CN102346609A - Display system with capacitive touch panel and manufacturing method thereof - Google Patents

Display system with capacitive touch panel and manufacturing method thereof Download PDF

Info

Publication number
CN102346609A
CN102346609A CN2010102497932A CN201010249793A CN102346609A CN 102346609 A CN102346609 A CN 102346609A CN 2010102497932 A CN2010102497932 A CN 2010102497932A CN 201010249793 A CN201010249793 A CN 201010249793A CN 102346609 A CN102346609 A CN 102346609A
Authority
CN
China
Prior art keywords
electrode
dielectric layer
display system
circuit
bridging structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102497932A
Other languages
Chinese (zh)
Inventor
陈文龙
曾榆钧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innolux Shenzhen Co Ltd
Chi Mei Optoelectronics Corp
Original Assignee
Innolux Shenzhen Co Ltd
Chi Mei Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolux Shenzhen Co Ltd, Chi Mei Optoelectronics Corp filed Critical Innolux Shenzhen Co Ltd
Priority to CN2010102497932A priority Critical patent/CN102346609A/en
Publication of CN102346609A publication Critical patent/CN102346609A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Position Input By Displaying (AREA)

Abstract

The invention provides a display system with a capacitive touch panel and a manufacturing method thereof. The display system with a capacitive touch panel comprises a substrate, an electrode circuit, a plurality of signal lines, a dielectric layer and an electrode bridging structure, wherein the electrode circuit is provided with a first electrode and a second electrode, the first electrode comprises a plurality of first conductive patterns, the second electrode comprises a plurality of second patterns, and the first conductive patterns are mutually electrically connected; the plurality of signal lines are formed on the substrate; the dielectric layer is formed on the electrode circuit and covers the electrode circuit; and in the invention, the electrode bridging structure with uniform thickness is formed on the dielectric layer by using a metal open repair technique, so that the second patterns are mutually electrically connected.

Description

Display system and manufacturing approach thereof with capacitance type touch-control panel
[technical field]
The invention relates to a kind of display system and method thereof, particularly relevant for a kind of display system and manufacturing approach thereof with capacitance type touch-control panel.
[background technology]
With reference to figure 1, it illustrates the synoptic diagram of the capacitance type touch-control panel 100 of display system in the prior art.Capacitance type touch-control panel 100 comprises base material 102, tin indium oxide (indium tin oxide; ITO) layer 104, plain conductor 106, dielectric layer (dielectric layer) 108, stack layer 110 and protective seam (passivation layer) 112, stack layer 110 is conductive materials.Above-mentioned physical vapour deposition (PVD) (the physical vapor deposition that utilizes; PVD) gold-tinted processing procedure such as method and little shadow technology forms tin indium oxide (ITO) layer 104, dielectric layer 108 and stack layer 110 in regular turn, and wherein tin indium oxide (ITO) layer 104 has left electrodes 104a and right electrodes 104b.
Yet in Fig. 1; Near the step edges (step edge) between dielectric layer 108 and tin indium oxide (ITO) layer 104; (step coverage) is not good for the step coverage rate of stack layer 110; That is the height fall of dielectric layer 108 and tin indium oxide (ITO) layer 104; Make and cause the in uneven thickness of stack layer 110 near 110 thickness of the stack layer the step edges less than 110 thickness of the stack layer on dielectric layer 108.Particularly when the thickness of dielectric layer 108 during greater than the thickness of stack layer 110, the not good situation of step coverage rate is even more serious, causes stack layer 110 situation in uneven thickness more obvious.Thus; Stack layer 110 raises with respect to the left electrodes 104a of tin indium oxide (ITO) layer 104 and the resistance value of right electrodes 104b; Influence left electrodes 104a and send a signal to plain conductor 106, or influencing right electrodes 104b sends a signal to plain conductor 106 via stack layer 110, left electrodes 104a via stack layer 110, right electrodes 104b.
Further; Because the step coverage rate (step coverage) of stack layer 110 is not good; Contact interface between the both ends of stack layer 110 and left electrodes 104a and the right electrodes 104b forms defective (defect) 111 easily; Make and poor electrical contact cause the stack layer 110 and the contact resistance value of tin indium oxide (ITO) layer 104 to raise.Between stack layer 110 and tin indium oxide (ITO) layer 104, produce the disconnecting state even,, can't send a signal to plain conductor 106, as shown in Figure 1 so that left electrodes 104a and right electrodes 104b are in state of insulation.
According to the above; Because the problem of the in uneven thickness and poor electrical contact of stack layer 110; The thickness of the material of necessary careful selection stack layer 110 and control tin indium oxide (ITO) layer 104 and dielectric layer 108 is so the fabrication steps of capacitance type touch-control panel 100 and material chosen receive very big restriction.Even prior art is desired to address the above problem with the mode that increases stack layer 110 thickness; Yet in the processing procedure of vapour deposition process and little shadow technology; Stack layer 110 is peeled off because of thickness is excessive easily, still can't solve the problem of poor electrical contact between not good and stack layer 110 of step coverage rate and tin indium oxide (ITO) layer 104.In view of this, be necessary really existing capacitance type touch-control panel is improved.
[summary of the invention]
For addressing the above problem, a purpose of the present invention is to provide a kind of display system and manufacturing approach thereof with capacitance type touch-control panel, can reduce the conductor resistance value of conductive pattern, and improve step coverage rate.
Another purpose of the present invention is to provide a kind of display system and manufacturing approach thereof with capacitance type touch-control panel, can improve the material selection elasticity of dielectric layer and protective seam, to improve the process rate of capacitance type touch-control panel.
For reaching above-mentioned purpose, the present invention provides a kind of display system and manufacturing approach thereof with capacitance type touch-control panel, and capacitance type touch-control panel mainly comprises base material, electrode circuit, some signal wires, dielectric layer, electrode bridging structure and protective seam.
In capacitance type touch-control panel; The electrode circuit is formed on the base material; Have first electrode and second electrode; First electrode is arranged on the base material along first direction; And second electrode is arranged on the base material along second direction; First electrode comprises that some first conductive patterns and second electrode comprise some second conductive patterns, and first conductive pattern electrically connects mutually each other, and wherein second electrode and first electrode are state of insulation each other.Some signal wires are formed on the base material, in order to first electrode and second electrode that electrically connects the electrode circuit respectively.Dielectric layer is formed on the electrode circuit, and dielectric layer partly is covered on the electrode circuit.Electrode bridge access node configuration is formed on dielectric layer and the electrode circuit; In order to electrically connect second conductive pattern of electrode circuit; So that second conductive pattern is in electric connection each other; Wherein the thickness of electrode bridging structure is greater than the thickness of dielectric layer, and dielectric layer is in order to first electrode of electrical isolation electrode bridging structure and electrode circuit.
Display system of the present invention mainly comprises capacitance type touch-control panel and power supply unit.Power supply unit is electrically connected at capacitance type touch-control panel, to supply power to capacitance type touch-control panel.
The manufacturing approach that has the display system of capacitance type touch-control panel in the embodiments of the invention comprises the following steps:
(1) forms first conductive layer on base material;
(2) form second conductive layer on first conductive layer;
(3) patterning second conductive layer forms some signal wires, and exposes first conductive layer to the open air;
(4) etching first conductive layer is to form the electrode circuit; Wherein the electrode circuit has first electrode and second electrode; And first electrode is formed on the base material along first direction; Second electrode is formed on the base material along second direction; First electrode comprises that some first conductive patterns and second electrode comprise some second conductive patterns; First conductive pattern electrically connects mutually each other, and wherein second electrode and first electrode are state of insulation each other;
(5) form dielectric layer on the electrode circuit, and dielectric layer is covered in partly on the electrode circuit; And
(6) form the electrode bridging structure on dielectric layer and electrode circuit; To electrically connect second conductive pattern of electrode circuit; So that second conductive pattern electrically connects each other; Wherein the thickness of electrode bridging structure is greater than the thickness of dielectric layer, and dielectric layer is in order to first electrode of electrical isolation electrode bridging structure and electrode circuit.
Compared to prior art, panel line construction of the present invention the present invention utilizes metal broken string recovery technique on the base material 202 of plastics, to form electrode bridging structure 210, effectively improves the process rate of the electrode framework of capacitance type touch-control panel.And the light weight of plastic base, thin thickness, significantly reduce the weight and the volume of capacitance type touch-control panel.The present invention effectively reduces the conductor resistance value of electrode circuit, thereby correctly transmits sensing signal to control circuit, and improve step coverage rate through selecting electrode bridging structure jumper connection second conductive pattern of uniform thickness for use.Increase the material selection elasticity of conductive layer simultaneously, and improve the material selection elasticity of dielectric layer and protective seam, to improve the process rate of capacitance type touch-control panel.In addition, the both ends of electrode bridging structure form preferable nurse difficult to understand with the contact interface of second conductive pattern respectively and contact.That is, effectively reduce the conductor resistance value between the electrode bridging structure and second conductive pattern, solve the problem that the prior art contact interface forms poor electrical contact that defective causes easily.
For allowing the foregoing of the present invention can be more obviously understandable, hereinafter specially lift preferred embodiment, and cooperate appended graphicly, elaborate as follows:
[description of drawings]
Fig. 1 illustrates the synoptic diagram of the capacitance type touch-control panel of display system in the prior art.
Fig. 2 illustrates the top view according to the display system that has capacitance type touch-control panel in the embodiment of the invention.
Fig. 3 A-3F illustrate according among the embodiment of Fig. 2 of the present invention along the manufacturing process sectional view of the contact panel of profile line A-A '.
Fig. 4 illustrates according to the block schematic diagram with display system of capacitance type touch-control panel of the present invention.
[embodiment]
Preferred embodiment of the present invention is described in detail through appended graphic and following explanation, different graphic in, identical element numbers is represented same or analogous assembly.
With reference to figure 2, it illustrates the top view according to the display system 400 that has capacitance type touch-control panel 200 in the first embodiment of the invention.Capacitance type touch-control panel (capacitive touch panel) 200 mainly comprises base material 202, electrode circuit 204, some signal wires 206, dielectric layer (dielectric layer) 208, electrode bridging structure 210 and protective seam (passivation layer) 212 (being shown in Fig. 3 F).Electrode circuit 204 sees through signal wire 206 formed leads and is connected in control circuit 214, and control circuit 214 comes from the sensing signal of electrode circuit 204 in order to processing.
Electrode circuit 204 is formed on the base material 202; And electrode circuit 204 has the first electrode 204a and the second electrode 204b; The first electrode 204a is arranged on the base material 202 along first direction; And the second electrode 204b is arranged on the base material 202 along second direction, and the first electrode 204a comprises that some first conductive patterns (204a1,204a2) and the second electrode 204b comprise some second conductive patterns (204b1,204b2).First conductive pattern (204a1,204a2) utilizes lead 205 to electrically connect mutually along first direction (for example Y direction) each other; Second conductive pattern (204b1,204b2) is arranged along second direction (for example X-direction) each other; Be state of insulation between the first electrode 204a and the second electrode 204b wherein, that is second conductive pattern (204b1,204b2) is a state of insulation with first conductive pattern (204a1,204a2) each other.First conductive pattern (204a1,204a2) disposes with matrix-style with second conductive pattern (204b1,204b2).
Some signal wires 206 are formed on the base material 202, and in order to the first electrode 204a and the second electrode 204b of electric connection electrode circuit 204, and signal wire 206 is positioned at the zones of different on the base material 202 with electrode circuit 204.Dielectric layer 208 is formed on the electrode circuit 204 and part is covered on the electrode circuit 204, and for example dielectric layer 208 is arranged at zone contiguous mutually between the top first conductive pattern 204a1, the below first conductive pattern 204a2, the left side second conductive pattern 204b1 and the right side second conductive pattern 204b2.
The electrode bridging structure 210 of capacitance type touch-control panel 200 of the present invention is formed on dielectric layer 208 and the electrode circuit 204; In order to electrically connect the second electrode 204b of electrode circuit 204; So that second conductive pattern (204b1,204b2) electrically connects each other, wherein dielectric layer 208 is in order to the first direction electrode 204a of electrical isolation electrode bridging structure 210 with electrode circuit 204.In a preferred embodiment, the thickness of electrode bridging structure 210 is greater than the thickness of dielectric layer 208.
In one embodiment; Electrode bridging structure 210 forms plain conductor; Utilize the plain conductor of metal broken string recovery technique (metal open repair technique) formation uniform thickness, effectively reduce the conductor resistance value (trace resistance) of electrode circuit 204.The width of plain conductor is between 3 μ m to 50 μ m, and length is between 50 μ m to 2mm, and thickness is between 0.3 μ m to 10 μ m.Within thickness range, plain conductor can completely be attached on the dielectric layer 208, yet bigger thickness also is applicable to electrode bridging structure 210 of the present invention.
With reference to figure 2 and Fig. 3 A-3F, Fig. 3 A-3F illustrate according among first embodiment of Fig. 2 of the present invention along the manufacturing process sectional view of the capacitance type touch-control panel 200 of profile line A-A '.In Fig. 3 A, form first conductive layer 300 on base material 202, then form second conductive layer 302 on first conductive layer 300.Base material 202 for example is a glass; Any of plastics and transparent material layer; Wherein plastics for example are vibrin (polyester resin); Polyacrylate resin (polyacrylate resin); Polyolefin resin (polyolefin resin); Polyimide resin (polyimide resin); Any of polycarbonate resin (polycarbonate resin) and polyurethane resin (polyurethane resin); Polyolefin resin (polyolefin resin) for example is tygon (polyethylene; PE) or polypropylene (Polypropylene; PP); Vibrin (polyester resin) for example is polyethylene terephthalate (polyethylene terephthalate; PET); Polyacrylate resin (polyacrylate resin) for example be polymethylmethacrylate (Polymethylmethacrylate, PMMA).The method of above-mentioned formation first conductive layer 300 and second conductive layer 302 for example is sputtering method or physical vaporous deposition; The material of first conductive layer 300 for example is tin indium oxide (indium tin oxide; ITO), the material of second conductive layer 302 for example is a metal.
In Fig. 3 B, etching second conductive layer 302 forms some signal wires 206, and exposes first conductive layer 300.For example use dry-etching method or wet etching etching to form some signal wires 206.In Fig. 2 and Fig. 3 C; Etching first conductive layer 300 forms electrode circuit 204; Wherein electrode circuit 204 has the first electrode 204a and the second electrode 204b, and the first electrode 204a comprises that some first conductive patterns (204a1,204a2) and the second electrode 204b comprise some second conductive patterns (204b1,204b2).First conductive pattern (204a1,204a2) utilizes lead 205 to electrically connect mutually along first direction (for example Y direction) each other; Second conductive pattern (204b1,204b2) is arranged along second direction (for example X-direction) each other; Be state of insulation between the first electrode 204a and the second electrode 204b wherein, that is some second conductive patterns (204b1,204b2) are state of insulations with some first conductive patterns (204a1,204a2) each other.For example use dry-etching method or wet etching etching to form electrode circuit 204.In one embodiment, when the material of base material 202 is plastics, utilize etching glue (etching paste) etching first conductive layer 300 to form electrode circuit 204.In another embodiment, form protection resin (protection resin) on first conductive layer 300, utilize etching step to form electrode circuit 204 then.
In Fig. 3 D, dielectric layer 208 parts are covered on the electrode circuit 204.The material of dielectric layer 208 for example is silicon dioxide (silicon oxide) or transparent non-organic material, and the present invention utilizes screen printing technology (screen printing technique), APR (Asahi Kasei Photosensitive Resin) plate face coating technique and spraying printing technology to form dielectric layer 208.In one embodiment, the thickness of dielectric layer 208 is between 0.1 μ m to 5 μ m.
In Fig. 3 E; Form an electrode bridging structure 210 on dielectric layer 208 and second conductive pattern (204b1,204b2); Second conductive pattern (204b1,204b2) that electrode bridging structure 210 electrically connects the second electrode 204b; So that second conductive pattern (204b1,204b2) electrically connects each other; Wherein the thickness of electrode bridging structure 210 is greater than the thickness of dielectric layer 208, and dielectric layer 208 is in order to the lead 205 of the electrical isolation electrode bridging structure 210 and the first electrode 204a.That is dielectric layer 208 makes first conductive pattern (204a1,204a2) of the first electrode 204a form electrical isolation with respect to electrode bridging structure 210.The material of electrode bridging structure 210 for example is an alloy material, and alloy material is any of alloy with palladium (Pd), platinum (Pt), gold (Au), silver (Ag) and aluminium (Al).In one embodiment, electrode bridging structure 210 is plain conductors, and utilizes metal broken string recovery technique to form plain conductor.For example be to utilize the routing mode to form plain conductor.In a preferred embodiment, the width of plain conductor is between 3 μ m to 50 μ m, and length is between 50 μ m to 2mm, and thickness is between 0.3 μ m to 10 μ m.
In Fig. 3 F, form a protective seam 212 on electrode circuit 204, signal wire 206 and electrode bridging structure 210.The material of protective seam 212 is silicon dioxide or non-organic material, and the thickness of protective seam 212 for example is between 0.1 μ m to 5 μ m.The present invention can utilize picture printing technology (screen printing technique), APR plate face coating technique, spraying printing technology protective seam and spraying technology (spray technique) to form protective seam 212.
According to above-mentioned; Use the gold-tinted processing procedure to form stack layer 110 (as shown in Figure 1) compared to prior art; Panel line construction 200 of the present invention utilizes metal broken string recovery technique; Through electrode bridging structure 210 jumper connections second conductive patterns (204b1,204b2) of selecting uniform thickness for use, effectively reduce the conductor resistance value (trace resistance) of electrode circuit 204.In other words, the second conductive pattern 204b1 is via electrode bridging structure 210, electrically connect with the second conductive pattern 204b2 of opposite side, thereby correctly transmits sensing signal to control circuit 214.
Further, the both ends of electrode bridging structure 210 form preferable nurse difficult to understand with the contact interface of the second conductive pattern 204b1,204b2 respectively and contact (Ohmic contact).That is, effectively reduce the conductor resistance value (trace resistance) between the electrode bridging structure 210 and second conductive pattern (204b1,204b2), solve the problem that the prior art contact interface forms poor electrical contact that defective causes easily.Therefore, the present invention utilizes the mode of metal broken string recovery technique formation electrode bridging structure 210 effectively to replace and uses gold-tinted fabrication steps formation stack layer 110 in the prior art.
And; Electrode bridging structure 210 of the present invention is applicable to the dielectric layer 208 and the electrode circuit 204 of various different-thickness; Mainly be because the thickness of electrode bridging structure 210 greater than the thickness of dielectric layer 208; And electrode bridging structure 210 has preferable ductility; So when dielectric layer 208 produces step edges (step edge) with electrode circuit 204; Electrode bridging structure 210 still can be covered on the dielectric layer 208 and be connected between left side second conductive pattern 204b1 and the right side second conductive pattern 204b2, does not peel off and can not produce.In other words, the thickness size of dielectric layer 208 can't influence the fabrication steps of electrode bridging structure 210.Therefore, in the manufacturing approach of electrode bridging structure of the present invention, the thickness of dielectric layer 208 does not need accurate control, thereby improves the material selection elasticity of dielectric layer 208, effectively improves the process rate of capacitance type touch-control panel.
In addition, when base material was plastic material, prior art will receive many restrictions if desire uses vapour deposition process to form electrode bridging structure 210.Relatively, the present invention utilizes metal broken string recovery technique on the base material 202 of plastics, to form electrode bridging structure 210, effectively improves the process rate of the electrode framework of capacitance type touch-control panel.And the light weight of plastic base, thin thickness, significantly reduce the weight and the volume of capacitance type touch-control panel.
With reference to figure 4, it illustrates according to the block schematic diagram with display system 400 of capacitance type touch-control panel 402 of the present invention.Display system 400 of the present invention mainly comprises capacitance type touch-control panel 400 and power supply unit 404.Power supply unit 404 is electrically connected at capacitance type touch-control panel 402; To supply power to capacitance type touch-control panel 402, wherein display system 400 for example is that display on mobile phone, digital camera, personal digital assistant, notebook computer, desktop computer, TV, satellite navigation, the car, aviation are with display or Portable DVD projector.
In sum, the present invention provides a kind of display system and method thereof with capacitance type touch-control panel, can reduce the contact resistance value of conductive layer, and improve step coverage rate.Increase the material selection elasticity of conductive layer simultaneously, and improve the material selection elasticity of dielectric layer and protective seam, to improve the process rate of capacitance type touch-control panel.

Claims (13)

1. display system with capacitance type touch-control panel; Wherein this capacitance type touch-control panel comprises: a base material, an electrode circuit and a dielectric layer; This electrode circuit is formed on this base material; Dielectric layer is formed on this electrode circuit; And this dielectric layer partly is covered on this electrode circuit; It is characterized in that: this electrode circuit has one first electrode and one second electrode; This first electrode is arranged on this base material along a first direction; And this second electrode is arranged on this base material along a second direction; This first electrode comprises that some first conductive patterns and this second electrode comprise some second conductive patterns; Those first conductive patterns electrically connect mutually each other; Wherein this second electrode and this first electrode are state of insulation each other; This capacitance type touch-control panel also comprises some holding wires and an electrode bridging structure; This equisignal line is formed on this base material; In order to this first electrode and this second electrode that electrically connects this electrode circuit respectively; This electrode bridge access node configuration is formed on this dielectric layer and this electrode circuit; In order to electrically connect those second conductive patterns of this electrode circuit; So that those second conductive patterns are in electric connection each other; Wherein the thickness of this electrode bridging structure is greater than the thickness of this dielectric layer, and this dielectric layer is in order to this first electrode of this electrode bridging structure of electrical isolation and this electrode circuit.
2. display system as claimed in claim 1 is characterized in that: this base material is selected from one of group that glass, plastics and transparent material layer form.
3. display system as claimed in claim 1 is characterized in that: the thickness of this dielectric layer is between 0.1 μ m to 5 μ m.
4. display system as claimed in claim 1 is characterized in that: the material of this electrode bridging structure is an alloy material.
5. display system as claimed in claim 1 is characterized in that: this electrode bridge access node configuration becomes plain conductor, and utilizes metal broken string recovery technique to form this plain conductor.
6. display system as claimed in claim 5 is characterized in that: the width of this plain conductor is between 3 μ m to 50 μ m, and length is between 50 μ m to 2mm, and thickness is between 0.3 μ m to 10 μ m.
7. display system as claimed in claim 1; It is characterized in that: this display system also comprises: a power supply unit; Be electrically connected at this capacitance type touch-control panel; To this capacitance type touch-control panel, wherein this display system is that display on a mobile phone, a digital camera, a personal digital assistant, a notebook computer, a desktop computer, a TV, a satellite navigation, the car, an aviation are with a display or a Portable DVD projector with power supply.
8. manufacturing approach with display system of capacitance type touch-control panel, it is characterized in that: this manufacturing approach comprises the following steps:
Form one first conductive layer on a base material;
Form one second conductive layer on this first conductive layer;
This second conductive layer of patterning forms some signal wires, and exposes this first conductive layer to the open air;
This first conductive layer of etching is to form an electrode circuit; Wherein this electrode circuit has one first electrode and one second electrode; And this first electrode is formed on this base material along a first direction; This second electrode is formed on this base material along a second direction; This first electrode comprises that some first conductive patterns and this second electrode comprise some second conductive patterns; Those first conductive patterns electrically connect mutually each other, and wherein this second electrode and this first electrode are state of insulation each other;
Form a dielectric layer on this electrode circuit, and this dielectric layer is covered in partly on this electrode circuit; And
Form an electrode bridging structure on this dielectric layer and this electrode circuit; To electrically connect those second conductive patterns of this electrode circuit; So that those second conductive patterns electrically connect each other; Wherein the thickness of this electrode bridging structure is greater than the thickness of this dielectric layer, and this dielectric layer is in order to this first electrode of this electrode bridging structure of electrical isolation and this electrode circuit.
9. manufacturing approach as claimed in claim 8 is characterized in that: this base material is selected from one of group that glass, plastics and transparent material layer form.
10. manufacturing approach as claimed in claim 8 is characterized in that: the thickness of this dielectric layer is between 0.1 μ m to 5 μ m.
11. manufacturing approach as claimed in claim 8 is characterized in that: the material of this electrode bridging structure is an alloy material.
12. manufacturing approach as claimed in claim 8 is characterized in that: this electrode bridging structure is a metal conductive line pattern, and utilizes metal broken string recovery technique to form this plain conductor.
13. manufacturing approach as claimed in claim 12 is characterized in that: the width of this plain conductor is between 3 μ m to 50 μ m, and length is between 50 μ m to 2mm, and thickness is between 0.3 μ m to 10 μ m.
CN2010102497932A 2010-08-03 2010-08-03 Display system with capacitive touch panel and manufacturing method thereof Pending CN102346609A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102497932A CN102346609A (en) 2010-08-03 2010-08-03 Display system with capacitive touch panel and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010102497932A CN102346609A (en) 2010-08-03 2010-08-03 Display system with capacitive touch panel and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN102346609A true CN102346609A (en) 2012-02-08

Family

ID=45545336

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102497932A Pending CN102346609A (en) 2010-08-03 2010-08-03 Display system with capacitive touch panel and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN102346609A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102622154A (en) * 2012-04-27 2012-08-01 福州华映视讯有限公司 Capacitive touch panel
CN103412665A (en) * 2013-04-02 2013-11-27 深圳欧菲光科技股份有限公司 Electronic device
CN103412689A (en) * 2013-03-30 2013-11-27 深圳欧菲光科技股份有限公司 Capacitive touch screen
CN104317457A (en) * 2014-11-13 2015-01-28 合肥鑫晟光电科技有限公司 Bridging structure for touch panel and touch panel
CN104461149A (en) * 2014-12-16 2015-03-25 合肥鑫晟光电科技有限公司 Touch panel and display device
CN109300430A (en) * 2018-07-18 2019-02-01 友达光电股份有限公司 Light emitting device and method for manufacturing the same
WO2020001422A1 (en) * 2018-06-28 2020-01-02 京东方科技集团股份有限公司 Touch control panel and method for manufacturing same, and display apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1933128A (en) * 2006-10-17 2007-03-21 友达光电股份有限公司 Thin film transistor structure and substrate producing method for liquid crystal display device
CN201078769Y (en) * 2007-04-27 2008-06-25 宸鸿光电科技股份有限公司 Touch control drawing structure of capacitance type touch control plate
CN101576794A (en) * 2009-06-05 2009-11-11 深圳莱宝高科技股份有限公司 Capacitive touch screen wiring and manufacturing method thereof
CN101655755A (en) * 2009-09-17 2010-02-24 友达光电股份有限公司 Touch control panel
CN101727251A (en) * 2010-01-22 2010-06-09 牧东光电(苏州)有限公司 Bridging type capacitance touch-control device and manufacture method thereof
CN101751190A (en) * 2008-12-11 2010-06-23 时纬科技股份有限公司 Capacitance type touch panel and manufacturing method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1933128A (en) * 2006-10-17 2007-03-21 友达光电股份有限公司 Thin film transistor structure and substrate producing method for liquid crystal display device
CN201078769Y (en) * 2007-04-27 2008-06-25 宸鸿光电科技股份有限公司 Touch control drawing structure of capacitance type touch control plate
CN101751190A (en) * 2008-12-11 2010-06-23 时纬科技股份有限公司 Capacitance type touch panel and manufacturing method thereof
CN101576794A (en) * 2009-06-05 2009-11-11 深圳莱宝高科技股份有限公司 Capacitive touch screen wiring and manufacturing method thereof
CN101655755A (en) * 2009-09-17 2010-02-24 友达光电股份有限公司 Touch control panel
CN101727251A (en) * 2010-01-22 2010-06-09 牧东光电(苏州)有限公司 Bridging type capacitance touch-control device and manufacture method thereof

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102622154A (en) * 2012-04-27 2012-08-01 福州华映视讯有限公司 Capacitive touch panel
CN102622154B (en) * 2012-04-27 2015-08-05 福州华映视讯有限公司 Capacitance type touch-control panel
CN103412689A (en) * 2013-03-30 2013-11-27 深圳欧菲光科技股份有限公司 Capacitive touch screen
CN103412689B (en) * 2013-03-30 2015-04-08 深圳欧菲光科技股份有限公司 Capacitive touch screen
CN103412665B (en) * 2013-04-02 2015-04-08 深圳欧菲光科技股份有限公司 Electronic device
CN103412665A (en) * 2013-04-02 2013-11-27 深圳欧菲光科技股份有限公司 Electronic device
CN104317457A (en) * 2014-11-13 2015-01-28 合肥鑫晟光电科技有限公司 Bridging structure for touch panel and touch panel
CN104317457B (en) * 2014-11-13 2018-03-06 合肥鑫晟光电科技有限公司 Bridging structure and contact panel for contact panel
US9910532B2 (en) 2014-11-13 2018-03-06 Boe Technology Group Co., Ltd. Bridging structure for touch panel and touch panel
CN104461149A (en) * 2014-12-16 2015-03-25 合肥鑫晟光电科技有限公司 Touch panel and display device
CN104461149B (en) * 2014-12-16 2018-06-15 合肥鑫晟光电科技有限公司 A kind of touch panel and display device
WO2020001422A1 (en) * 2018-06-28 2020-01-02 京东方科技集团股份有限公司 Touch control panel and method for manufacturing same, and display apparatus
CN109300430A (en) * 2018-07-18 2019-02-01 友达光电股份有限公司 Light emitting device and method for manufacturing the same

Similar Documents

Publication Publication Date Title
CN108920010B (en) Touch screen and OLED display panel
CN102346609A (en) Display system with capacitive touch panel and manufacturing method thereof
US9153385B2 (en) Electrode structure of the touch panel, method thereof and touch panel
US20120026128A1 (en) Display system having a capacitive touch panel and manufacturing methods of the same
TWI412815B (en) Electrode structure of multiple dielectric island layer and manufacturing method thereof
CN102446047A (en) Touch panel
US10705640B2 (en) Touch panel and method for fabricating the same, touch display device
TWI569289B (en) Conductive structure body and method for manufacturing the same, and display device
CN103376966A (en) Electrostatic capacity type touch screen panel for display device and method of manufacturing the same
CN103092414A (en) External type touch screen, manufacturing method thereof and display device
US10338751B2 (en) Touch-control pattern structure, manufacture method thereof and touch panel containing therein
CN102645995A (en) Touch screen, display device including touch screen, and manufacturing method for display device including touch screen
CN104076982B (en) Touch screen and production method thereof and display device
CN109976592A (en) Touch base plate and its manufacturing method and display device
CN102270074B (en) Electrode structure and manufacture method thereof
CN100507644C (en) Contact-controlling LCD device
CN115113764A (en) Display panel and display device
CN202771396U (en) Touch sensitive element and touch panel
CN102830836A (en) Touch control panel and manufacturing method thereof as well as touch control equipment
CN109074195A (en) Static capacity type sensor
CN207123824U (en) Contact panel and touch control display apparatus
CN101751178B (en) Touch panel and manufacturing method thereof
CN108304092B (en) Preparation method of touch substrate, touch substrate and display device
CN101661358B (en) Electronic device
CN109375829A (en) A kind of production method of the display device using the double touch-control sensors of metal mesh

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20120401

Address after: Guangdong province Shenzhen City, Longhua Town, Foxconn science and Technology Industrial Park E District 4 building, building 1, building

Applicant after: Qunkang Technology (Shenzhen) Co., Ltd.

Co-applicant after: Chimei Optoelectronics Co., Ltd.

Address before: Guangdong province Shenzhen City, Longhua Town, Foxconn science and Technology Industrial Park E District 4 building, building 1, building

Applicant before: Qunkang Technology (Shenzhen) Co., Ltd.

Co-applicant before: Chimei Optoelectronics Co., Ltd.

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20120208