around the circuit board and the heat dissipation structure, and the casing has a plurality of openings corresponding to the periphery of the heat dissipation protrusion.

According to the light emitting diode light bulb above, the housing forms a heat dissipation space near the heat source of the plurality of light emitting diodes, so that the heat dissipation structure is arranged in the heat dissipation space.

According to the above light emitting diode light bulb, the fourth surface of the cooling plate may have a protrusion, and the protrusion height of the protrusion gradually decreases from the center of the fourth surface to the edge.

According to the LED light bulb above, the heat dissipation structure can be made of metal.

According to the LED light bulb above, the heat dissipation structure is made by die casting.

According to the LED light bulb above, the shape of the heat dissipation bump is triangular cone, quadrangular pyramid, polygonal cone, triangular pyramid column, quadrangular pyramid column, polygonal pyramid column, cylinder, square column or polygonal column shape.

According to the LED light bulb above, it also includes nano-radiation heat-dissipating paint, which is arranged on the heat-dissipating bump.

It can be seen from the above that the effect of the present invention is that the light-emitting diode light bulb of the present invention utilizes the heat dissipation bumps arranged in height, so that the hot air at the heating center will not be blocked, but can dissipate heat quickly. The air holes distributed in 360 degrees can further help to dissipate the heat, and finally make the LED bulb maintain a non-high temperature state, which is beneficial to improve the luminous efficiency and service life of the LED bulb.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

FIG. 1 is a perspective view of an existing light-emitting diode bulb;

FIG. 2A and FIG. 2B are respectively a three-dimensional exploded view and a three-dimensional combined view of the light-emitting diode bulb of the present invention;

Fig. 3 is a side view of an embodiment of the heat dissipation structure of the LED light bulb of the present invention;

Fig. 4 is a side view of another embodiment of the heat dissipation structure of the LED light bulb of the present invention.

Among them, reference signs

1, 2 light-emitting diode bulbs 11 lamp cover

12 lamp holders 120 fins

121 cooling holes 13 electrical connectors

21 circuit board 21a first surface

21b second surface 22 light emitting diodes

23, 23' cooling structure 231, 231' cooling plate

231a third surface 231b, 231b' fourth surface

2311 Protruding part 232 Heat dissipation bump

24 shell 25 lampshade

26 Power driver 27 Electric connector

28 cooling space 240 holes

241, 242 Groove

Detailed ways

Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

Please refer to FIG. 2A and FIG. 2B , which are perspective views of the LED light bulb of the present invention, wherein FIG. 2A is an exploded view, and FIG. 2B is an assembled view.

As shown in FIG. 2A and FIG. 2B , the LED light bulb 2 of the present invention includes: a circuit board 21 having a first surface 21a and a second surface 21b opposite to each other; a plurality of LEDs 22 disposed on the first surface 21a; And the heat dissipation structure 23 includes a heat dissipation plate 231 having an opposite third surface 231a and a fourth surface 231b, the third surface 231a of the heat dissipation plate 231 is attached to the second surface 21b of the circuit board 21, and the fourth surface 231b There are a plurality of heat dissipation bumps 232 on it, and the length of the plurality of heat dissipation bumps 232 gradually decreases from the center of the fourth surface 231b to the edge, as shown in FIG. 3 , which shows a side view of the heat dissipation structure 23 of the present invention.

The aforementioned heat dissipation structure 23 of the light emitting diode bulb 2 can be made by die-casting.

According to the above structure, it may also include a casing 24, which is arranged around the circuit board 21 and the heat dissipation structure 23. The casing 24 has a plurality of openings 240 corresponding to the surroundings of the heat dissipation bump 232. Specifically, the The casing 24 forms a heat dissipation space 28 near the heat source of the plurality of LEDs 22 , so that the heat dissipation structure 23 is disposed in the heat dissipation space 28 . In the light-emitting diode bulb 2 of the present invention, the heat dissipation structure 23 is preferably made of metal, and the second surface 21b of the circuit board 21 and the third surface 231a of the heat dissipation plate 231 are made of thermally conductive paste (not shown). connected to speed up heat conduction efficiency.

Taking FIG. 2A as an example, the edges of the circuit board 21 and the heat dissipation structure 23 of the LED light bulb 2 of the present invention are inserted into the groove 241 inside the housing 24, while the edges of the lampshade 25 are inserted into the outside of the housing 24. In the groove 242, the assembly can be facilitated and the cost can be saved at the same time. It should be noted that, since the lampshade 25 , the power driver 26 , and the electrical connector 27 shown in FIG. 2A and FIG. 2B can be applied to common prior art, they will not be repeated here.

As can be seen from the above, the present invention first conducts the heat generated by the circuit board 21 and the LED 22 to the heat dissipation bump 232 of the heat dissipation structure 23, because the length of the heat dissipation bump 232 of the heat dissipation structure 23 is longer at the center and longer at the edge. Shorter, and the temperature at the center of the circuit board 21 is generally higher, thereby can be positioned at the center of the heat dissipation structure 23 and the longer heat dissipation bump 232 outside the heat dissipation area, and because the length of the heat dissipation bump 232 at the edge is longer Short, so it will not block or hinder the flow of air at the center, so the heat of the heat dissipation bump 232 at the center can quickly dissipate through the air convection; in addition, it can also pass through the opening 240 of the housing 24, so that the heat can be carried The hot air can be quickly discharged from the inside of the LED bulb to the surrounding (360 degrees), thereby improving the heat dissipation efficiency.

It can also be shown in FIG. 4, a side view of another embodiment of the heat dissipation structure of the present invention. To simplify the description, only the differences from FIG. 3 are described here, that is, the heat dissipation plate of the heat dissipation structure 23' The fourth surface 231b' of 231' has a protrusion 2311, and the protrusion height of the protrusion 2311 gradually decreases from the center of the fourth surface 231b' to the edge, and the heat dissipation area is increased by the protrusion 2311.

In the light emitting diode light bulb of this embodiment, the shape of the heat dissipation bump 232 can be triangular pyramid, quadrangular pyramid, polygonal pyramid, triangular pyramid cylindrical, quadrangular pyramid cylindrical, polygonal pyramid cylindrical, cylindrical, square columnar or polygonal columnar, etc., and are not limited to the shapes shown in the drawings.

In addition, the present invention may also include nano-radiation heat dissipation paint, which is disposed on the heat dissipation bump 232 by, for example, spraying, so as to further improve the heat dissipation effect.

To sum up, the light emitting diode light bulb of the present invention forms a heat dissipation space near the place where the heat source of the light emitting diode is generated, so that a heat dissipation structure in contact with the circuit board provided with the light emitting diode is arranged in the heat dissipation space, and the heat dissipation structure A side facing away from the emitting direction of the LED light source is provided with a plurality of heat dissipation bumps for heat dissipation. Since the lengths of the plurality of heat dissipation bumps are arranged in a manner that the center of the circuit board is longer and the edges are shorter, and the The shell of the light-emitting diode bulbs surrounding the heat dissipation space is also provided with a plurality of ventilation holes, so that the heat dissipation structure can further assist the dissipation of the heat of the light-emitting diodes. A plurality of air holes and a plurality of heat dissipation bumps are shortened and arranged from the inside to the outside of the heat dissipation space, and better heat convection treatment is provided to improve the overall heat dissipation effect of the LED bulb, so that the LED bulb can be maintained at room temperature. state, which is conducive to improving the luminous efficiency and service life of light-emitting diode bulbs.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (7)

1. a light emitting diode bulb is characterized in that, comprising:

Circuit board has opposite first and second surface;

A plurality of light emitting diodes are located on this first surface; And

Radiator structure; Comprise heat sink with relative the 3rd surface with the 4th surface; The 3rd surface of this heat sink is attached to the second surface of this circuit board, has a plurality of heat radiation projections on the 4th surface, and the length of this heat radiation projection is shortened to edge by the 4th centre of surface place gradually.

2. light emitting diode bulb according to claim 1 is characterized in that, also comprises housing, be located on this circuit board and radiator structure around, this housing locates to have a plurality of perforates around the projection to dispelling the heat.

3. light emitting diode bulb according to claim 1 is characterized in that, the 4th surface of this heat sink has jut, and the rising height of this jut is reduced to edge by the 4th centre of surface place gradually.

4. light emitting diode bulb according to claim 1 is characterized in that, the material of this radiator structure is a metal.

5. light emitting diode bulb according to claim 1 is characterized in that this radiator structure is processed through the die cast mode.

6. light emitting diode bulb according to claim 1 is characterized in that, this heat radiation projection be shaped as triangular pyramidal, quadrangular pyramid shape, polygonal taper, triangular pyramid shape, quadrangular pyramid cylindricality, polygonal awl cylindricality, cylindrical, square column type or polygonal cylindricality.

7. light emitting diode bulb according to claim 1 is characterized in that, also comprises nm radiation heat radiation lacquer, is arranged on this heat radiation projection.

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