CN102327854A - Method and device for producing embellished-edge dipped glue with copper-clad plate - Google Patents
Method and device for producing embellished-edge dipped glue with copper-clad plate Download PDFInfo
- Publication number
- CN102327854A CN102327854A CN201110223039A CN201110223039A CN102327854A CN 102327854 A CN102327854 A CN 102327854A CN 201110223039 A CN201110223039 A CN 201110223039A CN 201110223039 A CN201110223039 A CN 201110223039A CN 102327854 A CN102327854 A CN 102327854A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- glue
- base material
- plate base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims description 25
- 238000007598 dipping method Methods 0.000 claims description 9
- 238000009736 wetting Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to a method for producing embellished-edge dipped glue with a copper-clad plate, which is characterized in that before a copper-clad plate base material enters a glue spreader for single face pre-coating, two side edges of the copper-clad plate base material along the length direction are wetted with water, are pre-coated on the single face through the glue spreader, and are dragged through a traction roll group, so that the copper-clad plate base material is completely dipped into glue liquid. The device comprises a glue spreader (2), a first glue trough (3), a traction roll group (4) and a second glue trough (5) and is characterized in that the front of the glue spreader (2) is also provided with two water supply pipes (1), and the two water supply pipes (1) are respectively arranged above the two side edges of the copper-clad plate base material along the length direction. The glue quantity is less, the production cost can be reduced, and the environmental pollution is less.
Description
Technical field
The present invention relates to a kind of copper-clad plate and produce dipping method, be specifically related to a kind of copper-clad plate base material production profit limit dipping method and process units thereof.
Background technology
Copper-clad plate is with the substrate impregnation of copper-clad plate in manufacturing process, along its length substrate is cut to certain width then, again at its surface recombination Copper Foil.Before the present invention makes, during copper-clad plate substrate impregnation, be after the substrate of copper-clad plate is covered through the glue spreader one-sided precoat, to get into the glue groove through the carry-over pinch rolls group again, it is immersed in the glue fully.Do like this and make the discarded edge that is cut also soak into glue fully; Make the consumption of glue increase, and because the price of the glue that uses is higher, thereby make production cost raise; And because the discarded edge impregnation that cuts has glue; Its subsequent treatment is utilized difficulty again, increases waste pollution, not environmental protection easily.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, provide the copper-clad plate that a kind of glue consumption is few, cost is low to produce profit limit dipping method and device.
The objective of the invention is to realize like this: profit limit dipping method is produced in a kind of copper-clad plate; Said method is before copper-clad plate base material entering glue spreader one-sided precoat covers; Copper-clad plate base material dual-side is along its length used water-wet; Cover through the glue spreader one-sided precoat then, through the traction of carry-over pinch rolls group, the copper-clad plate base material is immersed in the glue fully again.
The water of said wetting usefulness linearly current shape flow on the copper-clad plate base material.
Profit limit gumming device is produced in a kind of copper-clad plate; It comprises glue spreader, the first glue groove, carry-over pinch rolls group and the second glue groove; The place ahead of said glue spreader also is provided with filler pipe, and said filler pipe is two, and said two filler pipes are arranged at copper-clad plate base material dual-side top along its length respectively.
Said filler pipe mouth of pipe bottom is horizontal plane.
Said filler pipe mouth of pipe bottom is 5-15mm with the distance of copper-clad plate base material.
The diameter of the mouth of pipe of said filler pipe bottom is 0.5-1.5mm, and said filler pipe nozzle diameter is that the length of 0.5-1.5mm part is 100-150mm.
The invention has the beneficial effects as follows:
Profit limit dipping method and device are produced in copper-clad plate of the present invention, before gluing, adopt water that the edge that the copper-clad plate base material need cut is wetting earlier, and adopt the wetting mode of current; Make the suction of its edge evenly and be prone to reach capacity, in follow-up gluing and immersing glue process, at the absorption glue; The less use amount of glue, thus the production cost rising reduced, and because the discarded edge that cuts does not have glue; Its subsequent treatment is easy with utilization, can not increase waste pollution, environmental protection.
Description of drawings
Fig. 1 produces the structural representation of profit limit gumming device for copper-clad plate of the present invention.
Fig. 2 is the vertical view of Fig. 1.
Reference numeral among the figure:
Filler pipe 1;
The first glue groove 3;
Carry-over pinch rolls group 4;
The second glue groove 5;
Copper-clad plate base material 6.
The specific embodiment
Profit limit dipping method is produced in the copper-clad plate that the present invention relates to; Be before copper-clad plate base material entering glue spreader one-sided precoat covers; Copper-clad plate base material dual-side is along its length used water-wet; Cover through the glue spreader one-sided precoat then, through the traction of carry-over pinch rolls group, the copper-clad plate base material is immersed in the glue fully again.
The water of said wetting usefulness linearly current shape flow on the copper-clad plate base material.
Referring to Fig. 1 and Fig. 2, profit limit gumming device is produced in copper-clad plate of the present invention, and it mainly is made up of filler pipe 1, glue spreader 2, the first glue groove 3, carry-over pinch rolls group 4 and the second glue groove 5; Said filler pipe 1 is positioned at the place ahead of glue spreader 2; Said filler pipe 1 is two, and two filler pipes 1 are arranged at copper-clad plate base material 6 dual-side top along its length respectively, and said glue spreader 2 belows are provided with the first glue groove 3; The lower submerged of said glue spreader 2 is in the glue of the first glue groove 3; The said second glue groove 5 is arranged at the rear of the first glue groove 3, and device has carry-over pinch rolls group 4 on the said second glue groove 5, and the part carry-over pinch rolls are immersed in the glue of the second glue groove 5 fully in the said carry-over pinch rolls group 4.
Be the linearly current shape outflow of water that guarantees wetting usefulness, said filler pipe 1 mouth of pipe bottom is horizontal plane, no inclination angle, thus can not produce the phenomenon of condensing water droplet.
In order to guarantee wetting effect and wetting width, said filler pipe 1 mouth of pipe bottom is 5-15mm with the distance of copper-clad plate base material 6.
The diameter of the mouth of pipe of said filler pipe 1 bottom is 0.5-1.5mm, and said filler pipe 1 nozzle diameter is that the length of 0.5-1.5mm part is 100-150mm.
Above-mentioned filler pipe 1 also can be two groups, and said two groups of filler pipes 1 are arranged at copper-clad plate base material 6 dual-side top along its length respectively.
Claims (6)
1. profit limit dipping method is produced in a copper-clad plate; It is characterized in that: said method is before copper-clad plate base material entering glue spreader one-sided precoat covers; Copper-clad plate base material dual-side is along its length used water-wet; Cover through the glue spreader one-sided precoat then, through the traction of carry-over pinch rolls group, the copper-clad plate base material is immersed in the glue fully again.
2. profit limit dipping method is produced in a kind of copper-clad plate according to claim 1, and it is characterized in that: the water of said wetting usefulness linearly current shape flow on the copper-clad plate base material.
3. profit limit gumming device is produced in a copper-clad plate; It comprises glue spreader (2), the first glue groove (3), carry-over pinch rolls group (4) and the second glue groove (5); It is characterized in that: the place ahead of said glue spreader (2) also is provided with filler pipe; Said filler pipe (1) is two, and said two filler pipes (1) are arranged at copper-clad plate base material (6) dual-side top along its length respectively.
4. profit limit gumming device is produced in a kind of copper-clad plate according to claim 3, it is characterized in that: said filler pipe (1) mouth of pipe bottom is horizontal plane.
5. profit limit gumming device is produced in a kind of copper-clad plate according to claim 4, it is characterized in that: said filler pipe (1) mouth of pipe bottom is 5-15mm with the distance of copper-clad plate base material (6).
6. produce profit limit gumming device according to claim 4 or 5 described a kind of copper-clad plates; It is characterized in that: the diameter of the mouth of pipe of said filler pipe (1) bottom is 0.5-1.5mm, and said filler pipe (1) nozzle diameter is that the length of 0.5-1.5mm part is 100-150mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110223039 CN102327854B (en) | 2011-08-05 | 2011-08-05 | Method and device for producing embellished-edge dipped glue with copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110223039 CN102327854B (en) | 2011-08-05 | 2011-08-05 | Method and device for producing embellished-edge dipped glue with copper-clad plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102327854A true CN102327854A (en) | 2012-01-25 |
| CN102327854B CN102327854B (en) | 2013-06-26 |
Family
ID=45479968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110223039 Expired - Fee Related CN102327854B (en) | 2011-08-05 | 2011-08-05 | Method and device for producing embellished-edge dipped glue with copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102327854B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003010753A (en) * | 2001-07-06 | 2003-01-14 | Toyo Aluminium Kk | Apparatus for forming belt-like coating film and method of forming a plurality of coating films simultaneously |
| WO2010040781A2 (en) * | 2008-10-07 | 2010-04-15 | Kaindl Decor Gmbh | Device for impregnating a web-type material with thermally curable impregnating resin |
| CN101856645A (en) * | 2010-05-20 | 2010-10-13 | 江门盈骅光电科技有限公司 | Method and device for infiltrating reinforced material and resin glue continuously |
| CN202180027U (en) * | 2011-08-05 | 2012-04-04 | 江苏星源航天材料股份有限公司 | Edge moistening and glue dipping device for production of copper-clad plates |
-
2011
- 2011-08-05 CN CN 201110223039 patent/CN102327854B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003010753A (en) * | 2001-07-06 | 2003-01-14 | Toyo Aluminium Kk | Apparatus for forming belt-like coating film and method of forming a plurality of coating films simultaneously |
| WO2010040781A2 (en) * | 2008-10-07 | 2010-04-15 | Kaindl Decor Gmbh | Device for impregnating a web-type material with thermally curable impregnating resin |
| CN101856645A (en) * | 2010-05-20 | 2010-10-13 | 江门盈骅光电科技有限公司 | Method and device for infiltrating reinforced material and resin glue continuously |
| CN202180027U (en) * | 2011-08-05 | 2012-04-04 | 江苏星源航天材料股份有限公司 | Edge moistening and glue dipping device for production of copper-clad plates |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102327854B (en) | 2013-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201880663U (en) | Dipping glue device | |
| CN204412508U (en) | A kind of spray equipment | |
| CN202830170U (en) | Wet process etching machine with water film spread function | |
| CN202180027U (en) | Edge moistening and glue dipping device for production of copper-clad plates | |
| CN204911948U (en) | Coating machine rubberizing device that can automatic gluing automatically regulated compression roller height | |
| CN202447258U (en) | Liquid storage disk device of roll coater | |
| CN102327854B (en) | Method and device for producing embellished-edge dipped glue with copper-clad plate | |
| CN202656523U (en) | Anti-bubble protective film | |
| CN205146575U (en) | Heated board rubber coating equipment | |
| CN105256976B (en) | A kind of underground heat solid wooden compound floor and its manufacturing method | |
| CN201903474U (en) | Slide dyeing tank structure for dyeing and dyeing machine | |
| CN203343010U (en) | Coating device for producing paper-making tobacco sheet | |
| CN205845993U (en) | Automatically welt device | |
| CN209010879U (en) | The reflective anti-skid structure of pavement of road | |
| CN204311139U (en) | A kind of hydrophilic coating line for foil aluminium cleaning by degreasing device | |
| CN202823988U (en) | Ultrasonic cleaner for cleaning photovoltaic welding copper belt | |
| CN203429508U (en) | Automatic overflow device used in vulcanized fiber paper cleaning process | |
| CN202226919U (en) | Passivation device for respooling machine | |
| CN202498001U (en) | Device used for pasting of battery polar plate and vacuum slurry suction of tab reservation positions | |
| CN201900078U (en) | Device for carrying out single-side gluing on thin film | |
| CN206240154U (en) | A kind of water route circuit board | |
| CN205645899U (en) | Battery protection film with exhausting function | |
| CN205042685U (en) | Take tree lace of scribbling of frictioning device | |
| CN203556591U (en) | Adhesive scraping tool | |
| CN203055970U (en) | Chemical surface treatment apparatus of solar cell silicon wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214401 No. 73, Qingyang Road Industrial Park, Jiangyin, Wuxi, Jiangsu Patentee after: Jiangsu Xingyuan spaceflight Material Co.,Ltd. Address before: 214401 No. 73, Qingyang Road Industrial Park, Jiangyin, Wuxi, Jiangsu Patentee before: Jiangsu Sunyuan Aerospace Material Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214401 No. 73, Qingyang Road Industrial Park, Jiangyin, Wuxi, Jiangsu Patentee after: Jiangyin Hucheng Xinyuan Electronic Technology Co.,Ltd. Address before: 214401 No. 73, Qingyang Road Industrial Park, Jiangyin, Wuxi, Jiangsu Patentee before: Jiangsu Xingyuan spaceflight Material Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130626 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |