CN102391529A - Preparation method of silicone resin type organic/inorganic hybrid material for packaging - Google Patents
Preparation method of silicone resin type organic/inorganic hybrid material for packaging Download PDFInfo
- Publication number
- CN102391529A CN102391529A CN2011101964068A CN201110196406A CN102391529A CN 102391529 A CN102391529 A CN 102391529A CN 2011101964068 A CN2011101964068 A CN 2011101964068A CN 201110196406 A CN201110196406 A CN 201110196406A CN 102391529 A CN102391529 A CN 102391529A
- Authority
- CN
- China
- Prior art keywords
- acid
- consumption
- mixture
- zinc
- organosilane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 47
- 229920002050 silicone resin Polymers 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000006068 polycondensation reaction Methods 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 71
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 62
- -1 zirconium iso-propoxides Chemical class 0.000 claims description 56
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 54
- 150000001282 organosilanes Chemical class 0.000 claims description 37
- 238000003756 stirring Methods 0.000 claims description 37
- 239000000178 monomer Substances 0.000 claims description 36
- 239000001257 hydrogen Substances 0.000 claims description 35
- 229910052739 hydrogen Inorganic materials 0.000 claims description 35
- 229910052710 silicon Inorganic materials 0.000 claims description 33
- 239000010703 silicon Substances 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 29
- 229910052697 platinum Inorganic materials 0.000 claims description 29
- 239000002253 acid Substances 0.000 claims description 28
- 239000008367 deionised water Substances 0.000 claims description 25
- 230000007935 neutral effect Effects 0.000 claims description 25
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 24
- 229910021641 deionized water Inorganic materials 0.000 claims description 24
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 21
- 229910052726 zirconium Inorganic materials 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 19
- 239000003054 catalyst Substances 0.000 claims description 19
- 229920002545 silicone oil Polymers 0.000 claims description 19
- 229910052725 zinc Inorganic materials 0.000 claims description 19
- 239000011701 zinc Substances 0.000 claims description 19
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 18
- 229920002554 vinyl polymer Polymers 0.000 claims description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 17
- 239000003153 chemical reaction reagent Substances 0.000 claims description 17
- 229920001296 polysiloxane Polymers 0.000 claims description 17
- OEOIWYCWCDBOPA-UHFFFAOYSA-N 6-methyl-heptanoic acid Chemical compound CC(C)CCCCC(O)=O OEOIWYCWCDBOPA-UHFFFAOYSA-N 0.000 claims description 15
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 15
- 239000003921 oil Substances 0.000 claims description 15
- 239000000047 product Substances 0.000 claims description 15
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 14
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 13
- 229910000765 intermetallic Inorganic materials 0.000 claims description 13
- 229910052719 titanium Inorganic materials 0.000 claims description 13
- 239000010936 titanium Substances 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- 239000005977 Ethylene Substances 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 125000004429 atom Chemical group 0.000 claims description 10
- 239000002512 suppressor factor Substances 0.000 claims description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 10
- 150000002431 hydrogen Chemical class 0.000 claims description 9
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 claims description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 8
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 8
- 238000005987 sulfurization reaction Methods 0.000 claims description 8
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 7
- 230000002378 acidificating effect Effects 0.000 claims description 7
- 239000003729 cation exchange resin Substances 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 7
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 7
- XHSOUGYKMNMDQP-UHFFFAOYSA-N 3,3,4-trimethylpent-1-yn-1-ol Chemical compound CC(C(C#CO)(C)C)C XHSOUGYKMNMDQP-UHFFFAOYSA-N 0.000 claims description 6
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 claims description 6
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 claims description 6
- OHMBHFSEKCCCBW-UHFFFAOYSA-N hexane-2,5-diol Chemical compound CC(O)CCC(C)O OHMBHFSEKCCCBW-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000376 reactant Substances 0.000 claims description 6
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 6
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 235000010290 biphenyl Nutrition 0.000 claims description 4
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 claims description 4
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 4
- PQVSTLUFSYVLTO-UHFFFAOYSA-N ethyl n-ethoxycarbonylcarbamate Chemical compound CCOC(=O)NC(=O)OCC PQVSTLUFSYVLTO-UHFFFAOYSA-N 0.000 claims description 4
- 238000009396 hybridization Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 4
- 239000010977 jade Substances 0.000 claims description 4
- GLXDVVHUTZTUQK-UHFFFAOYSA-M lithium hydroxide monohydrate Substances [Li+].O.[OH-] GLXDVVHUTZTUQK-UHFFFAOYSA-M 0.000 claims description 4
- 229940040692 lithium hydroxide monohydrate Drugs 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 4
- 230000035484 reaction time Effects 0.000 claims description 4
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 claims description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 claims description 4
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- DCSOPUDOZMRWRP-UHFFFAOYSA-N Cc1cc(C)cc([SiH2]Cl)c1 Chemical compound Cc1cc(C)cc([SiH2]Cl)c1 DCSOPUDOZMRWRP-UHFFFAOYSA-N 0.000 claims description 3
- OGPNXGJLKXGASM-UHFFFAOYSA-N [Si].CC=C Chemical group [Si].CC=C OGPNXGJLKXGASM-UHFFFAOYSA-N 0.000 claims description 3
- YFCGDEUVHLPRCZ-UHFFFAOYSA-N [dimethyl(trimethylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C YFCGDEUVHLPRCZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000003963 dichloro group Chemical group Cl* 0.000 claims description 3
- JEWCZPTVOYXPGG-UHFFFAOYSA-N ethenyl-ethoxy-dimethylsilane Chemical compound CCO[Si](C)(C)C=C JEWCZPTVOYXPGG-UHFFFAOYSA-N 0.000 claims description 3
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 claims description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 3
- 239000013557 residual solvent Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 claims description 3
- VNTDZUDTQCZFKN-UHFFFAOYSA-L zinc 2,2-dimethyloctanoate Chemical compound [Zn++].CCCCCCC(C)(C)C([O-])=O.CCCCCCC(C)(C)C([O-])=O VNTDZUDTQCZFKN-UHFFFAOYSA-L 0.000 claims description 3
- 239000011592 zinc chloride Substances 0.000 claims description 3
- 235000005074 zinc chloride Nutrition 0.000 claims description 3
- AUEJBKCWXPYRGZ-UHFFFAOYSA-N 1,1'-biphenyl diethoxysilane Chemical compound C(C)O[SiH2]OCC.C1(=CC=CC=C1)C1=CC=CC=C1 AUEJBKCWXPYRGZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- CRXNJSWBRJXDTE-UHFFFAOYSA-N Cl[SiH2]Cl.CC=C Chemical compound Cl[SiH2]Cl.CC=C CRXNJSWBRJXDTE-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- RBIILJCATVGHHI-UHFFFAOYSA-N [diethoxy(phenyl)silyl]methanamine Chemical compound NC[Si](OCC)(OCC)C1=CC=CC=C1 RBIILJCATVGHHI-UHFFFAOYSA-N 0.000 claims description 2
- YBHBEZSZXFLQMW-UHFFFAOYSA-N [dimethoxy(phenyl)silyl]methanamine Chemical compound CO[Si](CN)(OC)C1=CC=CC=C1 YBHBEZSZXFLQMW-UHFFFAOYSA-N 0.000 claims description 2
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 claims description 2
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 claims description 2
- GNEPOXWQWFSSOU-UHFFFAOYSA-N dichloro-methyl-phenylsilane Chemical compound C[Si](Cl)(Cl)C1=CC=CC=C1 GNEPOXWQWFSSOU-UHFFFAOYSA-N 0.000 claims description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims description 2
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 claims description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 238000001879 gelation Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims description 2
- 239000000113 methacrylic resin Substances 0.000 claims description 2
- NLUDDCJZODZYPA-UHFFFAOYSA-N methanol;zinc Chemical compound [Zn].OC.OC NLUDDCJZODZYPA-UHFFFAOYSA-N 0.000 claims description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 2
- XAKYZBMFCZISAU-UHFFFAOYSA-N platinum;triphenylphosphane Chemical compound [Pt].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 XAKYZBMFCZISAU-UHFFFAOYSA-N 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 239000006228 supernatant Substances 0.000 claims description 2
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 claims description 2
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 claims description 2
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 2
- XXZNHVPIQYYRCG-UHFFFAOYSA-N trihydroxy(propoxy)silane Chemical compound CCCO[Si](O)(O)O XXZNHVPIQYYRCG-UHFFFAOYSA-N 0.000 claims description 2
- 239000005051 trimethylchlorosilane Substances 0.000 claims description 2
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 abstract description 7
- 238000004073 vulcanization Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 239000005022 packaging material Substances 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 16
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 12
- 239000012141 concentrate Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 3
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- VXQHWTFBUHPLNU-UHFFFAOYSA-N CCC[Ti] Chemical compound CCC[Ti] VXQHWTFBUHPLNU-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Landscapes
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110196406 CN102391529B (en) | 2011-07-14 | 2011-07-14 | Preparation method of silicone resin type organic/inorganic hybrid material for packaging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110196406 CN102391529B (en) | 2011-07-14 | 2011-07-14 | Preparation method of silicone resin type organic/inorganic hybrid material for packaging |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102391529A true CN102391529A (en) | 2012-03-28 |
CN102391529B CN102391529B (en) | 2013-08-28 |
Family
ID=45858925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201110196406 Active CN102391529B (en) | 2011-07-14 | 2011-07-14 | Preparation method of silicone resin type organic/inorganic hybrid material for packaging |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102391529B (en) |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102675648A (en) * | 2012-04-24 | 2012-09-19 | 中国科学院宁波材料技术与工程研究所 | High-temperature resistant zirconium silicon resin containing zirconium in frame structure and preparation method thereof |
CN102952271A (en) * | 2012-06-07 | 2013-03-06 | 安徽众星新材料有限公司 | High-refraction-index silicon resin as well as preparation method and application thereof |
CN103012798A (en) * | 2012-11-23 | 2013-04-03 | 广东聚合有机硅材料有限公司 | Preparation method of methyl phenyl vinyl silicone resin |
CN103012797A (en) * | 2012-11-23 | 2013-04-03 | 广东聚合有机硅材料有限公司 | Preparation method of methyl phenyl vinyl silicone oil |
CN103131189A (en) * | 2013-01-05 | 2013-06-05 | 中科院广州化学有限公司 | Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof |
CN103146304A (en) * | 2013-03-20 | 2013-06-12 | 苏州太湖电工新材料股份有限公司 | Solventless insulating paint |
CN103265703A (en) * | 2013-05-06 | 2013-08-28 | 北京化工大学 | High refractive index titanium hybrid silicon resin and preparation method thereof |
CN103408763A (en) * | 2013-04-08 | 2013-11-27 | 北京化工大学 | Method for preparing silicon-titanium polymers |
CN103540289A (en) * | 2013-05-23 | 2014-01-29 | 杭州师范大学 | Preparation method and application of organic silicon resin adhesive |
CN103805129A (en) * | 2013-09-27 | 2014-05-21 | 北京化工大学常州先进材料研究院 | Titanium-containing organic silicon adhesive with high refractive index |
CN103834012A (en) * | 2014-02-25 | 2014-06-04 | 江苏三木化工股份有限公司 | Organic silicon resin for large-scale integrated circuit and preparation method of organic silicon resin |
CN104371641A (en) * | 2014-11-12 | 2015-02-25 | 北京化工大学常州先进材料研究院 | Bi-component organic silicon resin adhesive and preparation method thereof |
CN104531054A (en) * | 2014-12-19 | 2015-04-22 | 苏州佳亿达电器有限公司 | Preparation method of high-performance LED encapsulation adhesive |
CN105399958A (en) * | 2015-11-25 | 2016-03-16 | 烟台德邦先进硅材料有限公司 | Hybrid organic silicon resin with framework structure containing Zr or containing Zr and Ti simultaneously and preparation method of organic silicon resin |
CN105399956A (en) * | 2015-11-25 | 2016-03-16 | 烟台德邦先进硅材料有限公司 | High-temperature-resistant high-refractive-index Ti-containing organic silicon resin and preparation method thereof |
CN108084367A (en) * | 2017-12-29 | 2018-05-29 | 安徽科邦树脂科技有限公司 | A kind of antibiotic property acrylic resin |
CN108517037A (en) * | 2018-04-13 | 2018-09-11 | 江苏芃湃新材料科技有限公司 | High heat conduction organosilicon composite material and preparation method |
CN109232894A (en) * | 2018-09-21 | 2019-01-18 | 广州天宸高新材料有限公司 | Methoxy group methyl phenyl silicone resin, organosilicon coating glue and preparation method and application |
CN109403063A (en) * | 2018-11-01 | 2019-03-01 | 江苏济通复合材料有限公司 | A kind of fire resistant gear cigarette cloth and preparation method thereof |
CN110698861A (en) * | 2019-11-15 | 2020-01-17 | 江南大学 | Preparation method of organic-inorganic nano hybrid high-refractive-index optical material |
CN111040167A (en) * | 2019-11-29 | 2020-04-21 | 湖北新四海化工股份有限公司 | Polymer for cross-linking and curing silicone rubber and preparation method thereof |
CN113637450A (en) * | 2020-06-10 | 2021-11-12 | 湖北平安电工科技股份公司 | Hard mica plate adhesive and preparation method thereof |
CN115244109A (en) * | 2020-03-13 | 2022-10-25 | 东丽精细化工株式会社 | Method for producing siloxane polymer |
CN115636939A (en) * | 2022-11-14 | 2023-01-24 | 广东粤港澳大湾区黄埔材料研究院 | Preparation method of sulfydryl-containing organic silicon oligomer |
WO2023054700A1 (en) * | 2021-10-01 | 2023-04-06 | 株式会社カネカ | Curable composition |
WO2023054701A1 (en) * | 2021-10-01 | 2023-04-06 | 株式会社カネカ | Curable composition |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109403062B (en) * | 2018-11-01 | 2021-04-20 | 江苏济通复合材料有限公司 | High-silicon fireproof cloth and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101343365A (en) * | 2008-08-28 | 2009-01-14 | 杭州师范大学 | Preparation method for methyl phenyl vinyl polysiloxane for packaging LED |
CN101457022A (en) * | 2007-12-12 | 2009-06-17 | 深圳大学 | Production method of high refractive index nano modified organosilicon encapsulating material |
US20100213502A1 (en) * | 2009-02-24 | 2010-08-26 | Tsutomu Kashiwagi | Optical semiconductor device encapsulated with silicone resin |
-
2011
- 2011-07-14 CN CN 201110196406 patent/CN102391529B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101457022A (en) * | 2007-12-12 | 2009-06-17 | 深圳大学 | Production method of high refractive index nano modified organosilicon encapsulating material |
CN101343365A (en) * | 2008-08-28 | 2009-01-14 | 杭州师范大学 | Preparation method for methyl phenyl vinyl polysiloxane for packaging LED |
US20100213502A1 (en) * | 2009-02-24 | 2010-08-26 | Tsutomu Kashiwagi | Optical semiconductor device encapsulated with silicone resin |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102675648A (en) * | 2012-04-24 | 2012-09-19 | 中国科学院宁波材料技术与工程研究所 | High-temperature resistant zirconium silicon resin containing zirconium in frame structure and preparation method thereof |
CN102952271A (en) * | 2012-06-07 | 2013-03-06 | 安徽众星新材料有限公司 | High-refraction-index silicon resin as well as preparation method and application thereof |
CN103012798B (en) * | 2012-11-23 | 2015-01-07 | 广东聚合有机硅材料有限公司 | Preparation method of methyl phenyl vinyl silicone resin |
CN103012798A (en) * | 2012-11-23 | 2013-04-03 | 广东聚合有机硅材料有限公司 | Preparation method of methyl phenyl vinyl silicone resin |
CN103012797A (en) * | 2012-11-23 | 2013-04-03 | 广东聚合有机硅材料有限公司 | Preparation method of methyl phenyl vinyl silicone oil |
CN103012797B (en) * | 2012-11-23 | 2015-03-11 | 广东聚合有机硅材料有限公司 | Preparation method of methyl phenyl vinyl silicone oil |
CN103131189A (en) * | 2013-01-05 | 2013-06-05 | 中科院广州化学有限公司 | Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof |
CN103146304A (en) * | 2013-03-20 | 2013-06-12 | 苏州太湖电工新材料股份有限公司 | Solventless insulating paint |
CN103146304B (en) * | 2013-03-20 | 2015-06-03 | 苏州太湖电工新材料股份有限公司 | Solventless insulating paint |
CN103408763A (en) * | 2013-04-08 | 2013-11-27 | 北京化工大学 | Method for preparing silicon-titanium polymers |
CN103265703A (en) * | 2013-05-06 | 2013-08-28 | 北京化工大学 | High refractive index titanium hybrid silicon resin and preparation method thereof |
CN103540289A (en) * | 2013-05-23 | 2014-01-29 | 杭州师范大学 | Preparation method and application of organic silicon resin adhesive |
CN103805129A (en) * | 2013-09-27 | 2014-05-21 | 北京化工大学常州先进材料研究院 | Titanium-containing organic silicon adhesive with high refractive index |
CN103834012A (en) * | 2014-02-25 | 2014-06-04 | 江苏三木化工股份有限公司 | Organic silicon resin for large-scale integrated circuit and preparation method of organic silicon resin |
CN104371641A (en) * | 2014-11-12 | 2015-02-25 | 北京化工大学常州先进材料研究院 | Bi-component organic silicon resin adhesive and preparation method thereof |
CN104531054A (en) * | 2014-12-19 | 2015-04-22 | 苏州佳亿达电器有限公司 | Preparation method of high-performance LED encapsulation adhesive |
CN104531054B (en) * | 2014-12-19 | 2016-06-22 | 苏州佳亿达电器有限公司 | A kind of preparation method of high performance lED encapsulation glue |
CN105399958A (en) * | 2015-11-25 | 2016-03-16 | 烟台德邦先进硅材料有限公司 | Hybrid organic silicon resin with framework structure containing Zr or containing Zr and Ti simultaneously and preparation method of organic silicon resin |
CN105399956A (en) * | 2015-11-25 | 2016-03-16 | 烟台德邦先进硅材料有限公司 | High-temperature-resistant high-refractive-index Ti-containing organic silicon resin and preparation method thereof |
CN108084367A (en) * | 2017-12-29 | 2018-05-29 | 安徽科邦树脂科技有限公司 | A kind of antibiotic property acrylic resin |
CN108517037A (en) * | 2018-04-13 | 2018-09-11 | 江苏芃湃新材料科技有限公司 | High heat conduction organosilicon composite material and preparation method |
CN109232894A (en) * | 2018-09-21 | 2019-01-18 | 广州天宸高新材料有限公司 | Methoxy group methyl phenyl silicone resin, organosilicon coating glue and preparation method and application |
CN109403063B (en) * | 2018-11-01 | 2021-04-20 | 江苏济通复合材料有限公司 | High-temperature-resistant fireproof smoke-blocking cloth and preparation method thereof |
CN109403063A (en) * | 2018-11-01 | 2019-03-01 | 江苏济通复合材料有限公司 | A kind of fire resistant gear cigarette cloth and preparation method thereof |
CN110698861A (en) * | 2019-11-15 | 2020-01-17 | 江南大学 | Preparation method of organic-inorganic nano hybrid high-refractive-index optical material |
CN111040167A (en) * | 2019-11-29 | 2020-04-21 | 湖北新四海化工股份有限公司 | Polymer for cross-linking and curing silicone rubber and preparation method thereof |
CN115244109A (en) * | 2020-03-13 | 2022-10-25 | 东丽精细化工株式会社 | Method for producing siloxane polymer |
CN115244109B (en) * | 2020-03-13 | 2023-07-07 | 东丽精细化工株式会社 | Process for producing siloxane polymer |
CN113637450A (en) * | 2020-06-10 | 2021-11-12 | 湖北平安电工科技股份公司 | Hard mica plate adhesive and preparation method thereof |
WO2023054700A1 (en) * | 2021-10-01 | 2023-04-06 | 株式会社カネカ | Curable composition |
WO2023054701A1 (en) * | 2021-10-01 | 2023-04-06 | 株式会社カネカ | Curable composition |
CN115636939A (en) * | 2022-11-14 | 2023-01-24 | 广东粤港澳大湾区黄埔材料研究院 | Preparation method of sulfydryl-containing organic silicon oligomer |
Also Published As
Publication number | Publication date |
---|---|
CN102391529B (en) | 2013-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102391529B (en) | Preparation method of silicone resin type organic/inorganic hybrid material for packaging | |
CN102181159B (en) | Polysilsesquioxane reinforced light emitting diode (LED) encapsulation organic silicon rubber and preparation method thereof | |
CN101880396B (en) | Preparation method of organic silicon rubber for encapsulating LED being convenient for vacuum defoamation | |
CN101215381B (en) | Method for preparing methylphenyl hydrogen-containing silicone oil | |
CN103131189B (en) | Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof | |
CN101717584B (en) | Organic silica gel packaging material of large-power LED and preparation method thereof | |
CN101935455B (en) | Organosilicon material for packaging LED and preparation method thereof | |
CN101475689B (en) | Preparation of methyl phenyl vinyl silicon resin | |
CN103360603B (en) | A kind of LED phenyl vinyl polysiloxane and preparation method thereof | |
CN102993753B (en) | A kind of composite hybridization organosilicon LED encapsulation material and its preparation method and application | |
CN102898651B (en) | Preparation method of vinylphenyl silicon resin for LED (light-emitting diode) packaging | |
CN102977554A (en) | Epoxy/organosilicon co-curing composite material for LED packaging and preparation method | |
CN101343365A (en) | Preparation method for methyl phenyl vinyl polysiloxane for packaging LED | |
CN103408947B (en) | A kind of can the high-performance LED encapsulation material and preparation method thereof of dual cure | |
CN102898649B (en) | Refractive index-adjustable MDT silicone resin and preparation method thereof | |
CN104262970A (en) | Silicone Composition For Producing Transparent Silicone Materials And Optical Devices | |
CN105802532A (en) | Silicon boron tackifier, preparation method thereof and application thereof in double-component LED packaging gel | |
CN101974228B (en) | Organic silica-gel material for encapsulating luminous element and preparation method thereof | |
CN103249762A (en) | Addition-curable metallosiloxane compound | |
CN102532900B (en) | Organosilicon lens material for power type light-emitting diode (LED) packaging | |
CN102190888B (en) | Composition for thermosetting silicone resin | |
CN101665572B (en) | Organic silicon resin for encapsulating LED and preparation method thereof | |
CN102888001A (en) | Vinylphenyl silicon resin | |
CN110229339B (en) | Phenyl vinyl siloxane resin, high-refractive-index LED packaging silicon resin composition and preparation method thereof | |
CN110256676B (en) | Phenyl hydrogen-containing siloxane resin, high-refractive-index LED packaging silicon resin composition and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200812 Address after: 065800 pengerwan Industrial Zone, Zhaogezhuang Town, Wenan County, Langfang City, Hebei Province Patentee after: Wen'an Huawei Chemical Co., Ltd Address before: Hangzhou City, Zhejiang province 310036 Xuelin Xiasha Economic Development Zone Road No. 16 Patentee before: Hangzhou Normal University |
|
TR01 | Transfer of patent right | ||
CB03 | Change of inventor or designer information |
Inventor after: Laiguoqiao Inventor after: Fan Ligai Inventor after: Yang Xiongfa Inventor after: Cao Jian Inventor after: Shao Qian Inventor after: Yang Linlin Inventor after: Hua Xilin Inventor after: Jiang Jianxiong Inventor after: Luo Mengxian Inventor after: Xu Jinchang Inventor before: Laiguoqiao Inventor before: Yang Xiongfa Inventor before: Cao Jian Inventor before: Shao Qian Inventor before: Yang Linlin Inventor before: Hua Xilin Inventor before: Jiang Jianxiong Inventor before: Luo Mengxian |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211223 Address after: 065800 Xinqiao Economic Development Zone, Wen'an County, Langfang City, Hebei Province Patentee after: Hebei thick and rich organosilicon products Limited by Share Ltd. Address before: 065800 pengerwan Industrial Zone, Zhaogezhuang Town, Wen'an County, Langfang City, Hebei Province Patentee before: Wen'an Huawei Chemical Co., Ltd |
|
TR01 | Transfer of patent right |