CN102312195A - Electromagnetic interference protecting layer and method for preparing plastic shell thereof - Google Patents
Electromagnetic interference protecting layer and method for preparing plastic shell thereof Download PDFInfo
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- CN102312195A CN102312195A CN2010105994689A CN201010599468A CN102312195A CN 102312195 A CN102312195 A CN 102312195A CN 2010105994689 A CN2010105994689 A CN 2010105994689A CN 201010599468 A CN201010599468 A CN 201010599468A CN 102312195 A CN102312195 A CN 102312195A
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Abstract
The invention provides an electromagnetic interference protecting layer and a method for preparing a plastic shell thereof. The electromagnetic interference protecting layer is used for preparing the plastic shell of an electronic product so as to prevent the electronic elements inside the electronic product from the electromagnetic interference; the electromagnetic interference protecting layer only comprises a single metal layer which is prepared by sputtering or evaporation; and a compact oxide layer is formed on the surface of the metal layer. The material of the metal layer can be one or the mixture of aluminum, titanium, zinc and chromium, or copper nickel alloy, or copper zinc alloy or copper aluminum alloy.
Description
Technical field
The invention relates to a kind of electromagnetic wave proof layer (EMI; Electromagnetic interference) and be prepared in the method for plastic casing.
Background technology
Because the element shapes of engineering plastics usually can be integrally formed,,, become the main raw of electronic product casing at present for each electronic product provides higher design flexibility and yield-power unlike the extra metal work program of metal needs.Plastic cement is an isolator; But electromagnetic interference wave but can freely penetrate the plastic cement that does not add mask layer, when the electronic component of electronic product, particularly digital circuit in when running; The hertzian wave that is produced can disturb the normal operation of other devices, therefore need add the electromagnetic wave proof layer.In addition, the shell that plastic cement material is processed, texture is relatively poor when vision or touching.Therefore, the plastic shell of electronic product is added the electromagnetic wave proof layer, also can make electronic product shell have good visual sense of beauty and texture simultaneously.
In existing technology, electromagnetic wave proof layer 12 is double-deck metallic membranes, after plastic casing 10 plating layer of metal layers 120, must plate one deck anti oxidation layer 121 again, and is as shown in Figure 1.Such as in present notebook computer industry,, therefore select for use copper as main electromagnetic wave proof layer because the resistance value of copper is very low.But, the easy oxidation of copper, and the resistance value of cupric oxide is very high, can reduce the anti electromagnetic wave effects of jamming.So after the copper facing, must plate one deck stainless steel again as anti oxidation layer.
Yet the electromagnetic wave proof layer comprises the metal level of two kinds of differing materials, need cause cost to promote than complex apparatus, and the also related manufacturing process time that makes increases.In addition, because stainless target has magnetic diffusivity, when using the sputter mode to be sputtered in stainless steel on the copper metal layer, target atom is difficult to bombarded out, causes the difficulty of ME.Moreover the tack between copper and the plastic cement itself is not fine, and fabrication process condition is restricted.Therefore, develop a kind of electromagnetic wave proof layer, make simplified manufacturing process, cost reduces, and can improve the sticking power of metal level at frosting again, is a problem to be solved.
Summary of the invention
Because above-mentioned problem the purpose of this invention is to provide a kind of preparation electromagnetic wave proof layer (electromagneticinterference) in the method for the plastic casing of electronic product, comprising: the plastic casing that an electronic product is provided; And only deposit a metal level on plastic casing as the electromagnetic wave proof layer; Wherein utilize layer on surface of metal spontaneity to form a fine and close zone of oxidation or to utilize the anti-characteristic of waiting of metal level; Or the sacrificial anode characteristic protects metal level can not continue oxidation, and reaches the effect of electromagnetic wave proof layer.
With single metal level be sputtered onto plastic casing as the electromagnetic wave proof layer after, more comprise plastic casing put into atmosphere furnace, and feed hot oxygen and warm air, so that layer on surface of metal forms compact oxidation layer.
It is wherein a kind of that the material of metal level can be selected from the group that aluminium, titanium, zinc, chromium and arbitrary combination thereof form.Perhaps be selected from gunmetal, copper zinc alloy or xaloy, the about 100nm to 1500nm of thickness.
Wherein, when metal layer material was alloy, the target of being selected for use formed two kinds of combined type sputtering targets that pure metal is inlayed each other.And, if during as metal layer material, when sputter, zinc or zinc alloy target are heated to about 150 to 300 ℃, to improve sputtering raste with zinc or zinc alloy.
Another object of the present invention provides a kind of electromagnetic wave proof layer, only comprises a metal level, is deposited on electronic product shell with the mode of sputter or evaporation, such as: notebook computer, mobile phone, PDA(Personal Digital Assistant).Layer on surface of metal can form a fine and close zone of oxidation, prevents that metal level from continuing inside oxidation, does not therefore need to plate in addition anti oxidation layer, also can reach anti electromagnetic wave interferential purpose.
No matter method of the present invention is all easier on ME and equipment, prevent that therefore the effect of Electromagnetic Interference from not giving a discount.And, owing to need not re-use stainless steel, the problem that has been produced when yet having avoided the sputter stainless steel as anti oxidation layer.
Description of drawings
Fig. 1 shows the diagrammatic cross-section of existing electromagnetic wave proof layer;
Fig. 2 shows the diagrammatic cross-section of electromagnetic wave proof layer of the present invention;
Fig. 3 shows the preparation flow figure of electromagnetic wave proof layer of the present invention; And
Fig. 4 A and Fig. 4 B show the synoptic diagram of the employed inserted composition target of sputter electromagnetic wave proof layer of the present invention.
Drawing reference numeral
10,20: plastic casing 120: metal level
12,22: electromagnetic wave proof layer 121: anti oxidation layer
S100～S120 process step 3: inserted composition target
31: the second metallic substance
Embodiment
For make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable; Hereinafter is according to a kind of electromagnetic wave proof layer of the present invention (electromagnetic interference) and the method that is prepared in plastic casing; Special act preferred embodiment; And cooperate appended relevant drawings, and elaborate as follows, wherein components identical will be explained with the components identical symbol.
With reference to Fig. 2, can find out obviously that please electromagnetic wave proof layer 22 of the present invention is deposited on plastic casing 20 surfaces of electronic product, only comprises single-layer metal layer 22.Fig. 3 is the schema for preparing the method for electromagnetic wave proof layer (electromagneticinterference) provided by the present invention, specifically please referring to step S100～S120 among the figure.
The plastic casing that one electronic product at first is provided is as base material, current common electronic product, such as: the shell of mobile phone, notebook computer, PDA(Personal Digital Assistant) etc. all can.In the present embodiment, the material of plastic casing can be selected from wherein a kind of of ABS, ABS/PC, PP, PVC or PC.
When plastic casing penetrates at molding factory, usually can in manufacturing processed, spray some oil or remover, cause greasy dirt and dirty, residue on the plastic casing, therefore reduce the sticking power of electromagnetic wave proof layer.So, before sputter electromagnetic wave proof layer, optionally utilize chemical solvents that plastic casing is cleaned.
In the present embodiment, cleaning mainly comprises two steps, at first utilizes a hydrophobic organic solvent to remove the greasy dirt on plastic casing surface; Then, utilize a hydrophilic organic solvent to remove hydrophobic organic solvent and impurity.This cleaning step increases the electromagnetic wave proof layer in the adhesive ability of plastic casing, or even the relatively poor copper metal of sticking power, is sputtered in behind the plastic casing after the chemical solvents cleaning, and sticking power also can reach the industry required standard.
Plastic casing is dried Xu Lenghou, promptly adopt the mode of sputter or evaporation, the electromagnetic wave proof layer is deposited on the plastic casing.What pay special attention to is that in the present invention, the electromagnetic wave proof layer is single metal level, and in follow-up ME, does not need to deposit anti oxidation layer again.
Wherein among the embodiment, in order to be suitable for sputter, the material of metal level belongs to the material of nonferromagnetic in the present invention, and selects wherein a kind of from the group of aluminium, titanium, zinc, chromium and arbitrary combination thereof.These materials all have a kind of denominator, are exactly after film forming, can idiopathicly form compact oxide at layer on surface of metal, and the fine and close characteristic of oxide compound, it is oxidized that metal level can not continued again.
Compact oxidation layer thickness only has about big approximate number nanometer to tens nanometer, for the whole resistance value of electromagnetic wave proof layer, can't impact.Therefore, electromagnetic wave proof layer of the present invention, the single metal level of a sputter just can reach the effect of anti electromagnetic wave interferential.Other comprise selects to make metal level integral body have good anti-time property, or the sacrificial anode characteristic, also can reach same effect.
In addition, zinc, chromium and titanium atom, when being sputtered in plastic casing, its sticking power is good than copper.The contriver is through behind the environmental testing repeatedly, finds that be a preferred embodiment with zinc as the main raw of individual layer electromagnetic wave proof layer.Because during sputter zinc, the plating rate of zinc selects for use other alloys target fast, can save more manufacturing process time under equal-wattage.
Yet, use zinc as metal layer material merely, though the speed of sputter is fast; But blemish in an otherwise perfect thing is that zinc is compared to other metals, and is water-soluble higher; When the moisture in the environment is too heavy; Possibly corroded by aqueous vapor, influence the effect of electromagnetic wave proof, but select for use zinc alloy can overcome problem in this respect.
Zinc alloy is to be main with zinc, and wherein a kind of of the formed group of aluminium, chromium, titanium, copper and arbitrary combination thereof that adds 3 to 50 weight percents all has characteristic preferably in tack and electromagnetic wave proof to plastic basis material.In the preferred embodiment of the present invention, the material of metal level is to select aluminium zinc for use.
In addition, when the material selection zinc of metal level or zinc alloy, in the sputter procedure, target is heated between 150 to 300 ℃, sputtering raste can effectively promote.And the employed target cost of sputter is lower.Behind spatter film forming, stability is also better.
After zinc or zinc alloy being sputtered in plastic casing with sputter or evaporation mode; More comprise the plastic casing after the sputter completion is put into atmosphere furnace; And feed hot oxygen or warm air, promoting to form compact oxidation layer fast by layer on surface of metal, to protect interior metal no longer oxidized.
In addition, the spontaneous zone of oxidation that forms is very fine and close on the aluminum metal surface, and therefore adopting aluminium also is a good selection as the material of single metal level.But it is relatively poor compared to titanium or chromium that aluminium is attached to the sticking power of plastic casing; So in embodiments of the present invention; Use aluminum titanium alloy or aluminum chromium as the electromagnetic wave proof layer, titanium or chromium atom are many more, and the sticking power that its aluminum titanium alloy or aluminum chromium layer are attached to plastic casing is strong more.But with aluminum titanium alloy, titanium than the expensive of aluminium four times, therefore, based on considering on the effect of sticking power and the cost, in sputter or the employed alloy target material of evaporation aluminum titanium alloy, the weight percent of titanium about 3% to 50% is optimal selection.
Owing to overcome copper not good problem of adhesive ability on the plastic basis material plastic casing, in another preferred embodiment of the present invention, metal layer material is to adopt copper alloy.With copper is main, and adds group's one of them (for example: gunmetal, copper zinc alloy or xaloy etc.) that about 3 to 50% the tin of weight percent, zinc or aluminium and arbitrary combination thereof are formed.
In another preferred embodiment of the present invention; Tin, zinc or aluminium are made an addition in the copper; Can make copper promote oxidation resistance,, avoid the problem that causes ME difficulty and cost to increase owing to the sputter stainless steel in the prior art so do not need again the sputter stainless steel as anti oxidation layer.The resistance value of copper alloy is higher than copper, therefore, with copper alloy as the electromagnetic wave proof layer; Resistance value will reach requirement, and thickness needs thicker, but the applicant finds through experiment; The sputtering raste of this Albatra metal-exceeds three times than copper, and does not need sputter anti oxidation layer more again, on ME, can save the more time on the contrary; And, also can before the plastic casing distortion, accomplish the ME of sputter electromagnetic wave proof layer.
In the embodiment of the invention, the alloys target that sputter is used is to adopt inserted composite target material.Wherein a preferred embodiment can be with reference to Fig. 4 A and Fig. 4 B; Inserted composite target material of the present invention selects first metallic substance 30 as base material; Base material dug out at least one fairlead 300 by sputter face; And one second metallic substance, 31 close-fittings are embedded in the fairlead 300, form two kinds of combined type sputtering targets that pure metal is inlayed each other.Second metallic substance also can screw or other locked mechanisms be attached to first metallic substance, be combined into a target.
Second metallic substance 31 accounts for alloys target by the ratio of sputter face area; Can influence second metallic substance proportion in metal level; So the size of fairlead 300 can be adjusted according to this, shape can be a random geometry, makes single metal level protect electromagnetic effect and reaches optimizing.In a preferred embodiment, the shape of fairlead 300 becomes a ring-type according to DISTRIBUTION OF MAGNETIC FIELD, and second metallic substance of being inlayed 31 is easy to by sputter.
Inserted composite target material provided by the present invention is not limited to only use two kinds of metals, also can offer a plurality of fairleads according to demand, like Fig. 4 A, and selects for use a plurality of alloys to inlay each other.Those a plurality of fairlead 300 same Distribution of Magnetic Field that according to are arranged in ring structure.
The thickness of electromagnetic wave proof layer can decide according to different clients' demand, thicker, and the metallic diaphragm resistance value is low more, and the anti electromagnetic wave effects of jamming is good more.To notebook computer, the standard of industry is that the cornerwise resistance value of notebook computer is less than 10 Ω.For the resistance value that makes the electromagnetic wave proof layer reaches the standard of industry, in the present invention's one preferred embodiment, the about 100nm to 1500nm of metal layer thickness.And in another preferred embodiment, the material of electromagnetic wave proof layer is a zinc, the about 300nm to 400nm of thickness.
Electromagnetic wave proof layer of the present invention adopts sputter or evaporation mode; Only form the effect that the single-layer metal layer just can reach the electromagnetic wave proof layer; And select the easily spontaneous metal that forms compact oxidation layer for use in the metallic surface; Ingenious this layer zone of oxidation of utilizing prevents that metal inside from continuing oxidized principle, saves the deposition of another layer anti oxidation layer, saved equipment and material cost.In addition, electromagnetic wave proof layer of the present invention does not need the sputter stainless steel as anti oxidation layer, has avoided stainless steel to be difficult for the problem that is sputtered out yet.
Though the present invention illustrates as above with preferred embodiments, so it is not only to terminate in the foregoing description in order to limit the present invention's spirit with the invention entity.All those skilled in the art are when understanding and utilize other element or mode to produce identical effect easily.Therefore, the modification of in not breaking away from spirit of the present invention and category, being done all should be included in the claim scope.
Claims (10)
1. a method for preparing the electromagnetic wave proof layer in an electronic product plastic casing is characterized in that, does not receive Electromagnetic Interference in order to protect said electronic product internal electronic element, and said method comprises:
The plastic casing of one electronic product is provided; And
With sputter or evaporation mode, only deposit a metal level on said electronic product plastic casing as the electromagnetic wave proof layer, wherein said metal level is a zinc alloy.
2. the method for claim 1 is characterized in that, the about 100nm to 1500nm of said metal layer thickness.
3. the method for claim 1 is characterized in that, said zinc alloy is to be main with zinc, wherein a kind of of the formed group of aluminium, chromium, titanium, copper and arbitrary combination thereof that adds 3 to 50 weight percents.
4. the method for claim 1 is characterized in that, when more being included in sputter, the zinc alloy target is heated to about 150 to 300 ℃, to improve sputtering raste.
5. the method for claim 1; It is characterized in that; The target of the said metal level of sputter is an inserted composition target, and wherein, said inserted composition target has one first metallic substance and one second metallic substance; Said first metallic substance is as base material, and said second metal embeds said first metal with close-fitting or locks and the synthetic target of said first metal junctions with mechanism.
6. the method for claim 1; It is characterized in that, after more being included in the completion sputter or evaporating said metal level, said electronic product plastic casing is sent in the atmosphere furnace; Feed hot oxygen or warm air, to form said compact oxidation layer in said layer on surface of metal rapidly.
7. the method for claim 1 is characterized in that, deposits before the said metal level, more comprises:
Utilize a hydrophobic organic solvent to clean said electronic product plastic casing, to remove the greasy dirt on said plastic casing surface; And
Utilize a hydrophilic organic solvent to clean said electronic product plastic casing, to remove said hydrophobic organic solvent and impurity.
8. electromagnetic wave proof layer; It is characterized in that, be plated on an electronic product plastic casing, do not receive Electromagnetic Interference to protect said electronic product internal electronic element; Said electromagnetic wave proof layer is a single metal level; Wherein, said single layer on surface of metal has a spontaneous compact oxidation layer, and it is wherein a kind of that the material of said metal level is selected from the formed group of aluminium, chromium, titanium, zinc and arbitrary combination thereof.
9. an electromagnetic wave proof layer is characterized in that, is plated on the plastic casing of an electronic product; To protect said electronic product internal electronic element not receive Electromagnetic Interference; Said electromagnetic wave proof layer is a single metal level, and wherein, the material of said single metal level is selected from copper alloy.
10. electromagnetic wave proof layer as claimed in claim 9 is characterized in that, described copper alloy is to be main with copper, wherein a kind of of the formed group of tin, zinc, aluminium and arbitrary combination thereof that adds 3 to 50 weight percents.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105994689A CN102312195A (en) | 2010-07-08 | 2010-12-21 | Electromagnetic interference protecting layer and method for preparing plastic shell thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010226855 | 2010-07-08 | ||
| CN201010226855.8 | 2010-07-08 | ||
| CN2010105994689A CN102312195A (en) | 2010-07-08 | 2010-12-21 | Electromagnetic interference protecting layer and method for preparing plastic shell thereof |
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| CN102312195A true CN102312195A (en) | 2012-01-11 |
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| CN2010105994689A Pending CN102312195A (en) | 2010-07-08 | 2010-12-21 | Electromagnetic interference protecting layer and method for preparing plastic shell thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103966564A (en) * | 2013-02-04 | 2014-08-06 | 富优技研股份有限公司 | Making method of anti-electromagnetic plastic member |
| CN108598670A (en) * | 2018-04-26 | 2018-09-28 | 维沃移动通信有限公司 | A kind of production method of antenna, terminal device and antenna |
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| CN1395465A (en) * | 2001-07-05 | 2003-02-05 | 柏腾科技股份有限公司 | Method for forming electromagnetic wave interference shading film on non-conductive material |
| CN1696345A (en) * | 2004-05-14 | 2005-11-16 | 吴东兴 | Method for metallizing surface of nonmetallic material, and composing structure of surface |
| CN101311314A (en) * | 2007-05-21 | 2008-11-26 | 响亿电子科技(上海)有限公司 | Film-plating method for case |
| CN101553105A (en) * | 2008-04-01 | 2009-10-07 | 林淑清 | Electromagnetic wave shielding structure |
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2010
- 2010-12-21 CN CN2010105994689A patent/CN102312195A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395465A (en) * | 2001-07-05 | 2003-02-05 | 柏腾科技股份有限公司 | Method for forming electromagnetic wave interference shading film on non-conductive material |
| CN1696345A (en) * | 2004-05-14 | 2005-11-16 | 吴东兴 | Method for metallizing surface of nonmetallic material, and composing structure of surface |
| CN101311314A (en) * | 2007-05-21 | 2008-11-26 | 响亿电子科技(上海)有限公司 | Film-plating method for case |
| CN101553105A (en) * | 2008-04-01 | 2009-10-07 | 林淑清 | Electromagnetic wave shielding structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103966564A (en) * | 2013-02-04 | 2014-08-06 | 富优技研股份有限公司 | Making method of anti-electromagnetic plastic member |
| CN108598670A (en) * | 2018-04-26 | 2018-09-28 | 维沃移动通信有限公司 | A kind of production method of antenna, terminal device and antenna |
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Application publication date: 20120111 |