CN101661358B - Electronic device - Google Patents
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- CN101661358B CN101661358B CN200910173525A CN200910173525A CN101661358B CN 101661358 B CN101661358 B CN 101661358B CN 200910173525 A CN200910173525 A CN 200910173525A CN 200910173525 A CN200910173525 A CN 200910173525A CN 101661358 B CN101661358 B CN 101661358B
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- metal pattern
- bonding pad
- signal bonding
- pad
- electronic installation
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Abstract
An electronic device comprises a plurality of electronic elements, a plurality of wires, a plurality of signal pads and at least one metal pattern. The electronic elements are arranged on a substrate; the wires are arranged on the substrate and electrically connected with the electronic elements; the signal pads are electrically connected with the wires separately; at least one metal pattern is arranged on partial signal pads, wherein at least one metal pattern does not contact with the wires directly. In the electronic device of the invention, the signal pads are arranged below the metal pattern so that when forming the signal pads, the upper metal layer can not be damaged. In addition, the metal pattern is a metal film prepared from the same material of the wires, and the metal pattern is used to identify the engaged position or engaged effect in the technology and does not contact with the wires so as to avoid the problem that the metal pattern is corroded along with the wires to cause the breakage of the wires.
Description
Technical field
The present invention relates to a kind of electronic installation, and be particularly related to a kind of electronic installation of making particular design in signal bonding pad.
Background technology
In recent years; Fast development along with the application of each items such as infotech, wireless mobile communications and information household appliances; More lightly change and more humane purpose in order to reach more convenient, volume, the input media of many information products changes touch-control display panel (touch displaypanel) into by traditional keyboard or mouse etc.In general now touch-control display panel design, with the design concept classification of touch-control sensing pattern, roughly can divide into resistance-type, condenser type, optical profile type, sound wave type and electromagnetic type etc., be main flow with resistance-type and condenser type again wherein; With the structural group constituent class, then can be divided into two kinds of external hanging type (adhesive type) and built-in (built-in type).
With electric resistance touch-control panel, mainly be the pressure of pushing through single-point, make the conductive layer that originally separates be in contact with one another and conducting, thereby produce a voltage drop (voltage drop) in conducting place; Via the position that measuring voltage is fallen, can judge that pushing the generation part is positioned at the coordinate on the panel.With regard to capacitance type touch-control panel, cardinal principle is that outside conductive layer produces uniform low voltage electric field within it, combines when conductor (like the mankind's finger) can produce static when contacting with it, thereby produces a small capacitance variations; Via the position of measuring capacitance variations, can judge that the contact origination point is positioned at the coordinate on the panel.
Generally speaking, the periphery of contact panel can design with contact panel in the signal bonding pad that electrically connects of element, so that the touching signals in the contact panel is exported.Above-mentioned signal bonding pad mostly is to be made up of metallic pad and the transparent conductive patterns that covers on the metallic pad.Yet because of using the etching solution (for example chloroazotic acid) of highly corrosive, it tends to the metallic pad of lower floor is produced transition etching or corrosion, and causes the impaired of metallic pad in the etching program that forms above-mentioned transparent conductive patterns.
Summary of the invention
Therefore, the present invention provides a kind of electronic installation, and it can solve the problem that the metallic pad in the classical signals connection pad suffers damage because of the transition etching easily.
The present invention proposes a kind of electronic installation, comprises a plurality of electronic components, many leads, a plurality of signal bonding pad and at least one metal patterns.Electronic component is arranged on the substrate.Lead is arranged on the substrate, and electrically connects with electronic component.Signal bonding pad and electrically corresponding connection of lead.Above-mentioned at least one metal pattern is positioned on the signal bonding pad of at least a portion, and wherein above-mentioned at least one metal pattern does not directly contact with lead.
The present invention proposes a kind of electronic installation, and it comprises a plurality of electronic components, many leads, a plurality of signal bonding pad, at least one virtual connection pad (dummy pad) and at least one metal patterns.Electronic component is arranged on the substrate.Lead is arranged on the substrate, and electrically connects with electronic component.Signal bonding pad and electrically corresponding connection of lead.At least one virtual connection pad is to be arranged on the substrate, and wherein said at least one virtual connection pad directly is not connected with lead.At least one metal pattern is positioned on the virtual connection pad, and metal pattern does not directly contact with lead.
Based on the above,, therefore when forming signal bonding pad, do not have the problem of injury lower metal layer because signal bonding pad of the present invention is arranged on the below of metal pattern.In addition, metal pattern and lead are the metallic film with material, and metal pattern is the usefulness as identification bonding station in the technology or joint effect, are not connected with lead to avoid metal pattern to have when corrosion the lead corrosion and to cause broken string by a curb.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and conjunction with figs. elaborates as follows.
Description of drawings
Figure 1A is that electronic installation is not provided with circuit board synoptic diagram before as yet according to an embodiment of the invention.
Figure 1B is the synoptic diagram of electronic installation after circuit board is set according to an embodiment of the invention.
Fig. 2 A is that Figure 1A is along the diagrammatic cross-section of profile line A-A ' with profile line B-B '.
Fig. 2 B is that Figure 1B is along the diagrammatic cross-section of profile line A-A ' with profile line B-B '.
Fig. 3 and Fig. 4 are the synoptic diagram of electronic component according to an embodiment of the invention.
Fig. 5 A is that electronic installation is not provided with circuit board synoptic diagram before as yet according to an embodiment of the invention.
Fig. 5 B is the synoptic diagram of electronic installation after circuit board is set according to an embodiment of the invention.
Fig. 6 A is that Fig. 5 A is along the diagrammatic cross-section of profile line A-A ' with profile line B-B '.
Fig. 6 B is that Fig. 5 B is along the diagrammatic cross-section of profile line A-A ' with profile line B-B '.
Description of reference numerals in the above-mentioned accompanying drawing is following:
10,20: the induction connection pad
12,22: connecting line
30: dot structure
40: active component
50: pixel electrode
SL: sweep trace
DL: data line
100: substrate
102: electronic component
104: lead
106: signal bonding pad
106a: virtual connection pad
108: metal pattern
120: overlayer
130: circuit board
132: base material
134: conductive structure
140: anisotropic conductive
150: alignment mark
Embodiment
Figure 1A is the synoptic diagram before circuit board is not set as yet of electronic installation according to an embodiment of the invention, and Figure 1B is the synoptic diagram of electronic installation after circuit board is set according to an embodiment of the invention.Fig. 2 A be Figure 1A along the diagrammatic cross-section of profile line A-A ' with profile line B-B ', Fig. 2 B is that Figure 1B is along the diagrammatic cross-section of profile line A-A ' with profile line B-B '.
Please earlier with reference to Figure 1A and Fig. 2 A, the electronic installation before circuit board is not set as yet comprises electronic component 102, lead 104, signal bonding pad 106 and at least one metal pattern 108.In a preferred embodiment, electronic installation also comprises at least one contraposition mark 150.
For example, as shown in Figure 3 if electronic component 102 is the capacitive touch control elements, then electronic component 102 comprises the first touch-control connection pad 10, the second touch-control connection pad 20, first connecting line 12 and second connecting line.The first touch-control connection pad 10 is arranged along first direction (for example directions X), and is electrically connected through first connecting line 12 between two the first adjacent touch-control connection pads 10.The second touch-control connection pad 20 is arranged along second direction (for example being the Y direction), and is electrically connected through second connecting line 22 between two the second adjacent touch-control connection pads 20.Generally speaking, be provided with an insulation course in the crossing part of first connecting line 12 and second connecting line 22, to avoid first connecting line 12 and the 22 electrical short circuits of second connecting line.In the present embodiment, the first touch-control connection pad 10 and the second touch-control connection pad 20 can be respectively metal material or transparent conductive material (metal oxide).
Other lifts an example, if electronic component 102 is display pixel structure, as shown in Figure 4, then electronic component 102 comprises sweep trace SL, data line DL and dot structure 30, and wherein dot structure 30 comprises active component 40 and pixel electrode 50.Each dot structure 30 can electrically connect with a corresponding data line DL and a corresponding sweep trace SL.
No matter above-mentioned electronic component 102 is capacitive touch control elements, electric resistance touch-control element or display pixel structure, and it all needs to electrically connect with external circuit or device, can export or input electronic element 102 so as to making signal.Therefore, general electronic component 102 can electrically connect with other external circuit or device through lead (or being called lead-in wire).
Please refer again to Figure 1A and Fig. 2 A, lead 104 is arranged on the substrate 100, and lead 104 electrically connects with electronic component 102.If electronic component 102 is capacitive touch control elements (as shown in Figure 3); Then the first touch-control connection pad 10 of each row can electrically connect with a corresponding lead 104 respectively with second touch-control connection pad 20 of each row, transfers out so as to the signal that the first touch-control connection pad 10 and the second touch-control connection pad 20 are sensed.If electronic component 102 is display pixel structure (as shown in Figure 4), then each bar data line DL can electrically connect with a corresponding lead 104 respectively with each bar sweep trace SL, so as to drive signal being input in each dot structure 30.In the present embodiment, lead 104 is a plain conductor, and it can be among the process that forms electronic component 102 and defines in the lump.
Particularly, in the present embodiment, the signal bonding pad of some is virtual connection pad 106a.So-called virtual connection pad 106a does not generally electrically connect with electronic component 102, thereby it does not have the function of signal bonding pad 106.Yet virtual connection pad 106a forms with signal bonding pad 106 simultaneously, and it can be used as detection, test or the usefulness of repairing.The material of above-mentioned virtual connection pad 106a comprises metal oxide or metal.
In the present embodiment, metal pattern 108 is positioned on the virtual connection pad 106a, and metal pattern 108 is not connected with lead 104 or not directly contact.In other words, break off between metal pattern 108 and the lead 104.And,, still have the relation of electric connection between metal pattern 108 and the lead 104 therefore through virtual connection pad 106a because metal pattern 108 is covered on the virtual connection pad 106a with lead 104 separately.In addition, metal pattern 108 covers virtual connection pad 106a area over half.In addition, in the present embodiment, except virtual connection pad 106a, then be not provided with metal pattern on the signal bonding pad 106.
In general, on substrate 100, can cover last layer overlayer 120, so as to the lead 104 of protecting electronic component 102 and electrically connecting with electronic component 102.Yet for signal bonding pad 106 can be electrically connected with follow up device or element, overlayer 120 can expose signal bonding pad 106.
Then, please with reference to Figure 1B and Fig. 2 B, electronic installation of the present invention also comprises a circuit board 130, and it is arranged on the signal bonding pad 106, and electrically connects with signal bonding pad 106.In the present embodiment, circuit board 130 is a flexible circuit board, and it comprises base material 132 and conductive structure 134, and wherein the conductive structure 134 of circuit board electrically connects with signal bonding pad 106.
In the present embodiment, between circuit board 130 and signal bonding pad 106, also comprise an anisotropic conductive 140.Through anisotropic conductive 140 circuit board 130 is attached on the substrate 100, and the conductive structure 134 of circuit board 130 and signal bonding pad 106 are electrically connected.In general, a conductive structure on the circuit board 130 134 can corresponding electrically contact with a signal bonding pad 106.
Hold the above, the signal bonding pad 106 in the electronic installation of present embodiment is not to be to be made up of metallic pad and the transparent conductive patterns that covers on the metallic pad like traditional connection pad.Therefore, the signal bonding pad 106 of present embodiment does not have the problem that can cause damage because of the etching solution that uses highly corrosive in the technology to metallic pad.In addition, the signal bonding pad 106 of present embodiment is not a metallic pad, thereby does not have metal easily because of being exposed to the problem of oxidation in the air or corrosion yet.
Moreover present embodiment is provided with metal pattern 108 on virtual connection pad 106a.Follow-uply after being bonded on circuit board 130 on the substrate 100, just observe the impression on the metal pattern 108, so as to the quality good and the bad reference of the splice program of decision circuitry plate 130.What deserves to be mentioned is; Because of the metal pattern 108 of present embodiment only is arranged on the virtual connection pad 106a; Even therefore metal pattern 108 is because of being exposed to oxidation or corrosion in the air; But the effect of not transmitting because of virtual connection pad 106a as signal, thus the oxidation of metal pattern 108 or corrosion can't between circuit board 130 and the signal bonding pad 106 engage or electrical connection causes bad influence.
The electronic installation of the foregoing description is on virtual connection pad 106a, metal pattern 108 to be set, and metal pattern is not set on signal bonding pad 106.Yet, in other the electronic installation of embodiment, also can not form virtual connection pad, and on signal bonding pad 106, all be provided with metal pattern, specify as follows.
Fig. 5 A is the synoptic diagram before circuit board is not set as yet of electronic installation according to an embodiment of the invention, and Fig. 5 B is the synoptic diagram of electronic installation after circuit board is set according to an embodiment of the invention.Fig. 6 A be Fig. 5 A along the diagrammatic cross-section of profile line A-A ' with profile line B-B ', Fig. 6 B is that Fig. 5 B is along the diagrammatic cross-section of profile line A-A ' with profile line B-B '.
Please earlier with reference to Fig. 5 A and Fig. 6 A, present embodiment is represented with identical label with the components identical of the foregoing description, and following explanation will not repeat to give unnecessary details to components identical.Present embodiment and the foregoing description difference are that present embodiment is not provided with virtual connection pad, and all connection pads all are signal bonding pad 106.And on each signal bonding pad 106 all correspondence be provided with a metal pattern 108.Particularly, each metal pattern 108 covers corresponding signal bonding pad 106 half the following areas.Because each metal pattern 108 covers corresponding signal bonding pad 106 half the following areas, so signal bonding pad 106 most areas are not still covered by metal pattern 108.
Then, please with reference to Fig. 5 B and Fig. 6 B, on the signal bonding pad 106 that circuit board 130 is arranged on substrate 100 after, conductive structure on the circuit board 130 134 electrically connects with signal bonding pad 106.Similarly, in the present embodiment, between circuit board 130 and signal bonding pad 106, also comprise an anisotropic conductive 140.Through anisotropic conductive 140 circuit board 130 is attached on the substrate 100, and the conductive structure 134 of circuit board 130 and signal bonding pad 106 are electrically connected.In general, a conductive structure on the circuit board 130 134 can corresponding electrically contact with a signal bonding pad 106.
Because the signal bonding pad 106 most areas of present embodiment are not still covered by metal pattern 108.Therefore the conductive structure 134 on the circuit board 130 is signal bonding pad 106 electric connections that exposed with major part.In other words, in the present embodiment, the conductive structure 134 of circuit board 130 mainly is still directly and signal bonding pad 106 electrically connects, but not just electrically connects via metal pattern 108.Present embodiment is provided with metal pattern 108 on signal bonding pad 106 purpose mainly is, after being bonded on circuit board 130 on the substrate 100, can observe the impression on the metal pattern 108, so as to the quality good and the bad reference of the splice program of decision circuitry plate 130.
Similarly, in the electronic installation of present embodiment, signal bonding pad 106 is arranged on metal pattern 108 belows.Therefore, the signal bonding pad 106 of present embodiment does not have the problem that can cause damage because of the etching solution that uses highly corrosive in the technology to lower metal layer.In addition, the signal bonding pad 106 of present embodiment is not the use metallic pad, thereby does not have metal easily because of being exposed to the problem of oxidation in the air or corrosion yet.
Moreover; The metal pattern 108 of present embodiment only is arranged on few part area of signal bonding pad 106; And metal pattern 108 is not as the bridge of signal bonding pad 106 with the electric connection of circuit board 130; Therefore even metal pattern 108 is because of being exposed to oxidation or corrosion in the air, the oxidation of metal pattern 108 or corrosion can't between circuit board 130 and the signal bonding pad 106 engage or electrical connection causes bad influence.
Electronic installation at the embodiment of Figure 1A and Figure 1B is on virtual connection pad, metal pattern to be set, and on signal bonding pad, metal pattern is not set.In the electronic installation of the embodiment of Fig. 5 A and Fig. 5 B then is not to be formed with virtual connection pad, and on signal bonding pad, all is provided with metal pattern.According to another embodiment of the present invention, can be to combine above-mentioned two embodiment.Just, in electronic installation, be designed with on virtual connection pad and the virtual connection pad and be coated with metal pattern, on signal bonding pad, also be provided with metal pattern simultaneously, and the metal pattern on the signal bonding pad only covers the half the following area of signal bonding pad.
Though the present invention discloses as above with embodiment; Right its is not in order to limit the present invention; Those of ordinary skill in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking appended the scope that claim defined.
Claims (10)
1. electronic installation comprises:
A plurality of electronic components are arranged on the substrate;
Many leads are arranged on this substrate, and electrically connect with said a plurality of electronic components;
A plurality of signal bonding pad, itself and the electrically corresponding connection of said many leads; And
At least one metal pattern is positioned on said a plurality of signal bonding pad of at least a portion, and wherein this at least one metal pattern electrically connects with said many leads but directly do not contact.
2. electronic installation as claimed in claim 1; Wherein, The wherein part of said a plurality of signal bonding pad is arranged on this substrate as virtual connection pad, and this metal pattern more is arranged on this virtual connection pad, and wherein this virtual connection pad directly is not connected with said many leads.
3. electronic installation as claimed in claim 2, wherein the material of this virtual connection pad comprises metal oxide or metal.
4. electronic installation as claimed in claim 2 also comprises at least one contraposition mark, is positioned on this substrate and is positioned at least one side of this virtual connection pad.
5. electronic installation as claimed in claim 1 is provided with a metal pattern separately on wherein said a plurality of signal bonding pad.
6. electronic installation as claimed in claim 1, wherein said a plurality of electronic components comprise capacitance touching control element, electric resistance touch-control element or display pixel structure.
7. electronic installation as claimed in claim 1, the material of wherein said a plurality of signal bonding pad comprises metal oxide.
8. electronic installation comprises:
A plurality of electronic components are arranged on the substrate;
Many leads are arranged on this substrate, and electrically connect with said a plurality of electronic components;
A plurality of signal bonding pad, itself and the electrically corresponding connection of said many leads, wherein, the wherein part of said a plurality of signal bonding pad is arranged on this substrate as virtual connection pad, and wherein this virtual connection pad directly is not connected with said many leads; And
At least one metal pattern is positioned on this virtual connection pad, and wherein this metal pattern electrically connects with said many leads but directly do not contact.
9. electronic installation as claimed in claim 8, the material of wherein said a plurality of signal bonding pad comprises metal oxide.
10. electronic installation as claimed in claim 8, wherein the material of this virtual connection pad comprises metal oxide or metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910173525A CN101661358B (en) | 2009-09-15 | 2009-09-15 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910173525A CN101661358B (en) | 2009-09-15 | 2009-09-15 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101661358A CN101661358A (en) | 2010-03-03 |
| CN101661358B true CN101661358B (en) | 2012-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910173525A Expired - Fee Related CN101661358B (en) | 2009-09-15 | 2009-09-15 | Electronic device |
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| Country | Link |
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| CN (1) | CN101661358B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103268179B (en) | 2013-05-02 | 2016-05-25 | 京东方科技集团股份有限公司 | Touch-control electrode and preparation method, capacitive touch device and touch display unit |
| TWI492120B (en) * | 2013-07-05 | 2015-07-11 | Au Optronics Corp | Touch panel |
| TWI486843B (en) * | 2013-09-13 | 2015-06-01 | Henghao Technology Co Ltd | Touch panel |
| TWI582653B (en) * | 2015-06-10 | 2017-05-11 | 恆顥科技股份有限公司 | Touch panel including fpc having dummy pattern and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050002243A (en) * | 2003-06-30 | 2005-01-07 | 엘지.필립스 엘시디 주식회사 | Liquid Crystal Display Device And Fabricating Method Thereof |
| CN1893783A (en) * | 2005-06-30 | 2007-01-10 | 中华映管股份有限公司 | Display module and flexible construction unit |
-
2009
- 2009-09-15 CN CN200910173525A patent/CN101661358B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050002243A (en) * | 2003-06-30 | 2005-01-07 | 엘지.필립스 엘시디 주식회사 | Liquid Crystal Display Device And Fabricating Method Thereof |
| CN1893783A (en) * | 2005-06-30 | 2007-01-10 | 中华映管股份有限公司 | Display module and flexible construction unit |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2009-4460A 2009.01.08 |
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| CN101661358A (en) | 2010-03-03 |
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