Summary of the invention
In order to alleviate shortcomings and deficiencies of the prior art, the object of the present invention is to provide a kind of electrocondution slurry and preparation method thereof.
The present invention adopts following technical scheme to achieve these goals:
Electrocondution slurry is characterized in that the weight portion of its constitutive material is: metal dust 15-30 part, attapulgite 2-5 part, stalk ashes 1-3 part, polyamide 10-20 part, phenolic resins 10-15 part, fatty acid ester 5-10 part, aliphatic acid 30-40 part, expoxy propane phenyl ether 5-10 part, methyl triacetoxysilane 15-25 part, thickener 5-10 part, dispersant 5-10 part and levelling agent 5-10 part.
Described electrocondution slurry is characterized in that: described metal dust is selected from a kind of or its mixture in silver powder, copper powder, aluminium powder and the nickel powder.
Described electrocondution slurry is characterized in that: described dispersant is selected from Bi Ke chemistry BYK-2150, and levelling agent is selected from EFKA EFKA-3600, and thickener is selected from the molten expansion emulsus of alkali thickener.
The preparation method of electrocondution slurry is characterized in that may further comprise the steps:
(1) it is even to press weight portion Mixed Concave convex rod soil, stalk ashes, methyl triacetoxysilane, aliphatic acid, expoxy propane phenyl ether and the fatty acid ester mixed at high speed of constitutive material, obtains organic carrier;
(2) press weight portion mixed metal powder, phenolic resins and the polyamide of constitutive material, obtain mixed liquor;
(3) mixed liquor in the step (2) is joined in the organic carrier in the step (1), and add thickener, dispersant and levelling agent, obtain electrocondution slurry through stirring, grinding.
Beneficial effect of the present invention:
Preparation method of the present invention is simple, and is easy to operate, and prescription is reasonable, and the electrocondution slurry that the present invention makes can be widely used in the productions such as thin film switch, circuit and circuit board, and the electrocondution slurry unharmful substance, meets national standard.
Embodiment
Embodiment 1:Electrocondution slurry, the weight portion of its constitutive material is: 8 parts of 20 parts of silver powder, 3 parts of attapulgites, 2 parts in stalk ashes, 15 parts of polyamides, 12 parts in phenolic resins, 8 parts of fatty acid esters, 35 parts in aliphatic acid, 8 parts of expoxy propane phenyl ethers, 20 parts of methyl triacetoxysilanes, 8 parts of thickeners, 8 parts of dispersants and levelling agents.
Described dispersant is selected from Bi Ke chemistry BYK-2150, and levelling agent is selected from EFKA EFKA-3600, and thickener is selected from the molten expansion emulsus of alkali thickener.
The preparation method of electrocondution slurry may further comprise the steps:
(1) it is even to press weight portion Mixed Concave convex rod soil, stalk ashes, methyl triacetoxysilane, aliphatic acid, expoxy propane phenyl ether and the fatty acid ester mixed at high speed of constitutive material, obtains organic carrier;
(2) press weight portion combined silver powder, phenolic resins and the polyamide of constitutive material, obtain mixed liquor;
(3) mixed liquor in the step (2) is joined in the organic carrier in the step (1), and add thickener, dispersant and levelling agent, obtain electrocondution slurry through stirring, grinding.
Embodiment 2:Electrocondution slurry, the weight portion of its constitutive material is: 5 parts of 20 parts of copper powders may, 4 parts of attapulgites, 3 parts in stalk ashes, 15 parts of polyamides, 12 parts in phenolic resins, 10 parts of fatty acid esters, 35 parts in aliphatic acid, 8 parts of expoxy propane phenyl ethers, 20 parts of methyl triacetoxysilanes, 5 parts of thickeners, 6 parts of dispersants and levelling agents.
Dispersant is selected from Bi Ke chemistry BYK-2150, and levelling agent is selected from EFKA EFKA-3600, and thickener is selected from the molten expansion emulsus of alkali thickener.
The preparation method of electrocondution slurry may further comprise the steps:
(1) it is even to press weight portion Mixed Concave convex rod soil, stalk ashes, methyl triacetoxysilane, aliphatic acid, expoxy propane phenyl ether and the fatty acid ester mixed at high speed of constitutive material, obtains organic carrier;
(2) press weight portion mixed copper powder, phenolic resins and the polyamide of constitutive material, obtain mixed liquor;
(3) mixed liquor in the step (2) is joined in the organic carrier in the step (1), and add thickener, dispersant and levelling agent, obtain electrocondution slurry through stirring, grinding.
Embodiment 3:Electrocondution slurry, the weight portion of its constitutive material is: 7 parts of 20 parts of aluminium powders, 5 parts of attapulgites, 3 parts in stalk ashes, 20 parts of polyamides, 15 parts in phenolic resins, 10 parts of fatty acid esters, 40 parts in aliphatic acid, 10 parts of expoxy propane phenyl ethers, 25 parts of methyl triacetoxysilanes, 10 parts of thickeners, 8 parts of dispersants and levelling agents.
Dispersant is selected from Bi Ke chemistry BYK-2150, and levelling agent is selected from EFKA EFKA-3600, and thickener is selected from the molten expansion emulsus of alkali thickener.
The preparation method of electrocondution slurry may further comprise the steps:
(1) it is even to press weight portion Mixed Concave convex rod soil, stalk ashes, methyl triacetoxysilane, aliphatic acid, expoxy propane phenyl ether and the fatty acid ester mixed at high speed of constitutive material, obtains organic carrier;
(2) press weight portion aluminum mixture powder, phenolic resins and the polyamide of constitutive material, obtain mixed liquor;
(3) mixed liquor in the step (2) is joined in the organic carrier in the step (1), and add thickener, dispersant and levelling agent, obtain electrocondution slurry through stirring, grinding.
Embodiment 4:Electrocondution slurry performance test of the present invention, as follows:
1, sheet resistance is≤0.018 Ω; 2, shielding rate>75dB; 3, adhesive force is 4.5B; 4, hardness is 2.5H; 5, bake out temperature is 60 ℃, only needs 15 minutes.