CN102354906B - Expansion refrigeration system of high-power semiconductor laser - Google Patents
Expansion refrigeration system of high-power semiconductor laser Download PDFInfo
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- CN102354906B CN102354906B CN 201110278193 CN201110278193A CN102354906B CN 102354906 B CN102354906 B CN 102354906B CN 201110278193 CN201110278193 CN 201110278193 CN 201110278193 A CN201110278193 A CN 201110278193A CN 102354906 B CN102354906 B CN 102354906B
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Abstract
The invention discloses an expansion refrigeration system of a high-power semiconductor laser, comprising a refrigeration compressor, a condenser and a laser refrigeration packaging assembly in sequent communication based on a refrigerant flow, wherein the laser refrigeration packaging assembly is provided with an expansion cavity, an refrigerant is expanded, evaporated and gasified in the expansion cavity of the laser refrigeration packaging assembly and then returns to an inlet of the refrigeration compressor; and a semiconductor laser array is in heat conduction connection with an externalwall of the expansion cavity. According to the invention, an expanded and refrigerated capillary tube and an evaporator assembly are arranged in the laser refrigeration packaging assembly, thus the expansion refrigeration system has larger refrigerator power, and has a preferable cooling effect when being applied to the high power semiconductor laser array, as well as overcomes the defects such as high manufacturing accuracy, complicated process, large volume and high pressure in the prior art, thereby saving energy sources; and an independent cooling water precooling system is not used in the expansion refrigeration system, and the expansion refrigeration system is simple in structure, operated conveniently, and low in use cost, thus reducing the cost of a semiconductor laser cooling system, and improving the service life of the semiconductor laser.
Description
Technical field
The present invention relates to a kind of semiconductor laser cooling system, particularly a kind of for the high power semiconductor lasers cooling system.
Background technology
Semiconductor laser has that volume is little, lightweight, the life-span is long, the electro-optical efficiency advantages of higher, is widely used in the every field of science and technology and national economy.Since the invention of superlattice quantum well laser material, along with the needs of Practical Project development, the power output of semiconductor laser is also more and more higher, and thermal power density also (reaches 4-6W/mm greatly
2), this has just proposed very high requirement to cooling technology and device.
In the prior art, for the high power semiconductor lasers array cooling effect of continuous or quasi-continuous output preferably technology be that sharp formol National Laboratory of California, USA university was in invention in 1992, and in practical microchannel cooling assembly (Modular Microchannel Cooled Heatsinks) in 1996, use it not only to have good cooling effect, and can realize the laminated face battle array that is assembled into of a plurality of diode laser arrays to obtain more large-power semiconductor Laser output, so microchannel cooling assembly also becomes the requisite critical component of development large-power semiconductor laser technology.Although through application practice for many years, microchannel cooling assembly has also had many improvement, basic structure and the type of cooling there is no large change.
In the prior art, a kind of microchannel cooling assembly of high-power laser diode array also occurred, be applied to high power semiconductor lasers and have preferably cooling effect.
In the technique scheme, higher to the making required precision of device, process procedure is many, and comparatively complicated, and rate of finished products is low, has improved manufacturing cost, so that promoting the use of of microchannel cooling assembly is greatly limited; This device also has special requirement to required refrigerating system and cooling water recirculation system, must adopt the cooling of high pressure (approximately 0.5Mpa) pure water, used cooling water also must freeze in advance, need the water under high pressure cooling system that volume is larger, incompatible with the advantage that the semiconductor laser volume is little, affected the convenience of using.
Therefore, need to improve the refrigerating system of high power semiconductor lasers, have larger refrigeration work consumption, be applied to the high power semiconductor lasers array and have preferably cooling effect, change make in the prior art that precision is high, complex process and volume is large, pressure is high shortcoming, energy savings, and simple in structure, easy to operate, use cost is low, thereby reduce the cost of semiconductor laser cooling system, improve the useful life of semiconductor laser.
Summary of the invention
In view of this, purpose of the present invention provides a kind of expansion refrigeration system of high-power semiconductor laser, have larger refrigeration work consumption, be applied to the high power semiconductor lasers array and have preferably cooling effect, change make in the prior art that precision is high, complex process and volume is large, pressure is high shortcoming, energy savings, and simple in structure, easy to operate, use cost is low, thereby reduce the cost of semiconductor laser cooling system, improve the useful life of semiconductor laser.
Expansion refrigeration system of high-power semiconductor laser of the present invention comprises the refrigerant compressor, condenser and the laser refrigeration package assembling that are communicated with successively by the refrigerant flow process; Described laser refrigeration package assembling is provided with expansion chamber, and described refrigerant expands in the expansion chamber of laser refrigeration package assembling and is back to the refrigerant compressor import after evaporation is gasified; Semiconductor laser array is connected with the heat conduction of expansion chamber outer wall.
Further, described laser refrigeration package assembling comprises the substrate group that a slice substrate at least closely is built up and lays respectively at substrate both sides and substrate group tight superimposed holding piece I and holding piece II, described substrate surface etching expansion slot and the capillary channel that communicates with expansion slot, the capillary channel that described expansion slot and capillary channel form respectively expansion chamber and communicate with expansion chamber by closely superimposed adjacent substrate or holding piece I sealing, described capillary channel is communicated with condensator outlet, and expansion chamber is communicated in the suction port of compressor;
Further, described substrate is provided with for the heavy stand that semiconductor laser array is installed, and described expansion slot is positioned at the heavy stand dorsal part, and is contained within heavy stand;
Further, described expansion chamber is provided with the expansion chamber media outlet, and capillary channel is provided with the import of capillary channel medium, and the import of capillary channel medium and expansion chamber media outlet are is located at on-chip through hole.
Further, the size of described expansion chamber is more than or equal to the size of semiconductor laser array, and the medium import that described expansion chamber media outlet and expansion chamber are used for being communicated with capillary channel lays respectively at expansion chamber along the two ends of semiconductor laser array;
Further, described holding piece I is provided with the inlet channel that is communicated in the import of capillary channel medium, and holding piece II is provided with the outlet flow that is communicated with the expansion chamber media outlet;
Further, the substrate in the described substrate group is one, the capillary channel that the expansion slot of substrate and capillary channel form respectively expansion chamber and communicate with expansion chamber by closely superimposed holding piece I sealing.
Further, substrate in the substrate group is a plurality of, the expansion slot and the capillary channel that are positioned at the substrate of head end are sealed by closely superimposed holding piece I, the expansion slot of all the other substrates and capillary channel fit tightly sealing by the adjacent substrate that is positioned at its front side, its capillary channel medium import was interconnected and forms the medium intake channel after adjacent substrate was superimposed, and its expansion chamber media outlet was interconnected and forms the media outlet passage after adjacent substrate was superimposed.
Beneficial effect of the present invention: expansion refrigeration system of high-power semiconductor laser of the present invention, adopt the swell refrigeration technology, simultaneously, capillary and the evaporator assemblies of swell refrigeration are arranged in the laser refrigeration package assembling, reduced the volume of refrigerating system, be beneficial to the advantage of giving full play to semiconductor laser, and has a larger refrigeration work consumption, be applied to the high power semiconductor lasers array and have preferably cooling effect, change make in the prior art that precision is high, complex process and volume is large, pressure is high shortcoming, energy savings; And do not need independent cooling water chilldown system, simple in structure, easy to operate, use cost is low, thereby reduces the cost of semiconductor laser cooling system, the useful life of improving semiconductor laser.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is cooling system principle schematic of the present invention;
Fig. 2 is laser refrigeration package assembling structural representation;
Fig. 3 is substrate plane figure;
Fig. 4 is the laser refrigeration package assembling structural representation that the multi-disc substrate forms.
Embodiment
Fig. 1 is cooling system principle schematic of the present invention, Fig. 2 is laser refrigeration package assembling structural representation, Fig. 3 is substrate plane figure, as shown in the figure: the expansion refrigeration system of high-power semiconductor laser of the present embodiment comprises the refrigerant compressor 1, condenser 2 and the laser refrigeration package assembling 5 that are communicated with successively by the refrigerant flow process; Described laser refrigeration package assembling is provided with expansion chamber, and described refrigerant expands in the expansion chamber of laser refrigeration package assembling and is back to refrigerant compressor 1 import after evaporation is gasified; Semiconductor laser array 6 is connected with the heat conduction of expansion chamber outer wall; As shown in the figure, refrigerant compressor 1 carries refrigerant to enter laser refrigeration package assembling 5 by pipeline 4 through condenser (air-cooled), adjuster valve 3, and described refrigerant is back to refrigerant compressor 1 import by pipeline 7 after the expansion evaporation gasification in the expansion chamber of laser refrigeration package assembling.
In the present embodiment, described laser refrigeration package assembling comprises the substrate group that a slice base 53 at least closely is built up and lays respectively at substrate both sides and substrate 53 groups of tight superimposed holding piece I 51 and holding piece 52II, the substrate both sides refer to that two planes are relative, and the stack that forms sheet and sheet is fitted; Described substrate 53 surface etch expansion slots and the capillary channel that communicates with expansion slot, the capillary channel 53b that described expansion slot and capillary channel form respectively expansion chamber 53a and communicate with expansion chamber 53a by closely superimposed adjacent substrate or holding piece I 51 sealings, described capillary channel 53b is communicated with condenser 2 outlets, and expansion chamber 53a is communicated in compressor 1 entrance; Etch capillary channel and expansion slot at substrate, and utilize capillary channel and the expansion chamber that closely is built up sealing, make easily, simple in structure, and do not need higher precision, reach sealing and can realize goal of the invention.
In the present embodiment, described substrate 53 is provided with for the heavy stand 53d that semiconductor laser array is installed, described expansion slot 53a is positioned at heavy stand 53d dorsal part, and is contained within heavy stand 53d, and namely expansion chamber 53a covers heavy stand 53d is whole, pointed cools off, laser array is reached fully and the effect of evenly cooling off, and the convenient cryogenic temperature of regulating, cold avoids waste, energy savings.
In the present embodiment, described expansion chamber 53a is provided with expansion chamber media outlet 53e, capillary channel 53b is provided with capillary channel medium import 53c, as shown in the figure, capillary channel medium import 53c and expansion chamber media outlet 53e are the through hole of being located on the substrate 53, this structure is beneficial to the superimposed structure of multi-disc substrate, have more simple and practical, have stronger versatility and be beneficial to the characteristics of standardized production.
In the present embodiment, the size of described expansion chamber 53a is more than or equal to the size of semiconductor laser array 6, in the present embodiment for being slightly larger than; The medium import that described expansion chamber 53a media outlet 53e and expansion chamber are used for being communicated with capillary channel lays respectively at expansion chamber along the two ends of semiconductor laser array; Make medium after the evaporation through cooling space, be beneficial to the cooling effect of giving full play to medium, do not have the dead angle, thereby make the full and uniform cooling of laser array.
In the present embodiment, described holding piece I 51 is provided with the inlet channel 51a that is communicated in capillary channel medium import 53c, and holding piece II52 is provided with the outlet flow 52a that is communicated with expansion chamber media outlet 53e; Simple in structure, make easily, be beneficial to dismounting and installation.
In the present embodiment, the substrate 53 in the described substrate group is one, the capillary channel 53b that the expansion slot of substrate 53 and capillary channel form respectively expansion chamber 53a and communicate with expansion chamber 53a by closely superimposed holding piece I 51 sealings; Be applicable to only have the situation of a laser array.
Fig. 4 is the laser refrigeration package assembling structural representation that the multi-disc substrate forms, as shown in the figure, in the present embodiment, substrate 53 in the substrate group (among the figure is 14 for a plurality of, the view of each substrate is that Fig. 3 is along A-A to cutaway view), the expansion slot and the capillary channel that are positioned at the substrate of head end form expansion chamber and the capillary channel corresponding with it by closely superimposed holding piece I 51 sealings, all the other substrates (substrate except the head end substrate, head end is the end that medium enters) expansion slot and capillary channel fit tightly sealing by the adjacent substrate that is positioned at its front side, form separately expansion chamber and capillary channel; As shown in the figure, substrate 53 forms expansion chamber 53a and capillary channel 53b by tight superimposed rear its expansion slot of substrate and the capillary channel that is positioned at its front side); Its expansion chamber media outlet was interconnected and forms media outlet passage 54 after adjacent substrate was superimposed, its capillary channel medium import was interconnected and forms medium intake channel 55 after adjacent substrate was superimposed, medium intake channel 55 is communicated in inlet channel 51a, media outlet passage 54 is communicated in outlet flow 52a, so that form in parallel between the capillary channel, form parallel connection between the expansion chamber, have uniform cooling effect; This structure is beneficial to the superimposed structure of multi-disc substrate, have structure more simple and practical, that this structure of characteristics that have stronger versatility and be beneficial to standardized production is applicable to laser matrix, solved the technological difficulties of cooling off for high power laser in the prior art.
The present invention adopts existing swell refrigeration principle, and laser refrigeration package assembling improved, swell refrigeration capillary channel and expansion chamber (evaporator) are arranged in it, adopt superimposed and compression between each substrate and between substrate and the holding piece, guarantee sealing effectiveness, and can use adhesives according to circumstances; This expansion refrigeration system can adopt Automatic Control Theory to carry out the automatic control of chilling temperature and automatically adjusting, guarantees that the working temperature of laser is in normal condition, prolongs its useful life.
Explanation is at last, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although with reference to preferred embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not breaking away from aim and the scope of technical solution of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (3)
1. an expansion refrigeration system of high-power semiconductor laser is characterized in that: comprise the refrigerant compressor, condenser and the laser refrigeration package assembling that are communicated with successively by the refrigerant flow process; Described laser refrigeration package assembling is provided with expansion chamber, and described refrigerant expands in the expansion chamber of laser refrigeration package assembling and is back to the refrigerant compressor import after evaporation is gasified; Semiconductor laser array is connected with the heat conduction of expansion chamber outer wall;
Described laser refrigeration package assembling comprises the substrate group that a slice substrate at least closely is built up and lays respectively at substrate both sides and substrate group tight superimposed holding piece I and holding piece II, described substrate both sides refer to that two planes are relative, the stack that forms sheet and sheet is fitted, described substrate surface etching expansion slot and the capillary channel that communicates with expansion slot, the capillary channel that described expansion slot and capillary channel form respectively expansion chamber and communicate with expansion chamber by closely superimposed adjacent substrate or the sealing of holding piece I, described capillary channel is communicated with condensator outlet, and expansion chamber is communicated in the suction port of compressor;
Described substrate is provided with for the heavy stand that semiconductor laser array is installed, and described expansion slot is positioned at the heavy stand dorsal part, and is contained within heavy stand;
Described expansion chamber is provided with the expansion chamber media outlet, and capillary channel is provided with the import of capillary channel medium, and the import of capillary channel medium and expansion chamber media outlet are is located at on-chip through hole;
The size of described expansion chamber is more than or equal to the size of semiconductor laser array, and the medium import that described expansion chamber media outlet and expansion chamber are used for being communicated with capillary channel lays respectively at expansion chamber along the two ends of semiconductor laser array;
Described holding piece I is provided with the inlet channel that is communicated in the import of capillary channel medium, and the holding piece II is provided with the outlet flow that is communicated with the expansion chamber media outlet.
2. expansion refrigeration system of high-power semiconductor laser according to claim 1, it is characterized in that: the substrate in the described substrate group is one, the capillary channel that the expansion slot of substrate and capillary channel form respectively expansion chamber and communicate with expansion chamber by closely superimposed holding piece I sealing.
3. expansion refrigeration system of high-power semiconductor laser according to claim 1, it is characterized in that: the substrate in the substrate group is a plurality of, the expansion slot and the capillary channel that are positioned at the substrate of head end are sealed by closely superimposed holding piece I, the expansion slot of all the other substrates and capillary channel fit tightly sealing by the adjacent substrate that is positioned at its front side, its capillary channel medium import was interconnected and forms the medium intake channel after adjacent substrate was superimposed, and its expansion chamber media outlet was interconnected and forms the media outlet passage after adjacent substrate was superimposed; The medium intake channel is communicated in inlet channel, and the media outlet channel connection so that form parallel connection between the capillary channel, forms in parallel in outlet flow between the expansion chamber.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110278193 CN102354906B (en) | 2011-09-19 | 2011-09-19 | Expansion refrigeration system of high-power semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110278193 CN102354906B (en) | 2011-09-19 | 2011-09-19 | Expansion refrigeration system of high-power semiconductor laser |
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| Publication Number | Publication Date |
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| CN102354906A CN102354906A (en) | 2012-02-15 |
| CN102354906B true CN102354906B (en) | 2013-04-24 |
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| CN 201110278193 Expired - Fee Related CN102354906B (en) | 2011-09-19 | 2011-09-19 | Expansion refrigeration system of high-power semiconductor laser |
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| CN114649726A (en) * | 2022-03-18 | 2022-06-21 | 苏州天弘激光股份有限公司 | Heat management method and device of high-power optical fiber laser |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922219Y (en) * | 2006-06-22 | 2007-07-11 | 广州工业发展集团有限公司 | Cooling temperature controlling device for solid laser device |
| CN201682172U (en) * | 2010-03-24 | 2010-12-22 | 中国科学院理化技术研究所 | Cooling device for solid laser |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922219Y (en) * | 2006-06-22 | 2007-07-11 | 广州工业发展集团有限公司 | Cooling temperature controlling device for solid laser device |
| CN201682172U (en) * | 2010-03-24 | 2010-12-22 | 中国科学院理化技术研究所 | Cooling device for solid laser |
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| CN102354906A (en) | 2012-02-15 |
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