CN102446041A - Arrangement method and structure of bridging electrode capable of shielding bright spots - Google Patents
Arrangement method and structure of bridging electrode capable of shielding bright spots Download PDFInfo
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- CN102446041A CN102446041A CN2010105068430A CN201010506843A CN102446041A CN 102446041 A CN102446041 A CN 102446041A CN 2010105068430 A CN2010105068430 A CN 2010105068430A CN 201010506843 A CN201010506843 A CN 201010506843A CN 102446041 A CN102446041 A CN 102446041A
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Abstract
The invention discloses an arrangement method and structure of a bridging electrode capable of shielding bright spots. The arrangement method comprises the following steps of: providing a substrate; forming a transparent conductive layer on the substrate, wherein the transparent conductive layer is provided with a plurality of pattern blocks which are adjacently arranged mutually; forming an alignment film layer on the substrate, wherein the alignment film layer is provided with a plurality of bridging grooves which are transversely spanned among the pattern blocks; forming a conductive layer on the substrate, wherein the conductive layer is provided with a plurality of electric conductors which are respectively correspondingly arranged on the bridging grooves; forming a conductive corresponding layer at one side of the conductive layer, wherein the conductive corresponding layer is used for shielding the electric conductors; and forming a protection layer on the substrate, wherein the protection layer is used for increasing optical transmittance and protecting the substrate, the transparent conductive layer, the alignment film layer and the conductive layer.
Description
Technical field
The present invention relates to bridge connected electrode distribution method and its structure, relate in particular to a kind of tool cover bright spot utilize one the conduction respective layer in a side of conductive layer, to cover the distribution method and the structure of bright spot that this conductive layer is produced.
Background technology
In prior art; In the processing procedure of capacitance type touch-control panel; On substrate, form two disalignments to electrode, and form insulation course once more on one of the therein axial electrode, see through in order to another axial electrode to be provided that set plain conductor is electrically connected on this insulation course.Yet traditionally because the plain conductor that is arranged on the insulation course might cause the damage of this plain conductor because in follow-up processing procedure, making can't conducting, and then causes the decline of capacitance type touch-control panel manufacture qualified rate.
So in some technology, can be again this plain conductor be arranged at this bridge connected groove by the technology of bridge connected groove, it can avoid this plain conductor to be damaged.Yet, solve the doubt that this plain conductor can avoid being damaged after, this plain conductor produces a plurality of bright spots in this contact panel after this capacitance type touch-control panel is accomplished in assembling, as shown in Figure 1, has caused puzzlement for demonstration.
So be necessary to provide a kind of new structure, except that can the lifting of this capacitance type touch-control panel yield of efficient lifting, more the generation of avoiding these bright spots can be provided.
Summary of the invention
In view of this, fundamental purpose of the present invention is the bridge connected electrode distribution method that provides a kind of tool to cover bright spot, utilizes the conduction respective layer in order to cover this conductive layer, in order to reach the purpose of no bright spot generation.
The bridge connected electrode structure that another object of the present invention provides a kind of tool to cover bright spot is provided with the conduction respective layer in a side of this conductive layer, in order to cover the bright spot that this conductive layer produces.
For achieving the above object, technical scheme of the present invention is achieved in that
A kind of tool covers the bridge connected electrode distribution method of bright spot, and its method step comprises: substrate is provided; Form transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks; Form the orientation rete on this substrate, and this orientation rete have a plurality of bridge connected grooves in order to across between these pattern blocks; Form conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these bridge connected grooves; Form the side that the conduction respective layer is arranged at this conductive layer, in order to cover these electrical leads; And form protective seam on this substrate, in order to increase optics transmittance and this substrate of protection, this transparency conducting layer, this orientation rete and this conductive layer.
A kind of tool covers the bridge connected electrode structure of bright spot, is used for capacitive touch control plate, and it comprises substrate, a plurality of the first region piece, a plurality of second electrode block, bridge joint insulation unit and a plurality of electrode pair and answers block.Wherein, these the first region pieces are arranged at this substrate and see through first lead and are electrically connected in series; These second electrode blocks are arranged at the both sides that this substrate and these second electrode blocks are arranged at this first lead respectively; This bridge joint insulation unit vertically is arranged at this first lead, and this bridge joint insulation unit has the bridge connected groove, and the height of this bridge connected groove is lower than the height of this bridge joint insulation unit; And these electrode pairs answer block to cover these the first region pieces and/or these second electrode blocks.Wherein, these second electrode blocks are electrically connected in series by this bridge joint insulation unit with second lead.
A kind of tool covers the bridge connected electrode structure of bright spot, and it comprises substrate layer, transparency conducting layer, orientation rete, conductive layer, conduction respective layer and protective seam.Wherein, this transparency conducting layer is arranged at least one side of this substrate; This orientation rete is arranged at a side of this substrate layer; This conductive layer is in abutting connection with a side that is arranged at this orientation rete; This conduction respective layer is arranged at a side of this conductive layer, in order to covering this conductive layer, and this protective seam, is arranged at a side of this conduction respective layer.
Tool provided by the present invention covers the bridge connected electrode distribution method and the structure thereof of bright spot, has the following advantages:
Compared with prior art; Tool of the present invention covers the distribution method and the structure thereof of the bridge connected electrode of bright spot, except that improving effectively the process rate, can cover this conductive layer by the conduction respective layer again; No any bright spot produces on capacitive touch control plate in order to reach; And in one of which embodiment, but the photoresistance of special conductive layer still can be reached the purpose of covering bright spot at capacitive touch control plate not under the situation of stripping (strip).
Description of drawings
Fig. 1 is a conventional condenser Trackpad synoptic diagram;
Fig. 2 to Fig. 8 covers the schematic flow sheet of the bridge connected electrode distribution method of bright spot for tool;
Fig. 9 a to Fig. 9 d is the synoptic diagram that tool covers the bridge connected electrode structure of bright spot;
Figure 10 a to Figure 10 d is the vertical cut-away schematic view that tool covers the bridge connected electrode structure of bright spot.
[primary clustering symbol description]
10 substrates
12 the first region pieces
14 second electrode blocks
16 bridge joints insulation unit
18 first leads
20 bridge connected grooves
22 electrode pairs are answered block
24 second leads
The PL protective seam
The ECL transparency conducting layer
The S substrate layer
PI orientation rete
The CL conductive layer
SL conducts electricity respective layer
Embodiment
Below in conjunction with accompanying drawing and embodiments of the invention electrode distribution method of the present invention and structure thereof are done further detailed explanation.
Fig. 2 to Fig. 5 covers the schematic flow sheet of the bridge connected electrode distribution method of bright spot for tool of the present invention.Among Fig. 2, the step of the distribution method of bridge connected electrode mainly comprises:
Step S1 provides substrate;
Step S2 form transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks;
Step S3 forms the orientation rete on this substrate, and this orientation rete has a plurality of bridge connected grooves in order to across between these pattern blocks;
Step S4 forms conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these bridge connected grooves.
Wherein, in another embodiment, these electrical leads of this conductive layer cooperate the one of which at least of overexposure or overdevelop to form by optical compensation formula light shield;
Step S5 forms a side of conducting electricity respective layer and being arranged at this conductive layer, in order to cover these electrical leads;
Step S6 forms protective seam on this substrate, in order to increase optics transmittance and this substrate of protection, this transparency conducting layer, this orientation rete and this conductive layer.
Moreover Fig. 3 is the more detailed step of above-mentioned steps S3, and the step that its this orientation rete forms further comprises:
Step S3-1 applies photoresistance on this substrate;
Step S3-2 provides the light shield with pattern or has the light shield of shadow tone site (Halftone) pattern, and by above-mentioned light shield in order to this pattern or this halftone screen dot pattern are exposed on this photoresistance;
Step S3-3 develops this pattern or this halftone screen dot pattern on this photoresistance, has across these bridge connected grooves between these pattern blocks in order to formation;
Step S3-4 toasts this photoresistance.
It should be noted that; The line footpath in light tight zone that above-mentioned formation step with this light shield of this halftone screen dot pattern comprises the surface that is provided in this light shield is greater than the line footpath of this halftone screen dot pattern or form a plurality of holes (for example these holes can be circle, rectangle or other arbitrary shape); And be arranged at the surface of this light shield fifty-fifty; And via when exposure light for interference and diffraction that this halftone screen dot pattern is caused, make photoresistance this bridge connected groove after development of this bridge connected groove be lower than the height of this bridge joint insulation unit.
Fig. 4 is the detailed step of above-mentioned steps S4, and the step that its this conductive layer forms further comprises following steps:
Step S4-1, the sputter conductive material is on this substrate;
Step S4-2 applies photoresistance on this substrate;
Step S4-3 provides to have this optical compensation formula light shield, and see through this optical compensation formula light shield with the electrical lead pattern overexposure of corresponding these electrical leads on this photoresistance;
Step S4-4, this electrical lead pattern that develops has these pattern blocks adjacent one another are in order to formation, and this electrical lead pattern utilizes overexposure and overdevelop and produces.
Fig. 5 is the detailed step of above-mentioned steps S5, and the formation step of its this conduction respective layer further comprises following steps:
Step S5-1, the sputter conductive material is on this substrate;
Step S5-2 applies photoresistance on this substrate;
Step S5-3 provides to have this optical compensation formula light shield, and sees through corresponding electrical lead pattern overexposure that this optical compensation formula light shield forms corresponding these electrical leads on this photoresistance;
Step S5-4, developing should corresponding electrical lead pattern with stripping, and applies another photoresistance again and utilizes the light shield of electrical lead to cover the conduction respective layer pattern of this electrical lead pattern in order to formation.
Fig. 6 is another detailed step of above-mentioned steps S5, and the formation step of its this conduction respective layer further comprises following steps:
Step S5 '-1, the sputter conductive material is on this substrate;
Step S5 '-2 is coated with coloured light and hinders on this substrate;
Step S5 '-3 provides to have this optical compensation formula light shield, and sees through corresponding electrical lead pattern overexposure that this optical compensation formula light shield forms corresponding these electrical leads on this photoresistance;
Step S5 '-4 develops and the stripping (strip) that this coloured photoresistance is not carried out this corresponding electrical lead pattern, covers the conduction respective layer pattern of this electrical lead pattern in order to formation.
Fig. 7 is the another detailed step of above-mentioned steps S5, and wherein the formation step of this conduction respective layer further comprises following steps:
Step S5 "-1, see through wire mark or the light shield (suitable) have should the electrical lead pattern with the processing procedure that forms conductive layer, apply this coloured photoresistance on this electrical lead pattern, cover the conduction respective layer pattern of this electrical lead pattern in order to formation.
Fig. 8 is the detailed step of above-mentioned steps S6, and it further comprises following steps:
Step S6-1 applies a photoresistance, sputter one photoresistance or an organic one of which at least on this substrate;
Step S6-2 toasts this photoresistance or this organism, to form hard type protection film.
Fig. 9 a to Fig. 9 d covers the synoptic diagram of the bridge connected electrode structure of bright spot for tool of the present invention.In present embodiment, the present invention provides a kind of bridge connected electrode structure, is used for capacitive touch control plate, and it comprises substrate 10, a plurality of the first region piece 12, a plurality of second electrode block 14 and bridge joint insulation unit 16.The material of this substrate 10 can be glass material, that is glass substrate.
Wherein, these the first region pieces 12 are arranged at this substrate 10 and see through first lead 18 and are electrically connected in series.These second electrode blocks 14 are arranged at the both sides that this substrate 10 and these second electrode blocks 14 are arranged at this first lead 18 respectively, and these second electrode blocks 14 are provided with second lead 24.This bridge joint insulation unit 16 vertically is arranged on this first lead 18, and this bridge joint insulation unit 16 has bridge connected groove 20, and the height of this bridge connected groove 20 is lower than the height of this bridge joint insulation unit 16.It should be noted that in Fig. 9 c a plurality of electrode pairs answer block 22 to cover this first lead 18 and/or this second lead 24 on these second electrode blocks 14 on these the first region pieces 12.Wherein, These electrode block 12,14 pairing electrode pairs answer block 22 can be overlapped in these the first region pieces 12; Also perhaps these electrode pairs answer block 22 can fully cover corresponding to these the first region pieces 12 and these second electrode blocks 14; For example, these electrode pairs answer block 22 to be coloured photoresistance.
Figure 10 a to Figure 10 d covers the vertical cut-away schematic view of the bridge connected electrode structure of bright spot for tool of the present invention.In present embodiment, the bridge connected electrode structure that tool covers bright spot is used for capacitive touch control plate, and it comprises substrate layer S, transparency conducting layer ECL, orientation rete PI, conductive layer CL, conduction respective layer SL and protective seam PL.This transparency conducting layer ECL is arranged at least one side of this substrate layer S.This orientation rete PI is arranged at the side of this substrate layer S.This conductive layer CL is in abutting connection with a side that is arranged at this orientation rete PI, and this conductive layer CL can be the structure of molybdenum (MO)-aluminium (AL)-molybdenum (MO).This conduction respective layer SL is arranged at the side of this conductive layer CL, and in order to covering this conductive layer CL, that is this conduction respective layer SL can be arranged between this conductive layer ECL and this protective seam PL.In an embodiment, can be with reference to figure 10a, conduction respective layer SL is arranged between this conductive layer CL and this orientation rete PI, it should be noted that the length of this conductive layer CL is longer than this conduction respective layer SL in order this conductive layer CL is connected with this transparency conducting layer ECL; In another embodiment, shown in Figure 10 c, conduction respective layer SL is arranged at this conductive layer CL one side; In addition, 10b figure and Figure 10 d respectively the simplification processing procedure tool afterwards of corresponding diagram 10a and Figure 10 c cover the bridge connected electrode structure of bright spot.So the present invention is covered the bridge connected electrode structure of bright spot with the tool that comprises the standard processing procedure, simplify under processing procedure and the improvement processing procedure.
In addition, this bridge connected electrode structure in above-mentioned is provided with protective seam PL at least one side, and in an embodiment, this conduction respective layer SL can be arranged between this conductive layer ECL and this protective seam PL.For example, this protective seam PL can be organic matter layer, photoresistance thing layer, anti-reflecting layer (AR, anti-reflection), anti-glare layer (AG, anti-glare) or above-mentioned combination.Being familiar with this art should recognize, this protective seam PL also can ignore, and the arrangement process sequence of each layer also can change with demand.
Compare with prior art; Tool of the present invention covers the bridge connected electrode distribution method and the structure thereof of bright spot, except that improving effectively the process rate, can cover this conductive layer by the conduction respective layer again; No any bright spot produces on capacitive touch control plate in order to reach; And in one of which embodiment, but the photoresistance of conductive layer also can be reached the purpose of covering bright spot at capacitive touch control plate under the situation of stripping (strip) not.
The above is merely preferred embodiment of the present invention, is not to be used to limit protection scope of the present invention.
Claims (14)
1. a tool covers the bridge connected electrode distribution method of bright spot, it is characterized in that it comprises:
One substrate is provided;
Form a transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks;
Form an orientation rete on this substrate, and this orientation rete have a plurality of bridge connected grooves in order to across between these pattern blocks;
Form a conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these bridge connected grooves;
Form a conduction respective layer, be arranged at a side of this conductive layer, in order to cover these electrical leads; And
Form a protective seam on this substrate, in order to increase optics transmittance and this substrate of protection, this transparency conducting layer, this orientation rete and this conductive layer.
2. tool according to claim 1 covers the bridge connected electrode distribution method of bright spot, it is characterized in that, wherein the said electrical lead of this conductive layer cooperates the one of which at least of overexposure or overdevelop to form by an optical compensation formula light shield.
3. tool according to claim 2 covers the bridge connected electrode distribution method of bright spot, it is characterized in that, the step that its this orientation rete forms further comprises:
Apply a photoresistance on this substrate;
A light shield that light shield with a pattern is provided or has a shadow tone half-tone appearance, and by this light shield in order to this pattern or this halftone screen dot pattern are exposed on this photoresistance;
Develop this pattern or this halftone screen dot pattern on this photoresistance, have across these bridge connected grooves between these pattern blocks in order to formation; And toast this photoresistance.
4. tool according to claim 3 covers the bridge connected electrode distribution method of bright spot, it is characterized in that, the step that its this conductive layer forms further comprises:
Sputter one conductive material is on this substrate;
Apply a photoresistance on this substrate;
Provide to have this optical compensation formula light shield, and see through this optical compensation formula light shield with an electrical lead pattern overexposure of corresponding these electrical leads on this photoresistance; And
This electrical lead pattern that develops has these pattern blocks adjacent one another are in order to formation, and this electrical lead pattern utilizes overexposure and overdevelop and produces.
5. tool according to claim 4 covers the bridge connected electrode distribution method of bright spot, it is characterized in that, the step that its this conduction respective layer forms further comprises:
Sputter one conductive material is on this substrate;
Apply a photoresistance on this substrate;
Provide to have this optical compensation formula light shield, and see through a corresponding electrical lead pattern overexposure that this optical compensation formula light shield forms corresponding these electrical leads on this photoresistance; And
Developing should corresponding electrical lead pattern with stripping, and the light shield that applies another photoresistance and these electrical leads of profit again covers the conduction respective layer pattern of this electrical lead pattern in order to formation.
6. tool according to claim 4 covers the bridge connected electrode distribution method of bright spot, it is characterized in that, the step that its this conduction respective layer forms further comprises:
Sputter one conductive material is on this substrate;
Apply a coloured photoresistance on this substrate;
Provide to have this optical compensation formula light shield, and see through a corresponding electrical lead pattern overexposure that this optical compensation formula light shield forms corresponding these electrical leads on this photoresistance; And
Develop and the stripping that this coloured photoresistance is not carried out this corresponding electrical lead pattern, cover the conduction respective layer pattern of this electrical lead pattern in order to formation.
7. tool according to claim 4 covers the bridge connected electrode distribution method of bright spot, it is characterized in that, the step that its this conduction respective layer forms further comprises:
See through wire mark or the light shield have should the electrical lead pattern, apply this coloured photoresistance on this electrical lead pattern, cover the conduction respective layer pattern of this electrical lead pattern in order to formation.
8. cover the bridge connected electrode distribution method of bright spot according to claim 5,6 or 7 described tools, it is characterized in that, the step that its this protective seam forms further comprises:
Apply a photoresistance, sputter one photoresistance or an organic one of which at least on this substrate; And
Toast this photoresistance or this organism, to form a hard type protection film.
9. a tool covers the bridge connected electrode structure of bright spot, is used for a capacitive touch control plate, it is characterized in that it comprises:
One substrate;
A plurality of the first region pieces are arranged at this substrate and see through one first lead and are electrically connected in series;
A plurality of second electrode blocks are arranged at the both sides that this substrate and these second electrode blocks are arranged at this first lead respectively;
One bridge joint insulation unit vertically is arranged at this first lead, and this bridge joint insulation unit has a bridge connected groove, and the height of this bridge connected groove is lower than the height of this bridge joint insulation unit; And
A plurality of electrode pairs are answered block, cover these the first region pieces and/or these second electrode blocks;
Wherein these second electrode blocks are electrically connected in series by this bridge joint insulation unit with one second lead.
10. tool according to claim 9 covers the bridge connected electrode structure of bright spot, it is characterized in that, wherein to answer block be a coloured photoresistance to these electrode pairs.
11. a tool covers the bridge connected electrode structure of bright spot, is used for a capacitive touch control plate, it is characterized in that it comprises:
One substrate layer;
One transparency conducting layer is arranged at least one side of this substrate layer;
One orientation rete is arranged at a side of this substrate layer;
One conductive layer is in abutting connection with a side that is arranged at this orientation rete;
One conduction respective layer is arranged at a side of this conductive layer, in order to cover this conductive layer; And
One protective seam is arranged at a side of this conduction respective layer.
12. tool according to claim 11 covers the bridge connected electrode structure of bright spot, it is characterized in that, wherein this conduction respective layer is arranged between this conductive layer and this protective seam.
13. tool according to claim 11 covers the bridge connected electrode structure of bright spot, it is characterized in that, wherein this conduction respective layer is arranged between this conductive layer and this transparency conducting layer.
14. tool according to claim 13 covers the bridge connected electrode structure of bright spot, it is characterized in that, wherein the length of this conductive layer is longer than this conduction respective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010506843.0A CN102446041B (en) | 2010-10-14 | 2010-10-14 | Arrangement method and structure of bridging electrode capable of shielding bright spots |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010506843.0A CN102446041B (en) | 2010-10-14 | 2010-10-14 | Arrangement method and structure of bridging electrode capable of shielding bright spots |
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| Publication Number | Publication Date |
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| CN102446041A true CN102446041A (en) | 2012-05-09 |
| CN102446041B CN102446041B (en) | 2014-03-12 |
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| CN201010506843.0A Expired - Fee Related CN102446041B (en) | 2010-10-14 | 2010-10-14 | Arrangement method and structure of bridging electrode capable of shielding bright spots |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113760115A (en) * | 2020-06-05 | 2021-12-07 | 瀚宇彩晶股份有限公司 | Touch panel and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1986084A1 (en) * | 2007-04-27 | 2008-10-29 | TPK Touch Solutions Inc. | Conductor pattern structure of capatitive touch panel |
| CN201298221Y (en) * | 2008-10-10 | 2009-08-26 | 达虹科技股份有限公司 | Two-dimensional sensing structure of capacitive touch control panel |
| TWM368846U (en) * | 2009-06-26 | 2009-11-11 | Young Fast Optoelectronics Co | Improved structure of touch panel |
-
2010
- 2010-10-14 CN CN201010506843.0A patent/CN102446041B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1986084A1 (en) * | 2007-04-27 | 2008-10-29 | TPK Touch Solutions Inc. | Conductor pattern structure of capatitive touch panel |
| CN201298221Y (en) * | 2008-10-10 | 2009-08-26 | 达虹科技股份有限公司 | Two-dimensional sensing structure of capacitive touch control panel |
| TWM368846U (en) * | 2009-06-26 | 2009-11-11 | Young Fast Optoelectronics Co | Improved structure of touch panel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113760115A (en) * | 2020-06-05 | 2021-12-07 | 瀚宇彩晶股份有限公司 | Touch panel and manufacturing method thereof |
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| CN102446041B (en) | 2014-03-12 |
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Granted publication date: 20140312 Termination date: 20201014 |