CN102393609B - Device and method for exchanging of double workpiece tables on lintel type single/double guide rails in double-drive stepping scanning - Google Patents
Device and method for exchanging of double workpiece tables on lintel type single/double guide rails in double-drive stepping scanning Download PDFInfo
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Abstract
A device and a method for exchanging of double workpiece tables on lintel type single/double guide rails in double-drive stepping scanning belong to semiconductor manufacturing equipment. The system comprises a silicon wafer table running at an exposure station and a silicon wafer table running at a pretreatment station, and the two silicon wafer tables are arranged on a same base table. Four linear movement units in the Y direction and two linear movement units in the X direction are arranged at the edge of the base table; two lintel type linear movement units higher than the working surface of the silicon wafer table in the X direction are arranged in the middle of the base table; and the linear movement in the X direction of the linear movement units in the Y direction can be realized by the linear movement units in the X direction, and the linear movement units in the Y direction and movement sliders of the movement units in the Y direction can realize the movement of the silicon wafer table in the X direction or in the Y direction. The device and the method can improve the torque interference resisting capacity of the guide rail and reduces or overcomes movement deviation and deformation deviation due to the interference of torque, thereby enhancing the movement precision of the silicon wafer table. The table exchanging process only needs three beats, so that the time for exchanging the double tables is shortened, and the production efficiency of a lithography machine is enhanced obviously.
Description
Technical field
The invention belongs to semiconductor manufacturing equipment technical field, relate generally to two step-scan double-workpiece-table switch and the methods of driving of a kind of lintel type list/bis-guide rail.
Background technology
Photoetching technique is by the method for exposure, the figure on mask to be transferred on the photoresist that is coated on silicon chip surface, utilizes the technology such as follow-up development, etching that the figure on photoresist is transferred on silicon chip.Litho machine is one of ultraprecise system type engineering equipment important in photoetching technique, and its overall performance has very important effect for whole photoetching process.The Main Function of work stage is at a high speed and carry wafer under the condition of high acceleration and realize nanoscale location, completes the operations such as fluctuating plate in photoetching process, prealignment, aligning, and the while has coordinated exposure actions with mask platform.Work stage technology has vital effect for improving litho machine resolution, alignment precision and productive rate.
Productive rate is mainly one of pursuing a goal of litho machine industrialized development.In order to improve productive rate, avoid frequently changing wafer, wafer current diameter is progressively increased to current 300mm from 150m, 200mm.When diameter wafer increases, the movement velocity of work stage and acceleration of motion have also been carried out corresponding raising.The movement velocity of work stage and the raising of acceleration of motion propose larger test to nanoscale location, and overall performance is made a big impact.In order further to improve productive rate, from reducing the time to locating tab assembly, someone proposes dual-stage technology, in work stage, set exposure station and prealignment station, two silicon wafer stages lay respectively at exposure station and prealignment station, adopt when realizing in this way prealignment and exposure and carry out.The TwinScan system of Holland ASML company is the double-workpiece-table system proposing the earliest in the world, based on TwinScan technology (being dual-stage technology) litho machine, is also the most representative current double-workpiece-table litho machine.The operational efficiency that adopts the raising litho machine that dual-stage technology can be very large, improves productive rate.Different companies adopts different implementation methods.In two platform patent WO98/40791, in each silicon wafer stage structure, there is the unit of two commutative cooperations to realize the exchange of two platforms, when realizing pre-service and exposure, work alone, improved production efficiency.But because silicon wafer stage and guide rail adopt the mode that is of coupled connections, in exchange process, silicon wafer stage and driver element can exist of short duration separatedly, and the positioning precision of silicon wafer stage is impacted.In patent US2001/0004105A1, adopt two platform switching technologies, realization has improved productive rate under the prerequisite that does not improve silicon wafer stage movement velocity, but owing to also adopting the mode that is of coupled connections between silicon wafer stage and guide rail, same in zapping process, there will be equally the of short duration separated of silicon wafer stage and driver element, affect the positioning precision of silicon wafer stage.Simultaneously moving cell and guide rail are longer, and moving-mass is larger, for the raising of movement velocity and acceleration, all produce harmful effect.In patent CN101231471A, adopt H type driver element to dock with the friction pulley on transition catching device, to avoid guide rail merging precision problem, but silicon wafer stage when zapping, need to wait for that driver element and friction pulley complete after docking and just can carry out zapping operation, productive rate is brought to very large impact.In patent CN1828427A, at pre-service station, be provided with an X-direction guide rail, exposure station is provided with two X-direction guide rails, realize the concurrent working of two stations, but because driver element is fixed on pedestal, when silicon wafer stage moves, have and be delivered to more energetically on pedestal, integral body is brought to harmful effect.
In such scheme, the impact of the motion of the driver element that leads while all not considering zapping during zapping on efficiency.From zapping beat, consider all to adopt five beat forms,, in zapping process, two silicon wafer stages need to stay for some time and make catching device complete exchange, thereby complete zapping work.More and more higher to productive rate requirement in the situation that, also can have a huge impact productive rate the swap time of catching device.In patent CN101201555, utilize travelling belt and docking slide block to complete zapping process, tact of motion is few, therefore Operation and Maintenance is simple, but conveyer mechanism and docking slide block be fixed on base station, in zapping process, have larger masterpiece and be used on base station, larger to overall dynamics performance impact.In patent CN1485694, utilize the docking of Y-direction linear electric motors and line slideway to complete zapping operation, but because the excesssive gap in the middle of base station is introduced bridge-set, tact of motion is increased, increased the zapping time, X-direction linear electric motors magnet steel partial fixing is on base station simultaneously, and during zapping, the athletic meeting of moving component produces larger reacting force to base station, and then affects the dynamic property of whole system.In patent CN101770181, utilize the docking of permute unit to complete zapping work, but its guide piece is fixed on base station, in zapping motion, moving component can produce larger reacting force to base station, and then affects the dynamic property of whole system.Therefore current two platform schemes have much room for improvement.
Summary of the invention
For shortcomings and deficiencies of the prior art, the object of this invention is to provide two step-scan double-workpiece-table switch and the methods of driving of a kind of lintel type list/bis-guide rail, by two-way pair of guide rail of XY, drive silicon wafer stage to do exposure motion simultaneously, effectively improve the guide rail moment of torsion causing because of driving force deviation while driving because of single-rail two ends, and then effectively improve position deviation and the deformation deviation that this torsion causes, improve the precision of silicon wafer stage exposure motion; Simultaneously, the present invention adopts integrated design scheme, has avoided grabbing card and card changing action and beat in existing double-workpiece-table exchange process, and whole exchange process only needs three beats, greatly shorten two platforms and exchanged the needed time, improved the production efficiency of litho machine.
Technical scheme of the present invention is as follows:
The two step-scan double-workpiece-table switching methods of driving of a kind of lintel type list/bis-guide rail, the three beat steps of the method are: before double-workpiece-table exchange, the first silicon wafer stage in pre-service station is held by Y-direction the first linear motion unit, and in exposure station the second silicon wafer stage by second and third linear motion unit of Y-direction, jointly held; After exposure motion finishes, the first beat: Y-direction the second linear motion unit is separated with the second silicon wafer stage, and simultaneously respectively to base station border movement, Y-direction the 3rd linear motion unit composition composite guideway that finally aligns with Y-direction the 4th linear motion unit wherein, the first silicon wafer stage in pre-service station is under the drive of Y-direction the first linear motion guide rail simultaneously, beginning is to base station border movement, align with Y-direction the second linear motion unit, form a composite guideway, in whole beat process, silicon wafer stage motion is without pausing; The second beat: first and second silicon wafer stage moves along two Y-direction composite guidewaies respectively, simultaneously, with the linear motor rotor slide block of contactless Y-direction the second linear motion unit of silicon wafer stage to base station border movement, for silicon wafer stage reserves enough spaces, move to base station centre position with the linear motor rotor slide block of the contactless Y-direction of silicon wafer stage the 3rd linear motion unit, for next step, grabbing card silicon wafer stage prepares, in first and second silicon chip motion, pass through first and second lintel type and pass through Y-direction linear motion unit, and cross over composite guideway docking site; The 3rd beat: first and second silicon wafer stage is respectively under the drive of Y-direction second, four linear motion units, along directions X, move, simultaneously, Y-direction the 3rd linear motion unit is done the motion with the first silicon wafer stage relative direction, to silicon wafer stage, move with the linear motor rotor slide block of the contactless Y-direction of silicon wafer stage the 3rd linear motion unit simultaneously, until near and hold, in whole process, silicon wafer stage motion is without pausing; So far, exchange process completes, and exposure and pretreatment process start; In exposure with after pretreatment process finishes, silicon wafer stage is done and the motion of above-mentioned motion process contrary, thereby realizes continuous zapping process.
The two step-scan double-workpiece-table switches that drive of a kind of lintel type list/bis-guide rail, this device contains the first silicon wafer stage that runs on pre-service station being arranged on same base station and runs on the second silicon wafer stage of exposure station, in four edges of described base station, 4 Y-directions first are set respectively, second, the 3rd, the 4th linear motion unit, 1 directions X first is respectively set on the position, both sides of base station symmetry, the second linear motion unit, in base station middle part, be provided with 2 bottom surfaces along directions X and exceed first, the lintel type first of the second silicon wafer stage workplace, the second linear motion unit, in the plane that 4 Y-direction first, second, third, fourth linear motion units of first, second described silicon wafer stage on base station and first, second linear motion unit of directions X surround, do X-Y motion, and form air-bearing and spigot surface with base station surface is common, 4 described Y-direction first, second, third, fourth linear motion units can be realized along directions X and being moved by first, second linear motion unit of directions X, and jointly realize the directions X of silicon wafer stage or the motion of Y-direction by the linear motor rotor of Y-direction linear motion unit of himself, 4 Y-direction first, second, third, fourth linear motion units include Y-direction linear electric motors and Y-direction air-float guide rail, wherein the linear motor stator electric of Y-direction linear motion guide rail is permanent magnetism group structure, the linear motor rotor of Y-direction linear motion unit slide block is loop construction, and Y-direction air-float guide rail is arranged between the linear motor stator electric of Y-direction linear motion unit guide rail and the linear motor rotor of Y-direction linear motion unit slide block, each linear electric motors comprises a stationary part, one or two mover part, permanent magnetism group arrangement is horizontal or vertical, 2 first, second linear motion units of directions X include linear electric motors and air-bearing, wherein the linear motor stator electric of directions X linear motion unit guide rail is permanent magnetism group structure, the linear motor rotor of directions X linear motion unit slide block is loop construction, and air-bearing is arranged between the linear motor stator electric of directions X linear motion unit guide rail and the linear motor rotor of directions X linear motion unit slide block, each linear electric motors comprises a stator and two movers, permanent magnetism group arrangement is horizontal or vertical, 2 first, second linear motion units of lintel type include linear electric motors and air-bearing, wherein the linear motor stator electric of linear motion unit guide rail is permanent magnetism group structure, the linear motor rotor of linear motion unit slide block is loop construction, and air-bearing is arranged between the linear motor stator electric of linear motion unit guide rail and the linear motor rotor of linear motion unit slide block, each linear electric motors comprises a stator and two movers, permanent magnetism group arrangement is for being horizontal or vertical, one of the linear motor rotor of linear motor stator electric one end of Y-direction linear motion guide rail and directions X linear motion unit slide block rigid attachment, one of the linear motor stator electric other end of Y-direction linear motion guide rail and the linear motor rotor of linear motion unit slide block rigid attachment, the linear motor stator electric of the linear motor stator electric of directions X linear motion unit guide rail and the guide rail of linear motion unit all with base station (1) rigid attachment, mechanism for card is respectively grabbed in first, second described silicon wafer stage directions X two sides, 4 described Y-direction first, second, third, fourth linear motion units all contain can control step up or unclamp grab mechanism for card, coordinate with the mechanism for card of grabbing of first, second silicon wafer stage side, the described mechanism for card of grabbing is electromagnetism adsorption structure or by the mechanical structure of grabbing card slide block and forming.
The present invention compares and has following innovative point and outstanding advantages with existing method and apparatus:
1, this device has been realized parallel lintel type three beat zappings.Together with work stage and Y-direction air-float guide rail cover and linear motor rotor connect firmly, there is no card grasping action and card changing action in zapping process, three beats can complete the exchange of two work stage positions, than existing double-workpiece-table exchange scheme, save two beats; Simultaneously in exchange process, the first beat guide rail keeps to the side to integrate with and the 3rd beat guide rail is all the two modes of driving of the two guide rails in Y-direction guide rail two ends to two actions of working position motion, driving force is large, and driven member, be Y-direction guide rail (be less than Y-direction whole process 1/2) and work stage, quality and inertia are little, and actuating speed is fast, comprehensive above-mentioned technical advantage, the zapping time of this programme can significantly be shorter than existing method and apparatus scheme, and this is one of innovative point of the present invention and remarkable advantage;
2, lintel type double-workpiece-table system organization plan is proposed.By two air-float guide rails and linear electric motors arranged parallel, on beam, two groups of (4) X-direction air-float guide rail sliding sleeves and linear motor rotor coordinate with it installation.When exposure, exposure position work stage and two X-direction air-float guide rails and linear electric motors form step-scan system; Pre-service position work stage and another two X-direction air-float guide rails and linear electric motors form pretreatment system.When two work stage switches, corresponding air-float guide rail and the linear electric motors of two systems slide to rapidly base station edge, under beam, form two long air-float guide rail and linear electric motors that run through Y-direction base station Y-direction edge.Two work stage slide to opposite along two air-float guide rails and linear electric motors respectively under beam, and form new exposure system and pretreatment system with two groups of Y-direction air-float guide rails on two working positions.This organization plan can guarantee to form an overall work face as the base station platform of two work stage guiding and carrying plane, robust motion and continuity while being conducive to two work stage exchanges and work are conducive to improve the one-piece construction rigidity of overall permanence and the double-workpiece-table system of balance-impact and vibration simultaneously.This is two of the innovative point of this programme and remarkable advantage.
3, the integral structure scheme of Y-direction moving cell is proposed.Work stage and one of them Y-direction air-float guide rail and linear motor rotor are connected firmly mutually, realized the integrated design of silicon wafer stage and Y-direction air-float guide rail and linear electric motors, make more compact structure, the rigidity of structure significantly improves, and is conducive to the lifting of control characteristic.This both can obviously promote the speed that two work stage drive at zapping duration stroke, and stepping and sweep velocity in exposure process are significantly promoted.Comprehensive above-mentioned technical advantage, this programme can make the monolithic process-cycle obviously shorten with device than existing methods, and this is three of innovative point of the present invention and remarkable advantage;
4, propose exposure silicon wafer stage and be two guide rails and two organization plan driving in X-direction and Y-direction.When double-workpiece-table exchange working position, the mode that adopts two guide rails and dual linear motor to drive, can bring into play two advantages such as large with two guide rail mode driving forces, angular rigidity is large, disturbance torque is little of driving, both can improve actuating speed, can improve again stationarity and the stability of exposure motion; When exposure step-scan campaign, adopt two guide rails and dual linear motor type of drive, can integrate that driving force is large, angular rigidity is large, one-piece construction rigidity is large, disturbance torque is little and driven member quality and the many advantages such as inertia is little, not only being conducive to zapping speed promotes, exposure step-scan speed promotes, and the lifting of the step-scan precision that is conducive to expose.(silicon wafer stage of pre-service campaign is clamped by a Y-direction guide rail in Y-direction, is that needed kinematic accuracy and movement velocity are all smaller because pre-service campaign is moved with respect to exposure.) this is four of innovative point of the present invention and remarkable advantage.
Accompanying drawing explanation
Fig. 1 is the principle of work schematic diagram of litho machine.
Fig. 2 is general structure intention of the present invention.
Fig. 3 is 4 Y-direction linear motion unit structural representations of the present invention.
Fig. 4 is 2 directions X linear motion unit structural representations of the present invention.
Fig. 5 is 2 lintel type linear motion unit structural representations of the present invention.
Fig. 6, Fig. 7, Fig. 8 Fig. 9 are zapping schematic flow sheet.
Figure 10 is the Workpiece platform structure schematic diagram of embodiment 2 in the present invention
In figure:
1, base station; 2, base station upper surface; 6, pre-service station; 7, exposure station; 11, the first silicon wafer stage; 12, the second silicon wafer stage; 20a, Y-direction linear motion unit guide rail, comprise linear motor stator electric; 20b, Y-direction linear motion unit slide block, comprise linear motor rotor; 20b1,20b2,20c1,20c2,
grab card slide block;21, Y-direction the first linear motion unit; 22, Y-direction the second linear motion unit; 23, Y-direction the 3rd linear motion unit; 24, Y-direction the 4th linear motion unit; 30a, directions X linear motion unit guide rail, comprise linear motor stator electric; 30b, 30c, directions X linear motion unit slide block, comprise linear motor rotor; 31, directions X the first linear motion unit; 32, directions X the second linear motion unit; 40a, 40b, linear motion unit guide rail, comprise linear motor stator electric; 40c, 40d, 40e, 40f, linear motion unit slide block, comprise linear motor rotor; 41, lintel type the first linear motion unit; 42, lintel type the second linear motion unit; 44, lens combination; 45, light source; 47, mask; 50, silicon chip;
embodiment
Below in conjunction with accompanying drawing, embodiment of the present invention is described in detail.
Embodiment 1
The two step-scan double-workpiece-table switches that drive of a kind of lintel type list/bis-guide rail, this device contains the second silicon wafer stage 12 that is arranged on the first silicon wafer stage 11 that runs on pre-service station 6 on same base station 1 and runs on exposure station 7, in 1 four edges of described base station, 4 Y-directions first are set respectively, second, the 3rd, the 4th linear motion unit 21, 22, 23, 24, 1 directions X first is respectively set on the position, both sides of base station 1 symmetry, the second linear motion unit 31, 32, in base station 1 middle part, be provided with 2 bottom surfaces along directions X and exceed first, the second silicon wafer stage 11, the lintel type first of 12 workplaces, the second linear motion unit 41, 42, first, second described silicon wafer stage 11,12 4 Y-directions, first, second, third, fourth linear motion units 21 on base station 1,22,23,24 with first, second linear motion unit 31 of directions X, in 32 planes that surround, do X-Y motion, and jointly form air-bearing and spigot surface with base station 1 surface, described 4 Y-directions, first, second, third, fourth linear motion unit 21,22,23,24 by first, second linear motion unit 31 of directions X, 32 can realize along directions X and moving, and jointly realize the directions X of silicon wafer stage or the motion of Y-direction by himself the linear motor rotor 20b of Y-direction linear motion unit, 4 Y-direction first, second, third, fourth linear motion units 21,22,23,24 include Y-direction linear electric motors and Y-direction air-float guide rail, wherein the linear motor stator electric 20a of Y-direction linear motion guide rail is permanent magnetism group structure, the linear motor rotor 20b of Y-direction linear motion unit slide block is loop construction, and Y-direction air-float guide rail is arranged between the linear motor stator electric 20a of Y-direction linear motion unit guide rail and the linear motor rotor 20b of Y-direction linear motion unit slide block, each linear electric motors comprises a stationary part, one or two mover part, permanent magnetism group arrangement is horizontal or vertical, 2 first, second linear motion units 31 of directions X, 32 include linear electric motors and air-bearing, wherein the linear motor stator electric 30a of directions X linear motion unit guide rail is permanent magnetism group structure, the linear motor rotor 30b of directions X linear motion unit slide block, 30c is loop construction, air-bearing is arranged on the linear motor stator electric 30a of directions X linear motion unit guide rail and the linear motor rotor 30b of directions X linear motion unit slide block, between 30c, each linear electric motors comprises a stator and two movers, permanent magnetism group arrangement is horizontal or vertical, 2 first, second linear motion units 41,42 of lintel type include linear electric motors and air-bearing, wherein the linear motor stator electric 40a of linear motion unit guide rail, 40b is permanent magnetism group structure, the linear motor rotor 40c of linear motion unit slide block, 40d, 40e, 40f is loop construction, air-bearing is arranged on the linear motor stator electric 40a of linear motion unit guide rail, the linear motor rotor 40c of 40b and linear motion unit slide block, 40d, 40e, between 40f, each linear electric motors comprises a stator and two movers, permanent magnetism group arrangement is for being horizontal or vertical, the linear motor rotor 30b of linear motor stator electric 20a one end of Y-direction linear motion guide rail and directions X linear motion unit slide block, one of 30c rigid attachment, the linear motor stator electric 20a other end of Y-direction linear motion guide rail and the linear motor rotor 40c of linear motion unit slide block, 40d, 40e, one of 40f rigid attachment, the linear motor stator electric 40a of the linear motor stator electric 30a of directions X linear motion unit guide rail and the guide rail of linear motion unit, 40b all with base station 1 rigid attachment, mechanism for card is respectively grabbed in described first, second silicon wafer stage (11,12) directions X two sides, described 4 Y-direction first, second, third, fourth linear motion units (21,22,23,24) all contain can control step up or unclamp grab mechanism for card, coordinate with the mechanism for card of grabbing of first, second silicon wafer stage 11,12 sides, the described mechanism for card of grabbing is electromagnetism adsorption structure or by grabbing card slide block 20b1,20b2,20c1, the mechanical structure that 20c2 forms.
System completes the process of silicon slice bench double-bench exchange as shown in Fig. 2,6,7,8.Before first and second silicon wafer stage 11,12 exchanges, silicon wafer stage present position is initial position as shown in Figure 2, wherein the first silicon wafer stage 11 is by Y-direction the first linear motion unit 21 clampings, the second silicon wafer stage 12 is clamped jointly by second and third linear motion unit 22,23 of Y-direction, and do X and Y-direction motion according to above-mentioned principle, to realize exposure and the required motion of pre-service.
The first beat: complete after exposure and pretreatment process at silicon wafer stage, as Fig. 6, shown in 7, Y-direction the second linear motion unit 22 is separated with the second silicon wafer stage 12, and simultaneously respectively to base station border movement, Y-direction the 3rd linear motion unit 23 composition composite guideway that finally aligns with Y-direction the 4th linear motion unit 24 wherein, silicon wafer stage 11 in pre-service station is under the drive of Y-direction the first linear motion guide rail 21 simultaneously, beginning is to base station border movement, and finally all reach both allocations of base station edge, align with Y-direction the second linear motion unit 22, form a composite guideway, in whole beat process, silicon wafer stage motion is without pausing,
The second beat: as shown in Figure 8, silicon wafer stage 11,12 move along two Y-direction composite guidewaies respectively, simultaneously, with the contactless linear motor rotor slide block of silicon wafer stage 20b2 to base station border movement, for silicon wafer stage reserves enough spaces, 20c1 moves to base station centre position with the contactless linear motor rotor slide block of silicon wafer stage, for next step, grabbing card silicon wafer stage prepares, final first and second silicon wafer stage 11,12 reaches both allocations, passes through first and second lintel type and pass through Y-direction linear motion unit 41 in process, 42, and cross over composite guideway docking site;
The 3rd beat: as shown in Figure 9, first and second silicon wafer stage 11,12 respectively under the drive of Y-direction second, four linear motion units 22,24, along directions X, moves, simultaneously, Y-direction the 3rd linear motion unit 23 is done the motion with silicon wafer stage 11 relative directions, with the contactless linear motor rotor slide block of silicon wafer stage 20c1 simultaneously to silicon wafer stage motion, until near and hold, in whole process, silicon wafer stage motion is without pausing; So far, exchange process completes, and exposure and pretreatment process start;
As shown in figure 10, in revision for execution scheme 1, be placed in the structure of two first and second linear motion units 41,42 of lintel type in base station centre position, obtain embodiment 2.In embodiment 1, first and second linear motion unit 41,42nd of lintel type, consist of, and in embodiment 2, first and second linear motion unit 41,42 of new lintel type does not comprise structure of the linear motion actuator, and be only air-float guide rail linear electric motors and air-float guide rail.Compare with embodiment 1, in embodiment 2, directions X drive from two drive to become singly drive because the silicon wafer stage in exposure station still takes in Y-direction that two guide rails are two drives mode, so angular rigidity is large, resisting torque etc., advantage still exists; Because Y-direction adopts singly drives, to a certain extent, can reduce guide rail two ends driving force problem of inconsistency simultaneously; And, because lintel type guide rail has reduced structure of the linear motion actuator, therefore Z direction size also reduces accordingly, be conducive to the utilization of workpiece table system design space; In addition on the one hand, because of directions X from two drive to become singly drive, therefore to singly driving also corresponding increase of motor requirement, as size becomes large etc.
Claims (2)
1. lintel type list/bis-guide rail pair drives step-scan double-workpiece-table switching methods, it is characterized in that: the three beat steps of the method are: before double-workpiece-table exchange, the first silicon wafer stage in pre-service station is held by Y-direction the first linear motion unit, and in exposure station the second silicon wafer stage by second and third linear motion unit of Y-direction, jointly held; After exposure motion finishes, the first beat: Y-direction the second linear motion unit is separated with the second silicon wafer stage, and simultaneously respectively to base station border movement, Y-direction the 3rd linear motion unit composition composite guideway that finally aligns with Y-direction the 4th linear motion unit wherein, the first silicon wafer stage in pre-service station is under the drive of Y-direction the first linear motion guide rail simultaneously, beginning is to base station border movement, align with Y-direction the second linear motion unit, form a composite guideway, in whole beat process, silicon wafer stage motion is without pausing; The second beat: first and second silicon wafer stage moves along two Y-direction composite guidewaies respectively, simultaneously, with the linear motor rotor slide block of contactless Y-direction the second linear motion unit of silicon wafer stage to base station border movement, for silicon wafer stage reserves enough spaces, move to base station centre position with the linear motor rotor slide block of the contactless Y-direction of silicon wafer stage the 3rd linear motion unit, for next step, grabbing card silicon wafer stage prepares, in first and second silicon chip motion, pass through first and second lintel type and pass through Y-direction linear motion unit, and cross over composite guideway docking site; The 3rd beat: first and second silicon wafer stage is respectively under the drive of Y-direction second, four linear motion units, along directions X, move, simultaneously, Y-direction the 3rd linear motion unit is done the motion with the first silicon wafer stage relative direction, to silicon wafer stage, move with the linear motor rotor slide block of the contactless Y-direction of silicon wafer stage the 3rd linear motion unit simultaneously, until near and hold, in whole process, silicon wafer stage motion is without pausing; So far, exchange process completes, and exposure and pretreatment process start; In exposure with after pretreatment process finishes, silicon wafer stage is done and the motion of above-mentioned motion process contrary, thereby realizes continuous zapping process.
2. lintel type list/bis-guide rail pair drives step-scan double-workpiece-table switches, it is characterized in that: this device contains the second silicon wafer stage (12) that is arranged on the first silicon wafer stage (11) that runs on pre-service station (6) on same base station (1) and runs on exposure station (7), in (1) four edge of described base station, 4 Y-directions first are set respectively, second, the 3rd, the 4th linear motion unit (21, 22, 23, 24), on the symmetrical position, both sides of base station (1), 1 directions X first is respectively set, the second linear motion unit (31, 32), in base station (1) middle part, be provided with 2 bottom surfaces along directions X and exceed first, the second silicon wafer stage (11, 12) lintel type first of workplace, the second linear motion unit (41, 42), first, second described silicon wafer stage (11,12) 4 Y-directions, first, second, third, fourth linear motion unit (21 on base station (1), 22,23,24) with first, second linear motion unit (31 of directions X, 32) in the plane surrounding, do X-Y motion, and jointly form air-bearing and spigot surface with base station (1) surface, described 4 Y-directions, first, second, third, fourth linear motion unit (21,22,23,24) by first, second linear motion unit (31 of directions X, 32) can realize along directions X and moving, and jointly realize the directions X of silicon wafer stage or the motion of Y-direction by the linear motor rotor (20b) of Y-direction linear motion unit of himself, 4 Y-direction first, second, third, fourth linear motion units (21,22,23,24) include Y-direction linear electric motors and Y-direction air-float guide rail, wherein the linear motor stator electric of Y-direction linear motion guide rail (20a) is permanent magnetism group structure, the linear motor rotor (20b) of Y-direction linear motion unit slide block is loop construction, and Y-direction air-float guide rail is arranged between the linear motor stator electric (20a) of Y-direction linear motion unit guide rail and the linear motor rotor (20b) of Y-direction linear motion unit slide block, each linear electric motors comprises a stationary part, one or two mover part, permanent magnetism group arrangement is horizontal or vertical, 2 first, second linear motion units (31 of directions X, 32) include linear electric motors and air-bearing, wherein the linear motor stator electric of directions X linear motion unit guide rail (30a) is permanent magnetism group structure, linear motor rotor (the 30b of directions X linear motion unit slide block, 30c) be loop construction, air-bearing is arranged between the linear motor stator electric (30a) of directions X linear motion unit guide rail and the linear motor rotor (30b, 30c) of directions X linear motion unit slide block, each linear electric motors comprises a stator and two movers, permanent magnetism group arrangement is horizontal or vertical, 2 first, second linear motion units (41 of lintel type, 42) include linear electric motors and air-bearing, linear motor stator electric (the 40a of linear motion unit guide rail wherein, 40b) be permanent magnetism group structure, linear motor rotor (the 40c of linear motion unit slide block, 40d, 40e, 40f) be loop construction, air-bearing is arranged on the linear motor stator electric (40a, 40b) of linear motion unit guide rail and linear motor rotor (40c, the 40d of linear motion unit slide block, 40e, 40f) between, each linear electric motors comprises a stator and two movers, permanent magnetism group arrangement is for being horizontal or vertical, one of the linear motor rotor (30b, 30c) of the linear motor stator electric of Y-direction linear motion guide rail (20a) one end and directions X linear motion unit slide block rigid attachment, one of the linear motor rotor of the linear motor stator electric of Y-direction linear motion guide rail (20a) other end and linear motion unit slide block (40c, 40d, 40e, 40f) rigid attachment, the linear motor stator electric (40a, 40b) of the linear motor stator electric (30a) of directions X linear motion unit guide rail and the guide rail of linear motion unit all with base station (1) rigid attachment, mechanism for card is respectively grabbed in described first, second silicon wafer stage (11,12) directions X two sides, described 4 Y-direction first, second, third, fourth linear motion units (21,22,23,24) all contain can control step up or unclamp grab mechanism for card, coordinate with the mechanism for card of grabbing of first, second silicon wafer stage (11,12) side, the described mechanism for card of grabbing is electromagnetism adsorption structure or by the mechanical structure of grabbing card slide block (20b1,20b2,20c1,20c2) and forming.
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| CN107664927A (en) * | 2017-11-28 | 2018-02-06 | 苏州源卓光电科技有限公司 | A kind of novel sports platform architecture and workflow based on mask-free photolithography system |
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| CN101770181A (en) * | 2010-03-05 | 2010-07-07 | 上海微电子装备有限公司 | Double-workpiece-table system of lithography machine |
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