CN102339956A - Laser induced thermal imaging device for absorbing impaction - Google Patents

Laser induced thermal imaging device for absorbing impaction Download PDF

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Publication number
CN102339956A
CN102339956A CN2011101768325A CN201110176832A CN102339956A CN 102339956 A CN102339956 A CN 102339956A CN 2011101768325 A CN2011101768325 A CN 2011101768325A CN 201110176832 A CN201110176832 A CN 201110176832A CN 102339956 A CN102339956 A CN 102339956A
Authority
CN
China
Prior art keywords
supply pipe
air supply
lower casing
upper casing
damping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101768325A
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Chinese (zh)
Inventor
金相午
金焕
尹小辉
崔东奎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AP Systems Inc
AP Cells Inc
Original Assignee
AP Cells Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AP Cells Inc filed Critical AP Cells Inc
Publication of CN102339956A publication Critical patent/CN102339956A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/40Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
    • B41M5/46Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography characterised by the light-to-heat converting means; characterised by the heat or radiation filtering or absorbing means or layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F16/00Transfer printing apparatus
    • B41F16/0006Transfer printing apparatus for printing from an inked or preprinted foil or band
    • B41F16/0093Attachments or auxiliary devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/267Marking of plastic artifacts, e.g. with laser
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Abstract

The invention relates to a laser induced thermal imaging device for absorbing impaction, comprising: a lower housing; an upper housing disposed at the upper part of the lower housing to form a vacuum cavity; and a damping unit disposed at the contact part of the upper housing and the lower housing, and reducing impaction via a pneumatic pressure. The damping unit is provided with a pneumatic supply so as to reduce impaction caused by contact with the lower housing when the upper housing is supported.

Description

Damping laser is led to thermal imaging device
Technical field
The present invention relates to a kind of damping laser and lead to thermal imaging (Laser Induced Thermal Imaging; LITI) device; More specifically, relate to a kind of can alleviating in the film cohesive process and lead to thermal imaging device because upper casing contacts the damping laser of the vibrations that produce with lower casing.
Background technology
In flat-panel monitor; Because the fast response time of display of organic electroluminescence is 1ms or shorter, low in energy consumption and because of its visual angle outstanding for self-luminous has, display of organic electroluminescence has the advantage no matter how the moving image size all can be used as its display medium.In addition, because display of organic electroluminescence can create via simple technology based on the conventional semiconductor process technology at low temperatures, therefore the display of organic electroluminescence as flat-panel monitor of future generation has caused concern.
According to material that uses in the Organnic electroluminescent device and technology, display of organic electroluminescence can be divided into polymer-type device that adopts wet method and the low-molecular-weight type device that adopts sedimentation usually.
Yet in the one-tenth figure of polymer or low-molecular-weight luminescent layer method (patterning method), ink-jet printing process has following shortcoming: the material (except that luminescent layer) for organic layer has restriction, and the structure that is used for inkjet printing must be formed at substrate.In addition, when utilizing sedimentation,, make that large-scale display device is difficult to make owing to adopted metal mask to luminescent layer one-tenth figure.
As the substitute technology of above-mentioned one-tenth figure method, developed a kind of laser recently and led to thermal imaging (LITI) method.
The LITI method will convert heat energy into from the laser of light source, and then successively one-tenth schemed material and pass and to move on on the target substrate, form figure.
In the LITI method, donor film covers the whole base plate as acceptor, and donor film and substrate are fixed on the platform.In addition, through lamination treatment, donor film and substrate further combine, and form figure through laser imaging then.
It should be noted that it is in order to understand background technology that above-mentioned explanation is provided, rather than to the explanation of technology well-known in the art.
Routinely, in fit on casing and the process of lower casing, produce vibrations, cause the mechanical damage of donor film and substrate with definite vacuum chamber (donor film and substrate combine therein).Therefore, be necessary to address the above problem.
Summary of the invention
One aspect of the present invention provides a kind of damping laser and leads to thermal imaging device, and the vibrations that this device produces in the time of can alleviating upper casing and lower casing assembling are to prevent the damage when it assembles.
According to an aspect of the present invention, a kind of damping laser leads to thermal imaging (LITI) device to comprise: lower casing; Upper casing places on this lower casing and forms vacuum chamber; And vibration absorption unit, be positioned at the contact portion of this upper casing and this lower casing, and utilize pneumatic pressure to alleviate vibrations.
Said vibration absorption unit comprises: air supply pipe, pass said lower casing; Air feed pump connects this air supply pipe and supplies pneumatic pressure through this air supply pipe; And damper assembly (damping member), support said upper casing and connect this air supply pipe to receive pneumatic pressure through this air supply pipe supply.
Said damper assembly comprises: the coupling part that connects said air supply pipe; And extend out from this coupling part and store the damping portion of pneumatic pressure therein.
Said coupling part is provided with mesh hook in its outer peripheral edges, and this mesh hook is meshed with engaging plate on being arranged at said lower casing.
The contact protrusion that said damping portion has a plurality of and said upper casing preferentially to contact.
Said damper assembly comprises elastomeric material.
Description of drawings
Below in conjunction with accompanying drawing embodiment is described, make above-mentioned and other aspects of the present invention, feature and advantage obvious, wherein:
Fig. 1 leads to thermal imaging (LITI) schematic representation of apparatus for damping laser according to an exemplary embodiment of the present invention;
Fig. 2 is the cross-sectional schematic according to the damping LITI device of exemplary embodiment; And
Fig. 3 is the sketch map according to the damper assembly of the damping LITI device of exemplary embodiment.
Embodiment
To be elaborated to embodiments of the invention with reference to accompanying drawing now.It should be noted that accompanying drawing is not according to accurate scale, be merely the convenience and clear possibly on the size of the thickness of lines or assembly, the exaggerating of explanation.In addition, define through considering function of the present invention, can change according to user or operating personnel's custom or intention at the term of this application.Therefore, should confirm the implication of these terms according to whole disclosure in this elaboration.
Fig. 1 leads to thermal imaging (LITI) schematic representation of apparatus for damping laser according to an exemplary embodiment of the present invention; Fig. 2 is the cross-sectional schematic according to the damping LITI device of exemplary embodiment, and Fig. 3 is the sketch map according to the damper assembly of the damping LITI device of exemplary embodiment.
Referring to figs. 1 through 3, comprise according to the damping LITI device 1 of exemplary embodiment: lower casing 10, upper casing 20 and vibration absorption unit 30.
Substrate 11 is installed on the lower casing 10, and donor film 12 is installed on the substrate 11.
When laser beam irradiation in 12 last times of donor film, the photothermal transformation layer of donor film 12 converts laser beam into heat so that it expands in the heat radiation process.Like this, organic layer (being transfer layer) expands equally and separates from donor film 12, thereby on substrate 11, forms organic layer.Here, one-tenth figure material is attached to substrate 11 according to the direction of laser radiation.
Upper casing 20 be positioned at lower casing 10 above, and place on the lower casing 10 through the automatic motion of upper casing 20.
The edge of said upper casing like this through assembling, forms vacuum chamber 25, and holds substrate 11 and donor film 12 therein to extending below between upper casing 20 and lower casing 10.
Vibration absorption unit 30 is positioned at the contact portion of upper casing 10 and lower casing 20.Comprise in the vibration absorption unit 30 and can alleviate vibrations and improve vacuum chamber 25 bubble-tight air.
Vibration absorption unit 30 comprises air supply pipe 31, air feed pump 32 and damper assembly 33.
Air supply pipe 31 passes lower casing 10.Particularly, air supply pipe 31 is crooked, and an end of air supply pipe 31 passes the upside of lower casing 10 and upwards stretches out therefrom like this, and its other end passes the outer peripheral edges of lower casing 10 and stretches out therefrom.
In one embodiment, an end of air supply pipe 31 passes and stretches out from a position of lower casing 10, and the edge of upper casing 20 is positioned at this position.
Air feed pump 32 is connected with the other end of air supply pipe 31 and supplies pneumatic pressure to air supply pipe 31.
Damper assembly 33 is connected with air supply pipe 31, so that store the pneumatic pressure through air supply pipe 31 supplies.Damper assembly 33 supports upper casing 20 to prevent contacting damage and the noise that causes with lower casing 10 by upper casing 20.
Damper assembly 33 comprises coupling part 331 and damping portion 332.
Coupling part 331 is around air supply pipe 31.Coupling part 331 has shape cylindraceous, is inserted in around the air supply pipe 31 and is fixedly connected on the air supply pipe 31.Here, when an end of air supply pipe 31 is crooked during like ring flange, coupling part 331 is just caught this curved end of air supply pipe 31 regularly.
Damping portion 332 331 extends out from the coupling part.The width of damping portion 332 is greater than air supply pipe 31, and is configured to store pneumatic pressure.
Be equipped with mesh hook 333 on the coupling part 331, mesh hook 333 is one-body molded with the outer peripheral edges of coupling part 331.Mesh hook is meshed with the engaging plate 15 of lower casing 10.
Engaging plate 15 conducts independently assembly are made, and are fixedly mounted on the lower casing 10.Engaging plate 15 is made up of a pair of plate, and mesh hook 333 stretches out so that be meshed with a pair of plate 15 to the relative direction of coupling part 331.
Damping portion 332 side above that has a plurality of contact protrusions 334.Upper casing 20 preferentially contacts with contact protrusion 334 at specified point.Contact with the preferential of upper casing 20 through contact protrusion 334, disperseed the wearing and tearing that are applied to the load on the upper casing 20 and prevented damping portion 332.
In one embodiment, damper assembly 33 can be formed by elastomeric material.Damper assembly 33 leans on pneumatic compression swelling and leans on the gravity of upper casing 20 to shrink.
Next, will the operation of damping LITI device with said structure be described.
Substrate 11 and donor film 12 are placed on the lower casing 10, and upper casing 20 places on the lower casing 10.
Here, the damper assembly 33 that is provided is positioned at the contact portion of upper casing 20 and lower casing 10, under pneumatic pressure effect, is in swelling state, can alleviate the vibrations of upper casing 20 like this.
That is, under the driving of air feed pump 32, air is supplied and is stored in the damper assembly 33 through the air supply pipe 31 that passes lower casing 10, and damper assembly 33 can support upper casing 20 like this.Here, the scope by the pneumatic pressure of air feed pump 32 air supplied is 1 to 3 crust (bar).
Simultaneously, the coupling part 331 of damper assembly 33 is inserted in and is engaged to an end of the air supply pipe 31 that upwards stretches out from lower casing 10.
Here, be meshed with engaging plate 15 on being assemblied in lower casing 10 owing to be arranged at the mesh hook 333 of coupling part 331 peripheries, so damper assembly 33 is installed on the lower casing 10.
The damping portion 332 of damper assembly 33 is full of air, and side is provided with the contact protrusion that preferentially contacts with upper casing 20 above that, and damping portion 332 can be disperseed the weight of upper casing 20 like this, thereby supports 20 a very long times of upper casing.
In addition, because contact protrusion 334 directly contacts with upper casing 20, so contact protrusion 334 has limited the wearing and tearing of damping portion 332 and prevented because the gas leakage that the damage of damping portion 332 causes.
Like this; According to said embodiment; Said damping LITI device utilizes vibration absorption unit to prevent therefore to have prevented noise and the damage when fit on casing and lower casing in the direct contact between upper casing and the lower casing during to lower casing of fit on casing, has improved the air-tightness of vacuum chamber simultaneously.
In addition, according to said embodiment, said damping LITI device utilizes the pneumatic pressure of air feed pump Sustainable Control, thereby can be the constant pneumatic pressure of said vibration absorption unit supply.
In addition, according to said embodiment, said damping LITI device provides the secure engagement between the engaging plate of mesh hook and lower casing of damper assembly, and said like this damper assembly stably is installed on the said lower casing.
In addition, according to said embodiment, said damping LITI device provides the damper assembly with contact protrusion, and this contact protrusion preferentially contacts with upper casing, can disperse the load of upper casing like this and prevent the wearing and tearing of damper assembly.
Though described some embodiment among the present invention; But it is understandable that given embodiment has been merely explanation; And and unrestricted protection scope of the present invention; And the people with this area general knowledge can carry out various modification under the situation of not running counter to the present invention's spirit and protection range, change and change, the content that these only are subject to the appended claim of the present invention and are equal to.

Claims (6)

1. a damping laser leads to thermal imaging device to comprise:
Lower casing;
Upper casing places on this lower casing and forms vacuum chamber; And
Vibration absorption unit is positioned at the contact portion of this upper casing and this lower casing, and utilizes pneumatic pressure to alleviate vibrations.
2. device according to claim 1 is characterized in that, said vibration absorption unit comprises:
Air supply pipe passes said lower casing;
Air feed pump connects this air supply pipe and supplies pneumatic pressure through this air supply pipe; And
Damper assembly supports said upper casing and connects this air supply pipe to receive the pneumatic pressure through this air supply pipe supply.
3. device according to claim 2 is characterized in that, said damper assembly comprises: the coupling part connects said air supply pipe; And damping portion, extend out from this coupling part and store pneumatic pressure therein.
4. device according to claim 3 is characterized in that said coupling part is provided with mesh hook in its outer peripheral edges, and this mesh hook is meshed with engaging plate on being arranged at said lower casing.
5. according to claim 3 or 4 described devices, it is characterized in that the contact protrusion that said damping portion has a plurality of and said upper casing preferentially to contact.
6. device according to claim 3 is characterized in that said damper assembly comprises elastomeric material.
CN2011101768325A 2010-06-30 2011-06-28 Laser induced thermal imaging device for absorbing impaction Pending CN102339956A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0062727 2010-06-30
KR1020100062727A KR101182168B1 (en) 2010-06-30 2010-06-30 Laser induced thermal imaging device for absorbing impaction

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Publication Number Publication Date
CN102339956A true CN102339956A (en) 2012-02-01

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CN (1) CN102339956A (en)
TW (1) TWI478409B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1028505A1 (en) * 1981-11-06 1983-07-15 Белорусский Научно-Исследовательский И Проектно-Технологический Институт Организации И Управления Строительством Vibration plantform
CN1923529A (en) * 2005-08-30 2007-03-07 三星Sdi株式会社 Laser induction heat imaging device
JP2008261900A (en) * 2007-04-10 2008-10-30 Omron Corp Transfer head of laser transfer device
CN101382178A (en) * 2008-10-16 2009-03-11 上海微电子装备有限公司 Active vibration damping and vibration isolating device and active vibration damping and vibration isolating system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623894B2 (en) * 2001-03-14 2003-09-23 Kodak Polychrome Graphics, Llc Laser-induced thermal imaging with masking
GB0412969D0 (en) * 2004-06-10 2004-07-14 Esselte Thermal laser printing
KR100931072B1 (en) * 2008-05-28 2009-12-10 오광열 Compression Heat Transfer Device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1028505A1 (en) * 1981-11-06 1983-07-15 Белорусский Научно-Исследовательский И Проектно-Технологический Институт Организации И Управления Строительством Vibration plantform
CN1923529A (en) * 2005-08-30 2007-03-07 三星Sdi株式会社 Laser induction heat imaging device
JP2008261900A (en) * 2007-04-10 2008-10-30 Omron Corp Transfer head of laser transfer device
CN101382178A (en) * 2008-10-16 2009-03-11 上海微电子装备有限公司 Active vibration damping and vibration isolating device and active vibration damping and vibration isolating system

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Publication number Publication date
KR101182168B1 (en) 2012-09-12
TWI478409B (en) 2015-03-21
KR20120002045A (en) 2012-01-05
TW201203642A (en) 2012-01-16

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Application publication date: 20120201