CN102346588A - Method for making metal circuit of touch control panel and touch control panel - Google Patents
Method for making metal circuit of touch control panel and touch control panel Download PDFInfo
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- CN102346588A CN102346588A CN2010102461786A CN201010246178A CN102346588A CN 102346588 A CN102346588 A CN 102346588A CN 2010102461786 A CN2010102461786 A CN 2010102461786A CN 201010246178 A CN201010246178 A CN 201010246178A CN 102346588 A CN102346588 A CN 102346588A
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- hard coating
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Abstract
The invention discloses a method for making a metal circuit of a touch control panel and a touch control panel. The method comprises the following steps of: 1, providing a substrate, wherein the substrate is provided with a guide line area; 2, providing at least one hard coating layer on the guide line area of the substrate; 3, forming a plurality of grooves on the hard coating layer; 4, forming a metal layer on the surface of the hard coating layer and in the grooves; and 5, heating. The metal layer is gathered in the grooves by means of surface tension, so a plurality of metal circuits are formed.
Description
Technical field
The present invention relates to a kind of manufacturing approach and contact panel thereof of metallic circuit of contact panel, refer to that especially a kind of etching step that need not use is the manufacturing approach and the contact panel thereof of plastic metallic circuit.
Background technology
Progress along with science and technology; Requirement for the operation-interface of electronic equipment also improves day by day; The visualize of for example operating, simplicity, high response or the like, especially, touch technology can replace the use of keyboard; And satisfy above-mentioned requirements, so contact panel has been used in the electronic products such as personal electric assistant (PDA), mobile phone in a large number.
The employed contact panel of electronic product can be divided into resistance-type, condenser type, infrared-type and ultrasonic formula or the like form haply at present, is modal product with electric resistance touch-control panel and capacitance type touch-control panel wherein; And with application surface; Capacitance type touch-control panel can be divided into surface capacitance type contact panel (single-point touch) and projected capacitive touch panel (multi-point touch) according to the different design in its Touch Zone; Dying can be applicable to the characteristic of multi-point touch because of capacitance type touch-control panel, capacitance type touch-control panel has been widely used on the high-order electronic product.
Capacitance type touch-control panel structurally comprises a substrate, is formed with tin indium oxide Touch Zone and conductor section on this substrate; Conductor section is provided with many leads, and these leads cooperate gold-tinteds and etch process and take shape on the above-mentioned conductor section, and are connected electrically in this tin indium oxide Touch Zone.
Yet; For the sensitivity of keeping contact panel and make it have the more touch controllable function of multiple spot; So the quantity of above-mentioned lead must significantly increase; But the size of considering the tin indium oxide Touch Zone must reach maximized condition, and the width of lead must reduce, in limited substrate space enough number of conductors to be set.Yet; Taiwan patent publication No. for example: 201001004 with Taiwan patent announcement number: M348999 has disclosed a kind of gold-tinted and above-mentioned lead of etch process making of utilizing; Its shortcoming is that tradition utilizes gold-tinted and etch process to be difficult for dwindling the width of lead, perhaps makes the width of plain conductor inhomogeneous, and causes not having stable resistance value on the plain conductor; Even possibly increase the resistance value of lead, and the delay that causes touching signals to transmit; Taiwan patent announcement number and for example: M354807 has disclosed a kind of photoresistance and has divested technology, and its technology is comparatively complicated, causes the increase of production cost.
Inventor of the present invention is in view of the shortcoming of technology when reality is implemented of above-mentioned usefulness, and the accumulation individual is engaged in the many years of experience that related industry is developed practice, studies intensively, and proposed a kind of reasonable in design and effectively improve the structure of the problems referred to above finally.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of manufacturing approach of metallic circuit of contact panel, and it provides a kind of manufacturing approach of metallic circuit, replacing traditional gold-tinted and etch process, and then produce resistance value stable with the low metallic circuit of resistance value.
Fundamental purpose of the present invention is to provide a kind of manufacturing approach of metallic circuit of contact panel, and it provides a kind of manufacturing approach of metallic circuit, to replace traditional gold-tinted, etch process, to simplify technology.
In order to achieve the above object, the present invention provides a kind of manufacturing approach of metallic circuit of contact panel, comprises following steps:
Step 1: a substrate is provided, and it has a conductor area;
Step 2: at least one hard coating is provided on this conductor area of this substrate;
Step 3: on this hard coating, make a plurality of grooves;
Step 4: moulding one metal level in the surface of this hard coating and these grooves; And
Step 5: carry out a heating steps, this metal level utilizes surface tension and accumulates in these grooves, thereby forms many metallic traces.
The present invention also provides a kind of contact panel that has according to the metallic circuit of the manufacturing approach manufacturing of above-mentioned metallic circuit, comprising: a substrate, and it has a conductor area; At least one hard coating, it is arranged on this conductor area of this substrate; And a plurality of grooves, it is molded on this hard coating, and wherein, each in these grooves all has the metallic circuit of assembling moulding because of surface tension.
The present invention has following useful effect: the present invention utilizes the mode of machining on hard coating, to make the groove that is equivalent to circuit layout; The surface tension effect that raises and caused through temperature again; The metal level that makes sheet produces the effect of cohesion along above-mentioned groove, has low impedance value and can be in order to transmit the conducting wire of signal and further form.In other words, the present invention need not use gold-tinted, the etching step of complicated steps, thereby reduces process complexity, also can reach the effect of simplifying technology, reducing production costs.
In order further to understand characteristic of the present invention and technology contents, consult following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide reference and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Figure 1A to Fig. 1 E is the schematic flow sheet of manufacturing approach that the metallic circuit of contact panel of the present invention is shown.
Fig. 2 is the synoptic diagram of contact panel of the present invention.
Fig. 3 is the side view of contact panel of the present invention.
Symbol description
10 substrates, 101 conductor area
102 touch areas, 1021 touch control units
11 hard coating 111 grooves
12 metal levels, 13 metallic circuits
20 rollers, 21 dimpling pieces
Embodiment
The present invention proposes a kind of manufacturing approach of metallic circuit of contact panel; It can not use traditional gold-tinted, etch process that metal level is made and be shaped to metallic circuit; But utilize modes such as machining to make groove; Further cooperate groove to make metallic circuit again, therefore manufacturing approach proposed by the invention has the effect of simplifying technology, reducing cost.
The manufacturing approach of the metallic circuit of the contact panel of specific embodiment of the present invention may further comprise the steps:
At first, with reference to Figure 1A, in step 1, a substrate 10 is provided.Particularly; This substrate 10 is the main support plate of contact panel; After integrated artistic is accomplished (as shown in Figure 2), can comprise conductor area 101 and touch area 102 on the substrate 10 at least, this conductor area 101 roughly is distributed in the periphery of this touch area 102; And the metallic circuit 13 on the civilian described conductor area 101 in back is electrically connected to this touch area 102, is sent to other electronic package with the signal that touch area 102 is sensed.Therefore, the present invention mainly proposes to carry out to the conductor area 101 on the substrate 10 forming method of metallic circuit 13, and therefore, the zone shown in Figure 1A to Fig. 1 E is merely the conductor area 101 of substrate 10.
In this specific embodiment, this substrate 10 can be plastics, PET for example, but do not exceed with above-mentioned.Particularly; This substrate 10 can be divided into conductor area 101 and touch area 102, combines Fig. 2 simultaneously, and touch area 102 can have a plurality of touch control units 1021 in fact; Each touch control unit 1021 comprises the transparency conducting layer (not shown) that is formed on this substrate 10 at least; This transparency conducting layer can be tin indium oxide (ITO) material, but not as limit, each touch control unit 1021 can be in order to sensing user's touching signals.
Then, with reference to Figure 1B, step 2 is moulding one a hard coating (hard coating layer) 11 on this conductor area 101 of this substrate 10; Yet in an alternate embodiment, this hard coating 11 can fully take shape on the conductor area 101 and touch area 102 of this substrate 10.Hard coating 11 can be processed by following material; Quasi cobalt carbon diaphragm (Diamond Like Carbon for example; DLC), silicon base compound (Silicon-Based Compound) and metal oxide etc., for example in one embodiment, hard coating 11 can be the silicon dioxide cured film; It has lower refractive index (about 1.46) and excellent hardness, thereby improves the stability and the structural strength of substrate 10.In addition, hard coating 11 infusion process capable of using (Dipping) or physical/chemical gas-phase depositions, for example (Plasma Enhanced Chemical Vapor Deposition PECVD) makes the plasma enhanced chemical vapor deposition method.
Next, with reference to figure 1C, step 3 is on this hard coating 11, to make a plurality of grooves 111.In the present invention; Utilize the mode of machining on this hard coating 11, to make above-mentioned groove 111; For example in one embodiment, the mode of roller capable of using (roll to roll) is made groove 111 on this hard coating 11, and concrete implementation method has roller 20 roll extrusion on this hard coating 11 of dimpling piece 21 for utilizing the surface; Dimpling piece 21 can take shape in the corresponding groove 111 on this hard coating 11 in order to making, and made groove 111 width are about 10 nanometers.
Then, with reference to figure 1D, step 4 is moulding one metal level 12 in the surface of this hard coating 11 and these grooves 111.In this specific embodiment, utilize sputtering method with metal material moulding such as gold, silver on the surface of hard coating 11 with these grooves 111 in.
At last, with reference to figure 1E, step 5 is for carrying out heating steps, makes this metal level 12 utilize surface tension and accumulates in these grooves 111, and form many metallic traces 13.Therefore; In this step,, make that the quite thin metal level 12 of institute's moulding condenses because of surface tension in the step 4 through the rising of temperature; And because formed recess can provide the position that above-mentioned metal material is assembled in the groove 111; In other words, the effect of consolidated statement surface tension and groove 111, therefore the quite thin metal level 12 of institute's moulding can form metallic circuit 13 in the step 4 along groove 111.In this specific embodiment; Can temperature be increased to more than 150 ℃ or 150 ℃; So that this metal level 12 can be shaped to linearity and has certain patterns and do not contact with each other, be used for the metallic circuit 13 of transmission signals along these grooves 111; And metallic circuit 13 is molded in the conductor area 101 and be electrically connected to this touch area 102 (as shown in Figure 2), is sent to other electronic package with the signal that touch area 102 is sensed.
Therefore, specific embodiment of the present invention utilizes the mode of roller 20 roll extrusion on this hard coating 11, to form the groove 111 with configuration; Coated with conductive property good metal layer 12 on this hard coating 11 again; And, utilize capillary effect to be gathered in the groove 111 laminar metal level 12 with the mode of rising temperature, to form many metallic circuits 13 with electronic circuit function along groove 111; That is, the present invention need not use traditional gold-tinted, etched technology, can on substrate 10, form the metallic circuit 13 that transmits signal effectively.
And in specific embodiment of the present invention; The impedance of the metallic circuit 13 of these moulding is about 5 Ω/; So can satisfy the specification requirement of transmission electronic signal, that is utilize the metallic circuit 13 of method manufacturing proposed by the invention to be sent to other electronic package in order to the signal that touch area 102 is sensed.
In sum, the present invention can produce a kind of contact panel according to the described method for making of above-mentioned specific embodiment, and it comprises a substrate 10, and it has a conductor area 101; At least one hard coating 11, it is located on the conductor area 101 of this substrate 10; And a plurality of grooves 111, it is molded on this hard coating 11, and wherein, each in these grooves 111 all has the metallic circuit 13 of assembling moulding because of surface tension.
With reference to figure 2 and Fig. 3; This contact panel comprises that also one is positioned at the touch area 102 on this substrate 10; And among the embodiment; This conductor area 101 is positioned at the periphery of this touch area 102, and this metallic circuit 13 is electrically connected to the touch control unit 1021 in this touch area 102, is sent to other electronic package with the signal that each touch control unit 1021 is sensed.
Particularly, each touch control unit 1021 comprises the transparency conducting layer (not shown) that is formed on this substrate 10 at least, and this transparency conducting layer can be tin indium oxide (ITO) material, but not as limit; In addition, gold capable of using or silver-colored material are made this metallic circuit 13, and impedance is low to form, the signal transmission path of good conductivity.
In sum; The present invention has following advantage: the present invention utilizes the mode of machining on hard coating, to make the groove that is equivalent to circuit layout; The surface tension effect or other thermal stress effects that raise and caused through temperature again; Make the metal level of sheet produce the effect of cohesion, can be used for the circuit of transmission signals with further formation along above-mentioned groove.That is, the present invention need not the gold-tinted, the etching step that use step numerous and diverse, thereby reduces process complexity, also can reach the effect of simplifying technology, reducing production costs.
The above is merely the preferred embodiments of the present invention, is not so limits claim of the present invention, and therefore every instructions of the present invention and resultant equivalence techniques of accompanying drawing content of utilizing changes, and includes within the scope of the invention.
Claims (9)
1. the manufacturing approach of the metallic circuit of a contact panel is characterized in that, comprises following steps:
One substrate is provided, and it has a conductor area;
At least one hard coating is provided on the said conductor area of said substrate;
On said hard coating, make a plurality of grooves;
Moulding one metal level on the surface of said hard coating; And
Carry out a heating steps, said metal level utilizes surface tension and accumulates in said a plurality of groove, to form many metallic traces.
2. the manufacturing approach of the metallic circuit of contact panel according to claim 1; It is characterized in that; The step of on said hard coating, making said a plurality of grooves is to utilize surperficial roller roll extrusion with dimpling piece in said hard coating, and said a plurality of grooves are molded on the said hard coating.
3. the manufacturing approach of the metallic circuit of contact panel according to claim 2; It is characterized in that, in the surface of said hard coating and said a plurality of groove the step of moulding one metal level be utilize sputtering method with metal material moulding in the surface of said hard coating and said a plurality of groove.
4. the manufacturing approach of the metallic circuit of contact panel according to claim 2; It is characterized in that; In the step of carrying out a heating steps; Temperature is increased to 150 ℃ so that said metal level along said a plurality of grooves be shaped to have certain patterns, in order to said many metallic traces of transmission signals.
5. the contact panel of the metallic circuit of the manufacturing approach manufacturing of the metallic circuit with contact panel according to claim 1 is characterized in that, comprising:
One substrate, it has a conductor area;
At least one hard coating, it is located on the said conductor area of said substrate; And
A plurality of grooves, it is molded on the said hard coating, and wherein, each in said a plurality of grooves all has the metallic circuit of assembling moulding because of surface tension.
6. contact panel according to claim 5 is characterized in that, comprises that also one is positioned at the touch area on the said substrate, and wherein said conductor area is positioned at the periphery of said touch area, and said metallic circuit is electrically connected to said touch area.
7. contact panel according to claim 6 is characterized in that said touch area has at least one touch control unit, and said touch control unit comprises a transparency conducting layer at least.
8. contact panel according to claim 7 is characterized in that, said transparency conducting layer is the tin indium oxide material.
9. contact panel according to claim 5 is characterized in that, said metallic circuit is gold or silver-colored material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102461786A CN102346588A (en) | 2010-08-04 | 2010-08-04 | Method for making metal circuit of touch control panel and touch control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102461786A CN102346588A (en) | 2010-08-04 | 2010-08-04 | Method for making metal circuit of touch control panel and touch control panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102346588A true CN102346588A (en) | 2012-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102461786A Pending CN102346588A (en) | 2010-08-04 | 2010-08-04 | Method for making metal circuit of touch control panel and touch control panel |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103440906A (en) * | 2013-07-31 | 2013-12-11 | 南昌欧菲光科技有限公司 | Conductive film and touch panel |
| CN103871546A (en) * | 2012-12-18 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Transparent conductive substrate and manufacturing method thereof |
| TWI493422B (en) * | 2013-03-28 | 2015-07-21 | 南昌歐菲光科技有限公司 | Capacitive touch screen |
| CN105094223A (en) * | 2014-05-09 | 2015-11-25 | 苹果公司 | Self-profiling friction pads for electronic devices |
| US9201551B2 (en) | 2013-03-28 | 2015-12-01 | Nanchang O-Film Tech. Co., Ltd. | Capacitive touch screen |
| CN105451438A (en) * | 2015-11-19 | 2016-03-30 | 业成光电（深圳）有限公司 | Embedded metal line structure and manufacturing method |
| US11269466B2 (en) | 2020-04-28 | 2022-03-08 | Beijing Zenithnano Technology Co., Ltd. | Touch panels |
| US11269474B2 (en) | 2020-04-28 | 2022-03-08 | Beijing Zenithnano Technology Co., Ltd | Touch devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080314626A1 (en) * | 2005-12-12 | 2008-12-25 | Moore Chad B | ELECTRODED SHEET (eSheet) PRODUCTS |
| EP2124514A1 (en) * | 2008-05-23 | 2009-11-25 | Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO | Providing a plastic substrate with a metallic pattern |
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2010
- 2010-08-04 CN CN2010102461786A patent/CN102346588A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080314626A1 (en) * | 2005-12-12 | 2008-12-25 | Moore Chad B | ELECTRODED SHEET (eSheet) PRODUCTS |
| EP2124514A1 (en) * | 2008-05-23 | 2009-11-25 | Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO | Providing a plastic substrate with a metallic pattern |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103871546A (en) * | 2012-12-18 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Transparent conductive substrate and manufacturing method thereof |
| TWI493422B (en) * | 2013-03-28 | 2015-07-21 | 南昌歐菲光科技有限公司 | Capacitive touch screen |
| US9201551B2 (en) | 2013-03-28 | 2015-12-01 | Nanchang O-Film Tech. Co., Ltd. | Capacitive touch screen |
| CN103440906A (en) * | 2013-07-31 | 2013-12-11 | 南昌欧菲光科技有限公司 | Conductive film and touch panel |
| CN103440906B (en) * | 2013-07-31 | 2016-04-13 | 南昌欧菲光科技有限公司 | Conducting film and contact panel |
| CN105094223A (en) * | 2014-05-09 | 2015-11-25 | 苹果公司 | Self-profiling friction pads for electronic devices |
| CN105094223B (en) * | 2014-05-09 | 2018-11-06 | 苹果公司 | Self-forming friction pad for electronic device |
| CN105451438A (en) * | 2015-11-19 | 2016-03-30 | 业成光电（深圳）有限公司 | Embedded metal line structure and manufacturing method |
| US11269466B2 (en) | 2020-04-28 | 2022-03-08 | Beijing Zenithnano Technology Co., Ltd. | Touch panels |
| US11269474B2 (en) | 2020-04-28 | 2022-03-08 | Beijing Zenithnano Technology Co., Ltd | Touch devices |
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Application publication date: 20120208 |