CN102363331A - Mortar jet flow device for cutting silicon chip - Google Patents
Mortar jet flow device for cutting silicon chip Download PDFInfo
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- CN102363331A CN102363331A CN2011101756262A CN201110175626A CN102363331A CN 102363331 A CN102363331 A CN 102363331A CN 2011101756262 A CN2011101756262 A CN 2011101756262A CN 201110175626 A CN201110175626 A CN 201110175626A CN 102363331 A CN102363331 A CN 102363331A
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- mortar
- silicon chip
- stirring
- pipe
- outer tube
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Abstract
The invention provides a mortar jet flow device for cutting a silicon chip. The mortar jet flow device comprises an outer casing, an inner pipe and a stirring device, wherein the inner pipe is arranged in the outer casing; an annular gap is formed between the inner pipe and an outer pipe; the inner pipe is provided with a plurality of through holes along the axis direction of the pipe; the outer casing is provided with a slot along the axis direction; the stirring device comprises a stirring shaft and a stirring blade; one end of the stirring shaft is axially arranged in the inner pipe, and the other end of the stirring shaft extends out of the outer casing; and the stirring blade is fixed on the stirring shaft. During working, the stirring shaft of the stirring device rotates at a low speed, the stirring blade is used for stirring mortar, and grinding material particles in mortar are in suspension state and are distributed more uniformly, so that ejected mortar has more uniform density, damage in the silicon chip cutting process is avoided, the yield of the silicon chip is increased, and the quality is improved; and the mortar jet flow device has a simple structure.
Description
Technical field
The present invention relates to the unrestrained device of a kind of spray, particularly a kind of silicon chip cuts the jet apparatus of mortar, belongs to the technical field of silicon chip process equipment.
Background technology
Along with the development of solar energy industry, the use of silicon chip more and more widely.The silicon chip cutting technique plays a key effect to the quality of silicon chip.Usually silicon chip cuts through the wearing and tearing between the mortar, line of cut and the silicon chip that have abrasive material, thereby realizes the cutting of silicon chip.During the silicon chip cutting, the flow of mortar, the uniformity of Density Distribution are the key factors that influences piece rate, goes out tablet quality, and density unevenness or local cutout can cause the scuffing of silicon chip, thereby influence the qualification rate of silicon chip.Mortar jet apparatus of the prior art comprises the interior pipe that is used for feeding mortar is housed in outer tube, the outer tube, is provided with annular space between interior pipe and the outer tube, and interior pipe is provided with a plurality of through holes along the direction of tube's axis, and outer tube is provided with slit along axis direction; During work, mortar ejects through through hole, and mortar receives stopping of outer tube tube wall, changes to flow to; In the gap in being filled between pipe and the outer tube, under pump function, flow down formation mortar curtain along slit; The spray wave device of this structure, mortar forms deposition easily in interior pipe, make abrasive grain skewness in the mortar; Thereby, influenced the quality of silicon chip, reduced the qualification rate of silicon chip.
Summary of the invention
Technical problem to be solved by this invention provides a kind of mortar jet apparatus that is used for the silicon chip cutting, and this jet apparatus can improve the uniformity of abrasive grain in the mortar, guarantees that slurry density is even, improve silicon chip qualification rate and quality, and this apparatus structure is simple.
In order to solve the problems of the technologies described above, a kind of mortar jet apparatus that is used for the silicon chip cutting of the present invention comprises outer tube; In the pipe, said in the pipe be installed in the said outer tube, said in the pipe and outer tube between be provided with annular space; Interior pipe is provided with a plurality of through holes along the direction of tube's axis, and outer tube is provided with slit along axis direction, wherein; Also comprise agitating device, said agitating device comprises shaft, paddle, in managing in said shaft one end is axially disposed within; The other end extends in outside the outer tube, and said paddle is fixedly installed on the shaft.Above-mentioned a kind of mortar jet apparatus that is used for the silicon chip cutting, wherein, the angle of said paddle and shaft is 150 degree.
The present invention can realize following beneficial effect: owing to be provided with agitating device in the interior pipe, during work, the shaft of agitating device slowly runs; Paddle is stirred mortar, make the abrasive grain in the mortar be in suspended state, and more even distribution; Thereby, make the slurry density that ejects more even, avoid the damage in the silicon chip cutting process; Thereby, improved the qualification rate and the quality of silicon chip; And the present invention is simple in structure.
The accompanying drawing accompanying drawing
Fig. 1 is a structural representation of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described further.
As shown in the figure, in order to solve the problems of the technologies described above a kind of mortar jet apparatus that is used for the silicon chip cutting of the present invention; Comprise outer tube 1, interior pipe 2, said interior pipe 2 is installed in the said outer tube 1; Be provided with annular space 3 between pipe 2 and the outer tube 1 in said, interior pipe 2 is provided with a plurality of through holes 4 along the direction of tube's axis, and outer tube 1 is provided with slit along axis direction; Also comprise agitating device, said agitating device comprises shaft 5, paddle 6, and said shaft 5 one ends pass outer tube 1 and interior pipe 2 is axially disposed within the interior pipe 2; The other end extends in outside the outer tube 1, is sealed and matched between shaft 5 peripheries and outer tube 1 and the interior pipe 2, and said paddle 6 is fixedly installed on the shaft 1; Paddle quantity is unrestricted, can design as required.Said paddle 6 is the 150 degree people with the angle [alpha] of shaft 5, is obstructed when avoiding mortar to flow into interior the pipe, prevents mortar skewness in interior pipe 2.
This device directly links to each other with the mortar feed system, is fixed on the mortar distributor, and during work, mortar gets into from the inlet of interior pipe; Behind the pipe, the shaft 5 through agitating device slowly runs, and 6 pairs of mortars of paddle are stirred in carrying out; Contain abrasive grain in the mortar, abrasive material is generally diamond dust, makes the abrasive grain in the mortar be in suspended state; And more even distribution, thereby, make the slurry density that ejects more even; Avoid the damage in the silicon chip cutting process, thereby, the qualification rate and the quality of silicon chip improved; And the present invention is simple in structure.
Those of ordinary skill in the art will be appreciated that; Above embodiment is used for explaining the object of the invention; And be not with opposing qualification of the present invention; As long as in essential scope of the present invention, all will drop in the scope of claim of the present invention variation, the modification of the above embodiment.
Claims (2)
1. a mortar jet apparatus that is used for the silicon chip cutting comprises outer tube, interior pipe; Pipe is installed in the said outer tube in said, is provided with annular space between said interior pipe and the outer tube, and interior pipe is provided with a plurality of through holes along the direction of tube's axis; Outer tube is provided with slit along axis direction, it is characterized in that, also comprises agitating device; Said agitating device comprises shaft, paddle; In the pipe, the other end extended in outside the outer tube in said shaft one end was axially disposed within, and said paddle is fixedly installed on the shaft.
2. a kind of according to claim 1 mortar jet apparatus that is used for the silicon chip cutting is characterized in that, the angle of said paddle and shaft is 150 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101756262A CN102363331A (en) | 2011-06-27 | 2011-06-27 | Mortar jet flow device for cutting silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101756262A CN102363331A (en) | 2011-06-27 | 2011-06-27 | Mortar jet flow device for cutting silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102363331A true CN102363331A (en) | 2012-02-29 |
Family
ID=45689939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101756262A Pending CN102363331A (en) | 2011-06-27 | 2011-06-27 | Mortar jet flow device for cutting silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102363331A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103802033A (en) * | 2012-11-12 | 2014-05-21 | 重庆渝弘嘉城汽车配件制造有限公司 | Propeller type equalization device and sand blasting system |
| CN107139085A (en) * | 2017-06-29 | 2017-09-08 | 安徽新兴翼凌机电发展有限公司 | A kind of portable abrasive jet cutting arrangement |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201493067U (en) * | 2009-09-11 | 2010-06-02 | 镇江市港南电子有限公司 | Wafer grinding sand liquid preparation device |
| RU2393077C1 (en) * | 2009-06-25 | 2010-06-27 | Государственное образовательное учреждение высшего профессионального образования "Московский государственный университет прикладной биотехнологии" | Device for hydroabrasive cutting |
| CN101966727A (en) * | 2010-09-29 | 2011-02-09 | 中国电子科技集团公司第四十八研究所 | Multi-wire cutting machine mortar jet flow device |
| CN102059068A (en) * | 2011-01-17 | 2011-05-18 | 西安华晶电子技术有限公司 | Single-shaft mortar and high-viscosity fluid stirrer for axial turbulent flow pattern multi-wire cutting machine |
| CN102068935A (en) * | 2010-10-28 | 2011-05-25 | 镇江市港南电子有限公司 | Stirring device of silicon sheet grinding fluid |
-
2011
- 2011-06-27 CN CN2011101756262A patent/CN102363331A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2393077C1 (en) * | 2009-06-25 | 2010-06-27 | Государственное образовательное учреждение высшего профессионального образования "Московский государственный университет прикладной биотехнологии" | Device for hydroabrasive cutting |
| CN201493067U (en) * | 2009-09-11 | 2010-06-02 | 镇江市港南电子有限公司 | Wafer grinding sand liquid preparation device |
| CN101966727A (en) * | 2010-09-29 | 2011-02-09 | 中国电子科技集团公司第四十八研究所 | Multi-wire cutting machine mortar jet flow device |
| CN102068935A (en) * | 2010-10-28 | 2011-05-25 | 镇江市港南电子有限公司 | Stirring device of silicon sheet grinding fluid |
| CN102059068A (en) * | 2011-01-17 | 2011-05-18 | 西安华晶电子技术有限公司 | Single-shaft mortar and high-viscosity fluid stirrer for axial turbulent flow pattern multi-wire cutting machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103802033A (en) * | 2012-11-12 | 2014-05-21 | 重庆渝弘嘉城汽车配件制造有限公司 | Propeller type equalization device and sand blasting system |
| CN107139085A (en) * | 2017-06-29 | 2017-09-08 | 安徽新兴翼凌机电发展有限公司 | A kind of portable abrasive jet cutting arrangement |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120229 |