CN102426888A - Novel surface-mounted PTC (positive temperature coefficient) thermistor and manufacturing method thereof - Google Patents
Novel surface-mounted PTC (positive temperature coefficient) thermistor and manufacturing method thereof Download PDFInfo
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- CN102426888A CN102426888A CN2012100033650A CN201210003365A CN102426888A CN 102426888 A CN102426888 A CN 102426888A CN 2012100033650 A CN2012100033650 A CN 2012100033650A CN 201210003365 A CN201210003365 A CN 201210003365A CN 102426888 A CN102426888 A CN 102426888A
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Abstract
The invention relates to a novel surface-mounted PTC (positive temperature coefficient) thermistor, comprising a high-molecular core material, an upper-layer inner electrode, a lower-layer inner electrode, an end electrode and an insulating layer. The novel surface-mounted PTC thermistor is characterized in that each inner-layer electrode insulating groove is arranged at the position in each inner electrode deviating to the welding end; and the width of the insulating groove is 0.10mm-1.00mm. The invention also relates to a manufacturing method which can be used for batch and industrial production of the novel surface-mounted PTC thermistor. The novel surface-mounted PTC thermistor and manufacturing method thereof provided by the invention have the advantage of avoiding the short-circuit problem of a product caused by deviation of the insulating grooves to conducting holes after the core material is deformed. In the design diagram, even though the core material is deformed to cause deviation, an etching groove can deviate along with the whole body, the width is not changed basically, so that the risk of short circuit is greatly reduced. The design diagram of the novel surface-mounted PTC thermistor determines that the upper electrode and the lower electrode of the core materials are respectively connected with hole copper, and the reliability of the hole is improved.
Description
Technical field
Electronic devices and components and manufacturing approach thereof that to the present invention relates to a kind of conducting high polymers thing composite material be primary raw material relate in particular to a kind of novel surface and mount PTC thermistor and preparation method thereof.
Technical background
In the crystallization of filled conductive particle or hypocrystalline polymer composite, can show positive temperature coefficient PTC (positive temperature coefficient) phenomenon.That is to say that in certain temperature range, the resistivity of self can increase with the rising of temperature.These crystallizations or semi-crystalline polymer comprise polyethylene, polypropylene, Kynoar, polytrifluorochloroethylene, and their copolymer.Conducting particles comprises carbon black, graphite, carbon fiber, metal dust (like silver powder, copper powder, aluminium powder, nickel powder, stainless steel powder).When lower temperature, this type conductor presents lower resistivity, be elevated near its high molecular polymer fusing point and work as temperature, and when just reaching so-called " shutoff " temperature, the hurried rising of resistivity.This type electric conductor with ptc characteristics has been processed thermistor, is widely used in the overcurrent protection setting of circuit.Under common state; Electric current in the circuit is less relatively, and the thermistor actuator temperature is lower, and when the big electric current that is caused by fault passes through this from the renaturation fuse; Its temperature can be elevated to " shutoff " temperature suddenly; Cause its resistance value to become very big, so just make circuit be in a kind of approximate " open circuit " state, thereby protected other elements in the circuit.And after fault was got rid of, the temperature of thermistor descended, and its resistance value can return to the low resistance state again.
Thermosensitive resistor sticked with high polymer PTC on surface has been widely applied in the various fields such as communication, computer, household electrical appliance.The top electrode of the core of common thermosensitive resistor sticked with high polymer PTC on surface, an end extends to first welding ends, forms etching bath (or claiming insulation tank) between the via of the other end and second welding ends; The bottom electrode of core, an end extends to second welding ends, forms etching bath between the via of the other end and first welding ends.
See that Fig. 5 is shown in traditional structure sketch map and Fig. 6 traditional design internal layer upper/lower electrode etching design drawing; This structural circuit graphic designs scheme is in the high temperature pressing process of printed circuit board technology; Receive the influence of hot pressing under the high temperature; Core very easily is out of shape after the etching, causes insulation tank to be offset in the via (like frame of broken lines position, Fig. 6 right side), causes the product short circuit.In addition, because after electrode of welding ends was etched, the joint face of hole copper and internal layer electrode reduced, the reliability that causes hole copper to connect reduces, repeatedly the risk of the porose copper disconnection in action back.
Summary of the invention
The object of the present invention is to provide a kind of novel surface to mount the PTC thermistor, improve the connection reliability of via and internal layer electrode, to avoid via is connected disconnection with internal layer problem occurring after many actions of PTC.
A purpose more of the present invention is: the manufacture method of above-mentioned surface mount PTC thermistor is provided, is beneficial to produce in batches.
The object of the invention realizes through following technical proposals: a kind of novel surface mounts the PTC thermistor; Comprise the macromolecule core, two-layer up and down in electrode, termination electrode, insulating barrier; Wherein, The internal layer electrode insulation tank is located at the position of being partial to an end welding ends in the interior electrode, and the width of insulation tank is 0.10mm～1.00mm.The present invention is covered on the internal layer electrode etched figure on macromolecule core surface through change; Make hot pressing under the high temperature; Insulation tank can not shifted to via, efficiently solves the via that core causes because of distortion and be connected the problem that can not lean on earlier with internal layer in the lamination of printed circuit board (PCB).Compared with prior art, etching area be not design around via, promptly in an end of electrode, but, reach the effect (Fig. 3-1) of insulation with the position of etching bath design deflection one end welding ends in interior electrode.
On the such scheme basis, described insulation tank is that straight line combines, and also can be combined by curve, can also combine for straight line and curve.
On the such scheme basis, described macromolecule core is mixed by high molecular polymer, conductive filler, Nano filling and other fillers and processing aid, and wherein, described conductive filler is a kind of or its mixture in carbon black, graphite, the carbon fiber.
High molecular polymer is the blend of one or more polymer in the described core component, like polyethylene, polypropylene, Kynoar, polytrifluorochloroethylene, and their blend.
Conductive filler is following one or more mixtures of material in the described core component, like carbon black, graphite, carbon fiber, metal dust, metal oxide.
Other filler in the described core component is following one or more mixtures of material, like potter's clay, magnesium hydroxide, aluminium hydroxide, talcum powder.
Processing aid in the described core component is meant antioxidant, crosslinking accelerator, coupling agent; Wherein antioxidant can be phenols or aminated compounds; Like phenolic antioxidant ANOX70, crosslinking accelerator can be the polyfunctional group unsaturated compound, like triallyl isocyanurate (TAIC); Coupling agent can be silane coupler or titante coupling agent, like titanium coupling agent TCF.
The present invention provides the manufacture method of above-mentioned surface mount PTC thermistor, complies with following step:
First; Core component high molecular polymer, conductive filler and other fillers and processing aid are mixed in high-speed mixer; Then with mixing under 100～200 ℃ of temperature of mixture, process the macromolecule core with mold pressing or the method extruded then, area is 100～5000cm
2, the core of thick 0.1～3.0mm;
The second, hot pressing composition metal paillon foil is processed composite sheet in two surfaces of above-mentioned macromolecule core, as on hot press, being compound in tinsel two surfaces of above-mentioned sheet material;
The 3rd, with gamma-rays (Co60) or electron beam to irradiate crosslinked, dosage is 5～100Mrad with composite sheet, and preferably dosage is 10～100Mrad;
The 4th, the composite sheet that will pass through cross-linking radiation adopts printed wiring board technology, and through the figure transfer etching, electrode slice etches insulation tank in making, and this insulation tank is located at the position of deflection one end welding ends, and the width of insulation tank is 0.10mm～1.00mm;
The 5th; Insulating barrier and pair of metal paillon foil are stacked on the composite sheet and carry out high-temperature high-pressure and close, and the substrate after the pressing is zinc-plated through follow-up boring, heavy copper, copper facing, termination electrode, the etching outer graphics; Printing resistance solder paste China ink; Solidify resistance solder paste China ink and process the PCB laminate, sheet material is cut according to the unit, obtain novel surface and mount the PTC thermistor.In the circuit board technique manufacture process, the etched figure of electrodes use institute of the present invention particular design in the welding ends.
On the such scheme basis, described high molecular PTC thermistor is made up of one deck macromolecule core, or through the lamination mode, is made up of the layer high molecule core.
Superiority of the present invention is: avoid core distortion back insulation tank to be offset to via, the product short circuit problem that causes.Design configuration of the present invention causes skew even the core distortion occurs, and this etching bath meeting is along with overall offset, and its width can not change basically, reduces greatly so short risk occurs, like the diagram behind the compressive deformation of Fig. 4 right side.And design configuration of the present invention determined two electrodes up and down of core all to be connected with hole copper, improved the reliability in hole.
Description of drawings
Accompanying drawing 1 structural representation of the present invention;
Accompanying drawing 2 STRUCTURE DECOMPOSITION sketch mapes of the present invention;
Accompanying drawing 3 sides of the present invention are cutd open sketch map;
Fig. 4 is an internal layer upper/lower electrode etching design drawing, wherein, the left side be insulation tank at design attitude, the arrow right side is a compressive deformation insulation tank drift condition sketch map;
Fig. 5 traditional design side is cutd open sketch map;
Fig. 6 traditional design internal layer upper/lower electrode etching design drawing, wherein, the left side be insulation tank at design attitude, the arrow right side is a compressive deformation insulation tank drift condition sketch map;
Label among the figure:
1--macromolecule core;
2, the two-layer up and down interior electrode of 3--;
4,9--termination electrode;
The 5--via;
6-insulation tank;
7,8--insulating barrier;
10,11-traditionally times two-layer interior electrodes.
Embodiment
A kind of novel surface mounts the PTC thermistor; Cut open shown in the sketch map like accompanying drawing 1 structural representation of the present invention, accompanying drawing 2 STRUCTURE DECOMPOSITION sketch mapes of the present invention, accompanying drawing 3 sides of the present invention; Comprise macromolecule core 1, two-layer up and down in electrode 2,3, two termination electrodes 4,9, two insulating barriers 7,8, the position of deflection one end welding ends in the electrode was an internal layer upper/lower electrode etching design drawing like Fig. 4 in the internal layer electrode insulation tank was located at; Wherein, The left side be insulation tank at design attitude, the arrow right side is that the width of insulation tank is 0.10mm～1.00mm shown in the compressive deformation insulation tank drift condition sketch map.
Shown in Fig. 1 to 3, macromolecule core 1 can adopt existing general formulation, as: high density polyethylene (HDPE), carbon black, magnesium hydroxide and antioxidant are mixed 10min by a certain percentage in super mixer.Then that component of mixture is mixing even in banbury under 180 ℃ of temperature, through cooling, place it in after the pulverizing in the pressing mold, pressure 5Mpa, 180 ℃ of conditions of temperature press down processes area 200cm
2, thick 0.2 mm macromolecule core 1;
Copper Foil behind the surface coarsening after smooth, at pressure 5Mpa, is hot-pressed onto the two-sided of core under 160 ℃ of conditions of temperature; Promptly obtain the high molecular PTC composite sheet; 80 ℃ of heat treatments are after 48 hours in vacuum drying oven, and with gamma-rays (Co60) irradiation, dosage is 15Mrad;
The composite sheet that will pass through irradiation makes interior up and down electrode slice 2,3 etch insulation tank 6 through the figure transfer etching technique; As shown in Figure 4, then with insulating barrier 7,8 and pair of metal paillon foil as termination electrode 4,9 be stacked on the composite sheet and carry out high-temperature high-pressure and close.It is zinc-plated that substrate after the pressing forms via 5, heavy copper, copper facing, termination electrode through follow-up boring, the etching outer graphics, and printing resistance solder paste China ink solidifies the high molecular PTC thermistor that step such as resistance solder paste China ink is processed the surface mount pattern.
Shown in Fig. 1 to 4, during the making sheet of current use line plate technology, the position of an inclined to one side end welding ends in the electrode in internal layer electrode 2,3 up and down; One width of etching is the insulation tank of 0.20mm; Promptly can be made into one deck PTC type and mount pattern polymer thermistor device, even behind the compressive deformation, shown in Fig. 4 arrow right side; This resistor still can avoid core distortion back insulation tank to be offset to via, the product short circuit problem that causes.
High molecular PTC thermistor of the present invention also can be made up of the layer high molecule core.
Claims (5)
1. a novel surface mounts the PTC thermistor; Comprise the macromolecule core, two-layer up and down in electrode, termination electrode, insulating barrier; It is characterized in that, the position of deflection one end welding ends in the electrode in the internal layer electrode insulation tank is located at, the width of insulation tank is 0.10mm～1.00mm.
2. mount the PTC thermistor according to the said a kind of novel surface of claim 1, it is characterized in that, described insulation tank is that straight line combines, and also can be combined by curve, can also combine for straight line and curve.
3. novel surface according to claim 1 mounts high molecular PTC thermistor; It is characterized in that; Described macromolecule core is mixed by high molecular polymer, conductive filler, Nano filling and other fillers and processing aid; Wherein, described conductive filler is a kind of or its mixture in carbon black, graphite, the carbon fiber.
4. mount the manufacture method of PTC thermistor according to the said a kind of novel surface of one of claim 1 to 3, it is characterized in that, comply with following step:
The first, core component high molecular polymer, conductive filler and other fillers and processing aid are mixed in high-speed mixer, then with mixing under 100～200 ℃ of temperature of mixture, process the macromolecule core with mold pressing or the method extruded then;
The second, hot pressing composition metal paillon foil is processed composite sheet in two surfaces of above-mentioned macromolecule core;
The 3rd, with gamma-rays (Co60) or electron beam to irradiate crosslinked, dosage is 10～100Mrad with composite sheet; The 4th, electrode slice etched insulation tank in the composite sheet of cross-linking radiation made through the figure transfer etching, and this insulation tank is located at the position of deflection one end welding ends, and the width of insulation tank is 0.10mm～1.00mm;
The 5th; Insulating barrier and pair of metal paillon foil are stacked on the composite sheet and carry out high-temperature high-pressure and close, and the substrate after the pressing is zinc-plated through follow-up boring, heavy copper, copper facing, termination electrode, the etching outer graphics; Printing resistance solder paste China ink; Solidify resistance solder paste China ink and process the PCB laminate, sheet material is cut according to the unit, obtain novel surface and mount the PTC thermistor.
5. mount the manufacture method of high molecular PTC thermistor according to claim 1 described novel surface, it is characterized in that described high molecular PTC thermistor is made up of one deck macromolecule core, or, form by the layer high molecule core through the lamination mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012100033650A CN102426888A (en) | 2012-01-09 | 2012-01-09 | Novel surface-mounted PTC (positive temperature coefficient) thermistor and manufacturing method thereof |
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| CN2012100033650A CN102426888A (en) | 2012-01-09 | 2012-01-09 | Novel surface-mounted PTC (positive temperature coefficient) thermistor and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969100A (en) * | 2012-12-13 | 2013-03-13 | 上海长园维安电子线路保护有限公司 | Thin surface mounting macromolecular PTC (Positive Temperature Coefficient) thermistor and manufacturing method thereof |
| CN104795193A (en) * | 2014-10-24 | 2015-07-22 | 深圳市慧瑞电子材料有限公司 | Surface mounting PTC and thermal fuse composition element and manufacturing method thereof |
| CN105427976A (en) * | 2015-02-28 | 2016-03-23 | 上海长园维安电子线路保护有限公司 | Surface mounting overcurrent protection element with resistor positive temperature effect and manufacturing method of surface mounting overcurrent protection element |
| CN109119216A (en) * | 2017-06-22 | 2019-01-01 | 菲尼克斯电气公司 | A kind of varistor for realizing short circuit optimization by polymerization |
| CN110088586A (en) * | 2016-08-05 | 2019-08-02 | 斯蒂芬.A.马什 | Micropressure sensor |
| CN111863362A (en) * | 2020-08-20 | 2020-10-30 | 东莞市竞沃电子科技有限公司 | Manufacturing method of over-current protection element with reliable weather resistance |
| WO2021253822A1 (en) * | 2020-06-17 | 2021-12-23 | 上海维安电子有限公司 | Surface-mounted polymer ptc overcurrent protection element having small package size |
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| CN2569298Y (en) * | 2002-09-11 | 2003-08-27 | 上海维安热电材料股份有限公司 | High molecular thermosensitive resistor for surface adhesive mounting |
| CN101000817A (en) * | 2006-01-10 | 2007-07-18 | 聚鼎科技股份有限公司 | Surface adhesion type overcurrent protection element |
| US20110175700A1 (en) * | 2006-04-14 | 2011-07-21 | Bourns, Inc. | Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same |
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| US6172591B1 (en) * | 1998-03-05 | 2001-01-09 | Bourns, Inc. | Multilayer conductive polymer device and method of manufacturing same |
| CN2569298Y (en) * | 2002-09-11 | 2003-08-27 | 上海维安热电材料股份有限公司 | High molecular thermosensitive resistor for surface adhesive mounting |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969100A (en) * | 2012-12-13 | 2013-03-13 | 上海长园维安电子线路保护有限公司 | Thin surface mounting macromolecular PTC (Positive Temperature Coefficient) thermistor and manufacturing method thereof |
| CN104795193A (en) * | 2014-10-24 | 2015-07-22 | 深圳市慧瑞电子材料有限公司 | Surface mounting PTC and thermal fuse composition element and manufacturing method thereof |
| CN104795193B (en) * | 2014-10-24 | 2018-10-23 | 深圳市慧瑞电子材料有限公司 | A kind of surface attaching type PTC and Thermal Cutoffs composition element and preparation method thereof |
| CN105427976A (en) * | 2015-02-28 | 2016-03-23 | 上海长园维安电子线路保护有限公司 | Surface mounting overcurrent protection element with resistor positive temperature effect and manufacturing method of surface mounting overcurrent protection element |
| CN110088586A (en) * | 2016-08-05 | 2019-08-02 | 斯蒂芬.A.马什 | Micropressure sensor |
| CN109119216A (en) * | 2017-06-22 | 2019-01-01 | 菲尼克斯电气公司 | A kind of varistor for realizing short circuit optimization by polymerization |
| WO2021253822A1 (en) * | 2020-06-17 | 2021-12-23 | 上海维安电子有限公司 | Surface-mounted polymer ptc overcurrent protection element having small package size |
| CN111863362A (en) * | 2020-08-20 | 2020-10-30 | 东莞市竞沃电子科技有限公司 | Manufacturing method of over-current protection element with reliable weather resistance |
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Application publication date: 20120425 |