CN102446041B - Arrangement method and structure of bridging electrode capable of shielding bright spots - Google Patents
Arrangement method and structure of bridging electrode capable of shielding bright spots Download PDFInfo
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- CN102446041B CN102446041B CN201010506843.0A CN201010506843A CN102446041B CN 102446041 B CN102446041 B CN 102446041B CN 201010506843 A CN201010506843 A CN 201010506843A CN 102446041 B CN102446041 B CN 102446041B
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Abstract
The invention discloses an arrangement method and structure of a bridging electrode capable of shielding bright spots. The arrangement method comprises the following steps of: providing a substrate; forming a transparent conductive layer on the substrate, wherein the transparent conductive layer is provided with a plurality of pattern blocks which are adjacently arranged mutually; forming an alignment film layer on the substrate, wherein the alignment film layer is provided with a plurality of bridging grooves which are transversely spanned among the pattern blocks; forming a conductive layer on the substrate, wherein the conductive layer is provided with a plurality of electric conductors which are respectively correspondingly arranged on the bridging grooves; forming a conductive corresponding layer at one side of the conductive layer, wherein the conductive corresponding layer is used for shielding the electric conductors; and forming a protection layer on the substrate, wherein the protection layer is used for increasing optical transmittance and protecting the substrate, the transparent conductive layer, the alignment film layer and the conductive layer.
Description
Technical field
The present invention relates to bridge electrode distribution method and its structure, what relate in particular to that a kind of tool covers bright spot utilizes a conduction respective layer in a side of conductive layer, to cover distribution method and the structure of bright spot that this conductive layer is produced.
Background technology
In prior art, in the processing procedure of capacitance type touch-control panel, on substrate, form two disalignments to electrode, and one of therein on axial electrode, again form insulation course, in order to provide another axial electrode to see through set plain conductor on this insulation course, be electrically connected to.Yet, owing to being arranged at plain conductor on insulation course likely because in follow-up processing procedure, cause the damage of this plain conductor traditionally, making cannot conducting, and then causes capacitance type touch-control panel to make the decline of yield.
Therefore in some technology, can be again by the technology of bridge connected groove, this plain conductor be arranged to this bridge connected groove, it can avoid this plain conductor to be damaged.Yet, solving after the doubt that this plain conductor can avoid being damaged, this plain conductor completes after this capacitance type touch-control panel in assembling, in this contact panel, produces a plurality of bright spots, as shown in Figure 1, for demonstration, has caused puzzlement.
Therefore be necessary to provide a kind of new structure, except can the lifting of this capacitance type touch-control panel yield of efficient lifting, more can provide the generation of avoiding these bright spots.
Summary of the invention
In view of this, the bridge electrode distribution method that provides a kind of tool to cover bright spot is provided fundamental purpose of the present invention, utilizes conduction respective layer in order to cover this conductive layer, in order to reach the object producing without bright spot.
The bridge electrode structure that another object of the present invention provides a kind of tool to cover bright spot, arranges conduction respective layer in a side of this conductive layer, the bright spot producing in order to cover this conductive layer.
For achieving the above object, technical scheme of the present invention is achieved in that
Tool covers a bridge electrode distribution method for bright spot, and its method step comprises: substrate is provided; Form transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks; Form orientation rete on this substrate, and this orientation rete have a plurality of bridge connected grooves in order to across between these pattern blocks; Form conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these bridge connected grooves; Form the side that conduction respective layer is arranged at this conductive layer, in order to cover these electrical leads; And form protective seam on this substrate, in order to increase optics transmittance and this substrate of protection, this transparency conducting layer, this orientation rete and this conductive layer.
Tool covers a bridge electrode structure for bright spot, and for capacitive touch control plate, it comprises substrate, a plurality of the first region piece, a plurality of the second electrode block, bridge joint insulation unit and a plurality of electrode pair and answers block.Wherein, these the first region pieces are arranged at this substrate and see through the first wire and are electrically connected in series; These the second electrode blocks are arranged at the both sides that this substrate and these the second electrode blocks are arranged at this first wire respectively; This bridge joint insulation unit is vertically arranged at this first wire, and this bridge joint insulation unit has bridge connected groove, and the height of this bridge connected groove is lower than the height of this bridge joint insulation unit; And these electrode pairs answer block to cover these the first region pieces and/or these the second electrode blocks.Wherein, these the second electrode blocks are electrically connected in series by this bridge joint insulation unit with the second wire.
Tool covers a bridge electrode structure for bright spot, and it comprises substrate layer, transparency conducting layer, orientation rete, conductive layer, conduction respective layer and protective seam.Wherein, this transparency conducting layer is arranged at least one side of this substrate; This orientation rete is arranged at a side of this substrate layer; This conductive layer is in abutting connection with a side that is arranged at this orientation rete; This conduction respective layer is arranged at a side of this conductive layer, in order to cover this conductive layer, and this protective seam, is arranged at a side of this conduction respective layer.
Tool provided by the present invention covers bridge electrode distribution method and the structure thereof of bright spot, has the following advantages:
Compared with prior art, tool of the present invention covers distribution method and the structure thereof of the bridge electrode of bright spot, except can effectively improving process rate, can by conduction respective layer, cover this conductive layer again, in order to reach on capacitive touch control plate, without any bright spot, produce, and in one embodiment, photoresistance that especially can conductive layer in the situation of stripping (strip), still can not reached the object of covering bright spot at capacitive touch control plate.
Accompanying drawing explanation
Fig. 1 is conventional condenser Trackpad schematic diagram;
Fig. 2 to Fig. 8 is the schematic flow sheet that tool covers the bridge electrode distribution method of bright spot;
Fig. 9 a to Fig. 9 d is the schematic diagram that tool covers the bridge electrode structure of bright spot;
Figure 10 a to Figure 10 d is the vertical cut-away schematic view that tool covers the bridge electrode structure of bright spot.
[primary clustering symbol description]
10 substrates
12 the first region pieces
14 second electrode blocks
16 bridge joint insulation unit
18 first wires
20 bridge connected grooves
22 electrode pairs are answered block
24 second wires
PL protective seam
ECL transparency conducting layer
S substrate layer
PI orientation rete
CL conductive layer
SL conducts electricity respective layer
Embodiment
Below in conjunction with accompanying drawing and embodiments of the invention, pole layout method of the present invention and structure thereof are described in further detail.
Fig. 2 to Fig. 5, for tool of the present invention covers the schematic flow sheet of the bridge electrode distribution method of bright spot.In Fig. 2, the step of the distribution method of bridge electrode mainly comprises:
Step S1, provides substrate;
Step S2, form transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks;
Step S3, forms orientation rete on this substrate, and this orientation rete has a plurality of bridge connected grooves in order to across between these pattern blocks;
Step S4, forms conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these bridge connected grooves.
Wherein, in another embodiment, these electrical leads of this conductive layer, by optical compensation formula light shield, coordinate at least one of overexposure or overdevelop to form;
Step S5, forms a side of conducting electricity respective layer and being arranged at this conductive layer, in order to cover these electrical leads;
Step S6, forms protective seam on this substrate, in order to increase optics transmittance and this substrate of protection, this transparency conducting layer, this orientation rete and this conductive layer.
Moreover Fig. 3 is the more detailed step of above-mentioned steps S3, the step that its this orientation rete forms further comprises:
Step S3-1, applies photoresistance on this substrate;
Step S3-2, provides the light shield that has the light shield of pattern or have shadow tone site (Halftone) pattern, and by above-mentioned light shield in order to this pattern or this halftone screen dot pattern are exposed on this photoresistance;
Step S3-3, develops this pattern or this halftone screen dot pattern on this photoresistance, in order to form, has across these bridge connected grooves between these pattern blocks;
Step S3-4, toasts this photoresistance.
It should be noted that, the wire diameter that the above-mentioned formation step with this light shield of this halftone screen dot pattern comprises the surperficial light tight region that is provided in this light shield is greater than the wire diameter of this halftone screen dot pattern or forms a plurality of holes (for example these holes can be circle, rectangle or other arbitrary shape), and be arranged at fifty-fifty the surface of this light shield, and via when exposure the light interference and the diffraction that cause for this halftone screen dot pattern, the photoresistance that makes this bridge connected groove after development this bridge connected groove lower than the height of this bridge joint insulation unit.
Fig. 4 is the detailed step of above-mentioned steps S4, and the step that its this conductive layer forms further comprises following steps:
Step S4-1, sputter conductive material is on this substrate;
Step S4-2, applies photoresistance on this substrate;
Step S4-3, provides and has this optical compensation formula light shield, and see through this optical compensation formula light shield by the electrical lead pattern overexposure of corresponding these electrical leads on this photoresistance;
Step S4-4, this electrical lead pattern that develops, has these pattern blocks adjacent one another are in order to form, and this electrical lead pattern utilizes overexposure and overdevelop and produces.
Fig. 5 is the detailed step of above-mentioned steps S5, and the formation step of its this conduction respective layer further comprises following steps:
Step S5-1, sputter conductive material is on this substrate;
Step S5-2, applies photoresistance on this substrate;
Step S5-3, provides and has this optical compensation formula light shield, and the corresponding electrical lead pattern overexposure that forms corresponding these electrical leads through this optical compensation formula light shield is on this photoresistance;
Step S5-4, develops and this corresponding electrical lead pattern of stripping, and applies another photoresistance again and utilize the light shield of electrical lead in order to form the conduction respective layer pattern that covers this electrical lead pattern.
Fig. 6 is another detailed step of above-mentioned steps S5, and the formation step of its this conduction respective layer further comprises following steps:
Step S5 '-1, sputter conductive material is on this substrate;
Step S5 '-2, are coated with coloured light and hinder on this substrate;
Step S5 '-3, provide and have this optical compensation formula light shield, and the corresponding electrical lead pattern overexposure that forms corresponding these electrical leads through this optical compensation formula light shield is on this photoresistance;
Step S5 '-4, develop and this coloured photoresistance are not carried out the stripping (strip) of this corresponding electrical lead pattern, in order to form the conduction respective layer pattern that covers this electrical lead pattern.
Fig. 7 is the another detailed step of above-mentioned steps S5, and wherein the formation step of this conduction respective layer further comprises following steps:
Step S5 "-1, see through wire mark or the light shield (suitable with the processing procedure that forms conductive layer) have should electrical lead pattern, apply this coloured photoresistance on this electrical lead pattern, in order to form the conduction respective layer pattern that covers this electrical lead pattern.
Fig. 8 is the detailed step of above-mentioned steps S6, and it further comprises following steps:
Step S6-1, applies a photoresistance, sputter one photoresistance or an organic at least one on this substrate;
Step S6-2, toasts this photoresistance or this organism, to form hard type protection film.
Fig. 9 a to Fig. 9 d, for tool of the present invention covers the schematic diagram of the bridge electrode structure of bright spot.In the present embodiment, the invention provides a kind of bridge electrode structure, for capacitive touch control plate, it comprises substrate 10, a plurality of the first region piece 12, a plurality of the second electrode block 14 and bridge joint insulation unit 16.The material of this substrate 10 can be glass material, that is glass substrate.
Wherein, these the first region pieces 12 are arranged at this substrate 10 and see through the first wire 18 and are electrically connected in series.These the second electrode blocks 14 are arranged at this substrate 10 and these the second electrode blocks 14 are arranged at the both sides of this first wire 18 respectively, and are provided with the second wire 24 on these the second electrode blocks 14.This bridge joint insulation unit 16 is vertically arranged on this first wire 18, and this bridge joint insulation unit 16 has bridge connected groove 20, and the height of this bridge connected groove 20 is lower than the height of this bridge joint insulation unit 16.It should be noted that in Fig. 9 c, a plurality of electrode pairs answer block 22 to cover this first wire 18 on these the first region pieces 12 and/or this second wire 24 on these the second electrode blocks 14.Wherein, these electrode block 12,14 corresponding electrode pairs answer block 22 can be overlapped in these the first region pieces 12, also or these electrode pairs answer block 22 can fully cover corresponding to these the first region pieces 12 and these the second electrode blocks 14, for example, these electrode pairs answer block 22 for coloured photoresistance.
Figure 10 a to Figure 10 d, for tool of the present invention covers the vertical cut-away schematic view of the bridge electrode structure of bright spot.In the present embodiment, tool covers the bridge electrode structure of bright spot for capacitive touch control plate, and it comprises substrate layer S, transparency conducting layer ECL, orientation rete PI, conductive layer CL, conduction respective layer SL and protective seam PL.This transparency conducting layer ECL is arranged at least one side of this substrate layer S.This orientation rete PI is arranged at a side of this substrate layer S.This conductive layer CL is in abutting connection with a side that is arranged at this orientation rete PI, and this conductive layer CL can be the structure of molybdenum (MO)-aluminium (AL)-molybdenum (MO).This conduction respective layer SL is arranged at a side of this conductive layer CL, and in order to cover this conductive layer CL, that is this conduction respective layer SL can be arranged between this conductive layer ECL and this protective seam PL.In an embodiment, can be with reference to figure 10a, conduction respective layer SL is arranged between this conductive layer CL and this orientation rete PI, it should be noted that the length of this conductive layer CL is longer than this conduction respective layer SL in order this conductive layer CL is connected with this transparency conducting layer ECL; In another embodiment, as shown in Figure 10 c, conduction respective layer SL is arranged at this conductive layer CL mono-side; In addition, 10b figure and Figure 10 d respectively the tool afterwards of simplification processing procedure of corresponding diagram 10a and Figure 10 c cover the bridge electrode structure of bright spot.Therefore the present invention comprising standard processing procedure, simplify the bridge electrode structure that processing procedure and the tool under improvement processing procedure cover bright spot.
In addition, this bridge electrode structure in above-mentioned arranges protective seam PL at least one side, and in an embodiment, this conduction respective layer SL can be arranged between this conductive layer ECL and this protective seam PL.For example, this protective seam PL can be organic matter layer, photoresistance thing layer, anti-reflecting layer (AR, anti-reflection), anti-glare layer (AG, anti-glare) or above-mentioned combination.Being familiar with this technical field person should recognize, this protective seam PL also can ignore, and the arrangement process sequence of each layer also can change with demand.
Compare with prior art, tool of the present invention covers bridge electrode distribution method and the structure thereof of bright spot, except can effectively improving process rate, can by conduction respective layer, cover this conductive layer again, in order to reach on capacitive touch control plate, without any bright spot, produce, and in one embodiment, photoresistance that can conductive layer, the in the situation that of stripping (strip) not, also can be reached the object of covering bright spot at capacitive touch control plate.
The above, be only preferred embodiment of the present invention, is not intended to limit protection scope of the present invention.
Claims (1)
1. tool covers a bridge electrode distribution method for bright spot, it is characterized in that, it comprises:
One substrate is provided;
Form a transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks;
Form an orientation rete on this substrate, and this orientation rete have a plurality of bridge connected grooves in order to across between this pattern block;
Form a conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on this bridge connected groove;
Form a conduction respective layer, be arranged at a side of this conductive layer, in order to cover this electrical lead; And
Form a protective seam on this substrate, in order to increase optics transmittance and this substrate of protection, this transparency conducting layer, this orientation rete and this conductive layer.
2. tool according to claim 1 covers the bridge electrode distribution method of bright spot, it is characterized in that, wherein the described electrical lead of this conductive layer, by an optical compensation formula light shield, coordinates at least one of overexposure or overdevelop to form.
3. tool according to claim 2 covers the bridge electrode distribution method of bright spot, it is characterized in that, the step that its this orientation rete forms further comprises:
Apply a photoresistance on this substrate;
A light shield that has the light shield of a pattern or have a shadow tone half-tone sample is provided, and by this light shield in order to this pattern or this halftone screen dot pattern are exposed on this photoresistance;
Develop this pattern or this halftone screen dot pattern on this photoresistance, in order to form, have across this bridge connected groove between this pattern block; And toast this photoresistance.
4. tool according to claim 3 covers the bridge electrode distribution method of bright spot, it is characterized in that, the step that its this conductive layer forms further comprises:
Sputter one conductive material is on this substrate;
Apply a photoresistance on this substrate;
Provide and there is this optical compensation formula light shield, and see through this optical compensation formula light shield by the electrical lead pattern overexposure to should electrical lead on this photoresistance; And
This electrical lead pattern that develops, has this pattern block adjacent one another are in order to form, and this electrical lead pattern utilizes overexposure and overdevelop and produces.
5. tool according to claim 4 covers the bridge electrode distribution method of bright spot, it is characterized in that, the step that its this conduction respective layer forms further comprises:
Sputter one conductive material is on this substrate;
Apply a photoresistance on this substrate;
Provide and there is this optical compensation formula light shield, and see through this optical compensation formula light shield and form a corresponding electrical lead pattern overexposure that should electrical lead on this photoresistance; And
Develop and this corresponding electrical lead pattern of stripping, and the light shield that applies again another photoresistance this electrical lead of profit is in order to form the conduction respective layer pattern that covers this electrical lead pattern.
6. tool according to claim 4 covers the bridge electrode distribution method of bright spot, it is characterized in that, the step that its this conduction respective layer forms further comprises:
Sputter one conductive material is on this substrate;
Apply a coloured photoresistance on this substrate;
Provide and there is this optical compensation formula light shield, and see through this optical compensation formula light shield and form a corresponding electrical lead pattern overexposure that should electrical lead on this photoresistance; And
Develop and this coloured photoresistance do not carried out the stripping of this corresponding electrical lead pattern, in order to form the conduction respective layer pattern that covers this electrical lead pattern.
7. tool according to claim 6 covers the bridge electrode distribution method of bright spot, it is characterized in that, the step that its this conduction respective layer forms further comprises:
See through wire mark or the light shield have should electrical lead pattern, apply this coloured photoresistance on this electrical lead pattern, in order to form the conduction respective layer pattern that covers this electrical lead pattern.
8. according to the tool described in claim 5,6 or 7, cover the bridge electrode distribution method of bright spot, it is characterized in that, the step that its this protective seam forms further comprises:
Apply a photoresistance, sputter one photoresistance or an organic at least one on this substrate; And
Toast this photoresistance or this organism, to form a hard type protection film.
9. tool covers a bridge electrode structure for bright spot, for a capacitive touch control plate, it is characterized in that, it comprises:
One substrate;
A plurality of the first region pieces, are arranged at this substrate and are electrically connected in series through one first wire;
A plurality of the second electrode blocks, are arranged at the both sides that this substrate and this second electrode block are arranged at this first wire respectively;
One bridge joint insulation unit, is vertically arranged at this first wire, and this bridge joint insulation unit has a bridge connected groove, and the height of this bridge connected groove is lower than the height of this bridge joint insulation unit; And
A plurality of electrode pairs are answered block, cover this first region piece and/or this second electrode block;
Wherein this second electrode block is electrically connected in series by this bridge joint insulation unit with one second wire.
10. tool according to claim 9 covers the bridge electrode structure of bright spot, it is characterized in that, wherein to answer block be a coloured photoresistance to this electrode pair.
11. 1 kinds of tools cover the bridge electrode structure of bright spot, for a capacitive touch control plate, it is characterized in that, it comprises:
One substrate layer;
One transparency conducting layer, is arranged at least one side of this substrate layer;
One orientation rete, is arranged at a side of this substrate layer;
One conductive layer, in abutting connection with a side that is arranged at this orientation rete;
One conduction respective layer, is arranged at a side of this conductive layer, in order to cover this conductive layer; And
One protective seam, is arranged at a side of this conduction respective layer.
12. tools according to claim 11 cover the bridge electrode structure of bright spot, it is characterized in that, wherein this conduction respective layer is arranged between this conductive layer and this protective seam.
13. tools according to claim 11 cover the bridge electrode structure of bright spot, it is characterized in that, wherein this conduction respective layer is arranged between this conductive layer and this transparency conducting layer.
14. tools according to claim 13 cover the bridge electrode structure of bright spot, it is characterized in that, wherein the length of this conductive layer is longer than this conduction respective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010506843.0A CN102446041B (en) | 2010-10-14 | 2010-10-14 | Arrangement method and structure of bridging electrode capable of shielding bright spots |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010506843.0A CN102446041B (en) | 2010-10-14 | 2010-10-14 | Arrangement method and structure of bridging electrode capable of shielding bright spots |
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| Publication Number | Publication Date |
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| CN102446041A CN102446041A (en) | 2012-05-09 |
| CN102446041B true CN102446041B (en) | 2014-03-12 |
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| CN201010506843.0A Expired - Fee Related CN102446041B (en) | 2010-10-14 | 2010-10-14 | Arrangement method and structure of bridging electrode capable of shielding bright spots |
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| CN113760115A (en) * | 2020-06-05 | 2021-12-07 | 瀚宇彩晶股份有限公司 | Touch panel and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1986084A1 (en) * | 2007-04-27 | 2008-10-29 | TPK Touch Solutions Inc. | Conductor pattern structure of capatitive touch panel |
| CN201298221Y (en) * | 2008-10-10 | 2009-08-26 | 达虹科技股份有限公司 | Two-dimensional sensing structure of capacitive touch control panel |
| TWM368846U (en) * | 2009-06-26 | 2009-11-11 | Young Fast Optoelectronics Co | Improved structure of touch panel |
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2010
- 2010-10-14 CN CN201010506843.0A patent/CN102446041B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1986084A1 (en) * | 2007-04-27 | 2008-10-29 | TPK Touch Solutions Inc. | Conductor pattern structure of capatitive touch panel |
| CN201298221Y (en) * | 2008-10-10 | 2009-08-26 | 达虹科技股份有限公司 | Two-dimensional sensing structure of capacitive touch control panel |
| TWM368846U (en) * | 2009-06-26 | 2009-11-11 | Young Fast Optoelectronics Co | Improved structure of touch panel |
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| CN102446041A (en) | 2012-05-09 |
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