CN102306319A - Intelligent metal product and manufacturing process thereof - Google Patents
Intelligent metal product and manufacturing process thereof Download PDFInfo
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- CN102306319A CN102306319A CN201110084404A CN201110084404A CN102306319A CN 102306319 A CN102306319 A CN 102306319A CN 201110084404 A CN201110084404 A CN 201110084404A CN 201110084404 A CN201110084404 A CN 201110084404A CN 102306319 A CN102306319 A CN 102306319A
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- electronic chip
- metal body
- inductive coil
- smart metals
- metal
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Abstract
The invention relates to a metal product, in particular to an intelligent metal product. The intelligent metal product comprises a metal body, and also comprises an electronic chip and an induction coil, wherein the electronic chip is fixed with the metal body; the induction coil is connected with the electronic chip through a circuit; the whole formed by the electronic chip and the induction coil are positioned in the metal body; and an insulating layer is arranged between the whole formed by the electronic chip and the induction coil and the metal body. The metal body is provided with a groove; the whole formed by the electronic chip and the induction coil is positioned in the groove; and the top of the groove is sealed by using the insulating layer. The metal body only has an outer circle; the central part is a cavity; the whole formed by the electronic chip and the induction coil is positioned in the cavity; and the upper part and the lower part of the cavity are sealed by using the insulating layer. In the intelligent metal product, the electronic chip is hidden in the metal product and cannot be seen in appearance; therefore, an effect of hiding identity can be achieved in certain special places and environments.
Description
Technical field
The present invention relates to a kind of metallic article, be specially a kind of SMART METALS goods.
Background technology
The SMART METALS goods are meant electronic chip implanted metal goods, with calculating punch or receiver, input or output literal or graphic file information data, make this metallic article reach the function of proprietary identification and literal, map file access.
At present SMART METALS goods on the market, generally all spare parts such as electronic chip or electronic equipment are attached to or are pasted on the metallic article surface, not seeing has inclusion at metallic article inside.
Summary of the invention
Technical matters to be solved by this invention provides that a kind of this metallic article can't see electronic chip in appearance with the SMART METALS goods in the direct implanted metal goods of electronic chip, but its use is unaffected.The present invention also provides the manufacture craft of these SMART METALS goods.
Technical matters to be solved by this invention is achieved through following technical scheme:
A kind of SMART METALS goods; Comprise metal body; Also comprise electronic chip that fixes with metal body and the inductive coil that is connected with the electronic chip circuit; The integral body that said electronic chip and inductive coil are formed is positioned at metal body inside, between integral body that electronic chip and inductive coil are formed and the metal body insulation course is arranged.
Said metal body is arranged in groove for the metallic object of band groove, the integral body that electronic chip and inductive coil are formed, and groove top seals with insulation course.
Said metal body has only the outer ring, and the middle part is the cavity, and the integral body that electronic chip and inductive coil are formed is arranged in the cavity, and seal with insulation course up and down in the cavity.
Said electronic chip contains the integrated circuit of 13.56MHZ or 2.4G transmission frequency.
The material of said metal body can be gold, silver, copper, iron, steel, aluminium, aluminium alloy, magnesium alloy, kirsite, and the shape of said metal body can be circular, square, rhombus, triangle, cylindrical.
The material of said insulation course is resin or baking vanish.
Resin specifically can be selected rosin, amber, shellac, tygon, polystyrene, teflon, phenolics, vibrin, polyamide, polypropylene, polycarbonate, nylon, polyetheretherketone, polyethersulfone.
Baking vanish is general low temperature baking vanish in the existing industry.
A kind of manufacture craft of SMART METALS goods, manufacturing process steps is:
A, carved the mould of metal body, metal material has been pressed into the germule of metal body;
B, with metal body bottom shop one deck insulating material earlier, insulating material needs high temperature to dry, and implants electronic chip and inductive coil then, seal with the insulating material full-filling more at last, and high temperature is dried;
C, be coated with impression case or literal.
Wherein, the described insulating material of step b is resin or baking vanish.
The baking temperature of the said insulating material of step b is: baking temperature is 90-120 ℃ when selecting for use resin to do the insulation material; Baking temperature is 150-180 ℃ when selecting for use baking vanish to do the insulation material.
Beneficial effect of the present invention is following:
The present invention is with in the direct implanted metal goods of electronic chip; Can utilize the interface of calculating punch; Set in advance and import Word message in the SMART METALS goods; And can export the literal of this setting through calculating punch, distinguish true from false or multinomial functions such as material-controlled tube reason, entrance guard management, consumption management and location tracking to do.Can the people who wear this SMART METALS goods easily be managed; Because electronic chip is hidden in metallic article inside; Compare attached to the mode outside the metallic article surface; Electronic chip can not get loose; And can't discover in appearance, under some special occasions and environment, can play the effect of hidden identity.
Description of drawings
Fig. 1 is the square section structural representation of embodiment 1 intelligent badge;
Fig. 2 is the structural representation of embodiment 2 Intelligent key boards;
Fig. 3 is the sectional view of clamp one end of the charged sub-chip of embodiment 4 intelligent tie clips.
Embodiment
According to embodiment and accompanying drawing the present invention is carried out detailed description below.The used electronic chip of the present invention all is an electronic chip common on the market.
Shown in accompanying drawing 1; A kind of intelligent badge; Comprise steel badge body 1; Badge body 1 middle part has groove 2; Have the integral body 3 (two lead ends of inductive coil are welded on respectively on two pads of electronic chip) that the inductive coil of electronic chip and the connection thereof of identity recognition function forms and be positioned at groove 2 inside; Groove 2 and have between the integral body 3 that the inductive coil of electronic chip and the connection thereof of identity recognition function forms and be filled with the acrylic resin insulation course, also seal with acrylic resin at groove 2 tops.
The manufacture craft of this intelligent badge is following:
A, carved the mould of badge figure, with the mode of punching press, steel disc has been pressed into the germule of badge, germule middle part punching press is fluted, again germule is ground deflashing, and safety pin freezes after cleaning up;
B, with the first shop one deck acrylic resin of bottom portion of groove; Acrylic resin needs to dry with 120 ℃, is used for isolating with the metal back layer insulation, implants electronic chip and inductive coil with identity recognition function; And then seal, and dry with 120 ℃ of temperature with the acrylic resin full-filling.
C, be coated with the pattern that is printed on color at the freeze another side of safety pin face of badge.
After the induction coil in this intelligent badge is received the identical radio wave of the electronic chip frequency with in the badge sent in the external world; A part of electromagnetic wave energy is converted into the sub- chip of powered to be used; Simultaneously another part electromagnetic wave signal is sent to electronic chip; Under the effect of the instruction that electromagnetic wave or electromagnetic wave carry, electronic chip is activated; It is emitted the form of the information of carrying with radio wave by induction coil; The radio reading machine sends to corresponding ports after receiving and being translated into the accessible information of computer after the information that electronic chip sends in the intelligent badge; Computer receives the identity information that accesses the licensee after the relevant information immediately and checks; Send right of way signal after the confirmation, otherwise send alarm signal.
Shown in accompanying drawing 2; A kind of Intelligent key board; The key card metal section and part is a copper ring 4; Copper ring 4 upper and lowers are low temperature baking vanish insulation course 5; Be implanted with the integral body 6 (two lead ends of inductive coil are welded on respectively on two pads of electronic chip) that the inductive coil of electronic chip with material-controlled tube reason and connection thereof is formed in the middle of the key card, accompanying drawing 2 shows is to implant the state that also adds low temperature baking vanish insulation course after the integral body 6 that the inductive coil of electronic chip with material-controlled tube reason and connection thereof forms on becket top.
The manufacture craft of this Intelligent key board is following:
A: carved the mould of key card figure, with the mode of die casting, copper sheet has been pressed into the germule of key card, germule is a toroidal, and hollow is ground deflashing with germule again;
B, elder generation are with low temperature baking vanish full-filling copper ring bottom back cover; Dry with 180 ℃; Implant the integral body 6 of the inductive coil composition of electronic chip with material-controlled tube reason function and connection thereof again; And then bind and dry with 180 ℃ again with the full-filling of low temperature baking vanish; After grinding two-sided baking vanish and beating bright baking vanish surface, clean and surface treatment such as plating;
C, be coated with impression case and literal at key card.
Shown in accompanying drawing 3; A kind of intelligent tie clip; The tie clip metal section and part is silver clamp 7; The side of clamp 7 one ends has clamp groove 8; Be implanted with the integral body 9 (two lead ends of inductive coil are welded on respectively on two pads of electronic chip) that the inductive coil of electronic chip with location tracking function and connection thereof is formed in the middle of the clamp groove 8; Clamp 7 and have the insulation course that phenolic resin material is arranged between the integral body 9 that the inductive coil of electronic chip and the connection thereof of location tracking function forms, also seal with the insulation course of phenolic resin material at clamp groove 8 tops.
The manufacture craft of this tie clip is following:
A: carved the mould of tie clip figure, with the mode of die casting, silver strip has been pressed into the germule of tie clip, the die casting of germule side has clamp groove 8, again germule is ground deflashing;
B, elder generation are with phenolics full-filling clamp groove 8 bottoms and sidewall; Dry with 90 ℃; Implant the integral body 9 that the inductive coil of electronic chip with location tracking function and connection thereof is formed again; And then bind and dry with 90 ℃ of temperature again with the phenolics full-filling; After grinding and beating bright phenolics surface, clean and surface treatment such as plating.
C, be coated with impression case and literal at tie clip.
The structure of present embodiment intelligence badge is identical with the intelligent badge among the embodiment 1, the material aluminium alloy of metal section and part, the material selection low temperature baking vanish of insulation course.
The manufacture craft of this intelligent badge is following:
A, carved the mould of badge figure, with the mode of punching press, aluminum alloy sheet has been pressed into the germule of badge, germule middle part punching press is fluted, again germule is ground deflashing, and safety pin freezes after cleaning up;
B, with the first shop one deck low temperature baking vanish of bottom portion of groove; The low temperature baking vanish needs to dry with 150 ℃, is used for isolating with the metal back layer insulation, implants electronic chip and inductive coil with identity recognition function; And then seal, and dry with 150 ℃ of temperature with the polycarbonate resin full-filling.
C, be coated with the pattern that is printed on color at the freeze another side of safety pin face of badge.
The above embodiment has only expressed embodiment of the present invention; It describes comparatively concrete and detailed; But can not therefore be interpreted as restriction to claim of the present invention; The badge that the present invention relates in embodiment, key card and the tie clip, can also be badge, key card, photo frame, tie clip, medal, goods of furniture for display rather than for use, bangle, ear pendant.In every case adopt the technical scheme that form obtained that is equal to replacement or equivalent transformation, all should fall within protection scope of the present invention.
Claims (9)
1. SMART METALS goods; Comprise metal body; Also comprise electronic chip that fixes with metal body and the inductive coil that is connected with the electronic chip circuit; It is characterized in that: the integral body that said electronic chip and inductive coil are formed is positioned at metal body inside, between integral body that electronic chip and inductive coil are formed and the metal body insulation course is arranged.
2. SMART METALS goods according to claim 1 is characterized in that: said metal body is arranged in groove for the metallic object of band groove, the integral body that electronic chip and inductive coil are formed, and groove top seals with insulation course.
3. SMART METALS goods according to claim 1 is characterized in that: said metal body has only the outer ring, and the middle part is the cavity, and the integral body that electronic chip and inductive coil are formed is arranged in the cavity, and seal with insulation course up and down in the cavity.
4. according to claim 2 or 3 described SMART METALS goods, it is characterized in that: said electronic chip contains the integrated circuit of 13.56MHZ or 2.4G transmission frequency.
5. SMART METALS goods according to claim 4 is characterized in that: the material of said metal body can be gold, silver, copper, iron, steel, aluminium, aluminium alloy, magnesium alloy, kirsite; The shape of said metal body can be circular, square, rhombus, triangle, cylindrical.
6. SMART METALS goods according to claim 1 is characterized in that: the material of said insulation course is resin or baking vanish.
7. the manufacture craft of the said SMART METALS goods of claim 1 is characterized in that manufacturing process steps is: a, carved the mould of metal body, metal material has been pressed into the germule of metal body;
B, with metal body bottom shop one deck insulating material earlier, insulating material needs high temperature to dry, and implants electronic chip and inductive coil then, seal with the insulating material full-filling more at last, and high temperature is dried;
C, be coated with impression case or literal.
8. according to the manufacture craft of the said SMART METALS goods of claim 7, it is characterized in that: the described insulating material of step b is resin or baking vanish.
9. the manufacture craft of said according to Claim 8 SMART METALS goods is characterized in that the baking temperature of the said insulating material of step b is: baking temperature is 90-120 ℃ when selecting for use resin to do the insulation material; Baking temperature is 150-180 ℃ when selecting for use baking vanish to do the insulation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110084404A CN102306319A (en) | 2011-03-30 | 2011-03-30 | Intelligent metal product and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110084404A CN102306319A (en) | 2011-03-30 | 2011-03-30 | Intelligent metal product and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102306319A true CN102306319A (en) | 2012-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110084404A Pending CN102306319A (en) | 2011-03-30 | 2011-03-30 | Intelligent metal product and manufacturing process thereof |
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| Country | Link |
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| CN (1) | CN102306319A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107212532A (en) * | 2017-05-17 | 2017-09-29 | 陶文渊 | A kind of badge and its manufacture method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2498666Y (en) * | 2001-08-31 | 2002-07-03 | 江贵州 | Electronic chip card with metal substrate |
| CN101513297A (en) * | 2009-02-26 | 2009-08-26 | 上海造币有限公司 | Metal coin stamp embedded with RFID electronic tag and manufacturing technique thereof |
| CN201331765Y (en) * | 2008-12-25 | 2009-10-21 | 上海韩硕信息科技有限公司 | Invisible Structure for embedding RFID (radio frequency identification) electronic tags in metal surface |
-
2011
- 2011-03-30 CN CN201110084404A patent/CN102306319A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2498666Y (en) * | 2001-08-31 | 2002-07-03 | 江贵州 | Electronic chip card with metal substrate |
| CN201331765Y (en) * | 2008-12-25 | 2009-10-21 | 上海韩硕信息科技有限公司 | Invisible Structure for embedding RFID (radio frequency identification) electronic tags in metal surface |
| CN101513297A (en) * | 2009-02-26 | 2009-08-26 | 上海造币有限公司 | Metal coin stamp embedded with RFID electronic tag and manufacturing technique thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107212532A (en) * | 2017-05-17 | 2017-09-29 | 陶文渊 | A kind of badge and its manufacture method |
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Application publication date: 20120104 |
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