CN102399511A - Electroplated shielding protective tape - Google Patents
Electroplated shielding protective tape Download PDFInfo
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- CN102399511A CN102399511A CN2011103857272A CN201110385727A CN102399511A CN 102399511 A CN102399511 A CN 102399511A CN 2011103857272 A CN2011103857272 A CN 2011103857272A CN 201110385727 A CN201110385727 A CN 201110385727A CN 102399511 A CN102399511 A CN 102399511A
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- material film
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Abstract
The invention discloses electroplated shielding protective tape, which comprises a base material film layer, a pressure-sensitive layer and a silicone oil layer, wherein the base material film layer is a polyester film, the pressure-sensitive layer is a silicone sealing layer, the pressure-sensitive layer is coated on the surface at one side of the base material film layer, and the silicone oil layer is coated on the surface at the other side of the base material film layer. According to the invention, as the outer surface of the base material is coated with the anti-acid and anti-alkali silicon oil layer so as to prevent electroplate liquid from permeating electronic parts and sprays, steam and the like of the electroplate liquid from polluting passive elements, the electroplated shielding protective tape has excellent solvent resistance and sealability, can be precisely fit with a circuit board even under the harsh condition of electroplating, and can be stripped without adhesive residue after being used.
Description
Technical field
The present invention relates to electronic product and components and parts thereof and make applied technical field, particularly relate to a kind of plating and cover protective tapes.
Background technology
At present, make in the object work flow of high temperature engineering in field, need to use of the protection of various adhesive tapes as covering at electronic product.For the metal electron component, the needs that have carry out electroplating technology and strengthen its wear resistance, erosion resistance, electroconductibility and aesthetics etc.This just needs masking tape not need galvanized component protection to other, makes it not receive extraneous oxidation.Existing this adhesive tape mainly uses orthoxenol as starting material, a kind of water-borne pressure sensitive adhesive of coating on orthoxenol, and oven dry is made.The adhesive tape of this structure can not soak in the power and water plating bath midium or long term, and is more not acidproof also not alkaline-resisting, and can not bear high temperature, can only apply to common occasion, is not suitable for the protection of covering when electronic component is electroplated.
Summary of the invention
The technical problem that the present invention mainly solves is: to the deficiency of prior art; Provide a kind of plating to cover protective tapes; Be used to prevent that electroplate liquid from infiltrating electronic component, prevent that the electroplate liquid spittle and steam etc. from polluting passive original paper, has fabulous anti-dissolubility and stopping property; Even also can fit electroplating under the harsh like this condition, almost can not have cull after the use and peel off with circuit card is accurate.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: provide a kind of plating to cover protective tapes; Comprise: base material film layer, varistor layer and silicon layer, said base material film layer is a polyester film, said varistor layer is the silicone seal glue-line; Said varistor layer is coated in a side surface of said base material film layer, the opposite side surface coated silicon layer of said base material film layer.
In preferred embodiment of the present invention, the thickness of said base material film layer is 0.025-0.05mm.
The invention has the beneficial effects as follows: the present invention has disclosed a kind of plating and has covered protective tapes; Be coated with the silicon layer of one deck acid and alkali-resistance at the outside surface of base material; Be used to prevent that electroplate liquid from infiltrating electronic component, prevent that the electroplate liquid spittle and steam etc. from polluting passive original paper, has fabulous anti-dissolubility and stopping property; Even also can fit electroplating under the harsh like this condition, almost can not have cull after the use and peel off with circuit card is accurate.
Description of drawings
Fig. 1 is that the present invention electroplates the structural representation that covers protective tapes one preferred embodiment;
The mark of each parts is following in the accompanying drawing: 1, varistor layer, 2, the base material film layer, 3, silicon layer.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also shown in Figure 1ly, the embodiment of the invention comprises:
Protective tapes is covered in a kind of plating; Comprise: base material film layer 2, varistor layer 1 and silicon layer 3; Said base material film layer 2 is a polyester film, and said varistor layer 1 is the silicone seal glue-line, and said varistor layer 1 is coated in a side surface of said base material film layer 2; The opposite side surface coated silicon layer 3 of said base material film layer 2 is made through oven dry.
The thickness of said base material film layer 2 is 0.025-0.05mm.
The present invention has disclosed a kind of plating and has covered protective tapes; Be coated with the silicon layer of one deck acid and alkali-resistance at the outside surface of base material; Be used to prevent that electroplate liquid from infiltrating electronic component, prevent that the electroplate liquid spittle and steam etc. from polluting passive original paper, has fabulous anti-dissolubility and stopping property; Even also can fit electroplating under the harsh like this condition, almost can not have cull after the use and peel off with circuit card is accurate.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (2)
1. protective tapes is covered in a plating; Comprise: base material film layer, varistor layer and silicon layer; It is characterized in that said base material film layer is a polyester film, said varistor layer is the silicone seal glue-line; Said varistor layer is coated in a side surface of said base material film layer, the opposite side surface coated silicon layer of said base material film layer.
2. protective tapes is covered in plating according to claim 1, it is characterized in that, the thickness of said base material film layer is 0.025-0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103857272A CN102399511A (en) | 2011-11-29 | 2011-11-29 | Electroplated shielding protective tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103857272A CN102399511A (en) | 2011-11-29 | 2011-11-29 | Electroplated shielding protective tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102399511A true CN102399511A (en) | 2012-04-04 |
Family
ID=45882178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103857272A Pending CN102399511A (en) | 2011-11-29 | 2011-11-29 | Electroplated shielding protective tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102399511A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106244034A (en) * | 2015-06-03 | 2016-12-21 | 日东电工株式会社 | Mask pressure-sensitive adhesive tape |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201665651U (en) * | 2010-03-16 | 2010-12-08 | 苏州银河激光科技有限公司 | Electroplating protection adhesive tape |
-
2011
- 2011-11-29 CN CN2011103857272A patent/CN102399511A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201665651U (en) * | 2010-03-16 | 2010-12-08 | 苏州银河激光科技有限公司 | Electroplating protection adhesive tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106244034A (en) * | 2015-06-03 | 2016-12-21 | 日东电工株式会社 | Mask pressure-sensitive adhesive tape |
| US10858552B2 (en) | 2015-06-03 | 2020-12-08 | Nitto Denko Corporation | Masking pressure-sensitive adhesive tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120404 |