CN102315322B - 在太阳能电池组件中植入rfid芯片的工艺 - Google Patents
在太阳能电池组件中植入rfid芯片的工艺 Download PDFInfo
- Publication number
- CN102315322B CN102315322B CN201110214561.8A CN201110214561A CN102315322B CN 102315322 B CN102315322 B CN 102315322B CN 201110214561 A CN201110214561 A CN 201110214561A CN 102315322 B CN102315322 B CN 102315322B
- Authority
- CN
- China
- Prior art keywords
- rfid chip
- solar module
- technique
- implanting
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005516 engineering process Methods 0.000 title abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 16
- 239000005357 flat glass Substances 0.000 claims description 13
- 239000007943 implant Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000005341 toughened glass Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract 3
- 238000004140 cleaning Methods 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000005022 packaging material Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110214561.8A CN102315322B (zh) | 2011-07-28 | 2011-07-28 | 在太阳能电池组件中植入rfid芯片的工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110214561.8A CN102315322B (zh) | 2011-07-28 | 2011-07-28 | 在太阳能电池组件中植入rfid芯片的工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102315322A CN102315322A (zh) | 2012-01-11 |
CN102315322B true CN102315322B (zh) | 2014-03-05 |
Family
ID=45428301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110214561.8A Active CN102315322B (zh) | 2011-07-28 | 2011-07-28 | 在太阳能电池组件中植入rfid芯片的工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN102315322B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108581497A (zh) * | 2018-06-22 | 2018-09-28 | 君泰创新(北京)科技有限公司 | 焊接设备和太阳能电池的组装方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2198367A1 (en) * | 2007-08-31 | 2010-06-23 | Applied Materials, Inc. | Photovoltaic production line |
CN201725800U (zh) * | 2010-07-28 | 2011-01-26 | 河北东旭投资集团有限公司 | 一种带防盗追溯功能的太阳电池 |
-
2011
- 2011-07-28 CN CN201110214561.8A patent/CN102315322B/zh active Active
Also Published As
Publication number | Publication date |
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CN102315322A (zh) | 2012-01-11 |
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Owner name: CHENGDU XUSHUANG SOLAR TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: TUNGHSU GROUP CO., LTD. Effective date: 20140423 Free format text: FORMER OWNER: CHENGDU TAIYISI SOLAR TECHNOLOGY CO., LTD. Effective date: 20140423 |
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Free format text: CORRECT: ADDRESS; FROM: 050021 SHIJIAZHUANG, HEBEI PROVINCE TO: 610200 CHENGDU, SICHUAN PROVINCE |
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Effective date of registration: 20140423 Address after: 610200 Sichuan city of Chengdu province Shuangliu County West Port Economic Development Zone and two Hua Road No. 1518 Patentee after: CHENGDU XUSHUANG SOLAR TECHNOLOGY Co.,Ltd. Address before: 050021 No. 94, Huitong Road, Hebei, Shijiazhuang Patentee before: TUNGHSU GROUP Co.,Ltd. Patentee before: CHENGDU TAIYISI SOLAR TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: No. 1518, Section 2, Muhua Road, xihanggang Economic Development Zone, Shuangliu County, Chengdu, Sichuan 610200 Patentee after: CHENGDU ZHONGPU TECHNOLOGY Co.,Ltd. Address before: No. 1518, Section 2, Muhua Road, xihanggang Economic Development Zone, Shuangliu County, Chengdu, Sichuan 610200 Patentee before: CHENGDU XUSHUANG SOLAR TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Technology of embedding RFID chip in solar cell module Effective date of registration: 20220720 Granted publication date: 20140305 Pledgee: Jinzhou Bank Co.,Ltd. Beijing Fuchengmen sub branch Pledgor: CHENGDU ZHONGPU TECHNOLOGY Co.,Ltd. Registration number: Y2022990000470 |
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