CN102385122A - Optical transmission module with optical wave guide structure - Google Patents

Optical transmission module with optical wave guide structure Download PDF

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Publication number
CN102385122A
CN102385122A CN2010102716658A CN201010271665A CN102385122A CN 102385122 A CN102385122 A CN 102385122A CN 2010102716658 A CN2010102716658 A CN 2010102716658A CN 201010271665 A CN201010271665 A CN 201010271665A CN 102385122 A CN102385122 A CN 102385122A
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China
Prior art keywords
channel structure
optical
delivery module
semiconductor substrate
reflecting surface
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CN2010102716658A
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Chinese (zh)
Inventor
伍茂仁
蓝孝晋
李韵芝
家齐
萧旭良
陈进达
沈帛宽
卢冠甫
张彦中
常振宇
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National Central University
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National Central University
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Priority to CN2010102716658A priority Critical patent/CN102385122A/en
Publication of CN102385122A publication Critical patent/CN102385122A/en
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Abstract

The invention provides an optical transmission module, which is applied to a printed circuit board. When applied to an emitting end, the module comprises a semiconductor substrate, a channel structure, a reflection surface, a thin film, a light source unit and an optical wave guide structure. The channel structure is formed in the semiconductor substrate, and the reflection surface is formed above one side of the channel structure. The optical wave guide structure and the thin film are formed on the channel structure, the light source unit is arranged on the semiconductor substrate corresponding to the reflection surface so as to convert electric signals into optical signals to be emitted into the optical wave guide structure and transmitted through reflection of the reflection surface. When applied to a receiving end, the module is provided with a similar structure, and the difference is that an optical detection unit converts the optical signals into the electric signals for transmission.

Description

Optical delivery module with optical waveguide structure
Technical field
The present invention is a kind of optical delivery module with optical waveguide structure; Especially refer to utilize the total reflection signal transmission technology of optical waveguide structure, to be applied to the conversion of electric signal or light signal and transmission and corresponding emission or a kind of optical delivery module on the reception technique.
Background technology
The tradition with metal material as circuit to be provided at the application of getting in touch with between transmission of electric signals or unit, quite general in prior art.And in the high-effect electronic system of digital communication, not only the setting of processor more increases, and the speed of signal Processing is also more and more faster, so the transmission quality of signal or information and speed also more show important.Yet it is not enough that traditional metallic circuit connects the existing institute of its transmission performances of design.
Optics connects and can receive the influence of transmission line material character less, can reach high frequency tolerance and laser propagation effect fast, just is important technical development so replace the electric transmission mode with the optical delivery mode.Under the technology of light emitting diode (LED) and semiconductor laser, be that media comes the mode of transmission signals just to develop with light; It mainly is to accomplish conversion, emission and reception between electricity, light signal or light, electric signal by the running of optocoupler components (Optical Coupler).And optocoupler components mainly comprises the signal that photoemissive transmitter or light source cell, the receiver that light-receiving is provided or optical detecting unit is provided and will will launch or receive and makes the driver or the amplifier that further drive or amplify.
Be used as the basic design in opto-electronic conversion and the electric signal transmission with optocoupler components, in present various circuit structures, electronic installation or related system, obtained using very widely.In the patent of No. the 7306378th, United States Patent (USP), disclose a kind of optocoupler components, seen also Fig. 1 a, just be diagrammatic cross-section according to the coupling device 101 that its patent content disclosed; As shown in the drawing, in semiconductor substrate 103, have a channel structure 105, and on an end of channel structure 105, defined the reflecting surface 107 that an angle of inclination is axially arranged that has with channel structure 105; One optical fiber 109 then disposes or the corresponding other end that is assembled in this channel structure 105 of arranging.In addition, 111 pairs of optical units should channel structure 105, and position that should reflecting surface 107 is arranged on its semiconductor substrate 103.Under the structure shown in Fig. 1 a, described optical unit 111 can be the light source that light signal sends or can be the receiver that light signal receives, and then makes light pass through reflecting surface 107 to produce non-coplanar turnover and accomplish and this optical fiber 109 coupling on optical delivery.
Hold the above, to the part of signal transmission, semiconductor substrate 103 utilizes soldering tin block 123 to be arranged on the printed circuit board (PCB) 115 and with a link 117 of its rear end and accomplishes electrical connections; And a circuit unit 125 is arranged in semiconductor substrate 127, and is arranged on its semiconductor substrate 103 with pin 131; This circuit unit 125 can be done to drive or control under the electrical connection situation to this optical unit 111, and then converts the electric signal 119 of this link 117 to light signal 113 through this optical unit 111, and utilizes these reflecting surface 107 reflection backs by these optical fiber 109 outputs; The light signal 113 that maybe this optical fiber 109 is transmitted utilizes this optical unit 111 to do to detect after by these reflecting surface 107 reflections to receive converting electric signal 119 to, and is exported by this link 117 through described electrical connection situation.And correlation unit is encapsulated by the capping 133 on the semiconductor substrate 103, so that electrical isolation or anti-interference to be provided.
In addition; Shown in Fig. 1 a; Further can also coupling structures such as its optical fiber 109, channel structure 105, reflecting surface 107 and optical unit 111 be done the configuration of a plurality of numbers in its coupling device 101, and do corresponding combination to construct another similar or identical coupling device; Accomplishing by wherein one carrying out the signal emission, and carry out the signal transmission and the running of changing of electricity-light-electricity that signal receives by another person.Shown in Fig. 1 b, just be to construct similar or identical two coupling device 101a, 101b, through two optical fiber 109a wherein, the synoptic diagram that the connection of 109b completion entity is connected with the signal transmission.
Yet; In above-mentioned optical delivery coupling structure design; Under all less condition of the size design of correlation unit; With the assembling of described optical fiber or be implanted in this channel structure, just have suitable difficulty with inconvenience or even can produce error, and then make light signal accurately reflex in the optical fiber or in the optical unit and the influence transmission light signal is derived or imported semiconductor substrate or coupling device to transmit.In addition, described optical fiber is when assembling or implant, because that its position is gone up in design is nearer apart from optical unit, thereby makes and in the process of assembling, easily it is damaged.Moreover described optical fiber needs the assembling or the implantation of the formula that in channel structure, fixes, and makes that the optical fiber rear end of being exposed also can form the extension of outlet body and cause the inconvenience in the use outside it except plug and assembling repeatedly can't be provided.
Summary of the invention
The object of the present invention is to provide a kind of optical delivery module with optical waveguide structure; Make it utilize the technology of transmitting with the total reflection signal that combines semiconductor technology and optical waveguide structure; Thereby can accomplish the manufacturing that is applied to the conversion of electric signal or light signal and transmission and corresponding emission or the optical delivery module that receives; And assemble and plug simultaneously can also can provide easy to use the time, thereby accomplish optical signal transmission by the collocation of adapter.
The present invention is a kind of optical delivery module, be applied on the printed circuit board (PCB) setting with to the transmission of one first electric signal, this optical delivery module includes: the semiconductor substrate is arranged on this printed circuit board (PCB); One first channel structure is formed in this semiconductor substrate; One first reflecting surface is formed on first side of this first channel structure; One second channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and linking each other; One film is formed on this semiconductor substrate, this first channel structure and this second channel structure; One first light source cell is arranged on this semiconductor substrate, after receiving this first electric signal and converting one first light signal to, launch, and the position of this first light source cell is corresponding with this first reflecting surface; One first optical waveguide structure is to being formed on this film with this second channel structure by first channel structure; And a guide bracket assembly, to should semiconductor substrate and be arranged on this printed circuit board (PCB),, the assembling in the transmission connects in order to being provided; Wherein this first light signal can get in this first optical waveguide structure and through the reflection of this first reflecting surface and transmit.
Another aspect of the present invention is a kind of optical delivery module, be applied on the printed circuit board (PCB) setting with to the transmission of one first light signal, this optical delivery module includes: the semiconductor substrate is arranged on this printed circuit board (PCB); One first channel structure is formed in this semiconductor substrate; One first reflecting surface is formed on first side of this first channel structure; One second channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and linking each other; One film is formed on this semiconductor substrate, this first channel structure and this second channel structure; One first optical detecting unit is arranged on this semiconductor substrate, and the position of this first optical detecting unit is corresponding with this first reflecting surface; One first optical waveguide structure is to being formed on this film with this second channel structure by first channel structure; And a guide bracket assembly, to should semiconductor substrate and be arranged on this printed circuit board (PCB),, the assembling in the transmission connects in order to being provided; Wherein this first light signal can transmit and get in this first optical waveguide structure, transmits by this first optical detecting unit reception and after converting one first electric signal to through the reflection of this first reflecting surface.
Description of drawings
This case is by attached drawings and explanation, with can be by more deep understanding:
Fig. 1 a is the diagrammatic cross-section of coupling device 101.
Fig. 1 b accomplishes entity with coupling device 101a, 101b through optical fiber 109a, 109b to connect the synoptic diagram that is connected with the signal transmission.
Fig. 2 a is the side schematic view of optical delivery module 2 of the present invention.
Fig. 2 b is the schematic perspective view of optical delivery module 2 of the present invention.
Fig. 2 c is the synoptic diagram of optical delivery module 2 on an ora terminalis.
Fig. 3 is that optical delivery module 2 is made the synoptic diagram that assembling is connected by guide bracket assembly 26 with adapter 3.
Fig. 4 is the side schematic view of optical delivery module 4 of the present invention.
Fig. 5 a is the side schematic view of optical delivery module 5 of the present invention.
Fig. 5 b is the schematic perspective view of optical delivery module 5 of the present invention.
Fig. 6 is the schematic perspective view of optical delivery module 6 of the present invention.
Fig. 7 is the schematic perspective view of optical delivery module 7 of the present invention.
Fig. 8 a is the schematic top plan view of optical delivery module 7 ' of the present invention.
Fig. 8 b is an optical delivery module 7 of the present invention " schematic top plan view.
Fig. 9 is the schematic perspective view of optical delivery module 8 of the present invention.
[main element symbol description]
Each element that is comprised during this case is graphic is listed as follows:
Coupling device 101,101a, 101b semiconductor substrate 103,127
Channel structure 105 reflectings surface 107
Optical fiber 109,109a, 109b optical unit 111
Light signal 113 printed circuit board (PCB)s 115
Link 117 electric signal 119
Soldering tin block 123 circuit units 125
Pin 131 cappings 133
Optical delivery module 2,4,5,6,7,7 ', 7 ", 8
Adapter 3 semiconductor substrates 20,40,50,60,70,80
Printed circuit board (PCB) 21,41,51,61,81
Film 22,42,52,62,72,82 electric signal transmission units 23,43,53,63,83
Driving circuit 24,54,64a, 84 light source cell 25a, 25b, 65a, 75a, 85a
Guide bracket assembly 26,46,56,66,86 guide brackets 261,262
Change impedance amplifier circuit 44,64b optical detecting unit 45a, 65b, 75b
Light detects the monitor unit 75c difference G41a of portion, G41b
Channel structure T11, T11 ', T12, T12 ', T14, T16, T18, T21, T22, T23, T31, T32, T34, T41, T43, T51
The first side T11a, T11a ', T21a, T23a, T31a, T51a
The second side T11b, T11b ', T21b, T23b, T31b, T51b
The first end T12a, T12a ', the T22a second end T12b, T12b ', T22b
Reflecting surface M11, M11 ', M13, M21, M22, M31, M33, M41, M43, M51
Optical waveguide structure G11, G11 ', G12, G21, G31, G32, G41, G42, G51
Electric signal E1, E2, E1 ' light signal O1, O2, O1 '
Embodiment
A kind of optical delivery module or optocoupler components proposed by the invention; Comprise transmitting terminal that can carry out the conversion between electric signal and light signal and the receiving end that can carry out the conversion between light signal and electric signal, mainly be still the purpose that reaches the signal transmission with light as media.And in announcement notion of the present invention, mainly utilize semiconductor technology and optical waveguide signal transmission technology; In described transmitting terminal or receiving end, accomplish corresponding structure; Its running light, electric signal or electricity, the conversion of light signal and the global design of transmission can guaranteed under the effect of signal transmitting quality, reach relevant hardware or be configured in manufacturing, combination or use and go up convenient purpose.
Carry out enforcement explanation of the present invention with one first embodiment at present.Please consult Fig. 2 a and Fig. 2 b simultaneously, wherein Fig. 2 a is the side schematic view of an optical delivery module 2 proposed by the invention; Fig. 2 b then is its schematic perspective view.Optical delivery module 2 of the present invention can be applied to the setting on the printed circuit board (PCB) 21; And shown in Fig. 2 a, this optical delivery module 2 consists predominantly of semiconductor substrate 20, one first channel structure T11, one second channel structure T12, a film 22, one first light source cell 25a, one first optical waveguide structure G11 and a guide bracket assembly 26.Wherein, This semiconductor substrate 20 is arranged on this printed circuit board (PCB) 21; And this first channel structure T11 and this second channel structure T12 carry out etching with semiconductor technology and form in this semiconductor substrate 20, and the first end T12a of its second channel structure T12 penetrates the second side T11b of this first channel structure T11 and is connected each other.In detail; The first channel structure T11 in this example accomplishes etching with V font pattern; The second channel structure T12 then accomplishes etching with trapezoidal (like dotted line scope among Fig. 2 a and the signal of the outward appearance among Fig. 2 b); And both also can form on the space and are interconnected and are connected, and its preferable design that both are demonstrated is vertical each other.
Hold the above, its application on transmitting terminal or receiving end of optical delivery module proposed by the invention can do to implement explanation at least one light signal is launched or received; The light source cell (or optical detecting unit) and a corresponding optical waveguide structure of collocation that just on a transmission module, can be designed to at least one transmit, and described optical waveguide structure is arranged on corresponding two channel structures that are connected each other; So the first optical waveguide structure G11 correspondence in the example is arranged in the space that the first channel structure T11 and the second channel structure T12 are had.Be with; Though in Fig. 2 b, do to arrange setting and implement signal with four identical channel structure T12, T14, T16, T18; But application of the present invention also is not limited thereto, and can implement with at least one described its first channel structure of second channel structure T12 collocation T11.
And in this example, this optical delivery module 2 also includes one first reflecting surface M11 of the first side T11a top that is formed at this first channel structure T11, in order to provide reflection of light.Promptly wherein the first side T11a of this first channel structure T11 just forms after the etching of V font pattern, and can be after this film 22 is done whole formation, in its corresponding position in addition lamination or coat relevant reflecting material after and form its first reflecting surface M11; And the bottom surface of formed this first reflecting surface M11 in this example (the first side T11a that comprises the first corresponding channel structure T11) and this printed circuit board (PCB) 21 or this semiconductor substrate 20 is formed with the angle of 45 degree.In addition, the second side T11b of the opposite side of this first channel structure T11 can be miter angle with the identical bottom surface with respect to this semiconductor substrate 20 and form in same etch process; Certainly, in other enforcement design, also can design this side and can demonstrate other angles, but the first side T11a at first main reflecting surface M11 place still need be rendered as 45 degree.
45 degree at first reflecting surface M11 place are rendered as preferable enforcement design, but the angle of inclination that in other embodiment, also can do other appears, or can accomplish design with an angular range, for example can be the scope of miter angle plus-minus 10 or 15 degree.In addition, in this example, the first reflecting surface M11 the formation that film 22 is done on the whole are set earlier after, the first side T11a of the more corresponding first channel structure T11 of the first reflecting surface M11 is formed on its film 22.Perhaps; In other embodiments, also can design after the first channel structure T11 forms; Earlier in lamination on its first side T11a or coat relevant reflecting material and after forming a corresponding reflecting surface, again this film 22 is formed on described reflecting surface and the whole module top layer; And because the design relation on the angle, this design can not influence light and penetrate and shining on described reflecting surface time institute with the reflecting effect of generation.
Hold the above, in this example earlier to the collocation of the second channel structure T12 and the first channel structure T11 explain with the second channel structure T12 similarly other channel structures then can explain that work analogize according to its enforcement.Please consult Fig. 2 c simultaneously, be the synoptic diagram of this optical delivery module 2 on an ora terminalis; As shown in the drawing; This second channel structure T12 (and other channel structures T14, T16, T18) appearing on its second end T12b just demonstrates its trapezoidal style design on the whole; But on the second end T12b, then be rendered as the plane of opposed flattened, its design is in order to provide follow-up assembling and to be connected the effect that can reach preferable.In addition, shown this second channel structure T12 also accompanies the angle of 45 degree with this printed circuit board (PCB) 21 on its two side; And the appearing of this angle, thereby in other embodiments, also can be designed to the sidewall of vertical or other angles with relevant to the etching mode of its semiconductor substrate 20.The shape of described channel structure will be corresponding with follow-up optical waveguide structure formed thereon, and its optical waveguide structure can fill up or not be filled in the corresponding channel structure.
Further; The detailed design in this example that is illustrated in like this Fig. 2 a to Fig. 2 c; This semiconductor substrate 20 that is wherein adopted is the substrate of a kind of single-sided polishing Silicon Wafer (Silicon Wafer with single-side polished), and can be to its surface with the be correlated with formation of rete of semiconductor technology; Thereby after forming relevant channel structure, can on other surfaces of this first channel structure T11 and this second channel structure T12 and semiconductor substrate 20, then form this film 22.And formed this film 22 is a kind of dielectric medium rete; Silicon dioxide for example; The interference that one of its purpose of design is to avoid light signal in transmission course, to receive relevant electromagnetism or electric effect is to provide electric insulation functions; Leak in the silicon substrate of lower end with the electric signal that blocks high frequency, its purpose of design of two is to be to provide follow-up set optical waveguide to form light beam is produced the total reflection effect.
And wherein, this film 22 in this example carries out whole oxidation for to the silicon substrate behind the etch process of accomplishing relevant channel structure, and explains with the formed dielectric medium rete of the oxidation material of silicon dioxide.But in the design of other embodiments; Its film that is constituted also is not limited to oxide (oxidation); Dielectric material such as nitrogen silicide classes such as (SiNx) also can adopt, as long as can meet the design (detailed of the back literary composition) of the required refractive index condition of this case.Perhaps, except forming out this film, also can add that the mode of partial oxidation forms with metal material or part metal with the total oxygen mode.For instance, be used as above-mentioned film 22, thereby can provide follow-up set optical waveguide to form reflecting effect (being close to total reflection) light beam with metallic diaphragm; But because the mould layer of metal material constitutes the design meeting light beam is had the situation that partially absorbs in irradiation, thereby can make loss to some extent in the transmission of light beam in optical waveguide partly.
Hold the above, like the detailed design in this example that is illustrated in of this Fig. 2 a to Fig. 2 c, this printed circuit board (PCB) 21 that 2 of described optical delivery modules are applied and are provided with can provide one first electric signal E1 and do corresponding transmission by it.And this first light source cell 25a is arranged on this semiconductor substrate 20, just relatively be arranged on the film 22 that is formed on the semiconductor substrate 20, and some exposes to this first channel structure T11 top to carry out the irradiation to its first side T11a; The meaning i.e. position of this first light source cell 25a is corresponding with this first reflecting surface M11.In addition, in this example, this first optical waveguide structure G11 is a material and being formed on this film 22 among this first channel structure T11 and this second channel structure T12 with semiconductor technology with high molecular polymer (polymer).In detail; Its technology can be the material of coating one high molecular polymer that (comprises the part that the corresponding first channel structure T11 and the second channel structure T12 expose) on the integral surface prior to its film 22, and then goes to define and etch required position with the exposure imaging mode; Just get the part that its material can fill up the space that this second channel structure T12 had, shown in this first optical waveguide structure G11 among Fig. 2 b.
Hold the above, in this example, this first optical waveguide structure G11 is other optical waveguide structures (for example G12) for doing to be parallel to each other on preferred configuration, in order to the transmission of light signal to be provided.In detail, corresponding light signal is to transmit in the optical waveguide structure (for example G11) of total reflection mode on the channel structure (for example T12) of correspondence; Therefore, the brought forward literary composition is said, and the refractive index of described film 22 needs the refractive index less than the corresponding optical waveguide structure in its top.For instance; If with silicon dioxide is to form material; Then the refractive index of its film 22 is about 1.46 to 1.5 scope; Thereby described optical waveguide structure (because of technology is identical, so the optical waveguide structure on each irrigation canals and ditches is identical material) just can to adopt its refractive index be material about the high molecular polymer of 1.56 to 1.6 scope; And under the design of this mode, the contrast of its refractive index of film that optical waveguide structure is adjacent heals when big, and the condition that can form total reflection for light signal can be wideer, just can transmit the light beam of some wide-angles.
On the other hand; In this example; The described first light source cell 25a can be with light emitting diode of the prior art, semiconductor laser or vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser; Be called for short VCSEL) constitute, its main function is in order to produce according to relevant electric signal or to launch light beam or light signal after the corresponding conversion to transmit equally.In detail, shown in Fig. 2 a and Fig. 2 b, optical delivery module 2 of the present invention also include be formed on this film 22 and with an electric signal transmission unit 23 of this first light source cell 25a completion electrical connection.In addition, its optical delivery module 2 also includes one drive circuit 24; And in this example; This driving circuit 24 is arranged on this electric signal transmission unit 23 and with these printed circuit board (PCB) 21 completion of this electric signal transmission unit 23 and rear end and is electrically connected; And then make this driving circuit 24 also to do corresponding transmission by this first electric signal E1 that this printed circuit board (PCB) 21 of transmission is provided through this electric signal transmission unit 23, and can carry out corresponding driving to this first light source cell 25a.
In this example, shown in Fig. 2 a and Fig. 2 b, with these driving circuit 24 direct chip packages to this semiconductor substrate 20, and this set-up mode need not routing (Wire) just can accomplish the structure dress of module.And the present invention also can accomplish electrical connection and computing or driving between its optical delivery module and applied printed circuit board (PCB) with the mode of system in package (System in Package is called for short SiP) in other enforcement design; Meaning be promptly except that being arranged on the electric signal transmission unit 23 driving circuit 24 or on this film 22, also can integrate required circuit unit and is set directly on this printed circuit board (PCB) 21.And set driving circuit can be accomplished and being electrically connected of electric signal transmission unit 23 and printed circuit board (PCB) 21 with routing (Wire) or the mode of in semiconductor substrate 20, making metal piercing.
Hold the above; In this example; Emission was to get among this first optical waveguide structure G11 after wherein this first light source cell 25a just can receive this first electric signal E1 and convert one first light signal O1 to, and this first light signal O1 also can transmit in this first optical waveguide structure G11 through the reflection of this first reflecting surface M11.With regard to preferable enforcement design; The distance of the first light source cell 25a and the first optical waveguide structure G11 more better; Guaranteeing that light beam can effectively get in the optical waveguide, and the transmission that can be parallel to each other with the axially directed work of this first optical waveguide structure G11 of the light path of this first light signal O1 that is reflected.And in preferable reflection or the irradiation light signal of dispersing is a little arranged to doing; Just can shine with the bigger incident angle of the relative first reflecting surface M11 among the first optical waveguide structure G11 of its light path on the second channel structure T12; Just can meet or exceed the incident critical angle of total reflection condition with respect to this film 22 of side wall perimeter, thereby make light when doing transmission, just can in this first optical waveguide structure G11, transmit with the total reflection mode with this kind light path.Be with; The V font pattern that this first channel structure T11 is appeared need be made corresponding size design, so that light signal can be unlikely to when entering into this second channel structure T12 and shining on its inboard, just not break away from this first optical waveguide structure G11 from this first channel structure T11.
And in this example, the design shown in Fig. 2 a to Fig. 2 c also can provide the application that other electric signal are transmitted; Meaning is promptly carried out with optical waveguide structure and the reflecting surface that the light source cell of four correspondences is arranged in pairs or groups on the corresponding channel structure.Explain that with one second electric signal E2 this second electric signal E2 is also provided by 21 of this printed circuit board (PCB)s and come a secondary light source unit 25b is driven by this driving circuit 24; This secondary light source unit 25b can do to integrate and the completion setting with this first light source cell 25a; After receiving this second electric signal E2 and converting one second light signal O2 to, launch, and need in the design on this film 22 and the first side T11a of this first channel structure T11 above form corresponding one the 3rd a reflecting surface M13 in position with secondary light source unit 25b.
Simultaneously; With similar design pattern and technology; Be formed with also in this semiconductor substrate 20 that the one of which end penetrates the second side T11b of this first channel structure T11 and one the 4th channel structure T14 that each other is connected; And can in above-mentioned same technology, also form this film 22 on it; And, make this second light signal O2 can get among this second optical waveguide structure G12 and and transmit through the reflection of the 3rd reflecting surface M13 again to should on this film 22, forming one second optical waveguide structure G12 with the 4th channel structure T14 by the first channel structure T11.And this one designs on the other hand; Can be directly reflecting material be all coated so that its whole face all forms reflecting surface in whole film 22 surfaces on should the first side T11a of the first channel structure T11, and then in the locational part zone of corresponding respectively first, second light source cell 25a of the first side T11a, 25b, constitute separately and required the first, the 3rd reflecting surface M11, M13.
And externally assemble the design that connects with transmission about this optical delivery module 2, as Fig. 2 a to Fig. 2 c (shown in, be provided with a corresponding guide bracket assembly 26 in this printed circuit board (PCB) 21.In this example, described guide bracket assembly 26 has two guide brackets 261,262 for design on the size that connects in assembling or the structure has mainly comprised, and its size or structure and can arrange in pairs or groups with relevant adapter of the prior art; For example can adopt in the prior art that time optics module of encapsulation (sub-mount) silicon substrate is made adapter that external signal connects and the element design (fiber ribbon connector) of optical fiber is assembled collocation to doing.In detail, corresponding hole (alignment hole) is arranged on each guide bracket, can provide adapter to do assembling and connect with corresponding assembling connecting interface.Please consult Fig. 3 simultaneously, for optical delivery module 2 of the present invention is made the synoptic diagram that assembling is connected by its guide bracket assembly 26 with an adapter 3.As shown in the drawing, in this example, go out this corresponding guide bracket assembly 26, and can two guide brackets made and be provided with the mode that one is type with a ㄇ font style design.
Hold the above, in other words, the size of this guide bracket assembly 26 is provided with it and needs and the second end T12b of this second channel structure T12 and the position corresponding (comprising the collocation of other channel structures and optical waveguide structure) of this first optical waveguide structure G11; Design is just gone up except that need are considered the specification and size of applied adapter 3; The number of fibers that adapter 3 is comprised also needs corresponding with set optical waveguide structure number, and adapter 3 need have the assembling lead foot (guide pin) of corresponding its guide bracket hole; Meaning is that adapter 3 need have corresponding assembling connecting interface.In addition, this set guide bracket assembly 26 also needs so can accomplish effective combination setting to transmit to size that should semiconductor substrate 20.Because the thickness of general silicon substrate is in reaching about about 25 microns precision on the technology; Even and this guide bracket assembly 26 that is designed is arranged on this printed circuit board (PCB) 21 with bonding or solid brilliant (die bond) mode; Etching mode also capable of using, position that control is simultaneously binded and thickness and reach the setting that about about 1 to 3 micron precision is adjusted assembly.Be to provide the corresponding optical waveguide structure and the optical fiber of rear end to do accurately linking all effectively controlling the error that this guide bracket assembly 26 is being provided with on all directions, make the transmission of light signal effectively to reach with, the present invention; The for example described first light signal O1 can transfer to from its first optical waveguide structure G11 in the corresponding optical fiber that this adapter 3 comprised.
Moreover, by this design, repeatedly plug and assembling expediently can be provided just on using; Except letting whole module have the succinct outward appearance, assemble corresponding adapter and also can not cause damage the module internal element.Certainly, in other embodiment, also can otherwise accomplish the design of its guide bracket assembly 26; For example can two guide brackets be made respectively and be provided with, and not design, make and the complexity that is provided with, also can accomplish with adapter and be connected the control of making precision in assembling though may increase with ㄇ font pattern.Be no matter to be that the optical delivery module of on its transmitting terminal, using can be done outside the assembling plug, also can on the optical delivery module that the receiving end that follow-up institute will explain is used, do assembling and plug with, employed adapter.
On the other hand, this embodiment also comprises the enforcement explanation to the optical delivery module of using as receiving end.See also Fig. 4, be the side schematic view of an optical delivery module 4 proposed by the invention.In detail; The first light signal O1 of the optical delivery module 2 among above-mentioned Fig. 2 a to Fig. 2 c is by reflection and the transmission in the first optical waveguide structure G11; And after connecting and further utilize optical fiber that it comprised to do transmission by the assembling of adapter as shown in Figure 33, just can receive, change and do follow-up transmission by the optical delivery module 4 of Fig. 4.Be to have similar structure design, element material, generation function, electrical connection and position with, this optical delivery module 4 to be provided with; In Fig. 4, also carry out graphic indication to correlation unit with similar numbering.Direct of travel and order on its difference only is the signal transmission and changes; And the light source cell (for example unit 25a) of inciting somebody to action wherein according to the purpose of design of its receiving end changes one first optical detecting unit 45a into, and will driving circuit 24 wherein changes one into and change impedance amplifier circuit 44.
Hold the above; The described first optical detecting unit 45a can be with light receiving diode of the prior art or optical receiver (Photodetector; Be called for short PD) constitute, its main function is in order to produce or to convert to corresponding electric signal to transmit according to relevant light signal equally.In detail; As shown in Figure 4; Because the position of this first optical detecting unit 45a is corresponding with the first reflecting surface M11 ' here; Therefore the first corresponding light signal O1 (can with Fig. 2 a in identical) in can transmit entering the first optical waveguide structure G11 ' here by similar adapter after, just can transmit by this first optical detecting unit 45a reception and after converting an electric signal E1 ' (identical transmission content can be arranged with the electric signal E1 among Fig. 2 a) to through the reflection of this first reflecting surface M11 '.Similarly; Its optical delivery module 4 is applied to the setting on the printed circuit board (PCB) 41; And described commentaries on classics impedance amplifier circuit 44 is electrically connected with printed circuit board (PCB) 41 with electric signal transmission unit 43 each other, and can this electric signal E1 ' that changed done to export after the corresponding amplification.
In addition, design similarly, the optical delivery module 4 of Fig. 4 also can be used the transmission that other light signal is done to receive with conversion, and this is partly identical with the correspondence explanation of Fig. 2 b and Fig. 2 c, its difference only is light source cell is replaced; For instance; Design is done another optical detecting unit to integrate to accomplish with this first optical detecting unit 45a and is provided with; And another light signal just can receive, change and do further transmission by described another optical detecting unit after doing transmission and reflection through corresponding optical waveguide structure and reflecting surface.
Transmit after in the first above-mentioned embodiment, in module, doing primary event, and then make light produce non-coplanar turnover and accomplish the coupling of optical fiber on optical delivery with corresponding optical waveguide structure and adapter through reflecting surface with light signal.Be with, under the design that is applied to transmitting terminal and receiving end, optical delivery module of the present invention can effectively provide light signal in doing signal transmission between circuit board and the circuit board or between chip and chip.In addition, be that form can more effectively be carried out at circuit board or each chip chamber when doing corresponding signal transmission for making with light, the light path of transmission can design with the connection requirement possible according to element.For instance, can make light carry out repeatedly reflection or turnover and can be in the transmission of the different enterprising traveling optical signals of direction.
Describe with one second embodiment at present.Please consult Fig. 5 a and Fig. 5 b simultaneously, wherein Fig. 5 a is the side schematic view of an optical delivery module 5 proposed by the invention; Fig. 5 b then is its schematic perspective view.The optical delivery module 5 of this second embodiment changes according to the framework of the optical delivery module 2 that first embodiment is proposed, and its main difference is in the semiconductor substrate 50 of this optical delivery module 5, further to design and is formed with one the 3rd channel structure T23; And the first side T23a of the 3rd channel structure T23 penetrates the second end T22b of its second channel structure T22 (comprising other channel structures shown in Fig. 5 b) and linking each other; And it is vertical that preferable design also makes its 3rd channel structure T23 and the second channel structure T22 appear, and to be its 3rd channel structure T23 with its first channel structure T21 appear meaning is parallel to each other.Further; In this example, design film 52 is formed on the 3rd channel structure T23; And on this film 52 and the top of the second side T23b of the 3rd channel structure T23 be formed with one second reflecting surface M22; Make the first light signal O1 ' that in the second channel structure T22, does transmission can form secondary turnover, thereby produce the vertical effect that penetrates semiconductor substrate 50 through the reflection of the second reflecting surface M22.
On the other hand, in this example, its guide bracket assembly 56 also need be made corresponding design variation; Shown in Fig. 5 a and Fig. 5 b; The setting of this guide bracket assembly 56 is corresponding with the position of the 3rd channel structure T23 and this second reflecting surface M22; Hole that just its guide bracket had simultaneously up, with the adapter 3 that provides corresponding assembling connecting interface do vertically to assembling connect.And in this example, its guide bracket assembly 56 binds two guide bracket utilizations or solid brilliant (die bond) mode is arranged at respectively on its printed circuit board (PCB) 51; Etching mode then also capable of using is controlled the thickness of its guide bracket assembly 56 aspect precision, so that the hole on it can be accomplished assembling accurately with each optical waveguide structure and the unit such as adapter 3 with corresponding optical fiber and be connected; For example the first light signal O1 ' among Fig. 5 b just can accomplish transmission and reflects the back through this second reflecting surface M22 and get in the corresponding optical fiber that adapter 3 comprised in first optical waveguide structure G21 of this example.In addition, this routine guide bracket assembly 56 also can design with ㄇ font pattern, and can two guide brackets be connected to accomplish the thickness adjustment simultaneously; And its corresponding setting for instance, can be binded along doing on the ora terminalis plane of this semiconductor substrate 50 to attach.And identical notion and framework also can be implemented on the optical delivery module of doing the receiving end application.
No matter optical delivery module in above-mentioned first embodiment or second embodiment is with regard to the application on transmitting terminal or the receiving end, is merely to launch to one or more light signal singlely or receive to use and design; Yet the present invention also can change according to the framework of first, second embodiment so that have on the same module of a plurality of optical waveguide structures can be simultaneously with the function of optical signal transmitting and reception.Describe with one the 3rd embodiment at present.See also Fig. 6, be the schematic perspective view of an optical delivery module 6 proposed by the invention; Similarly; The framework of the optical delivery module 2 that the optical delivery module 6 of this 3rd embodiment is proposed according to first embodiment (maybe can include two secondary reflections of second embodiment, the characteristic of turnover) changes; Its main difference is in this optical delivery module 6, to be designed with light source cell and optical detecting unit simultaneously, and the running of the corresponding reflecting surface of collocation emission and reception when carrying out light signal with optical waveguide structure.
Hold the above, explain with two groups of signal transmission among Fig. 6; Its first light source cell 65a can do integrate to accomplish with its first optical detecting unit 65b and be provided with, and the first light source cell 65a and the first optical detecting unit 65b institute reflecting surface M31, the M33 of correspondence are formed on the first side T31a of the first channel structure T31 equally respectively.And the first light source cell 65a and the first optical detecting unit 65b distinguish the formation of the first corresponding optical waveguide structure G31 and the second optical waveguide structure G32 except the corresponding first channel structure T31, corresponding respectively second channel structure T32 and the 4th channel structure T34 and form (and its below also is formed with the film 62 of whole layer).The driving circuit 64a that is positioned at the rear end is arranged on its electric signal transmission unit 63 and accomplishes with changeing impedance amplifier circuit 64b then can do to integrate and is electrically connected, thus the transmission of the electric signal on driving or amplify.Further, receive the first electric signal E1 by the first light source cell 65a, and utilize the first optical waveguide structure G31 to transmit after converting the first light signal O1 to; The first optical detecting unit 65b then receives in order to the second light signal O2 that the neutralization to the transmission entering second optical waveguide structure G32 is reflected, and transmits after converting the second electric signal E2 to.
Optical delivery module of the present invention also can change according to the framework of above-mentioned the 3rd embodiment again; In detail, can with its light source cell and optical detecting unit respectively the reflecting surface of correspondence be formed on the different channel structures.Describe with one the 4th embodiment at present.See also Fig. 7, be the schematic perspective view of an optical delivery module 7 proposed by the invention; Compared to the module framework of above-mentioned each embodiment, the difference of the optical delivery module 7 of this 4th embodiment is in this semiconductor substrate 70, to be formed with one the 3rd channel structure T43 that is not connected with its first channel structure T41; In other words, on the technology that forms relevant channel structure, its 3rd channel structure T43 and the first channel structure T41 are not same structure, and on relative formation position, can have tandem corresponding relation.And according to this design architecture, the first set light source cell 75a just is respectively formed on the different first channel structure T41 and the 3rd channel structure T43 with the pairing reflecting surface M41 of the first optical detecting unit 75b, M43; And except its first light source cell 75a and the first optical detecting unit 75b are provided with the position and have the tangible difference in demonstrating relatively in appearance, the first corresponding respectively optical waveguide structure G41 just have different formation length with the second optical waveguide structure G42 and come transmitting optical signal O1, O2.
Optical delivery module of the present invention also can change according to the framework of above-mentioned the 4th embodiment.Owing to no matter be to use or have concurrently light source cell that emission and the module that receives use partly at the module of transmitting terminal, the application of some high-orders can need a light to detect monitor unit (Monitor PD is called for short MPD) to do the detection of the accurate position of light signal and handle.If because of temperature or the feasible light beam generation intensity increase and decrease of being transmitted of environmental factor; Then its light detects that monitor unit just can be done corresponding detection and its result is driven through the oppose correspondence feedback of its light source cell of driving circuit, so that the intensity of the light signal that is transmitted can be kept effectively.
Seeing also Fig. 8 a, is the schematic top plan view of an optical delivery module 7 '.Hold the above, this optical delivery module 7 ' also includes a light and detects monitor unit 75c, and it also can be to be arranged on the semiconductor substrate with light source cell 75a, mode that optical detecting unit 75b is identical; And in this semiconductor substrate, also be formed with corresponding channel structure, accomplish the setting that this light detects monitor unit 75c by a G41a of difference portion who provides this optical delivery module 7 ' to be comprised.The G41a of this difference portion can come to be connected each other with main optical waveguide structure G41 with the mode of a turnover; Make the light signal of part can produce the situation of turnover or translation through the G41a of this difference portion, and then and the corresponding reflecting surface that comprised of the G41a of this difference portion capable of using (can be 45 degree; Maybe can be arranged on the side of corresponding channel structure as described in the previous embodiment) and receive by this light detection monitor unit 75c, thereby the feedback driving that described signal intensity is kept can be accomplished.
The above-mentioned G41a of difference portion also can equally with optical waveguide structure G41 use high molecular polymer to be coated with, and utilizes the exposure imaging mode to go to define and etch required position.In Fig. 8 b, then demonstrate another kind and comprised the optical delivery module 7 that the G41b of difference portion and light detect monitor unit 75c " be provided with to change and implement signal.
Optical delivery module of the present invention also can change with the announcement notion according to the framework of above-mentioned first embodiment again.In the first above-mentioned embodiment; Formation for the relevant channel structure in the semiconductor substrate; The first is done vertical etching (for example T11) with the pattern of a V font, and to be interconnected on the mutual vertical and space and the mode that is connected one or more channel structure (for example T12) of going out of lateral etches again.Yet this technology also can change or simplify and reach identical result of implementation; Just can on pattern and technology, integrate the formation of orthogonal each channel structure among first embodiment; Make it only keep horizontal irrigation canals and ditches partly; Or only need lateral etches that semiconductor substrate is opposed and answered; And let the space on the first channel structure T11 among first embodiment partly still fill up by former silicon materials, and do not have the V font pattern on the section.
Describe with one the 5th embodiment at present.See also Fig. 9, be the schematic perspective view of an optical delivery module 8 proposed by the invention; This optical delivery module 8 should be used as explanation with transmitting terminal.Hold the above; Shown in Figure 9 like this, in semiconductor substrate 80, be formed with a plurality of identical channel structures, and these channel structures are parallel each other; And on a side separately, be formed with a corresponding reflecting surface respectively, and the linking that on opposite side separately, provides subsequent group to load onto.An existing channel structure T51 with wherein explains; 45 degree or trapezoidal that form preferred configuration of the first side T51a of this channel structure T51 in semiconductor substrate 80, and its second side T51b appears as section with trapezoidal pattern in this example.In addition; Be formed on its semiconductor substrate 80 and the channel structure T51 film 82 whole layers; And in this example; Prior to the first side T51a of channel structure T51 go up form this film 82 after, lamination or coat reflecting material in addition on this film 82 of its first side T51a top again to form a reflecting surface M51.Moreover an optical waveguide structure G51 is to should channel structure T51 and be formed on this film 82, and the two ends of this optical waveguide structure G51 just correspond to the both sides of this channel structure T51.The position of one light source cell 85a is then to should reflecting surface M51 and be arranged on the semiconductor substrate 80, and it is launched after receiving corresponding electric signal E1 and converting corresponding light signal O1 to; This light signal O1 can get among the optical waveguide structure G51 and through the reflection of reflecting surface M51 and transmit.
This embodiment can be with reference to the explanation of aforementioned each embodiment about the setting and the associated change of guide bracket assembly 86; For example can two secondary reflections of second embodiment, the characteristic of turnover be added, and likewise, can the space on the opposite side of each channel structure partly be filled up by former silicon materials, and the V font pattern that does not have on the section appears.The notion of the optical delivery module 8 that the transmitting terminal that in addition, Fig. 9 disclosed is used also can be implemented in the application of receiving end; Perhaps, change explanation, in this example, also can a plurality of light source cells or optical detecting unit or the design that on same module, includes light source cell and optical detecting unit simultaneously done to integrate and be provided with according to aforementioned relevant enforcement.In other words; Optical delivery module proposed by the invention can be to be the basis like the notion that Fig. 9 was disclosed; And the notion that is disclosed with Fig. 2 b with and the variation that designs of V font pattern; Make when no matter whether being formed at V font pattern in the module, all can accomplish the optical signal transmission characteristics of waveguide by the optical waveguide structure of described correspondence because of the variation design requirement on the semiconductor technology.
Hereat; In sum; The present invention has combined the technology of semiconductor technology and the optical waveguide signal transmission technology that can do total reflection, and utilizes the adapter transmission design that can do corresponding assembling and plug, and need not the optical fiber of correspondence is done under the less condition of its size the assembling and the implantation of difficulty; Thereby the convenience in the use not only can be provided, also can effectively avoid light source cell or optical detecting unit are caused possible destruction situation.In addition, design of the present invention is the precision on the control setting effectively also, makes light signal to do to import exactly or derive through corresponding optical fiber and accomplishes signal and transmit.Be with, notion of the present invention can solve relevant issues mentioned in the prior art effectively, thereby can successfully reach the fundamental purpose of this case development.
Any those skilled in the art that can be under utilization and the prerequisite of the identical purpose of the present invention, the basis of using disclosed notion and embodiment variation to be used as designing and improving some other method.These change, substitute and improve and can not deviate from protection scope of the present invention that claims define.

Claims (23)

1. optical delivery module is applied on the printed circuit board (PCB) the transmission of one first electric signal, and this optical delivery module includes:
A semiconductor substrate is arranged on this printed circuit board (PCB);
One first channel structure is formed in this semiconductor substrate;
One first reflecting surface is formed on first side of this first channel structure;
One second channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and linking each other;
A film is formed on this semiconductor substrate, this first channel structure and this second channel structure;
One first light source cell is arranged on this semiconductor substrate, after receiving this first electric signal and converting one first light signal to, launch, and the position of this first light source cell is corresponding with this first reflecting surface;
One first optical waveguide structure is to being formed on this film with this second channel structure by first channel structure; And
A guide bracket assembly to should semiconductor substrate and be arranged on this printed circuit board (PCB), connects in order to the assembling in the transmission to be provided;
Wherein this first light signal gets in this first optical waveguide structure and through the reflection of this first reflecting surface and transmits.
2. optical delivery module as claimed in claim 1 is characterized in that: this first light source cell is light emitting diode, semiconductor laser or vertical cavity surface emitting laser.
3. optical delivery module as claimed in claim 1 is characterized in that: this film is the dielectric medium rete, and in order to the electrical isolation in the transmission course to be provided, the refractive index of this film is less than the refractive index of this first optical waveguide structure.
4. optical delivery module as claimed in claim 1 is characterized in that: this first light signal transmits in total reflection or reflection mode this first optical waveguide structure on this second channel structure through this first reflecting surface.
5. optical delivery module as claimed in claim 1 is characterized in that: the bottom surface of this first reflecting surface and this semiconductor substrate accompanies an angle of inclination.
6. optical delivery module as claimed in claim 1 is characterized in that: this optical delivery module includes an electric signal transmission unit, is formed on this film, and accomplishes electrical connection with this first light source cell, in order to transmit this first electric signal.
7. optical delivery module as claimed in claim 6; It is characterized in that: this optical delivery module includes a driving circuit; Be arranged on this electric signal transmission unit, this film or this printed circuit board (PCB); And accomplish with this electric signal transmission unit and this printed circuit board (PCB) and to be electrically connected, make this driving circuit by transmission this first electric signal that this printed circuit board (PCB) provided this light source cell is carried out corresponding driving.
8. optical delivery module as claimed in claim 1; It is characterized in that: this first channel structure carries out etching with this second channel structure with semiconductor technology and forms in this semiconductor substrate; And this first optical waveguide structure is formed on this film in this first channel structure and this second channel structure with semiconductor technology, and the material of this first optical waveguide structure is a high molecular polymer.
9. optical delivery module as claimed in claim 1; It is characterized in that: second end that position and this second channel structure are set of this guide bracket assembly and the position of this first optical waveguide structure are corresponding; And the adapter that this guide bracket assembly and have a corresponding assembling connecting interface is done assembling and is connected, in order to this first optical signal transmission to the corresponding optical fiber that this adapter comprised.
10. optical delivery module as claimed in claim 1 is characterized in that: this optical delivery module includes:
One the 3rd channel structure is formed in this semiconductor substrate, and its first side penetrates second end of this second channel structure and is connected each other, and this film is formed on the 3rd channel structure; And
One second reflecting surface is formed on second side of the 3rd channel structure;
Wherein this guide bracket assembly that the position is set is corresponding with the position of the 3rd channel structure and this second reflecting surface; And this guide bracket assembly is connected with an adapter do assembling with corresponding assembling connecting interface, in order to getting in corresponding optical fiber that this adapter comprised through this first optical signal transmission that this second reflecting surface reflects.
11. optical delivery module as claimed in claim 1 is characterized in that: this optical delivery module is applied to the transmission to one second electric signal, and this optical delivery module includes:
One the 3rd reflecting surface is formed on first side of this first channel structure;
One the 4th channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and is connected each other, and this film is formed on the 4th channel structure;
A secondary light source unit is arranged on this semiconductor substrate, after receiving this second electric signal and converting one second light signal to, launch, and the position of this secondary light source unit is corresponding with the 3rd reflecting surface; And
One second optical waveguide structure is to being formed on this film with the 4th channel structure by first channel structure;
Wherein this second light signal can get in this second optical waveguide structure and through the reflection of the 3rd reflecting surface and transmit.
12. optical delivery module as claimed in claim 1 is characterized in that: this optical delivery module is applied to the transmission to one second light signal, and this optical delivery module includes:
One the 3rd reflecting surface is formed on first side of this first channel structure;
One the 4th channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and is connected each other, and this film is formed on the 4th channel structure;
One first optical detecting unit is arranged on this semiconductor substrate, and the position of this first optical detecting unit is corresponding with the 3rd reflecting surface; And
One second optical waveguide structure is to being formed on this film with the 4th channel structure by first channel structure;
Wherein this second light signal can transmit and get in this second optical waveguide structure, transmits by this first optical detecting unit reception and after converting one second electric signal to through the reflection of the 3rd reflecting surface.
13. optical delivery module as claimed in claim 1 is characterized in that: this optical delivery module is applied to the transmission to one second light signal, and this optical delivery module includes:
One the 3rd channel structure is formed in this semiconductor substrate, and this film is formed on the 3rd channel structure;
One the 3rd reflecting surface is formed on first side of the 3rd channel structure;
One the 4th channel structure is formed in this semiconductor substrate, and its first end penetrates second side of the 3rd channel structure and is connected each other, and this film is formed on the 4th channel structure;
One first optical detecting unit is arranged on this semiconductor substrate, and the position of this first optical detecting unit is corresponding with the 3rd reflecting surface; And
One second optical waveguide structure is to being formed on this film with the 4th channel structure by the 3rd channel structure;
Wherein this second light signal can transmit and get in this second optical waveguide structure, transmits by this first optical detecting unit reception and after converting one second electric signal to through the reflection of the 3rd reflecting surface.
14. optical delivery module as claimed in claim 1; It is characterized in that: this optical delivery module includes a light and detects monitor unit; In order to conduct the detection of the accurate position of this first light signal is handled; And this optical delivery module includes a difference portion, and this difference portion makes this first light signal partly to produce to transfer and detect monitor unit by this light through this difference portion and receives with turnover mode and this first optical waveguide structure linking.
15. an optical delivery module is applied on the printed circuit board (PCB) the transmission of one first light signal, this optical delivery module includes:
A semiconductor substrate is arranged on this printed circuit board (PCB);
One first channel structure is formed in this semiconductor substrate;
One first reflecting surface is formed on first side of this first channel structure;
One second channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and linking each other;
A film is formed on this semiconductor substrate, this first channel structure and this second channel structure;
One first optical detecting unit is arranged on this semiconductor substrate, and the position of this first optical detecting unit is corresponding with this first reflecting surface;
One first optical waveguide structure is to being formed on this film with this second channel structure by first channel structure; And
A guide bracket assembly to should semiconductor substrate and be arranged on this printed circuit board (PCB), connects in order to the assembling in the transmission to be provided;
Wherein this first light signal can transmit and get in this first optical waveguide structure, transmits by this first optical detecting unit reception and after converting one first electric signal to through the reflection of this first reflecting surface.
16. optical delivery module as claimed in claim 15 is characterized in that: this first optical detecting unit is light receiving diode or optical receiver.
17. optical delivery module as claimed in claim 15 is characterized in that: this optical delivery module includes an electric signal transmission unit, is formed on this film, and is electrically connected with this first optical detecting unit completion, in order to transmit this first electric signal.
18. optical delivery module as claimed in claim 17; It is characterized in that: this optical delivery module includes one changes the impedance amplifier circuit; Be arranged on this electric signal transmission unit, this film or this printed circuit board (PCB); And accomplish with this electric signal transmission unit and this printed circuit board (PCB) and to be electrically connected, in order to transmit this first electric signal and to carry out the amplification of correspondence.
19. optical delivery module as claimed in claim 15 is characterized in that: this optical delivery module includes:
One the 3rd channel structure is formed in this semiconductor substrate, and its first side penetrates second end of this second channel structure and is connected each other, and this film is formed on the 3rd channel structure; And
One second reflecting surface is formed on second side of the 3rd channel structure;
Wherein this guide bracket assembly that the position is set is corresponding with the position of the 3rd channel structure and this second reflecting surface; And this guide bracket assembly is connected with an adapter do assembling with corresponding assembling connecting interface, gets in this first optical waveguide structure in order to this first light signal in the corresponding optical fiber that this adapter comprised is transmitted through the reflection of this second reflecting surface.
20. optical delivery module as claimed in claim 15 is characterized in that: this optical delivery module is applied to the transmission to one second light signal, and this optical delivery module includes:
One the 3rd reflecting surface is formed on first side of this first channel structure;
One the 4th channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and is connected each other, and this film is formed on the 4th channel structure;
One second optical detecting unit is arranged on this semiconductor substrate, and the position of this second optical detecting unit is corresponding with the 3rd reflecting surface; And
One second optical waveguide structure is to being formed on this film with the 4th channel structure by first channel structure;
Wherein this second light signal can transmit and get in this second optical waveguide structure, transmits by this second optical detecting unit reception and after converting one second electric signal to through the reflection of the 3rd reflecting surface.
21. optical delivery module as claimed in claim 15 is characterized in that: this optical delivery module is applied to the transmission to one second electric signal, and this optical delivery module includes:
One the 3rd reflecting surface is formed on first side of this first channel structure;
One the 4th channel structure is formed in this semiconductor substrate, and its first end penetrates second side of this first channel structure and is connected each other, and this film is formed on the 4th channel structure;
One first light source cell is arranged on this semiconductor substrate, after receiving this second electric signal and converting one second light signal to, launch, and the position of this first light source cell is corresponding with the 3rd reflecting surface; And
One second optical waveguide structure is to being formed on this film with the 4th channel structure by first channel structure;
Wherein this second light signal can get in this second optical waveguide structure and through the reflection of the 3rd reflecting surface and transmit.
22. an optical delivery module is applied on the printed circuit board (PCB) the transmission of at least one electric signal, this optical delivery module includes:
A semiconductor substrate is arranged on this printed circuit board (PCB);
At least one channel structure is formed in this semiconductor substrate, and on first side of this channel structure, is formed with corresponding reflecting surface;
A film is formed on this semiconductor substrate and this channel structure;
At least one light source cell is arranged on this semiconductor substrate, after receiving this corresponding electric signal and converting corresponding light signal to, launch, and the position of this light source cell is corresponding with this reflecting surface;
At least one optical waveguide structure is to should channel structure and be formed on this film; And
A guide bracket assembly to should semiconductor substrate and be arranged on this printed circuit board (PCB), connects in order to the assembling in the transmission to be provided;
Wherein this light signal can get in this corresponding optical waveguide structure and the reflection of this reflecting surface through correspondence is transmitted.
23. an optical delivery module is applied on the printed circuit board (PCB) the transmission of at least one light signal, this optical delivery module includes:
A semiconductor substrate is arranged on this printed circuit board (PCB);
At least one channel structure is formed in this semiconductor substrate, and on first side of this channel structure, is formed with corresponding reflecting surface;
A film is formed on this semiconductor substrate and this channel structure;
At least one optical detecting unit is arranged on this semiconductor substrate, and the position of this optical detecting unit is corresponding with this reflecting surface;
At least one optical waveguide structure is to should channel structure and be formed on this film; And
A guide bracket assembly to should semiconductor substrate and be arranged on this printed circuit board (PCB), connects in order to the assembling in the transmission to be provided;
Wherein this light signal can transmit and get in this corresponding optical waveguide structure, the reflection of this reflecting surface through correspondence and by this optical detecting unit of correspondence receive and convert corresponding electric signal to after transmit.
CN2010102716658A 2010-09-03 2010-09-03 Optical transmission module with optical wave guide structure Pending CN102385122A (en)

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JP7060798B2 (en) 2018-05-30 2022-04-27 日亜化学工業株式会社 Light source device

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Inventor after: Wu Maoren

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Free format text: CORRECT: INVENTOR; FROM: WU MAOREN LAN XIAOJIN LI YUNZHI JIA QI XIAO XULIANG CHEN JINDA SHEN BOKUANLU GUANFU ZHANG YANZHONG CHANG ZHENYU TO: WU MAOREN LAN XIAOJIN LI YUNZHI ZHANG JIAQI XIAO XULIANG CHEN JINDA SHEN BOKUAN LU GUANFU ZHANG YANZHONG CHANG ZHENYU

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Application publication date: 20120321