CN102374392A - Manufacturing method of LED (light emitting diode) lamp fitting - Google Patents
Manufacturing method of LED (light emitting diode) lamp fitting Download PDFInfo
- Publication number
- CN102374392A CN102374392A CN2010102517211A CN201010251721A CN102374392A CN 102374392 A CN102374392 A CN 102374392A CN 2010102517211 A CN2010102517211 A CN 2010102517211A CN 201010251721 A CN201010251721 A CN 201010251721A CN 102374392 A CN102374392 A CN 102374392A
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- lampshade
- circuit substrate
- aforesaid
- flame
- conduit
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Abstract
The invention relates to a manufacturing method of an LED (light emitting diode) lamp fitting. The method comprises the steps of combining a core column and a circuit board set, drying, enclosing a bulb, sucking gas, filling gas, sealing and combining a lamp seat and a lamp cover. Because a glass integrated lamp cover is manufactured according to the invention, and in the bulb enclosing step, an ear part of an insulation base and the neck part of the lamp cover are combined in a sintering mode, and the internal space of the lamp cover is subjected to air tight in a mode of conduit melting; because the internal space of the lamp cover can be subjected to air tight, the circuit board set in the LED illumination lamp manufactured by the treatment of drying, gas sucking and gas filling is difficult to be affected by external environment, and the reliability is difficult to be oxidized or be affected with damp; and the service life of the LED illumination device lamp fitting can be prolonged, and the device is extremely practical.
Description
Technical field
The present invention relates to a kind of method of making light fixture, especially a kind of manufacturing approach of LED lighting.
Background technology
General existing LED lighting is a combined type at present; As shown in Figure 6; Be provided with heat dissipating housing 60, be positioned at heat dissipating housing 60 inner circuit substrate group, lampshade 70, stem stem seat and lamp socket 80, the apical margin of heat dissipating housing 60 and lampshade 70 set firmly, and circuit substrate group is positioned at lampshade 70 and heat dissipating housing 60; The stem stem seat combines with heat dissipating housing 60 with detachably assembling and sets firmly with circuit substrate group, and lamp socket 80 covers are fixed in the stem stem seat; Wherein, heat dissipating housing 60 is used for the heat radiation of circuit substrate group, and heat dissipating housing 60 is generally that metal is processed and is light tight.Yet there is disadvantage in the LED lighting of prior art:
1. the combined type design causes producing seam and moisture-sensitive or oxidation: because heat dissipating housing 60 is that the combination back is fixed with the mode of gluing with lampshade 70; If bind and still can not produce small seam entirely; Cause the space seal in lampshade 70 and the heat dissipating housing 60 not good; And the stem stem seat combines also can produce seam with detachably assembling with heat dissipating housing 60, and causing circuit substrate group to be subject to external environment influences its reliability, is prone to that oxidation is made moist and aging impaired like PCB, conductor; Make the life-span of LED lighting lower, extremely impracticable.
2. combined type designs no change elasticity: because prior art is to belong to the combined type design; The form fix of heat dissipating housing 60 and lampshade 70 just is beneficial to assembling; But but can't change shape neatly, then need spend the heat dissipating housing 60 that very high cost is made new form if will change shape, extremely impracticable.
3. illumination efficiency is not good: the LED lighting of prior art sends evenly only to reflect through being coated with in the lampshade 70 and forms, and heat dissipating housing 60 also can cover down the light of photograph, can dimming, make illumination efficiency and poor effect.
4. insulating properties is not good: because heat dissipating housing 60 is in order dispelling the heat, to be made of metal mostly, but can to cause the insulating properties of LED lighting of prior art not good, the safety issue that causes the user to get an electric shock.
Summary of the invention
For the LED lighting that solves prior art relevant for moisture-sensitive or oxidation, no change elasticity, illumination efficiency is not good and insulating properties is not good deficiency and restriction; The object of the present invention is to provide a kind of manufacturing approach of LED lighting; Be preparation by the integrated lampshade of glass, and in the step of envelope bubble with the ear of insulating base with make that the lampshade inner space can be airtight after the neck of lampshade combines with sintering processing and with the mode of melting the conduit that breaks; Because the lampshade inner space can be airtight; So via oven dry, bleed and the processing of aeration after the made inner circuit substrate group of LED lighting of coming out its reliability that is difficult for being affected by the external environment; Be difficult for oxidation or make moist, can prolong the life-span of LED lighting, very practical.
The technological means that the present invention used is to provide a kind of manufacturing approach of LED lighting, and its step comprises:
In conjunction with stem stem and circuit substrate group: a stem stem is combined fixing with a circuit substrate group; Wherein, this stem stem is provided with an insulating base, two seal wires and a conduit, and this insulating base is a housing of being processed by glass and is provided with an ear that this ear is radially convex shape; These two seal wires fasten in this insulating base respectively and respectively are provided with a support end and a binding end, and each support end is to expose to this insulating base; This conduit is processed and is fastened by glass in this insulating base; This circuit substrate group be set firmly and electrical ties in these two support ends and include more than one LED;
Oven dry: with this circuit substrate group oven dry;
Envelope bubble: prepare a lampshade, this circuit substrate group is placed in this lampshade, this lampshade is to process and be provided with an opening and a neck by glass is one-body molded, and this neck is adjacent to the opening of this lampshade; Make this ear be resisted against the opening part that this neck is adjacent to this lampshade, rotate this lampshade and this stem stem, and utilize thermal-flame that this ear and this neck are sintered to fix; Wherein this conduit is that the inner space that partly exposes to this lampshade and this lampshade communicates with the external world through this conduit;
Bleed: utilize this conduit that the residual air in this lampshade is extracted out;
Aeration: nitrogen or inert gas are poured in this lampshade by this conduit;
Seal: melt disconnected this conduit and make the inner space of this lampshade become airtight conditions with thermal-flame; And
In conjunction with lamp socket and lampshade: a lamp holder sleeve is fixed in this neck, this lamp socket and this two binding ends are fixed according to corresponding polarity electrical ties.
The manufacturing approach of described LED lighting, wherein in aforesaid baking step, the time of drying aforesaid circuit substrate group is 10～15 minutes, and the temperature of drying aforesaid circuit substrate group is 120 ℃～125 ℃.
The manufacturing approach of described LED lighting wherein in the step of aforesaid envelope bubble, is inverted aforesaid lampshade and is handstand state, and the thermal-flame level penetrates also aims at aforesaid ear.
The manufacturing approach of described LED lighting; Wherein in the step of aforesaid envelope bubble; Aforesaid lampshade is erectility; Thermal-flame penetrates and aims at aforesaid ear towards having a down dip, and the folded angle of horizontal plane at thermal-flame and this ear place is a flame angle, and the scope at this flame angle is 5 °～15 °.
The manufacturing approach of LED lighting provided by the present invention, concrete benefit that can obtain and effect enhancement comprise at least:
1. form airtight space in the lampshade: because the present invention's preparation is by the integrated lampshade of glass, and in the step of envelope bubble with the ear of insulating base with make that the lampshade inner space can be airtight after the neck of lampshade combines with sintering processing and with the mode of melting the conduit that breaks; Because the lampshade inner space can be airtight; So via oven dry, bleed and the processing of aeration after the made inner circuit substrate group of LED lighting of coming out its reliability that is difficult for being affected by the external environment; Be difficult for oxidation or make moist, can prolong the life-span of LED lighting, very practical.
2. it is good that lampshade changes elasticity: because the non-combined type design of lampshade of the present invention is to process by glass is one-body molded; Lampshade can utilize heating and change shape neatly; The lamp socket that is easy to produce various form and is disposed at different types, it is splendid to change elasticity.
3. illumination efficiency is good: the luminous LED lighting in four sides is not that light luminous and that send can not blocked by heat dissipating housing by being coated with reflection in the lampshade because made of the present invention comes out evenly, and most light all can project, and illumination efficiency is good.
4. insulating properties is good: because the present invention does not have the heat dissipating housing of the LED lighting of prior art, and lampshade is to be processed by the insulator of glass, the safety issue that can the person of avoiding the use of might get an electric shock.
Description of drawings
Fig. 1 is the flow chart of the preferred embodiment of the present invention.
Fig. 2 is a preferred embodiment of the present invention stem stem and stereogram after circuit substrate group combines.
Fig. 3 is the generalized section of preferred embodiment of the present invention envelope bubble step.
Fig. 4 is the generalized section of preferred embodiment of the present invention envelope bubble step.
Fig. 5 is the stereo appearance figure of preferred embodiment of the present invention LED lighting.
Fig. 6 is the side view of prior art LED lighting.
The primary clustering symbol description
10 stem stems
11 insulating bases, 111 ears
12 seal wires, 121 support ends
122 binding ends, 13 conduits
20 circuit substrate group
30 lampshades, 31 necks
40 lamp sockets, 60 heat dissipating housings
70 lampshades, 80 lamp sockets
F flame gun F1 thermal-flame
θ flame angle
The specific embodiment
Be ability detail knowledge technical characterictic of the present invention and practical effect, and can implement,, specify as the back further with preferred embodiment as shown in the figure according to the content of specification:
The preferred embodiment of the manufacturing approach of a kind of LED lighting provided by the present invention, like Fig. 1, shown in 2, its step comprises:
In conjunction with stem stem and circuit substrate group: a stem stem 10 is combined fixing with a circuit substrate group 20; Wherein, This stem stem 10 is provided with an insulating base 11, two seal wires 12 and conduits 13; The circular shell that this insulating base 11 is processed by glass also is provided with a top, a bottom and an ear 111; This ear 111 is positioned at the bottom of this insulating base 11 and is radially convex shape, and this ear 111 roughly is funnel-form; These two seal wires 12 fasten in this insulating base 11 respectively and respectively are provided with a support end 121 and a binding end 122, and each support end 121 is to expose to the top of this insulating base 11 and processed by hard material steel material; This conduit 13 is processed and is fastened by glass in this insulating base 11; These circuit substrate group 20 solid weldings and electrical ties are in these two support ends 121; Because support end 121 is to process with the converted steel material, can support the weight of this circuit substrate group 20;
This circuit substrate group 20 includes more than one LED (Light Emitting Diode);
Oven dry: with these circuit substrate group 20 oven dry; The purpose of drying circuit substrate in batch 20 is that the aqueous vapor of avoiding substrate to absorb evaporates the life-span that is condensed in substrate part surface or lampshade 30 inner surfaces and the circuit substrate group 20 that detracts in the future; In the manufacturing approach of the LED lighting of prior art, even what essence effect the circuit substrate group oven dry is not had yet, because extraneous aqueous vapor still can be got into by no airtight seam between heat dissipating housing 60 and the lampshade 70;
Preferably, the time of drying circuit substrate in batch 20 is 10～15 minutes, and the temperature of drying circuit substrate in batch 20 is 120 ℃～125 ℃;
Envelope bubble: prepare a lampshade 30 (as shown in Figure 3); This circuit substrate group 20 is placed in this lampshade 30; This lampshade 30 is to process and be provided with a bottom, an opening and a neck 31 by glass is one-body molded, and this opening is formed at the bottom of this lampshade 30, and this neck 31 is adjacent to the opening of this lampshade 30; Make this ear 111 be resisted against the opening part that this neck 31 is adjacent to this lampshade 30, rotate this lampshade 30 and this stem stem 10, and utilize the thermal-flame F1 of a flame gun F that this ear 111 and this neck 31 are sintered to fix; Wherein this conduit 13 is that the inner space that partly exposes to this lampshade 30 and this lampshade 30 communicates with the external world through this conduit 13;
Preferably, as shown in Figure 3, this lampshade 30 is erectility, and the thermal-flame F1 that this flame gun F is sprayed penetrates and aim at this ear 111 towards having a down dip, and the folded viewpoint definition of horizontal plane at thermal-flame F1 and this ear 111 places is a flame angle θ; Preferably, the scope of this flame angle θ is 5 °～15 °; The purpose that forms flame angle θ is: utilize thermal-flame F1 to tilt to make Temperature Distribution to change, let circuit substrate group 20 unlikely burning out;
Preferably, or as shown in Figure 4, be inverted this lampshade 30 and be handstand state, the thermal-flame F1 level that this flame gun F is sprayed penetrates also aims at this ear 111; Owing to can heat the residual gas in the lampshade 30 during thermal-flame F1 sintering, gaseous exchange to the circuit substrate group 20 after the purpose of inversion lampshade 30 is to avoid heating up, and then avoid high-temperature gas to cause the damage of circuit substrate group 20;
Bleed: utilize this conduit 13 that the residual air in this lampshade 30 is extracted out;
Aeration: with inert gas, for example neon, argon gas etc., or nitrogen are poured in this lampshade 30 by this conduit 13; The purpose of the step of aeration is to avoid the risk of circuit substrate group 20 oxidations; Can prolong the service life of circuit substrate group 20; And institute's aeration body can increase the radiating effect of this circuit substrate group 20, and need not install the heat dissipating housing 60 of the LED lighting of prior art; Among the present invention,, just can bleed and the step of aeration because lampshade 30 inner spaces can be airtight;
Seal: melt disconnected this conduit 13 and make the inner space of this lampshade 30 become airtight conditions with thermal-flame F1;
In conjunction with lamp socket and lampshade: as shown in Figure 5, the mode cover of the high warm hardening of a lamp socket 40 usefulness lamp holder glue is fixed in the outer peripheral face of this neck 31, this lamp socket 40 and this two binding ends 122 are fixed according to corresponding polarity electrical ties.
But the above is merely the preferred embodiments of the present invention; Can not limit the scope that the present invention implements with this; And every simple equivalent of doing according to claim of the present invention and description changes and modifies, and all should still belong in the scope that claim of the present invention contains.
Claims (4)
1. the manufacturing approach of a LED lighting, its step comprises:
In conjunction with stem stem and circuit substrate group: a stem stem is combined fixing with a circuit substrate group; Wherein, this stem stem is provided with an insulating base, two seal wires and a conduit, and this insulating base is a housing of being processed by glass and is provided with an ear that this ear is radially convex shape; These two seal wires fasten in this insulating base respectively and respectively are provided with a support end and a binding end, and each support end is to expose to this insulating base; This conduit is processed and is fastened by glass in this insulating base; This circuit substrate group be set firmly and electrical ties in these two support ends and include more than one LED;
Oven dry: with this circuit substrate group oven dry;
Envelope bubble: prepare a lampshade, this circuit substrate group is placed in this lampshade, this lampshade is to process and be provided with an opening and a neck by glass is one-body molded, and this neck is adjacent to the opening of this lampshade; Make this ear be resisted against the opening part that this neck is adjacent to this lampshade, rotate this lampshade and this stem stem, and utilize thermal-flame that this ear and this neck are sintered to fix; Wherein this conduit is that the inner space that partly exposes to this lampshade and this lampshade communicates with the external world through this conduit;
Bleed: utilize this conduit that the residual air in this lampshade is extracted out;
Aeration: nitrogen or inert gas are poured in this lampshade by this conduit;
Seal: melt disconnected this conduit and make the inner space of this lampshade become airtight conditions with thermal-flame; And
In conjunction with lamp socket and lampshade: a lamp holder sleeve is fixed in this neck, this lamp socket and this two binding ends are fixed according to corresponding polarity electrical ties.
2. according to the manufacturing approach of claim 1 a described LED lighting, wherein in aforesaid baking step, the time of drying aforesaid circuit substrate group is 10～15 minutes, and the temperature of drying aforesaid circuit substrate group is 120 ℃～125 ℃.
3. the manufacturing approach of LED lighting according to claim 1 and 2 wherein in the step of aforesaid envelope bubble, is inverted aforesaid lampshade and is handstand state, and the thermal-flame level penetrates also aims at aforesaid ear.
4. the manufacturing approach of LED lighting according to claim 1 and 2; Wherein in the step of aforesaid envelope bubble; Aforesaid lampshade is erectility; Thermal-flame penetrates and aims at aforesaid ear towards having a down dip, and the folded angle of horizontal plane at thermal-flame and this ear place is a flame angle, and the scope at this flame angle is 5 °～15 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010251721 CN102374392B (en) | 2010-08-11 | 2010-08-11 | Manufacturing method of LED (light emitting diode) lamp fitting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010251721 CN102374392B (en) | 2010-08-11 | 2010-08-11 | Manufacturing method of LED (light emitting diode) lamp fitting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102374392A true CN102374392A (en) | 2012-03-14 |
| CN102374392B CN102374392B (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010251721 Expired - Fee Related CN102374392B (en) | 2010-08-11 | 2010-08-11 | Manufacturing method of LED (light emitting diode) lamp fitting |
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| CN (1) | CN102374392B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103216792A (en) * | 2013-04-24 | 2013-07-24 | 德清新明辉电光源有限公司 | Support of light emitting diode (LED) lighting module |
| CN103363332A (en) * | 2012-04-06 | 2013-10-23 | 赵依军 | LED bulb lamp with large light-emitting angle and manufacturing method thereof |
| CN103822114A (en) * | 2013-09-30 | 2014-05-28 | 孙明 | LED bulb lamp and method for manufacturing same |
| CN105257991A (en) * | 2015-10-09 | 2016-01-20 | 东莞市北科电子科技有限公司 | Ultraviolet light-emitting diode (UV LED) system |
| CN105485637A (en) * | 2015-12-31 | 2016-04-13 | 安徽世林照明股份有限公司 | Encapsulation method for LED filament lamp |
| CN105909996A (en) * | 2016-05-13 | 2016-08-31 | 东莞市华星照明实业有限公司 | Production process for LED glass bulb and LED glass bulb based on production process |
| CN109424868A (en) * | 2017-09-01 | 2019-03-05 | 液光固态照明股份有限公司 | LED bulb and manufacturing method thereof |
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| EP1471564A2 (en) * | 2003-04-10 | 2004-10-27 | Osram Sylvania Inc. | LED lamp |
| US20050007010A1 (en) * | 2003-07-09 | 2005-01-13 | Han-Ming Lee | Structure of the stem of LED chip unit bulb |
| TW200940897A (en) * | 2008-03-21 | 2009-10-01 | Liquidleds Lighting Corp | Glass-sealed LED light bulb and manufacturing method thereof |
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2010
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6523978B1 (en) * | 2000-10-27 | 2003-02-25 | Shining Blick Enterprises Co., Ltd. | Lamp bulb with stretchable lamp beads therein |
| EP1471564A2 (en) * | 2003-04-10 | 2004-10-27 | Osram Sylvania Inc. | LED lamp |
| US20050007010A1 (en) * | 2003-07-09 | 2005-01-13 | Han-Ming Lee | Structure of the stem of LED chip unit bulb |
| TW200940897A (en) * | 2008-03-21 | 2009-10-01 | Liquidleds Lighting Corp | Glass-sealed LED light bulb and manufacturing method thereof |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363332A (en) * | 2012-04-06 | 2013-10-23 | 赵依军 | LED bulb lamp with large light-emitting angle and manufacturing method thereof |
| CN103363332B (en) * | 2012-04-06 | 2017-05-03 | 赵依军 | LED bulb lamp with large light-emitting angle and manufacturing method thereof |
| CN103216792A (en) * | 2013-04-24 | 2013-07-24 | 德清新明辉电光源有限公司 | Support of light emitting diode (LED) lighting module |
| CN103216792B (en) * | 2013-04-24 | 2016-08-17 | 德清新明辉电光源有限公司 | A kind of support seat of LED illuminating module |
| CN103822114A (en) * | 2013-09-30 | 2014-05-28 | 孙明 | LED bulb lamp and method for manufacturing same |
| WO2015043330A1 (en) * | 2013-09-30 | 2015-04-02 | 孙明 | Led bulb lamp and method for manufacturing same |
| CN103822114B (en) * | 2013-09-30 | 2016-05-18 | 亚浦耳照明股份有限公司 | A kind of LED bulb lamp and preparation method thereof |
| US20160258580A1 (en) * | 2013-09-30 | 2016-09-08 | Ming Sun | Led light bulb and manufacturing method thereof |
| CN105257991A (en) * | 2015-10-09 | 2016-01-20 | 东莞市北科电子科技有限公司 | Ultraviolet light-emitting diode (UV LED) system |
| CN105485637A (en) * | 2015-12-31 | 2016-04-13 | 安徽世林照明股份有限公司 | Encapsulation method for LED filament lamp |
| CN105909996A (en) * | 2016-05-13 | 2016-08-31 | 东莞市华星照明实业有限公司 | Production process for LED glass bulb and LED glass bulb based on production process |
| CN109424868A (en) * | 2017-09-01 | 2019-03-05 | 液光固态照明股份有限公司 | LED bulb and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN102374392B (en) | 2013-09-25 |
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