CN102368482A - High-efficiency heat sink of porous metal structure - Google Patents
High-efficiency heat sink of porous metal structure Download PDFInfo
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- CN102368482A CN102368482A CN2011103038628A CN201110303862A CN102368482A CN 102368482 A CN102368482 A CN 102368482A CN 2011103038628 A CN2011103038628 A CN 2011103038628A CN 201110303862 A CN201110303862 A CN 201110303862A CN 102368482 A CN102368482 A CN 102368482A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 69
- 239000002184 metal Substances 0.000 title claims abstract description 69
- 241000276425 Xiphophorus maculatus Species 0.000 claims abstract description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 238000010276 construction Methods 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 9
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 5
- 150000002739 metals Chemical class 0.000 description 23
- 239000000463 material Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000006262 metallic foam Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005187 foaming Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
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Abstract
The invention discloses a high-efficiency heat sink of a porous metal structure, comprising a platy heat conducting part connected with a heat source and a blocky cooling part connected with the heat conducting part, wherein the cooling part is a porous metal structure and is internally and evenly provided with heat conducting bars connected with the heat conducting part; and the heat conducting part, the heat conducting bars and the cooling part are combined into an integral structure. The heat sink is used for solving the problems that a porous metal heat sink in the prior art is low in heat transfer efficiency and poor in cooling effects. The high-efficiency heat sink has the advantages of high heat transfer efficiency and good cooling effects as well as high use value.
Description
Technical field
The present invention relates to the heat abstractor of a kind of semiconductor or other solid state device, especially relate to a kind of high-efficiency radiator that is used for the porous metal structure of high power semi-conductor chip and great power LED cooling.
Background technology
High power semi-conductor chip and great power LED need dispose all that volume is little, the heat abstractor of good heat dissipation effect, and the heat abstractor of prior art is to adopt common aluminium radiator fin to dispel the heat basically; Because aluminium radiator fin is to be the basis according to aluminium section bar; Therefore its area that contacts with air is limited, if take to increase the effect that the method for fin is improved heat radiation, can increase the volume and weight of heat abstractor again; Cost is increased greatly, cause the cost performance of entire product to reduce.High power semi-conductor chips such as the CPU of computer reach the heat radiation of at present popular great power LED; Adopt heat pipe principle to realize the structure of dispelling the heat though also have; But common heat-pipe radiating apparatus all is on heat pipe, to install aluminium flake additional to make radiator at present, and its area of dissipation receives very big restriction.Open day is on March 14th, 2007; Publication number is that the patent document of CN 1929729A discloses a kind of metal foam radiator that is used for electronic heater members, comprises the heating panel that is used to place electronic heater members, and sintering has metal foam layers on the heating panel; Its metal foam layers adopts special processing technology; With any metal foaming material machine-shaping, and high temperature sintering utilizes the metal foam heat exchange area big to heating panel; The characteristics that heat transfer efficiency is high are taken away the heat that metal foam layers stores rapidly.Open day is on February 9th, 2011, and publication number is that the patent document of CN 20174267U discloses and a kind ofly makes the super heat-conductive pipe radiator of radiator with porous metal material, and it comprises porous metals, thermal source connecting plate and heat pipe; Wherein, heat pipe one end inserts porous metals, and the other end inserts the thermal source connecting plate; This structure connects thermal source and thermal component through heat pipe, can save the product installing space, reduces the whole weight of product, and cost saves material.Open day is on May 16th, 2007; Publication number is that the patent document of CN 1964092A discloses a kind of large-power light-emitting diodes that adopts porous metal material as heat abstractor, and it mainly is made up of through welding or bonding encapsulation porous metal material and large-power light-emitting diodes.Adopt the porous metal material produced through electrochemical process such as porous copper or porous aluminum as heat abstractor, can greatly increase area of dissipation, help the heat radiation of large-power light-emitting diodes.The radiator structure of above-mentioned several kinds of patents has all utilized the bigger characteristics of its surface area of porous metals, through increasing area of dissipation, makes the radiating effect of radiator that raising arranged.But said structure all exists the heat of thermal source can't be delivered to the problem in the whole porous metals equably; Because the porosity of porous metals is up to more than 90%; Therefore in porous metals, the effective heat transfer area in the unit are is very little, and we know; The size of heat transferred is directly proportional with heat transfer area; Therefore, this high porosity structure of porous metals makes the heat-conductive characteristic of porous metals be significantly less than conventional radiator, and heat transfer efficiency is very low; And porous metals and thermal source simply are connected or in porous metals, insert heat pipe simply or conducting strip all can't make the heat of thermal source be delivered to equably in the whole porous metals; Said structure is not all considered the conducting problem of heat in porous metals, and the advantage that the inherent shortcoming that heat transfer efficiency is low makes porous metals have the large tracts of land heat-delivery surface is not in full use, and has reduced the radiating effect of porous metals radiators.
Summary of the invention
The objective of the invention is to provide the high-efficiency radiator of the porous metal structure of a kind of heat transfer efficiency height, good heat dissipation effect for the porous metals radiator heat transfer efficiency problem low, the radiating effect difference that solves prior art.
The present invention solves the problems of the technologies described above the technical scheme that is adopted to be: a kind of high-efficiency radiator of porous metal structure; Comprise platy structure heat-conducting part that is connected with thermal source and the block structure radiating part that is connected with heat-conducting part; Described radiating part is a porous metal structure; Be scattered with the heat conduction bar that is connected with heat-conducting part in the radiating part, described heat-conducting part, heat conduction bar and radiating part are integrated well-balancedly.The heat conduction bar that is connected with heat-conducting part is set in the porous metal structure radiating part well-balancedly; Heat-conducting part just can be delivered in the radiating part of porous metal structure through the heat conduction bar from the heat that thermal source absorbs equably; The heat transfer efficiency of porous metal structure radiating part is greatly improved; Therefore the advantage of porous metal structure radiating part with large tracts of land heat-delivery surface just can be not fully exerted, thereby improves the radiating effect of porous metal structure radiator greatly." scattering " described here well-balancedly; Be meant these heat conduction bars evenly or symmetry or ratio harmoniously dispersed placement in entire heat dissipation portion; They can be the structures that equidistantly is arranged in parallel; Also can be equally distributed radial structure, the heat conduction bar self can be identical structure, also can be a kind of structure that rule changes that has.Heat-conducting part, heat conduction bar and radiating part adopt incorporate structure can improve heat transfer efficiency; Can adopt basic mode and the heat-conducting part combination that is provided with the heat conduction bar with porous metals; Generate technology through porous metals again and above heat-conducting part, generate porous metal structure, make the heat conduction bar be arranged in porous metal structure; For simple radiating device structure, also can adopt welding, method such as bonding to make heat-conducting part, heat conduction bar and porous metals be combined into one structure.Like this; Heat-conducting part, heat conduction bar and porous metal structure closely merge and link together; Form the composite metal body; The heat of heat-conducting part is delivered in the porous metal structure through the heat conduction bar rapidly, equably, utilizes porous metal structure to have the advantage of large tracts of land heat-delivery surface, heat is distributed rapidly.
As preferably, described heat conduction bar is column or platy structure, and the heat conduction bar is vertically set on the heat-conducting part of platy structure equally spacedly.This structure can make in the entire heat dissipation portion that the heat conduction bar arranges uniformly, is suitable for the heat radiation that thermal source is planar heater members.
As a kind of possibility, described heat conduction bar is column structure, and the heat conduction bar is on the radial heat-conducting part that is arranged on platy structure.The heat conduction bar of this structure is radial arrangement, and is concentrated relatively near heat-conducting part heat conduction bar, is suitable for the heat radiation that thermal source is the heater members of point-like.
As alternative dispensing means, described heat conduction bar spaced set, the integrated fenestral fabric that connects and composes solid between heat conduction bar and the heat conduction bar.This structure also is provided with the heat conduction bar of transversary except that the heat conduction bar that is provided with traditional sensing thermal source, the fenestral fabric of this solid can make in the entire heat dissipation portion that the heat conduction bar arranges uniformly, is particularly suitable for the heat radiation that thermal source is planar heater members.
As preferably; Described heat-conducting part is a slab construction; Described heat conduction bar is arranged on the vertical direction and horizontal direction of radiating part; In the horizontal direction heat conduction bar is set is intersected vertically by the heat conduction bar of the heat conduction bar of fore-and-aft direction and left and right directions and constitute, the horizontal direction heat conduction bar of the heat conduction bar of vertical direction and differing heights intersects vertically, and its bottom of heat conduction bar of vertical direction links to each other with heat-conducting part.Though the heat conduction bar of stereo grid shaped structure can adopt multiple arrangement mode, structure mutually orthogonal between the heat conduction bar can reduce manufacture difficulty, reduces production costs.
As preferably, the heat conduction bar of vertical direction is taper or wedge-like structure, and its cross-sectional area successively decreases to the heat conduction bar upper end away from heat-conducting part from the heat conduction bar bottom that connects heat-conducting part; Near its cross-sectional area of horizontal direction heat conduction bar of heat-conducting part greater than cross-sectional area away from the horizontal direction heat conduction bar of heat-conducting part.Consider in the heat transfer process and can constantly distribute; Therefore near its cross-sectional area of heat conduction bar of heat-conducting part greater than cross-sectional area away from the heat conduction bar of heat-conducting part, can alleviate the weight of radiator like this, economical with materials; Reduce cost, also can increase the area of dissipation of radiating part simultaneously.
As a kind of possibility, described heat-conducting part is a slab construction, and described heat conduction bar integral body is shape in the shape of a spiral, and spiral helicine its helical centre of heat conduction bar is vertical with the heat-conducting part of slab construction, and the bottom of heat conduction bar links to each other with heat-conducting part.This programme utilizes heat being delivered to the radiating part of stereochemical structure from heat-conducting part around structure of spiral, is provided with simple, with low cost.
As preferably, described spiral helicine its body of heat conduction bar is taper or wedge-like structure, and the cross-sectional area of heat conduction bar body successively decreases to the heat conduction bar upper end away from heat-conducting part from the heat conduction bar bottom that connects heat-conducting part.Consider in the heat transfer process and can constantly distribute; Therefore near its cross-sectional area of heat conduction bar of heat-conducting part greater than cross-sectional area away from the heat conduction bar of heat-conducting part, can alleviate the weight of radiator like this, economical with materials; Reduce cost, also can increase the area of dissipation of radiating part simultaneously.
As preferably, described spiral helicine heat conduction bar is inverted tower spring shape, near its spiral girth of helical form heat conduction bar of heat-conducting part less than spiral girth away from the helical form heat conduction bar of heat-conducting part.Inverted tower spring shape structural heat conducting bar can be so that increase away from the heat conduction rod density of heat-conducting part, and more heat is able to be delivered to the top of radiator, can let the heat distribution of radiating part more even like this, helps improving radiating effect.
As preferably, heat-conducting part and heat conduction bar are aluminium, aluminium alloy or copper, copper alloy, and radiating part is foam copper, foamed aluminium, nickel foam or foam iron.
The invention has the beneficial effects as follows: the porous metals radiator heat transfer efficiency that it has solved prior art effectively is low, the problem of radiating effect difference; Porous metal structure high-efficiency radiator heat transfer efficiency of the present invention is high, good heat dissipation effect, has very high use value.
Description of drawings
Fig. 1 is a kind of structural representation of the high-efficiency radiator embodiment 1 of porous metal structure of the present invention;
Fig. 2 is a kind of structural representation of the high-efficiency radiator embodiment 3 of porous metal structure of the present invention;
Fig. 3 is a kind of structural representation of the high-efficiency radiator embodiment 5 of porous metal structure of the present invention;
Fig. 4 is a kind of heat-conducting plate and the syndeton sketch map of heat conduction bar of the high-efficiency radiator embodiment 5 of porous metal structure of the present invention;
Fig. 5 is a kind of heat-conducting plate and the syndeton sketch map of heat conduction bar of the high-efficiency radiator embodiment 6 of porous metal structure of the present invention;
Fig. 6 is a kind of structural representation of the high-efficiency radiator embodiment 7 of porous metal structure of the present invention;
Fig. 7 is the vertical view of Fig. 6;
Fig. 8 is a kind of structural representation of the high-efficiency radiator embodiment 10 of the utility model porous metal structure;
Fig. 9 is a kind of structural representation of the high-efficiency radiator embodiment 11 of the utility model porous metal structure.
Embodiment
Pass through embodiment below, and combine accompanying drawing that the embodiment of technical scheme of the present invention is further described.
In embodiment shown in Figure 11; A kind of high-efficiency radiator of porous metal structure; Comprise copper platy structure heat-conducting part that is connected with thermal source and the block structure radiating part that is connected with heat-conducting part, described radiating part 1 is a porous metal foam copper, is scattered with the copper heat conduction bar 3 that is connected with heat-conducting part 2 in the radiating part well-balancedly; Described heat conduction bar is column structure; The heat conduction bar is vertically set on the heat-conducting part of platy structure equally spacedly, and the lower end of heat conduction bar is connected with heat-conducting part, and described heat-conducting part, heat conduction bar and radiating part are integrated.
Its heat conduction bar of the high-efficiency radiator of embodiment 2 is platy structure, and all the other are identical with embodiment 1.
In embodiment shown in Figure 23, described heat conduction bar is platy structure, and the heat conduction bar is on the radial heat-conducting part that is arranged on platy structure, and all the other are identical with embodiment 2.
Embodiment 4
Its heat conduction bar of the high-efficiency radiator of embodiment 4 is column structure, and the heat conduction bar is on the three-dimensional radial heat-conducting part that is arranged on platy structure, and all the other are identical with embodiment 1.
Embodiment 5
In Fig. 3, embodiment 5 shown in Figure 4, described heat conduction bar is cylindric, and spaced set integratedly between heat conduction bar and the heat conduction bar connects and composes three-dimensional fenestral fabric; Described heat-conducting part is a slab construction; Described heat conduction bar is arranged on the vertical direction and horizontal direction of radiating part; In the horizontal direction heat conduction bar is set to be intersected vertically by the heat conduction bar of the heat conduction bar of fore-and-aft direction and left and right directions and constitutes; The horizontal direction heat conduction bar of the heat conduction bar of vertical direction and differing heights intersects vertically, and its bottom of heat conduction bar of vertical direction links to each other with heat-conducting part, and all the other are identical with embodiment 1.
Embodiment 6
In embodiment shown in Figure 56; The heat-conducting part of radiator and heat conduction bar are aluminium matter; The porous metals of radiating part are foaming aluminium, and the heat conduction bar of vertical direction is the pyramid-shaped structure, and its cross-sectional area successively decreases to the heat conduction bar upper end away from heat-conducting part from the heat conduction bar bottom that connects heat-conducting part; Greater than the cross-sectional area away from the horizontal direction heat conduction bar of heat-conducting part, all the other are identical with embodiment 5 near its cross-sectional area of horizontal direction heat conduction bar of heat-conducting part.
Embodiment 7
In Fig. 6 embodiment 7 shown in Figure 7, described heat-conducting part is a slab construction, and described heat conduction bar integral body is shape in the shape of a spiral; Spaced set; Spiral helicine its helical centre of heat conduction bar is vertical with the heat-conducting part of slab construction, and the bottom of heat conduction bar links to each other with heat-conducting part, and all the other are identical with embodiment 1.
Embodiment 8
Its spiral helicine heat conduction bar body of the high-efficiency radiator of embodiment 8 is the wedge-like structure, and the cross-sectional area of heat conduction bar body successively decreases to the heat conduction bar upper end away from heat-conducting part from the heat conduction bar bottom that connects heat-conducting part, and all the other are identical with embodiment 7.
Embodiment 9
The spiral helicine heat conduction bar of embodiment 9 is inverted tower spring shape, and less than the spiral girth away from the helical form heat conduction bar of heat-conducting part, all the other are identical with embodiment 8 near its spiral girth of helical form heat conduction bar of heat-conducting part.
Embodiment 10
In embodiment shown in Figure 8 10, heat-conducting part is a slab construction, and the heat conduction bar is one and is arranged on radiating part centre position and the riser vertical with heat-conducting part that be integrally formed structure through welding between radiating part and heat conduction bar and the heat-conducting part, all the other are identical with embodiment 1.
Embodiment 11
In embodiment shown in Figure 9 11, heat-conducting part is a slab construction, and radiating part is block structure and is set directly on the heat-conducting part, heat-conducting part and radiating part be between through the bonding structure that is integrally formed.
In the above-described embodiments; Can adopt basic mode and the heat-conducting part combination that is provided with the heat conduction bar, generate technology through porous metals again and above heat-conducting part, generate porous metal structure, make the heat conduction bar be arranged in porous metal structure porous metals; Thereby make heat-conducting part, heat conduction bar and becoming one of radiating part structure; And, also can adopt welding, method such as bonding to make heat-conducting part, heat conduction bar and porous metals be combined into one structure, when between two kinds of different materials, welding for simple radiating device structure; Can on a kind of therein material transition zone be set, with convenient and other a kind of material welding.
High-efficiency radiator of the present invention in use; Heat-conducting part is close to the radiating surface of high power semi-conductor chip or great power LED; The heat that high power semi-conductor chip or great power LED produce is delivered in the porous metal structure through the heat conduction bar rapidly, equably; Utilize porous metal structure to have the advantage of large tracts of land heat-delivery surface, through modes such as natural cooling, air blast cooling or water-cooleds, heat is distributed rapidly again.
The foregoing description only is used for illustrative and explanation the present invention, rather than to the restriction of embodiment of the present invention, in the protection range of spirit of the present invention and claim, any modification and change to the present invention makes all fall in protection scope of the present invention.
Claims (10)
1. the high-efficiency radiator of a porous metal structure; Comprise platy structure heat-conducting part that is connected with thermal source and the block structure radiating part that is connected with heat-conducting part; It is characterized in that: described radiating part (1) is a porous metal structure; Be scattered with the heat conduction bar (3) that is connected with heat-conducting part (2) in the radiating part, described heat-conducting part, heat conduction bar and radiating part are integrated well-balancedly.
2. the high-efficiency radiator of porous metal structure according to claim 1, it is characterized in that: described heat conduction bar is column or platy structure, and the heat conduction bar is vertically set on the heat-conducting part of platy structure equally spacedly.
3. the high-efficiency radiator of porous metal structure according to claim 1, it is characterized in that: described heat conduction bar is column structure, and the heat conduction bar is on the radial heat-conducting part that is arranged on platy structure.
4. the high-efficiency radiator of porous metal structure according to claim 1 is characterized in that: described heat conduction bar spaced set, the integrated fenestral fabric that connects and composes solid between heat conduction bar and the heat conduction bar.
5. the high-efficiency radiator of porous metal structure according to claim 4; It is characterized in that: described heat-conducting part is a slab construction; Described heat conduction bar is arranged on the vertical direction and horizontal direction of radiating part; In the horizontal direction heat conduction bar is set is intersected vertically by the heat conduction bar of the heat conduction bar of fore-and-aft direction and left and right directions and constitute, the horizontal direction heat conduction bar of the heat conduction bar of vertical direction and differing heights intersects vertically, and its bottom of heat conduction bar of vertical direction links to each other with heat-conducting part.
6. the high-efficiency radiator of porous metal structure according to claim 5, it is characterized in that: the heat conduction bar of vertical direction is taper or wedge-like structure, and its cross-sectional area successively decreases to the heat conduction bar upper end away from heat-conducting part from the heat conduction bar bottom that connects heat-conducting part; Near its cross-sectional area of horizontal direction heat conduction bar of heat-conducting part greater than cross-sectional area away from the horizontal direction heat conduction bar of heat-conducting part.
7. the high-efficiency radiator of porous metal structure according to claim 1; It is characterized in that: described heat-conducting part is a slab construction; Described heat conduction bar integral body is shape in the shape of a spiral; Spiral helicine its helical centre of heat conduction bar is vertical with the heat-conducting part of slab construction, and the bottom of heat conduction bar links to each other with heat-conducting part.
8. the high-efficiency radiator of porous metal structure according to claim 7; It is characterized in that: described spiral helicine its body of heat conduction bar is taper or wedge-like structure, and the cross-sectional area of heat conduction bar body successively decreases to the heat conduction bar upper end away from heat-conducting part from the heat conduction bar bottom that connects heat-conducting part.
9. the high-efficiency radiator of porous metal structure according to claim 8; It is characterized in that: described spiral helicine heat conduction bar is inverted tower spring shape, near its spiral girth of helical form heat conduction bar of heat-conducting part less than spiral girth away from the helical form heat conduction bar of heat-conducting part.
10. according to the high-efficiency radiator of claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 described porous metal structures; It is characterized in that: heat-conducting part and heat conduction bar are aluminium, aluminium alloy or copper, copper alloy, and radiating part is foam copper, foamed aluminium, nickel foam or foam iron.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103038628A CN102368482B (en) | 2011-10-10 | 2011-10-10 | High-efficiency heat sink of porous metal structure |
| PCT/CN2011/083296 WO2013053174A1 (en) | 2011-10-10 | 2011-12-01 | High efficiency heat sink with porous metal structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103038628A CN102368482B (en) | 2011-10-10 | 2011-10-10 | High-efficiency heat sink of porous metal structure |
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| CN102368482A true CN102368482A (en) | 2012-03-07 |
| CN102368482B CN102368482B (en) | 2013-06-19 |
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| CN2011103038628A Expired - Fee Related CN102368482B (en) | 2011-10-10 | 2011-10-10 | High-efficiency heat sink of porous metal structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105144374A (en) * | 2013-04-23 | 2015-12-09 | 亚历克西乌和特里德控股公司 | Heat sink having a cooling structure with decreasing structure density |
| CN105960150A (en) * | 2016-07-10 | 2016-09-21 | 李增珍 | Method for manufacturing air-cooled radiator |
| CN110678319A (en) * | 2017-03-23 | 2020-01-10 | 昆特斯技术公司 | Pressing equipment |
| US10782078B2 (en) | 2016-09-13 | 2020-09-22 | Bgt Materials Limited | Heat dissipation coating layer and manufacturing method thereof |
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| CN105144374A (en) * | 2013-04-23 | 2015-12-09 | 亚历克西乌和特里德控股公司 | Heat sink having a cooling structure with decreasing structure density |
| CN105960150A (en) * | 2016-07-10 | 2016-09-21 | 李增珍 | Method for manufacturing air-cooled radiator |
| US10782078B2 (en) | 2016-09-13 | 2020-09-22 | Bgt Materials Limited | Heat dissipation coating layer and manufacturing method thereof |
| CN110678319A (en) * | 2017-03-23 | 2020-01-10 | 昆特斯技术公司 | Pressing equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102368482B (en) | 2013-06-19 |
| WO2013053174A1 (en) | 2013-04-18 |
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