CN102338903A - Light guide plate containing light guide mesh point and elastic contact - Google Patents
Light guide plate containing light guide mesh point and elastic contact Download PDFInfo
- Publication number
- CN102338903A CN102338903A CN2010102381777A CN201010238177A CN102338903A CN 102338903 A CN102338903 A CN 102338903A CN 2010102381777 A CN2010102381777 A CN 2010102381777A CN 201010238177 A CN201010238177 A CN 201010238177A CN 102338903 A CN102338903 A CN 102338903A
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- leaded light
- resilient contact
- light guide
- light site
- plastic substrate
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- Telephone Set Structure (AREA)
Abstract
The invention provides a light guide plate containing a light guide mesh point and an elastic contact. The light guide plate comprises a light guide mesh point, an elastic contact, and a transparent plastic substrate. Materials of the light guide mesh point and the elastic contact are UV resin compounds; and the light guide mesh point and the elastic contact are compounded on the transparent plastic substrate by one-time operation through a metal mould, so that an integral body is formed. A diameter of the elastic contact is 1-3 mms and a height of the elastic contact is 0.05 to 1 mms; and a diameter of the light guide mesh point is 0.05 to 0.5 mms and a height of the light guide mesh point is 0.01 to 0.5 mms. According to the invention, a manufacturing process of the light guide plate has a few processes; a whole thickness of the light guide plate is thin; a manufacturing cost is low and a universality is high. Moreover, sizes and positions of the light guide mesh point and the elastic contact have high precisions; light transmittance is high and a light guide effect is good.
Description
Technical field
The present invention relates to the LGP of mobile phone key, refer in particular to the compound LGP of a kind of one-time formed UV of containing resin combination leaded light site and resilient contact.
Background technology
LGP cooperates the use of the LED lamp of module backlight, can increase display brightness to mobile phone key, and when in the dark using mobile phone, this function seems and is even more important.LGP generally comprises light guide base plate (perhaps leaded light basement membrane), leaded light site, resilient contact.Usually the processing technology of LGP is: the employing mould on light guide base plate such as polycarbonate, adopts double faced adhesive tape bonding silicone rubber resilient contact to form the hot pressing of leaded light site then.Its bonding strength is not high, and is easily separated; Thickness is bigger, and the material light-conductive rate is not high, in the use mobile phone power consumption bigger, stand-by time shortens.
Number of patent application is that 200820107010.5 instructions discloses a kind of mobile phone press key light guide plate, and substrate wherein is a polyurethane sheet, and the leaded light point is that the point-like that is made up of light guide ink is protruding, and printing ink is prone to come off, and transmittance is not high, and the time has been grown influences light guide effect.Number of patent application is that 200420095020.3 instructions discloses a kind of mobile phone press key light guide plate; A plurality of and corresponding hole of button distributes on it; The sidewall of hole or groove is provided with light guiding surface, and LGP needs to prepare corresponding hole according to the different keys shape, makes trouble.
Number of patent application is that 200820092903.7 instructions discloses the incorporate mobile phone key of a kind of LGP; Comprise light guide base plate; The lateral surface printing or the injection mo(u)lding of light guide base plate have button, and this LGP manufacturing process is all complicated with the technological process that is installed on the mobile phone, and production efficiency is low; A little less than the versatility, lack practical value.Number of patent application is the method for making that 200610152849.6 instructions discloses a kind of light conducting plate structure; Prepare a mould earlier; High light transmissive material is injected mould, after plastic shaping, with mold releasability; Making plastic shaping is a sheet of LGP, and on a face of LGP, is formed with a plurality of light guide sections.This LGP global formation, substrate is identical material with light guide section, and cost is wayward, and light-conductive rate is difficult for controlling, and light guide section (leaded light site) precision is not high, lacks resilient contact again, can not use as high-quality mobile phone component.Number of patent application is the method for making that 200710003482.6 instructions discloses a kind of LGP, and the leaded light particle of glass microballoon is compound on the substrate, and is that resilient contact is together not compound; Use still not easy; This glass microballoon and substrate bonding are not firm simultaneously, come off easily, are prone to lose the leaded light effect; And there is the phenomenon of light scattering in glass microballoon, and transmittance is not high.
Summary of the invention
Goal of the invention: overcome the defective of matching used LGPs such as conventional mobile phone button, the LGP that contains leaded light site and resilient contact that a kind of manufacture craft process is few, light guide effect is good is provided.
Technical scheme: in the LGP of the present invention, comprise transparent plastic substrate, leaded light site, resilient contact.Transparent plastic substrate is PC plate, PET plate, TPU plate or PMMA plate, and the thickness of transparent plastic substrate is 0.1-3mm.The material of leaded light site and resilient contact is transparent UV resin combination; The UV resin combination is that the acryl resin, epoxy modified acrylic resin, polyurethane modified acrylic resin, vinyl polymer resins, silica gel resin, the silicon compound that contain the UV light curing agent are acrylic resin modified, a kind of in the urethane resin, modified polyurethane resin or several, and the UV resin combination solidifies after through the UV rayed.Form the UV resin combination of leaded light site and resilient contact, through metal die with the sheet glass mould is once-combined is solidificated on the transparent plastic substrate, become as a whole; Described metal die adopts machining process processing resilient contact die cavity earlier, again through the sensor location, adopts the method for laser engraving to make leaded light site die cavity on the metal die surface then.
Among the present invention, the diameter of leaded light site (2) is 0.05-0.5mm, highly for 0.01-0.5mm, the diameter of resilient contact (3) is 1-3mm, highly is 0.05-1mm.The leaded light network point distribution perhaps has the upper surface of part leaded light network point distribution at resilient contact around resilient contact.The density that arrange on transparent plastic substrate the leaded light site is inequality, and sparse near an end at led light source place, the other end is dense, so that the backlight illumination that each LED of button place lamp of mobile phone sends is impartial.
The UV resin combination of described transparent plastic substrate surface recombination is continuous, is linked to be an integral body with resilient contact and leaded light site, also can be discontinuous, and the resilient contact and the leaded light site of UV resin combination only arranged.
Metal die behind the described laser engraving is through surface working, or process is electroplated again, makes that surface smoothness is more than 8 grades.
Described sensor is an infrared ray sensor.
Among the present invention, compound before, transparent plastic substrate cleans through a kind of or several organic solvents in ethanol, acetone, cyclohexane or the ethyl acetate; Transparent plastic substrate can also adopt corona or plasma treatment again, increases the transparent plastic substrate surfactivity; Further increase the compound sticking power of transparent plastic substrate and leaded light site and resilient contact.
Beneficial effect: LGP manufacture craft process of the present invention is few, and the LGP integral thickness is thinner, and it is low to process cost, and production efficiency is high, and highly versatile is fit to and the supporting use of various mobile phone keys.And the UV resin combination of leaded light site and resilient contact and the composite junction of transparent plastic substrate are made a concerted effort strong, and the size of leaded light site and resilient contact and positional precision are high, and transmittance is high, and light guide effect is good.Adopt the mobile phone module LED lamp quantity backlight of this LGP to reduce, energy-saving and cost-reducing, prolongs standby time.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a process chart of the present invention
Among the figure: 1, transparent plastic substrate; 2, leaded light site; 3, resilient contact.
Embodiment
Adopt technological process as shown in Figure 2; Select one of metal die material for use; Carry out machining earlier; The metal die pros and cons is polished flat, process the resilient contact die cavity corresponding, make the diameter of the resilient contact after the moulding be 2mm, highly be 0.2mm with resilient contact shown in Figure 13 in one side; Mould passes through polishing again, reaches smooth finish more than 8 grades.Then; Locate through infrared ray sensor; On the correct station of laser engraving machine, with the come in and go out leaded light site die cavity of leaded light site 2 as shown in fig. 1 of laser engraving, make the diameter of the leaded light site 2 after the moulding be 0.1mm, highly be 0.05mm mold position in corresponding position; Leaded light site 2 be distributed in resilient contact 3 around, have part leaded light site 2 to be distributed in the upper surface of resilient contact 3.Make the compound metal die of using of LGP.
Then adopt technological process as shown in Figure 2, choose thickness and be one of the PC raw sheet of 0.2mm, the PC raw sheet through cyclohexane, is dried, make PC transparent plastic substrate 1.Adopt UV light curing agent allotment acryl resin, make the UV resin combination.Resilient contact die cavity and leaded light site die cavity with an amount of UV resin combination injection metal die cover transparent plastic substrate 1 on the die cavity of metal die, cover one deck sheet glass mould on the transparent plastic substrate 1 again.With UV light transmission sheet glass mould irradiation UV resin combination, carry out the UV rayed and solidify recombination reaction, finally demould obtains on transparent plastic substrate 1, containing the LGP of leaded light site 2 and resilient contact 3.
Claims (8)
1. a LGP that contains leaded light site and resilient contact comprises transparent plastic substrate (1), leaded light site (2), resilient contact (3), it is characterized in that:
Transparent plastic substrate (1) is PC plate, PET plate, TPU plate or PMMA plate, and the thickness of transparent plastic substrate (1) is 0.05-5mm; The material of leaded light site (2) and resilient contact (3) is transparent UV resin combination; The UV resin combination is that the acryl resin, epoxy modified acrylic resin, polyurethane modified acrylic resin, vinyl polymer resins, silica gel resin, the silicon compound that contain the UV light curing agent are acrylic resin modified, a kind of in the urethane resin, modified polyurethane resin or several, and the UV resin combination solidifies after through the UV rayed; Form the UV resin combination of leaded light site (2) and resilient contact (3), through metal die with the sheet glass mould is once-combined is solidificated on the transparent plastic substrate (1), become as a whole; Described metal die adopts machining process processing resilient contact (3) die cavity earlier, again through the sensor location, adopts the method for laser engraving to make leaded light site (2) die cavity on the metal die surface then.
2. the LGP that contains leaded light site and resilient contact according to claim 1 is characterized in that: the diameter of leaded light site (2) is 0.05-0.5mm, highly for 0.01-0.5mm, and the diameter of resilient contact (3) is 1-3mm, highly is 0.05-1mm; Leaded light site (2) be distributed in resilient contact (3) around, perhaps have part leaded light site (2) to be distributed in the upper surface of resilient contact (3).
3. the LGP that contains leaded light site and resilient contact according to claim 1 is characterized in that: it is inequality that the density of arranging is gone up at transparent plastic substrate (1) in leaded light site (2), and an end is sparse, and the other end is dense.
4. according to claim 1, the 2 or 3 described LGPs that contain leaded light site and resilient contact, it is characterized in that: the UV resin combination of transparent plastic substrate (1) surface recombination is continuous.
5. the LGP that contains leaded light site and resilient contact according to claim 1 is characterized in that: the metal die behind the laser engraving is through surface working, or process is electroplated again, makes that surface smoothness is more than 8 grades.
6. the LGP that contains leaded light site and resilient contact according to claim 1 is characterized in that: described sensor is an infrared ray sensor.
7. the LGP that contains leaded light site and resilient contact according to claim 1 is characterized in that: before compound, transparent plastic substrate (1) cleans through a kind of or several organic solvents in ethanol, acetone, cyclohexane or the ethyl acetate.
8. the LGP that contains leaded light site and resilient contact according to claim 7 is characterized in that: before compound, transparent plastic substrate (1) adopts corona or plasma treatment again, increases the transparent plastic substrate surfactivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102381777A CN102338903A (en) | 2010-07-28 | 2010-07-28 | Light guide plate containing light guide mesh point and elastic contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102381777A CN102338903A (en) | 2010-07-28 | 2010-07-28 | Light guide plate containing light guide mesh point and elastic contact |
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| Publication Number | Publication Date |
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| CN102338903A true CN102338903A (en) | 2012-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102381777A Pending CN102338903A (en) | 2010-07-28 | 2010-07-28 | Light guide plate containing light guide mesh point and elastic contact |
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| CN (1) | CN102338903A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106597586A (en) * | 2017-02-10 | 2017-04-26 | 中新科技集团股份有限公司 | Manufacturing method of liquid crystal display diffusion plate |
Citations (6)
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|---|---|---|---|---|
| CN1566996A (en) * | 2003-06-10 | 2005-01-19 | 鸿富锦精密工业（深圳）有限公司 | Process for preparing light guiding board and die therefor |
| CN201233826Y (en) * | 2008-07-16 | 2009-05-06 | 东莞广明电子有限公司 | Light guidance film press-key device and handhold mobile product having the device |
| CN101452092A (en) * | 2007-12-07 | 2009-06-10 | 比亚迪股份有限公司 | Light guide board and method for producing the same |
| CN201352515Y (en) * | 2009-01-24 | 2009-11-25 | 骏熠电子科技(昆山)有限公司 | Push-button module with light conducting function |
| JP2009295501A (en) * | 2008-06-06 | 2009-12-17 | Sharp Corp | Light source module and electronic apparatus equipped with the same |
| CN101752129A (en) * | 2008-12-22 | 2010-06-23 | 金宝电子工业股份有限公司 | Light guide structure of keys |
-
2010
- 2010-07-28 CN CN2010102381777A patent/CN102338903A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1566996A (en) * | 2003-06-10 | 2005-01-19 | 鸿富锦精密工业（深圳）有限公司 | Process for preparing light guiding board and die therefor |
| CN101452092A (en) * | 2007-12-07 | 2009-06-10 | 比亚迪股份有限公司 | Light guide board and method for producing the same |
| JP2009295501A (en) * | 2008-06-06 | 2009-12-17 | Sharp Corp | Light source module and electronic apparatus equipped with the same |
| CN201233826Y (en) * | 2008-07-16 | 2009-05-06 | 东莞广明电子有限公司 | Light guidance film press-key device and handhold mobile product having the device |
| CN101752129A (en) * | 2008-12-22 | 2010-06-23 | 金宝电子工业股份有限公司 | Light guide structure of keys |
| CN201352515Y (en) * | 2009-01-24 | 2009-11-25 | 骏熠电子科技(昆山)有限公司 | Push-button module with light conducting function |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106597586A (en) * | 2017-02-10 | 2017-04-26 | 中新科技集团股份有限公司 | Manufacturing method of liquid crystal display diffusion plate |
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Effective date of registration: 20131115 Address after: 226003, Nantong Gangzha Economic Development Zone, Jiangsu Province on the north side of Tong Kong Road Applicant after: Nantong Wande Electronic Industry Co., Ltd. Address before: 226000, No. 1, block A, south of Yongxing Avenue, Gangzha District, Jiangsu, Nantong Applicant before: Nantong Wande Electronic Industry Co., Ltd. |
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Application publication date: 20120201 |