CN102433538A - Sputtering equipment - Google Patents
Sputtering equipment Download PDFInfo
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- CN102433538A CN102433538A CN2010102966475A CN201010296647A CN102433538A CN 102433538 A CN102433538 A CN 102433538A CN 2010102966475 A CN2010102966475 A CN 2010102966475A CN 201010296647 A CN201010296647 A CN 201010296647A CN 102433538 A CN102433538 A CN 102433538A
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- chamber
- support plate
- vacuum lock
- baffle
- lock chamber
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Abstract
The invention relates to sputtering equipment, which comprises a first coating chamber, a first anode support plate, a first cathode support plate and a first baffle plate device, wherein the first anode support plate is positioned in the first coating chamber; the first anode support plate is arranged opposite to the first cathode support plate, and is used for bearing a coating workpiece; the first cathode support plate is used for bearing a first sputtering target material; the first baffle plate device is rotationally arranged between the first anode support plate and the first cathode support plate, and comprises a rotating disc, a first cantilever, a second cantilever, a first baffle plate and a second baffle plate; the first cantilever and the second cantilever are fixed on the rotating disc in sequence along the radial direction of the rotating disc; the extending direction of the first cantilever far away from the rotating disc is opposite to the extending direction of the second cantilever far away from the rotating disc; the first baffle plate is fixed on the first cantilever; the second baffle plate is fixed on the second cantilever; and the rotating disc is used for driving the first baffle plate and the second baffle plate to cover or expose the first sputtering target material.
Description
Technical field
The present invention relates to coating technique, relate in particular to a kind of sputtering equipment.
Background technology
The decorative appearance plated film of existing metal and plastic casing, its processing procedure can use physical vapor deposition, and (Physical Vapor Deposition PVD), and utilizes coating chamber to carry out the reaction formula sputter, like being coated with reaction formula magnetron sputtering plating mode.But, because the geometrical shape of this housing is increasingly sophisticated, so when film-plating process, it is bad that made rete is prone to produce the uneven caused rerum natura of thickness, undesirable like rub proofness and hardness.
In view of this, provide a kind of uniform sputtering equipment of coating film thickness that makes real for necessary.
Summary of the invention
A kind of sputtering equipment; It comprises the first filming chamber, is positioned at the first anode support plate of this first filming chamber, the first negative electrode support plate and first retaining device; This first anode support plate and this first negative electrode support plate are oppositely arranged; This first anode support plate is used to carry film-coating workpiece; This first negative electrode support plate is used to carry first sputtered target material, and this first retaining device is arranged between this first anode support plate and this first negative electrode support plate rotationally and comprises rotary disk, first cantilever, second cantilever, first baffle plate and second baffle, and this first cantilever and this second cantilever radially are fixed on this rotary disk successively along this rotary disk; And this first cantilever is opposite away from the bearing of trend of this rotary disk with this second cantilever edge along the bearing of trend away from this rotary disk; This first baffle plate is fixed on this first cantilever, and this second baffle is fixed on this second cantilever, and this rotary disk is used to drive this first baffle plate and this second baffle and blocks or expose this first sputtered target material.
Sputtering equipment provided by the invention, it adopts retaining device that sputtered target material is blocked or exposes, and electricity slurry is difficult to or clashes into sputtered target material easily with adjustment target concentration, thereby reach the purpose that homogenizing plates the thicknesses of layers of film-coating workpiece.
Description of drawings
The module diagram of a kind of sputtering equipment that Fig. 1 provides for embodiment of the present invention.
Fig. 2 is the schematic cross-section of the first filming chamber of the sputtering equipment among Fig. 1.
Fig. 3 is the schematic top plan view of the first indoor retaining device of the first filming among Fig. 2.
Fig. 4 is the schematic cross-section of second coating chamber of the sputtering equipment among Fig. 1.
Fig. 5 is a kind of view of the first indoor retaining device of the first filming among Fig. 2.
Fig. 6 is the another kind of view of the first indoor retaining device of the first filming among Fig. 2.
The main element nomenclature
The first vacuum lock chamber 20
The second vacuum lock chamber 40
The 3rd vacuum lock chamber 60
Ion purge chamber 70
The 4th vacuum lock chamber 80
The first filming chamber 90
The 5th vacuum lock chamber 100
The 6th vacuum lock chamber 120
The 7th vacuum lock chamber 140
Transmitting device 160
Film-coating workpiece 400
Advance part mouth 31
Go out part mouth 32
First anode support plate 901
The first negative electrode support plate 902
First retaining device 903
First electromagnetic assembly 904
Second anode support plate 111
The second negative electrode support plate 112
Second baffle device 113
Second electromagnetic assembly 114
First sputtered target material 500
Second sputtered target material 600
Embodiment
To combine below graphic the present invention to be done further explain.
See also Fig. 1 to Fig. 6; A kind of sputtering equipment 300 that the embodiment of the invention provides; Particularly a kind of continous way of reaction formula magnetic control sputtering plating (In-Line) filming equipment comprises load chamber 10, the first vacuum lock chamber 20, first transition chamber 30, the second vacuum lock chamber 40, heating chamber 50, the 3rd vacuum lock chamber 60, ion purge chamber 70, the 4th vacuum lock chamber 80, the first filming chamber 90, the 5th vacuum lock chamber 100, second coating chamber 110, the 6th vacuum lock chamber 120, second transition chamber 130, the 7th vacuum lock chamber 140, relief chamber 150, transmitting device 160 and motor 700.
This first vacuum lock chamber 20 connects this load chamber 10 and this first transition chamber 30; This second vacuum lock chamber 40 connects this first transition chamber 30 and this heating chamber 50; The 3rd vacuum lock chamber 60 connects this heating chamber 50 and this ion purge chamber 70; The 4th vacuum lock chamber 80 connects this ion purge chamber 70 and this first filming chamber 90; The 5th vacuum lock chamber 100 connects this first filming chamber 90 and connects this second coating chamber 110 and this vacuum lock chambers 130, the seven 140 connections of second transition chamber this second transition chamber 130 and this relief chamber 150 with these second coating chamber vacuum lock chambers 120 110, the six.Be provided with sealing moving door (figure does not show) between above-mentioned each chamber, be used for sealing separately the passage of each chamber and open two adjacent chamber.
This transmitting device 160 comprises transport tape 161 and is fixed on the anchor clamps 162 on this transport tape 161 that these anchor clamps 162 are used for this film-coating workpiece 400 of clamping.This transmitting device 160 is used for this film-coating workpiece 400 successively from this load chamber 10, this first vacuum lock chamber 20, this first transition chamber 30, this second vacuum lock chamber 40, this heating chamber 50, the 3rd vacuum lock chamber 60, this ion purge chamber 70, the 4th vacuum lock chamber 80, this first filming chamber 90, the 5th vacuum lock chamber 100, this second coating chamber 110, the 6th vacuum lock chamber 120, this second transition chamber 130, the 7th vacuum lock chamber 140 transfer to this relief chamber 150.The film-coating workpiece that operator will plate from relief chamber 150 removes collection.
The first filming chamber 90 and second coating chamber 110 all offer into part mouth 31 and go out part mouth 32 in relative two sides.Above-mentioned salable this of sealing moving door advances part mouth 31 and goes out part mouth 32.Film-coating workpiece 400 gets into corresponding coating chamber by advancing part mouth 31, and gets into corresponding vacuum lock chamber from going out part mouth 32.
This sputtering equipment 300 is provided with first anode support plate 901, the first negative electrode support plate 902, first retaining device 903 and first electromagnetic assembly 904 (ginseng Fig. 2) in this first filming chamber 90.
This first anode support plate 901 is oppositely arranged with this first negative electrode support plate 902, and this first anode support plate 901 is used to carry film-coating workpiece 400.This first negative electrode support plate 902 is used to carry first sputtered target material 500.
This first retaining device 903 is arranged between the first anode support plate 901 and the first negative electrode support plate 902 rotationally, and is arranged at the predetermined position, top of this first sputtered target material 500.First retaining device 903 comprises rotary disk 913, first cantilever 923, second cantilever 933, first baffle plate 943 and second baffle 953.
This first cantilever 923 and this second cantilever 933 radially are fixed on this rotary disk 913 successively along this rotary disk 913.This first cantilever 923 is opposite away from the bearing of trend of this rotary disk 913 with this second cantilever 933 edges along the bearing of trend away from this rotary disk 913.This first baffle plate 943 is fixed on this first cantilever 923, and this second baffle 953 is fixed on this second cantilever 933.In this embodiment, first baffle plate 943 is parallel to second baffle 953.This rotary disk 913 is used to drive this first baffle plate 943 and this second baffle 953 and blocks or expose this first sputtered target material 500.Particularly, please join Fig. 2, first baffle plate 943 and second baffle 953 are approximately perpendicular to first sputtered target material 500, and therefore, first baffle plate 943 and the frontal projected area of second baffle 953 on the plane that is parallel to first sputtered target material 500 are less.Under this state of Fig. 2, first baffle plate 943 and second baffle 953 expose this first sputtered target material 500.Along with the rotation of rotary disk 913, first baffle plate 943 and second baffle 953 frontal projected area on first sputtered target material 500 slowly becomes greatly, blocks first sputtered target material 500 fully until first baffle plate 943 and second baffle 953, and is as shown in Figure 6.Under this state of Fig. 6, first baffle plate 943 and second baffle 953 block this first sputtered target material 500, and the electricity slurry when making plated film is difficult to clash into first sputtered target material 500, and then control and adjustment target concentration.
First electromagnetic assembly 904 is arranged in the first negative electrode support plate 902.The electromagnetic force of the electric field that magnetic field that first electromagnetic assembly 904 produces and first anode support plate 901 and the first negative electrode support plate are 902 will influence movement of electrons in the electricity slurry, makes electronics will carry out screw type motion.The distance elongation that screw type motion is passed through before making electronics disappear in the electricity slurry; Therefore increase the collision frequency between electronics and gas molecule; And make the Ionized probability of gas molecule heighten; More ionic bombardment target is just arranged, sputter more particle and be deposited on the film-coating workpiece 400, therefore first electromagnetic assembly 904 can promote the deposition speed of sputter.
This sputtering equipment 300 is provided with second anode support plate 111, the second negative electrode support plate 112, second baffle device 113 and second electromagnetic assembly 114 (ginseng Fig. 4) in this second coating chamber 110.The second negative electrode support plate 112 is used to carry second sputtered target material 600.The material of the material of second sputtered target material 600 and first sputtered target material 500 is inequality.Therefore, these film-coating workpiece 400 surfaces can last two rete that material is different of layer.
The structure of second baffle device 113 is identical with the structure of first retaining device 903.The configuration of the configuration of second anode support plate 111, the second negative electrode support plate 112, second baffle device 113 and second electromagnetic assembly 114 and first anode support plate 901, the first negative electrode support plate 902, first retaining device 903 and first electromagnetic assembly 904 is identical.
During work; Film-coating workpiece 400 is clamped on the transmitting device 160 from load chamber 10, and by transmitting device 160 successively in the first vacuum lock chamber 20, first transition chamber 30, the second vacuum lock chamber 40, heating chamber 50, the 3rd vacuum lock chamber 60, ion purge chamber 70, arrival the first filming after 80s chamber, the 4th vacuum lock chamber 90.During plated film; Utilize first retaining device 903 to add and revise guiding plasma sputter travel path in first sputtered target material, 500 the place aheads; For example; If the target concentration of being come out by sputter occurs inhomogeneous; As the target concentration ratio that is positioned at 90 left sides, the first filming chamber to be positioned at the target concentration on 90 right sides, the first filming chamber big, then operator's controllable motor 700 drives first retaining device 903 the electricity slurry is difficult to clash into the target part of first sputtered target material 500 near 90 left sides, the first filming chamber along rotating counterclockwise so that second baffle 953 blocks first sputtered target material 500 gradually from the position of Fig. 2.Simultaneously; Because after first retaining device 903 rotates; First baffle plate 943 tilts with guide channel 800 of common formation (please join Fig. 5) with respect to first sputtered target material 500 with second baffle 953, be beneficial to the electricity slurry that is positioned at 90 tops, the first filming chamber be directed to first sputtered target material 500 near the target on 90 right sides, the first filming chamber partly so that more electric slurry can clash into this target part.Therefore, the target concentration that is positioned at 90 left sides, the first filming chamber slowly is tending towards evenly with the target concentration that is positioned at 90 right sides, the first filming chamber, and then homogenizing plates the thicknesses of layers of film-coating workpiece 400.Being appreciated that can be with having sensing member now, and the different positions that is arranged in the first filming chamber 90 like concentration sensor exports visual equipment (like indicating meter) to for operator's reference control motor 700 with sensing target concentration and with sensing result.The film-coating workpiece 400 of accomplishing the first layer plated film is transferred into the plated film that second coating chamber 110 carries out the second layer.After plated film was accomplished, film-coating workpiece 400 was collected by unloading from relief chamber 150.
Sputtering equipment provided by the invention, it adopts and utilizes retaining device that sputtered target material is blocked or expose, and the electricity slurry is difficult to or clashes into sputtered target material easily with adjustment target concentration, thereby reach the purpose that homogenizing plates the thicknesses of layers of film-coating workpiece.
The quantity that is appreciated that above-mentioned coating chamber is decided by film-coating workpiece 400 required rete quantity.In addition, in other embodiments, first baffle plate 943 can tilt with common formation funnel-form guide channel 800 with second baffle 953 each other.
In addition, those skilled in the art can also do other variation in spirit of the present invention.Certainly, these all should be included within the present invention's scope required for protection according to the variation that the present invention's spirit is done.
Claims (6)
1. sputtering equipment; It comprises the first filming chamber, is positioned at the first anode support plate of this first filming chamber, the first negative electrode support plate and first retaining device; This first anode support plate and this first negative electrode support plate are oppositely arranged; This first anode support plate is used to carry film-coating workpiece; This first negative electrode support plate is used to carry first sputtered target material, and this first retaining device is arranged between this first anode support plate and this first negative electrode support plate rotationally and comprises rotary disk, first cantilever, second cantilever, first baffle plate and second baffle, and this first cantilever and this second cantilever radially are fixed on this rotary disk successively along this rotary disk; And this first cantilever is opposite away from the bearing of trend of this rotary disk with this second cantilever edge along the bearing of trend away from this rotary disk; This first baffle plate is fixed on this first cantilever, and this second baffle is fixed on this second cantilever, and this rotary disk is used to drive this first baffle plate and this second baffle and blocks or expose this first sputtered target material.
2. sputtering equipment as claimed in claim 1 is characterized in that, this sputtering equipment comprises the motor that is used to drive this rotary disk rotation.
3. sputtering equipment as claimed in claim 1; It is characterized in that; This sputtering equipment also comprises load chamber, the first vacuum lock chamber, first transition chamber, the second vacuum lock chamber, heating chamber, the 3rd vacuum lock chamber, ion purge chamber, the 4th vacuum lock chamber, the 5th vacuum lock chamber, second coating chamber, the 6th vacuum lock chamber, second transition chamber, the 7th vacuum lock chamber, relief chamber and transmitting device; This first vacuum lock chamber connects this load chamber and this first transition chamber; This second vacuum lock chamber connects this first transition chamber and this heating chamber; The 3rd vacuum lock chamber connects this heating chamber and this ion purge chamber; The 4th vacuum lock chamber connects this ion purge chamber and this first filming chamber; The 5th vacuum lock chamber connects this first filming chamber and this second coating chamber; The 6th vacuum lock chamber connects this second coating chamber and this second transition chamber, and the 7th vacuum lock chamber connects this second transition chamber and this relief chamber, and this transmitting device is used for this film-coating workpiece is transferred to this relief chamber from this load chamber, this first vacuum lock chamber, this first transition chamber, this second vacuum lock chamber, this heating chamber, the 3rd vacuum lock chamber, this ion purge chamber, the 4th vacuum lock chamber, this first filming chamber, the 5th vacuum lock chamber, this second coating chamber, the 6th vacuum lock chamber, this second transition chamber, the 7th vacuum lock chamber successively.
4. sputtering equipment as claimed in claim 3; It is characterized in that; This sputtering equipment comprises second anode support plate, the second negative electrode support plate and the second baffle device that is positioned at this second coating chamber; This second anode support plate and this second negative electrode support plate are oppositely arranged; This second anode support plate is used to carry this film-coating workpiece, and this second negative electrode support plate is used to carry second sputtered target material, and the structure of this second baffle device is identical with the structure of this first retaining device; The second baffle that the rotary disk of this second baffle device is used to drive first baffle plate and this second baffle device of this second baffle device blocks or exposes this second sputtered target material, and the material of this second sputtered target material is different with the material of this first sputtered target material.
5. sputtering equipment as claimed in claim 3 is characterized in that, this transmitting device comprises transport tape and be fixed on the anchor clamps on this transport tape that these anchor clamps are used for this film-coating workpiece of clamping.
6. sputtering equipment as claimed in claim 1 is characterized in that, this sputtering equipment also comprises the electromagnetic assembly that is positioned at this first negative electrode support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102966475A CN102433538A (en) | 2010-09-29 | 2010-09-29 | Sputtering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102966475A CN102433538A (en) | 2010-09-29 | 2010-09-29 | Sputtering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102433538A true CN102433538A (en) | 2012-05-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102966475A Pending CN102433538A (en) | 2010-09-29 | 2010-09-29 | Sputtering equipment |
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| Country | Link |
|---|---|
| CN (1) | CN102433538A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103243302A (en) * | 2013-05-21 | 2013-08-14 | 上海和辉光电有限公司 | Baffle mechanism, thin film deposition device and thin film deposition method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3793167A (en) * | 1972-06-01 | 1974-02-19 | Globe Amerada Glass Co | Apparatus for manufacturing metal-coated glass |
| CN2186249Y (en) * | 1994-04-27 | 1994-12-28 | 长沙国防科技大学八达薄膜电子技术研究所 | Double-end magnetic controlled sputtering ion coating machine |
| CN1718849A (en) * | 2005-08-11 | 2006-01-11 | 孙卓 | Multifunction composite magnetic controlled plasma sputtering device |
| WO2010061589A1 (en) * | 2008-11-28 | 2010-06-03 | キヤノンアネルバ株式会社 | Sputtering device |
-
2010
- 2010-09-29 CN CN2010102966475A patent/CN102433538A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3793167A (en) * | 1972-06-01 | 1974-02-19 | Globe Amerada Glass Co | Apparatus for manufacturing metal-coated glass |
| CN2186249Y (en) * | 1994-04-27 | 1994-12-28 | 长沙国防科技大学八达薄膜电子技术研究所 | Double-end magnetic controlled sputtering ion coating machine |
| CN1718849A (en) * | 2005-08-11 | 2006-01-11 | 孙卓 | Multifunction composite magnetic controlled plasma sputtering device |
| WO2010061589A1 (en) * | 2008-11-28 | 2010-06-03 | キヤノンアネルバ株式会社 | Sputtering device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103243302A (en) * | 2013-05-21 | 2013-08-14 | 上海和辉光电有限公司 | Baffle mechanism, thin film deposition device and thin film deposition method |
| CN103243302B (en) * | 2013-05-21 | 2015-07-08 | 上海和辉光电有限公司 | Baffle mechanism, thin film deposition device and thin film deposition method |
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Application publication date: 20120502 |