JP2012247852A - Transparent conductive structure applicable to touch panel, and manufacturing method for the structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transparent conductive structure applicable to a touch panel and a manufacturing method for the structure.SOLUTION: A transparent conductive structure comprises: a substrate unit having at least one transparent substrate; a first coating unit having at least one first coating layer formed on an upper surface of the at least one transparent substrate; a transparent conductive unit having at least one transparent conductive layer formed on an upper surface of the at least one first coating layer, and having a plurality of conductive circuits arranged in a predetermined circuit pattern on the at least one transparent conductive layer; and a second coating unit having at least one second coating layer formed on an upper surface of the at least one transparent conductive layer from a mixture of silicon oxide, aluminum oxide, lithium oxide, and Teflon (Registered trademark), and having a touch surface that can be touched by an operator (for example, a finger of a user or any kind of touch pen) at an apex of the at least one second coating layer.

Description

  The present invention relates to a transparent conductive structure and a manufacturing method thereof, and particularly relates to a transparent conductive structure applied to a touch panel and a manufacturing method thereof.

  In general, touch panels are roughly classified into electric resistance type, capacitive type, piezoelectric type, infrared type, and ultrasonic type according to the detection principle. Among these, capacitive type touch panels have a transparent conductive material film on the glass surface as an inner lead. There is a structure called a touch sensor that is plated as a wire and transmits a signal to an integrated circuit (IC) on an external flexible plate or a rigid plate through a metal lead wire around the glass. When an external circuit board and the uppermost protective cover are further attached to the structure, a touch panel is obtained. In use, when a user touches a glass surface with a uniform electric field with a fingertip, static electricity is generated, and a capacitance change occurs between the finger and the electric field, and the coordinates of the input point position are positioned based on this change. be able to.

  FIG. 1 discloses a well-known technique of a transparent conductive structure applied to a touch panel. The structure includes a PET substrate 1a, a hard coating 2a formed on the upper surface of the PET substrate 1a, and a bottom of the PET substrate 1a. A plurality of conductive circuits 3a formed on the surface, and a protective layer 4a for covering the plurality of conductive circuits 3a to protect the plurality of conductive circuits 3a. However, in the above-described structure, the plurality of conductive circuits 3a are considerably separated from the upper surface 20a of the hard coating 2a (that is, the contact surface that is contacted when the user operates the touch panel). It is necessary to use an ultra-low conductivity material having an electrical conductivity (conducting range) lower than 0.3 ohm / square (Ω / □).

  An object of this invention is to provide the transparent conductive structure applied to a touchscreen, and its manufacturing method.

  The present invention includes a substrate unit having at least one transparent substrate, a first covering unit having at least one first covering layer formed on an upper surface of the at least one transparent substrate, and the at least one first substrate. A transparent conductive unit having at least one transparent conductive layer formed on an upper surface of one coating layer, and provided with a plurality of conductive circuits arranged in a predetermined circuit pattern on the at least one transparent conductive layer; And at least one second coating layer formed on the upper surface of the at least one transparent conductive layer and formed by mixing silicon oxide, aluminum oxide, lithium oxide, and Teflon (Teflon) with each other. And an operator (for example, a user's finger or any other touch pen) can be touched on the top end of the at least one second covering layer. Providing a second coating unit which touch surface is provided, such a transparent conductive structure applied to a touch panel, characterized in that it comprises a.

  The present invention also includes a step of first preparing a substrate unit having at least one transparent substrate, and a step of forming at least one first covering layer on the upper surface of the at least one transparent substrate. And forming at least one transparent conductive layer provided with a plurality of conductive circuits arranged in a predetermined circuit pattern on the upper surface of the at least one first covering layer, and finally, At least one transparent conductive layer is provided with a touch surface on the top end to which an operator can touch, and silicon oxide, aluminum oxide, lithium oxide, and Teflon (registered trademark) are mixed with each other. Forming a transparent conductive structure applied to a touch panel, comprising: forming at least one second covering layer.

  As described above, the transparent conductive structure and the manufacturing method thereof according to the present invention are configured so that the distance between the touch surface that can be touched by the operator and the predetermined circuit pattern is close to each other. There is no need to manufacture the circuit with an ultra-low conductive material, and a circuit pattern with a conductive range of 0.8 to 3 ohm / square can be obtained and applied to a touch panel. Furthermore, the at least one second coating layer is a hard material having a feature of high wear resistance and low friction coefficient, in which silicon oxide, aluminum oxide, lithium oxide, and Teflon (registered trademark) are mixed with each other. A protective layer is formed.

The side surface cross-section schematic diagram of the transparent conductive structure applied to the conventional touch panel is shown. The flow of 1st Embodiment which concerns on this invention is shown. (A) The side surface cross-section schematic diagram of 1st Embodiment which concerns on this invention which completed step S100 thru | or step S102 is shown. (B) The side surface cross-section schematic diagram of 1st Embodiment which concerns on this invention which completed step S104 is shown. (C) The side surface cross-section schematic diagram of 1st Embodiment which concerns on this invention which completed step S106 is shown. 1 is a schematic top view of a layout method for a plurality of conductive circuits according to a first embodiment of the present invention. The side surface cross-sectional schematic diagram of 2nd Embodiment which concerns on this invention is shown. The side surface cross-section schematic diagram of 3rd Embodiment which concerns on this invention is shown. The side surface cross-sectional schematic diagram of 4th Embodiment which concerns on this invention is shown.

[First Embodiment]
The manufacturing method of the transparent conductive structure applied to the touch panel of the first embodiment according to the present invention includes at least the following steps (see steps S100 to S106 shown in FIG. 2).

  As shown in FIGS. 2 and 3A, in step S100, a substrate unit 1 having at least one transparent substrate 10 is prepared. The at least one transparent substrate 10 is made of, for example, polyethylene terephthalate (PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene, PE), polyvinyl chloride (Poly Vinyl Chloride (PVC)), polypropylene (Poly Propylene). , PP), polystyrene (Poly Styrene, PS), or polymethylmethacrylate (PMMA), and the thickness may be 50 μm to 125 μm. In other words, the designer can manufacture the at least one transparent substrate 10 using different materials according to different demands. There are no limitations on the material for manufacturing the transparent substrate 10, and any material that can manufacture the transparent substrate 10 (for example, plastic, glass, etc.) can be applied to the present invention.

  In step S <b> 102, at least one first covering layer 20 is formed on the upper surface of the at least one transparent substrate 10. The at least one first covering layer 20 may be a hard covering layer made of a hard material, for example. In other words, the designer can manufacture the at least one first covering layer 20 using different hard materials according to different demands. For example, when the hard material is an ultraviolet curable material, the hard coating layer is an ultraviolet curable coating layer. However, there are no restrictions on the manufacturing material of the first coating layer 20, and any material that can manufacture the first coating layer 20 can be applied to the present invention.

  As shown in FIGS. 2 and 3B, in step S104, a plurality of conductive circuits 300 arranged in a predetermined circuit pattern P are provided on the upper surface of the at least one first covering layer 20. At least one transparent conductive layer 30 is formed. The transparent conductive unit 3 may be, for example, an indium tin oxide (ITO) conductive layer, and the conductive circuit 300 may be formed on the upper surface of the at least one transparent conductive layer 30. Depending on different demands, the plurality of conductive circuits 300 may be silver circuits made of silver material, aluminum circuits made of aluminum material, copper circuits made of copper material, or conductive circuits made of any conductive material. Further, the plurality of conductive circuits 300 do not need to be manufactured with an ultra-low conductive material, and the predetermined circuit pattern P having a conductive range (electrical conductivity) of 0.8 to 3 ohm / square can be obtained. . In other words, the designer can manufacture a plurality of conductive circuits 300 on the upper surface of the at least one transparent conductive layer 30 according to a predetermined circuit pattern P and a predetermined conductive range.

  Further, as shown in FIGS. 3B and 4, the plurality of conductive circuits 300 include, for example, a plurality of X-axis direction trajectory circuits 300 </ b> X extending in the horizontal direction and a vertical direction (the horizontal direction is substantially orthogonal to each other). ) And a plurality of Y-axis direction trajectory circuits 300Y that are insulated from and substantially orthogonal to the plurality of X-axis direction trajectory circuits 300X, and the thickness H (see FIG. 3B) is 3000 to 5000 mm. The X-axis direction trajectory circuit 300X has a width W1 of 3000 mm to 5000 mm, a distance D1 between the X-axis direction trajectory circuits 300X is 10 μm to 20 μm, and the plurality of Y-axis direction trajectory circuits 300Y. The width W2 is 1000 to 2000 mm, and the distance D2 between the Y-axis direction trajectory circuits 300Y is 5 to 15 μm. However, the plurality of conductive circuits 300 described above are merely examples, and do not limit the present invention.

As shown in FIG. 2 and FIG. 3C, in step S106, an operation element (for example, a user's finger F or any touch pen) can be touched on the top surface of the at least one transparent conductive layer 30 at the top end. At least one second covering layer 40 provided with a surface 400 is formed. Since the plurality of conductive circuits 300 are formed on the upper surface of the at least one transparent conductive layer 30, the plurality of conductive circuits 300 are covered with the at least one second covering layer 40. The at least one second covering layer 40 is, for example, a hard protective layer made of a hard material. For example, at least silicon oxide (for example, silicon dioxide (SiO ₂ )) and aluminum oxide (for example, alumina (Al ₂ O) ₃ )), lithium oxide and Teflon (registered trademark) are mixed with each other, and the weight percent of the silicon oxide with respect to the second coating layer 40 is 60% to 95%. Aluminum oxide % Of the second coating layer 40 is 20% to 25%, and the weight percent of the lithium oxide to the second coating layer 40 is 5% to 10%. Teflon (registered trademark) ) To the second coating layer 40 is 5% to 10%.

  Referring to FIG. 3C and FIG. 4, after step S100 to step S106 are completed, the first embodiment of the present invention includes a substrate unit 1 having at least one transparent substrate and the at least one transparent substrate. A first coating unit 2 having at least one first coating layer 20 formed on the upper surface of the substrate 10, and at least one transparent conductive material formed on the upper surface of the at least one first coating layer 20 A transparent conductive unit 3 including a plurality of conductive circuits 300 arranged in a predetermined circuit pattern P on the at least one transparent conductive layer, and an upper surface of the at least one transparent conductive layer 30. And at least one of silicon oxide, aluminum oxide, lithium oxide, and Teflon (registered trademark) mixed with each other A second covering layer 40 having a touch surface to which an operating element (for example, a user's finger or any other touch pen) can be touched at the top end of the at least one second covering layer 40 A transparent conductive structure applied to a touch panel including the unit 4 is provided.

  The at least one transparent substrate 10 is made of, for example, polyethylene terephthalate (PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene, PE), polyvinyl chloride (Poly Vinyl Chloride (PVC)), polypropylene (Poly Propylene). , PP), polystyrene (Poly Styrene, PS), or polymethylmethacrylate (PMMA), and the thickness may be 50 μm to 125 μm. The at least one first coating layer 20 may be a hard coating layer, and the hard coating layer may be an ultraviolet curable coating layer. The plurality of conductive circuits 300 may be silver circuits, aluminum circuits, copper circuits, or any conductive circuits, and the predetermined circuit pattern P may have a conductive range of 0.8 to 3 ohms / square.

  Further, the plurality of conductive circuits 300 (see FIG. 4) include a plurality of X-axis direction trajectory circuits 300 </ b> X extending in the horizontal direction, and extending in the vertical direction and insulated from and orthogonal to the plurality of X-axis direction trajectory circuits 300 </ b> X. A plurality of Y-axis direction trajectory circuits 300Y having a thickness H of 3000 mm to 5000 mm, and the plurality of X-axis direction trajectory circuits 300X having a width W1 of 3000 mm to 5000 mm. The distance D1 between 300X is 10 μm to 20 μm, the plurality of Y-axis direction trajectory circuits 300Y have a width W2 of 1000 to 2000 mm, and the distance D2 between the Y-axis direction trajectory circuits 300Y is 5 μm to It may be 15 μm. The plurality of conductive circuits 300 are formed on the upper surface of the at least one transparent conductive layer 30 and are covered with the at least one second covering layer 40. The at least one second covering layer 40 may be a hard protective layer made of a hard material.

[Second Embodiment]
Referring to FIG. 5, the second embodiment according to the present invention is applied to a touch panel including a substrate unit 1, a first covering unit 2, a transparent conductive unit 3, and a second covering unit 4. A transparent conductive structure is provided. From the comparison between FIG. 5 and FIG. 3C, the biggest difference between the second embodiment and the first embodiment is that in the second embodiment, the plurality of conductive circuits 300 are replaced with the at least one conductive circuit 300. A plurality of fitting type conductive circuits 300 are formed by fitting into one transparent conductive layer 30. For example, the plurality of conductive circuits 300 have their upper surfaces exposed such that their upper surfaces are covered with the at least one second covering layer 40 and are flush with the upper surface of the at least one transparent conductive layer 30. It has become. In other words, the designer places a plurality of conductive circuits 300 in the at least one transparent conductive layer 30 (for example, by roll pressing the plurality of conductive circuits 300 according to a predetermined circuit pattern P and a predetermined conductive range. Embedded in the at least one transparent conductive layer 30).

[Third Embodiment]
Referring to FIG. 6, the third embodiment according to the present invention is applied to a touch panel including a substrate unit 1, a first covering unit 2, a transparent conductive unit 3, and a second covering unit 4. A transparent conductive structure is provided. From the comparison between FIG. 6 and FIG. 3C, the biggest difference between the third embodiment and the first embodiment is that in the third embodiment, the plurality of conductive circuits 300 are replaced with the at least one conductive circuit 300. A plurality of fitting-type conductive circuits 300 are formed by fitting on the lower surfaces of the two transparent conductive layers 30 and fitting them into the at least one first covering layer 20. In other words, the designer rolls a plurality of conductive circuits 300 in the at least one first coating layer 20 (for example, the at least one transparent conductive layer 30 is rolled) according to a predetermined circuit pattern P and a predetermined conductive range. The plurality of conductive circuits 300 can be embedded in the at least one first covering layer 20 by pressing.

[Fourth Embodiment]
Referring to FIG. 7, the fourth embodiment according to the present invention is applied to a touch panel including a substrate unit 1, a first covering unit 2, a transparent conductive unit 3, and a second covering unit 4. A transparent conductive structure is provided. From the comparison between FIG. 7 and FIG. 3 (c), the greatest difference between the fourth embodiment and the first embodiment is that in the fourth embodiment, the at least one transparent conductive layer 30 is It has at least two transparent conductive films (30A, 30B) stacked on each other, and the plurality of conductive circuits 300 are formed between the at least two transparent conductive films (30A, 30B). . The plurality of conductive circuits 300 are, for example, simultaneously inserted into one transparent conductive film 30A (ie, the first transparent conductive film) and formed on the other transparent conductive film 30B (ie, the first transparent conductive film). The second transparent conductive film) may be contacted. In other words, the designer places a plurality of conductive circuits 300 between the at least two transparent conductive films (30A, 30B) (for example, the at least one transparent conductive film) according to a predetermined circuit pattern P and a predetermined conductive range. By rolling the layer 30, the plurality of conductive circuits 300 can be embedded in the at least two transparent conductive films (30 </ b> A, 30 </ b> B).

  As described above, the transparent conductive structure and the manufacturing method thereof according to the present invention are configured so that the distance between the touch surface that can be touched by the operator and the predetermined circuit pattern is close to each other. There is no need to manufacture the circuit with an ultra-low conductive material, and a circuit pattern with a conductive range of 0.8 to 3 ohm / square can be obtained and applied to a touch panel. Furthermore, the at least one second coating layer is a hard material having a feature of high wear resistance and low friction coefficient, in which silicon oxide, aluminum oxide, lithium oxide, and Teflon (registered trademark) are mixed with each other. A protective layer is formed.

  What has been described above is merely a preferred embodiment of the present invention, and any equivalent changes or modifications made based on the structures, features, and principles described in the claims of the present invention are all claimed in the present invention. It shall be included in the range of.

DESCRIPTION OF SYMBOLS 1 Substrate unit 10 Transparent substrate 2 1st coating unit 20 1st coating layer 3 Transparent conductive unit 30 Transparent conductive layer 30A, 30B Transparent conductive film 300 Conductive circuit P Circuit pattern 300X X-axis direction locus circuit 300Y Y-axis direction locus circuit H Thickness W1, W2 Width D1, D2 Distance 4 Second coating unit 40 Second coating layer 400 Touch surface F Finger

Claims (10)

A substrate unit having at least one transparent substrate;
A first coating unit having at least one first coating layer formed on an upper surface of the at least one transparent substrate;
A plurality of conductive circuits having at least one transparent conductive layer formed on an upper surface of the at least one first covering layer, and arranged in a predetermined circuit pattern on the at least one transparent conductive layer; Transparent conductive unit,
And at least one second coating layer formed on the upper surface of the at least one transparent conductive layer and formed by mixing silicon oxide, aluminum oxide, lithium oxide, and Teflon (registered trademark) with each other. A second covering unit provided with a touch surface to which an operator can touch at a top end of the at least one second covering layer;
A transparent conductive structure applied to a touch panel.   The at least one first coating layer is a hard coating layer, the hard coating layer is an ultraviolet-curing coating layer, and the plurality of conductive circuits are a silver circuit, an aluminum circuit, or a copper circuit, and the predetermined circuit 2. The circuit pattern according to claim 1, wherein a conductive range is 0.8 to 3 ohm / square, and the at least one second covering layer is a hard protective layer made of a hard material. Transparent conductive structure applied to touch panels.   The at least one transparent substrate may be polyethylene terephthalate (PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene, PE), polyvinyl chloride (Poly Vinyl Chloride, PVC), polypropylene (Poly Propylene, PP). 2. The transparent conductive structure applied to the touch panel according to claim 1, wherein the transparent conductive structure is selected from any of polystyrene, polystyrene (PS), and polymethylmethacrylate (PMMA).   The plurality of conductive circuits include a plurality of X-axis direction trajectory circuits extending in the horizontal direction and a plurality of Y-axis direction trajectory circuits extending in the vertical direction and insulated from and orthogonal to the plurality of X-axis direction trajectory circuits. The thickness of the plurality of X axis direction trajectory circuits is 3000 mm to 5000 mm, the distance between the X axis direction trajectory circuits is 10 μm to 20 μm, and the plurality of the X axis direction trajectory circuits are 10 μm to 20 μm. The Y-axis direction trajectory circuit has a width of 1000 to 2000 mm, and the distance between the Y-axis direction trajectory circuits is 5 μm to 15 μm. Conductive structure.   2. The touch panel according to claim 1, wherein the plurality of conductive circuits are formed on an upper surface of the at least one transparent conductive layer and are covered with the at least one second covering layer. Transparent conductive structure.   2. The transparent applied to the touch panel according to claim 1, wherein the plurality of conductive circuits are fitted into the at least one transparent conductive layer and are covered with the at least one second cover layer. Conductive structure.   2. The touch panel according to claim 1, wherein the plurality of conductive circuits are formed on a lower surface of the at least one transparent conductive layer and fitted into the at least one first covering layer. Transparent conductive structure.   The at least one conductive layer has at least two transparent conductive films stacked on each other, and the plurality of conductive circuits are formed between the at least two transparent conductive films. Item 2. A transparent conductive structure applied to the touch panel according to Item 1.   9. The transparent conductive structure applied to a touch panel according to claim 8, wherein the plurality of conductive circuits are simultaneously fitted in one transparent conductive film and are in contact with the other transparent conductive film. Providing a substrate unit having at least one transparent substrate;
Forming at least one first covering layer on an upper surface of the at least one transparent substrate;
Forming at least one transparent conductive layer provided with a plurality of conductive circuits arranged in a predetermined circuit pattern on an upper surface of the at least one first covering layer;
The top surface of the at least one transparent conductive layer is provided with a touch surface to which an operator can touch at the top end, and silicon oxide, aluminum oxide, lithium oxide, and Teflon (registered trademark) are mixed with each other. Forming at least one second coating layer comprising:
A method for producing a transparent conductive structure applied to a touch panel, comprising:

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