CN102419183A - Piezoelectric sensor and processing method thereof - Google Patents
Piezoelectric sensor and processing method thereof Download PDFInfo
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- CN102419183A CN102419183A CN2011102362183A CN201110236218A CN102419183A CN 102419183 A CN102419183 A CN 102419183A CN 2011102362183 A CN2011102362183 A CN 2011102362183A CN 201110236218 A CN201110236218 A CN 201110236218A CN 102419183 A CN102419183 A CN 102419183A
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Abstract
The invention belongs to a sensor technology, and in particular relates to a processing method of a piezoelectric sensor, aiming at providing the piezoelectric sensor with high survival rate and strong anti-interference capacity. In the invention, a copper foil is stuck onto a flexible substrate and a connecting line of a piezoelectric element is etched; and after the connecting line is etched on the flexible substrate, the substrate with the line, the piezoelectric element and curing glue are laminated and solidified in a laminating machine, and piezoelectric pieces are welded on the line by hot press and packaged into a whole. By combination of the flexible line and a rigid line, the survival rate of a product is increased effectively, and bonding pads are arranged on positive and negative surfaces of a BNC (Bayonet Nut Connector) head, so that the both surfaces can be welded directly and packaged by using the special solid glue, thus the survival rate is high up to one hundred percent; meanwhile, the consistency and the integrity of the product are improved. The processing method disclosed by the invention has the advantages of simple process, lower cost and larger practical application value.
Description
Technical field:
The invention belongs to sensor technology, relate to a kind of technological method for processing of piezoelectric sensor.
Background technology
Since 20 th century later, because the caused catastrophic effect of aviation accident that takes place all over the world makes that structural health monitoring technology is able to propose and develop rapidly.This technical research is installed in structure or the integrated sensor functional unit comes the on-line monitoring of implementation structure health status.In numerous sensors and driver, piezoelectric element both can be used as driver and also can be used as sensor owing to have positive inverse piezoelectric effect.Therefore, obtain a lot of researchers' concern and a large amount of the employing.
Traditional use piezoelectric sensor is that piezoelectric element is pasted one by one and is connected respectively, and such way can cause that there is performance difference in each piezoelectric element, and aspects such as stability, electrical specification and serviceable life are difficult to control.
Summary of the invention
The object of the invention: the piezoelectric sensor that a kind of survival rate is high, antijamming capability is strong is provided.
In addition, the present invention also proposes this piezoelectric sensor job operation.
Technical solution of the present invention is: a kind of piezoelectric sensor; It comprises substrate, piezoelectric patches, layer intraconnections circuit, sensor and outside connecting interface BNC connector; Wherein, Said piezoelectric patches, layer intraconnections circuit, sensor and outside connecting interface BNC connector all are arranged in the substrate, and it is characterized in that: said piezoelectric sensor each several part all contains flexible circuitry, and the BNC connector part also contains the rigidity circuit.
Said flexible circuitry is made up of ground floor flexible circuitry and second layer flexible circuitry, and wherein, the ground floor flexible circuitry includes screen layer, adhesive layer and substrate copper foil layer from outside to inside successively; The second layer flexible circuitry of BNC connector part includes electrical isolation flexible material layer, inner copper foil layer and low discharge prepreg layer; And the second layer flexible circuitry of layer intraconnections circuit pack and piezoelectric patches part comprises electrical isolation flexible material layer, inner copper foil layer, adhesive layer and outermost screen layer.
Said rigidity circuit mainly comprises FR-4 rigid layer, substrate copper foil layer and solder mask.
Said connecting interface BNC connector comprises a, b, c, d, e totally 5 pins, and wherein, said piezoelectric patches middle and upper part links to each other with the e pin of BNC connector through layer intraconnections circuit, and the piezoelectric patches middle and lower part links to each other with a pin of BNC connector.
Said BNC connector part pros and cons all is provided with the pad that can directly weld, and is encapsulated by solid gum.
A kind of job operation of piezoelectric sensor, it comprises the steps:
Step 1. requires matrix material and hot-setting adhesive are cut into identical shaped and big or small according to monitoring, add the randomness and the consistance in man-hour with raising;
The layer connection wire road of sheet, and preset scolding tin in corresponding position;
The matrix material that will have circuit is tiled on the flat board, again the hot-setting adhesive alignment is pasted on the matrix material, and in the position punching corresponding to piezoelectric patches; Be positioned over the punch position of hot-setting adhesive to piezoelectric patches, with matrix material alignment tiling and bonding on;
The curing of step 4. piezoelectric patches,
Ironing is fixedly around piezoelectric patches both sides and the matrix material; Flat board is put into vulcanizing press carry out hot-press solidifying, through the scolding tin that presets piezoelectric patches and circuit are welded simultaneously, take out behind water-cooled to the normal temperature;
The encapsulation of step 5.BNC plug,
BNC connector directly is welded on the flat board, passes through solid gum again surface hardening, encapsulation.
Piezoelectric patches is when vulcanizer solidifies again, and with solidifying pressure 2.5MPa, 120 ℃ of condition hot pressing of hot pressing temperature were cured in 120 minutes.
Technique effect of the present invention is: the present invention is pasted on Copper Foil on the flexible parent metal and etches the connection line of piezoelectric element; After etching connection line on the flexible parent metal; Also will in laminating machine, carry out lamination to the base material that has circuit, curing glue solidifies; And the piezoelectric patches welding on the line, and be packaged into an integral body through hot pressing.It combines through adopting flexible circuitry and rigidity circuit; Effectively improved the survival rate of product; And the BNC head is because pros and cons all is provided with pad so the two sides all can directly be welded; Encapsulate through special solid gum, survival rate has also improved consistency of product and integrality up to the hundred-percent while again.Its technology is simple and cost is lower, has bigger actual application value.
Description of drawings:
Fig. 1 is the structural representation of piezoelectric sensor one preferred embodiments of the present invention;
Fig. 2 is the technology composition diagram of piezoelectric sensor of the present invention;
Among the figure: 1 is substrate; 2 is piezoelectric patches; 3 is layer intraconnections circuit; 4 is sensor and outside connecting interface BNC connector; A, b, c, d, e are respectively five pins of BNC connector; 5 is screen layer; 6 is adhesive layer; 7 is the base copper foil layer; 8 is the electrical isolation flexible material layer; 9 is inner copper foil layer; 10 is the low discharge prepreg layer; 11 is the FR-4 rigid layer; 12 is solder mask; 13 is flexible circuitry; 14 is the rigidity circuit.
Embodiment
Through specific embodiment the present invention is described further below:
See also Fig. 1, it is the structural representation of piezoelectric sensor one preferred embodiments of the present invention.Said piezoelectric sensor comprises substrate 1, piezoelectric patches 2, layer intraconnections circuit 3, sensor and outside connecting interface BNC connector 4.Wherein, said piezoelectric patches 2, layer intraconnections circuit 3, sensor all are arranged in the substrate 1 with the connecting interface BNC connector 4 of outside.Said connecting interface BNC connector 4 comprises a, b, c, d, e totally 5 pins.Wherein, said piezoelectric patches 2 is arranged on the disk of substrate 1, and the middle and upper part links to each other with the e pin of BNC connector 4 through layer intraconnections circuit 3, and piezoelectric patches 2 middle and lower parts link to each other with a pin of BNC connector 4, so are connected with and help improve antijamming capability and Electro Magnetic Compatibility.
See also Fig. 2, it is the technology composition diagram of piezoelectric sensor of the present invention.Specify, piezoelectric sensor process structure of the present invention is made up of flexible circuitry part and rigidity circuit pack.Wherein piezoelectric patches 2, layer intraconnections circuit 3, sensor and outside connecting interface BNC connector 4 each several parts all contain flexible circuitry 13, and BNC connector 4 parts also contain rigidity circuit 14.
Said flexible circuitry 13 can be divided into ground floor flexible circuitry and second layer flexible circuitry.Wherein, the ground floor flexible circuitry includes screen layer 5, adhesive layer 6 and substrate copper foil layer 7 from outside to inside successively.The second layer flexible circuitry of BNC connector part 4 includes electrical isolation flexible material layer 8, inner copper foil layer 9 and low discharge prepreg layer 10.And the second layer flexible circuitry of layer intraconnections circuit pack 3 and piezoelectric patches part 2 comprises electrical isolation flexible material layer 8, inner copper foil layer 9, adhesive layer 6 and outermost screen layer 5.Said rigidity circuit 14 comprises FR-4 rigid layer 11, substrate copper foil layer 7 and the solder mask 12 that is provided with from inside to outside.
Why piezoelectric sensor of the present invention takes hierarchy, is because it contains material different, and the decision of the difference of the characteristics of material, character, application function should layering.Electric conductivity and insulativity have all obtained guarantee after the layering.Wherein, flexible portion is convenient to the shape according to various application structures, when making, processes different shape to piezoelectric sensor, can also do suitable cutting out according to the shape of three-dimensional structure.Rigid element mainly plays and the extraneous effect that is connected, and is made into rigidity and is more convenient for dismantling and being connected, and improves reliability and stability.
The material that specifies this manufacture craft below in conjunction with Fig. 2 is formed: in this embodiment, piezoelectric patches is as driver/sensor, and the employing diameter is that 8mm, thickness are the PZT piezoelectric patches of 0.3mm.The electrical isolation flexible material adopts the Kapton of Du Pont Kapton, and thickness is 0.025mm.Said layer intraconnections circuit 3 adopts Copper Foil, and its conductivity is 5.9 * 10
7S/m, tensile strength is 172MPa, and stretch coefficient is 30%, and thermal expansivity is 0.52 * 10
-6/ ℃, density is 8.86g/cm
3, elastic modulus is 110GPa.Adhesive layer 6 is used hot-setting adhesive.Resistance solder paste China ink in the solder mask adopts white Nanya model.
Piezoelectric sensor of the present invention and the existing flexible circuitry of external interface part have the rigidity circuit again; At high temperature with machine with the two pressing; Efficiently solve problem such as easy damage of sensor and welding inconvenience in the prior art, improved the reliability of piezoelectric sensor.In addition, the upper and lower surface of layer intraconnections circuit 3 and piezoelectric patches 2 all has screen layer, has significantly improved the antijamming capability of piezoelectric sensor.
In addition; All can directly weld because pros and cons all is provided with the pad event by the two sides with outside connecting interface BNC connector part 4 for piezoelectric sensor of the present invention; Encapsulate through solid gum, survival rate has also increased convenience, reliability and the consistance of its installation greatly up to the hundred-percent while again.
Suprabasil disk is fit to the piezoelectric patches of various models through handling, and piezoelectric patches through electric silica gel directly with the test specimen stickup, thereby the contact area that has increased greatly with test specimen has reduced impedance, has guaranteed that the piezoelectric patches performance is not changed.Overcome existing product deficiency in this respect, strengthened antijamming capability, improved reliability.
Provide the processing implementation method of piezoelectric sensor of the present invention below, disturb the problem big, that yield rate is low to solve in the existing technology, its concrete processing step is following:
Step 1. requires matrix material and hot-setting adhesive are cut into identical shaped and big or small according to monitoring, add the randomness and the consistance in man-hour with raising;
1). exposure: exposure is a characteristic (only accepting the wavelength of fixed energies) of utilizing dry film, and the circuit specification of needs is made into egative film, via the exposure principle of taking pictures, reaches the effect of image transfer;
2). develop: development is to utilize dry film after overexposure, produces photoresponse part or photoresponse part (this will according to the characteristic of light-sensitive surface) not, is dissolvable in water in the developer solvent of alkalescence, reaches the line pattern of the demand of producing;
3). etching: etching is the naked copper that comes etch not covered by dry film with etching solution, and unwanted copper layer is removed, and only stays essential circuit;
4). stripping: stripping is to remove fully with the dry film that NaOH will stay on the circuit, and circuit is moulding;
The matrix material that will have circuit is tiled on the flat board, hot-setting adhesive (in the position punching corresponding to piezoelectric patches) alignment is pasted on the matrix material again; Be positioned over the punch position of hot-setting adhesive to piezoelectric patches, and paste and go up special instant adhesive, at last the matrix material alignment is tiled on the instant adhesive;
The curing of step 4. piezoelectric patches,
In the piezoelectric patches both sides, and ironing is fixing gently around the matrix material with thermostatic iron (55 ℃); Flat board is put into vulcanizing press, and in actual certain preferred embodiments, with solidifying pressure 2.5MPa, 120 ℃ of condition hot pressing of hot pressing temperature 120 minutes (in this process, through the scolding tin that presets piezoelectric patches and circuit being welded simultaneously) are taken out behind water-cooled to the normal temperature.
The encapsulation of step 5.BNC plug,
BNC connector directly is welded on the flat board, passes through solid gum again, improve antijamming capability surface hardening, encapsulation.
The present invention is pasted on Copper Foil on the flexible parent metal and etches the connection line of piezoelectric element in sum; After etching connection line on the flexible parent metal; Also will in laminating machine, carry out lamination to the base material that has circuit, piezoelectric element, curing glue solidifies; And the piezoelectric patches welding on the line, and be packaged into an integral body through hot pressing.It combines through adopting flexible circuitry and rigidity circuit; Effectively improved the survival rate of product; And the BNC head since pros and cons all be provided with pad the two sides all can directly weld, encapsulate through special solid gum again, survival rate has also improved consistency of product and integrality up to the hundred-percent while; Its technology is simple and cost is lower, has bigger actual application value.
Claims (7)
1. piezoelectric sensor; It is characterized in that: comprise substrate [1], piezoelectric patches [2], layer intraconnections circuit [3], sensor and outside connecting interface BNC connector [4]; Wherein, Said piezoelectric patches [2], layer intraconnections circuit [3], sensor and outside connecting interface BNC connector [4] all are arranged in the substrate [1], and it is characterized in that: said piezoelectric sensor each several part all contains flexible circuitry [13], and BNC connector [4] part also contains rigidity circuit [14].
2. piezoelectric sensor according to claim 1; It is characterized in that: said flexible circuitry [13] is made up of ground floor flexible circuitry and second layer flexible circuitry; Wherein, the ground floor flexible circuitry includes screen layer [5], adhesive layer [6] and substrate copper foil layer [7] from outside to inside successively; The second layer flexible circuitry of BNC connector part [4] includes electrical isolation flexible material layer [8], inner copper foil layer [9] and low discharge prepreg layer [10]; And the second layer flexible circuitry of layer intraconnections circuit pack [3] and piezoelectric patches part [2] comprises electrical isolation flexible material layer [8], inner copper foil layer [9], adhesive layer [6] and outermost screen layer [5].
3. piezoelectric sensor according to claim 1 is characterized in that: said rigidity circuit [14] mainly comprises FR-4 rigid layer [11], substrate copper foil layer [7] and solder mask [12].
4. piezoelectric sensor according to claim 1; It is characterized in that: said connecting interface BNC connector [4] comprises a, b, c, d, e totally 5 pins; Wherein, Said piezoelectric patches [2] middle and upper part links to each other with the e pin of BNC connector [4] through layer intraconnections circuit 3, and piezoelectric patches [2] middle and lower part links to each other with a pin of BNC connector [4].
5. piezoelectric sensor according to claim 1 is characterized in that: said BNC connector [4] pros and cons all is provided with the pad that can directly weld, and is encapsulated by solid gum.
6. the job operation of a piezoelectric sensor is characterized in that, comprises the steps:
Step 1. requires matrix material and hot-setting adhesive are cut into identical shaped and big or small according to monitoring, add the randomness and the consistance in man-hour with raising;
Step 2. is produced the layer connection wire road of piezoelectric patches through the process of overexposure, development, etching, stripping on matrix material, and preset scolding tin in corresponding position;
Step 3. piezoelectric piece bonding in substrate,
The matrix material that will have circuit is tiled on the flat board, again the hot-setting adhesive alignment is pasted on the matrix material, and in the position punching corresponding to piezoelectric patches; Be positioned over the punch position of hot-setting adhesive to piezoelectric patches, with matrix material alignment tiling and bonding on;
The curing of step 4. piezoelectric patches,
Ironing is fixedly around piezoelectric patches both sides and the matrix material; Flat board is put into vulcanizing press carry out hot-press solidifying, through the scolding tin that presets piezoelectric patches and circuit are welded simultaneously, take out behind water-cooled to the normal temperature;
The encapsulation of step 5.BNC plug,
BNC connector directly is welded on the flat board, passes through solid gum again surface hardening, encapsulation.
7. the job operation of piezoelectric sensor according to claim 6 is characterized in that: piezoelectric patches is when vulcanizer solidifies again, and with solidifying pressure 2.5MPa, 120 ℃ of condition hot pressing of hot pressing temperature were cured in 120 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110236218 CN102419183B (en) | 2011-08-18 | 2011-08-18 | Piezoelectric sensor and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110236218 CN102419183B (en) | 2011-08-18 | 2011-08-18 | Piezoelectric sensor and processing method thereof |
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| Publication Number | Publication Date |
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| CN102419183A true CN102419183A (en) | 2012-04-18 |
| CN102419183B CN102419183B (en) | 2013-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110236218 Expired - Fee Related CN102419183B (en) | 2011-08-18 | 2011-08-18 | Piezoelectric sensor and processing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111134716A (en) * | 2020-01-03 | 2020-05-12 | 绵阳市中医医院 | Bowel sound collection system |
| CN113933086A (en) * | 2021-12-17 | 2022-01-14 | 中国飞机强度研究所 | Method for optimizing cutting condition of low-temperature environment test of complete airplane in laboratory |
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| EP1335194A1 (en) * | 1998-07-28 | 2003-08-13 | Rosemount Aerospace Inc. | Flexible silicon strain gage |
| JP2009053005A (en) * | 2007-08-27 | 2009-03-12 | Hitachi Metals Ltd | Semiconductor strain sensor, and mounting method of semiconductor strain sensor |
| CN102141451A (en) * | 2011-04-06 | 2011-08-03 | 东北大学 | Method for developing flexible pressure sensitive probe with side electrode |
| CN102157677A (en) * | 2011-02-24 | 2011-08-17 | 南京航空航天大学 | Rigid-flexible combined piezoelectric interlayer with insulating property |
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2011
- 2011-08-18 CN CN 201110236218 patent/CN102419183B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1335194A1 (en) * | 1998-07-28 | 2003-08-13 | Rosemount Aerospace Inc. | Flexible silicon strain gage |
| JP2009053005A (en) * | 2007-08-27 | 2009-03-12 | Hitachi Metals Ltd | Semiconductor strain sensor, and mounting method of semiconductor strain sensor |
| CN102157677A (en) * | 2011-02-24 | 2011-08-17 | 南京航空航天大学 | Rigid-flexible combined piezoelectric interlayer with insulating property |
| CN102141451A (en) * | 2011-04-06 | 2011-08-03 | 东北大学 | Method for developing flexible pressure sensitive probe with side electrode |
Non-Patent Citations (1)
| Title |
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| 曹康敏，等: "集成探头型压电式加速度传感器研究", 《传感技术学报》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111134716A (en) * | 2020-01-03 | 2020-05-12 | 绵阳市中医医院 | Bowel sound collection system |
| CN113933086A (en) * | 2021-12-17 | 2022-01-14 | 中国飞机强度研究所 | Method for optimizing cutting condition of low-temperature environment test of complete airplane in laboratory |
| CN113933086B (en) * | 2021-12-17 | 2022-02-22 | 中国飞机强度研究所 | Method for optimizing cutting condition of low-temperature environment test of complete airplane in laboratory |
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| CN102419183B (en) | 2013-10-23 |
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Granted publication date: 20131023 Termination date: 20160818 |