CN102299116A - Airtight metal packaging shell - Google Patents
Airtight metal packaging shell Download PDFInfo
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- CN102299116A CN102299116A CN2011102677554A CN201110267755A CN102299116A CN 102299116 A CN102299116 A CN 102299116A CN 2011102677554 A CN2011102677554 A CN 2011102677554A CN 201110267755 A CN201110267755 A CN 201110267755A CN 102299116 A CN102299116 A CN 102299116A
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- side wallboards
- framed side
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- wallboards
- air
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Abstract
The invention discloses an airtight metal packaging shell, which comprises a bottom plate and an annular frame, wherein the annular frame consists of four side wallboards; every two of the four side wallboards are butted through a stepped structure; in the four side wallboards, one pair of two opposite side wallboards is provided with a first stepped structure and the other pair of two opposite side wallboards is provided with a second stepped structure which corresponds to the first stepped structure. The shell which is assembled between plates in an overlapped (spliced) mode and is subjected to brazing has a compact structure, high air tightness, functions of saving the cost and improving the production efficiency and the like, and is particularly suitable for batch production and processing of circuit metal packaging shells with large dimensions and requirements for gas tightness. Compared with a processing process of the conventional metal packaging shell, the invention has the advantages of multiple processing methods, high processing efficiency, high material utilization rate, less resource waste and the like.
Description
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Technical field
The present invention relates to the encapsulation field of hybrid integrated circuit and photoelectricity electronic product, be specifically related to a kind of air-tightness metal-packaged shell housing.
Background technology
At present, the housing of the air-tight packaging shell that integrated circuit and photovoltaic are used mostly is the global formation structure as processing ring frame body earlier and then forming with the base plate lead welding and shaping, perhaps directly processes the unitary whole structure through multiple processing method.Traditional processing method has Vehicle Processing, mills processing, punching out processing, ring frame and base plate soldering processing etc., and Vehicle Processing can only be processed the shell of circular housing or special shape, complicated shell is difficult to processing maybe can't be processed, and does not satisfy many kinds of package casing requirement of mass production; Mill that processing exists that working (machining) efficiency is low, shortcomings such as waste material, plant maintenance and cost of use height; Punching out processing is wanted new die sinking tool in first being processed, has increased processing cost, and can only carry out punching out at simple shape, the less package casing of size; Ring frame and base plate soldering add need use the line cutting man-hour, low, the roughness of machining surface of line cutting efficiency, the shortcoming that same existence can only be processed simple small outline package, and the ring frame is prone to phenomenons off quality such as cooperating skew during with the base plate soldering, increase processing step and cost, can't carry out the production in enormous quantities of product.
Summary of the invention
The object of the present invention is to provide between a kind of four side walls and four side walls and base plate between cooperate the air-tightness metal-packaged shell shell structure of overlap joint (splicing), this structure to have advantages such as stock utilization height, compact conformation, production and processing be convenient by step surface.
Air-tightness metal-packaged shell housing of the present invention comprises base plate and ring frame, and described ring frame is made of four framed side wallboards, and described four framed side wallboards connect in twos by ledge structure.
In described four framed side wallboards, a pair of two relative framed side wallboards are provided with the first step structure, and another is provided with and the corresponding second step structure of ledge structure two relative framed side wallboards.
In described four framed side wallboards, a pair of two relative framed side wallboards are provided with ledge structure, and another is a slab construction to two relative framed side wallboards.
Described base plate is the flat board with boss structure, and the bottom of described four framed side wallboards is provided with the 3rd ledge structure that connects with base plate.
The step mating surface that tabular side wall overlap joint (splicing) is located has location, spacing effect, can effectively control the position of adjacent with it tabular spare and accessory parts, adjacent with it tabular spare and accessory parts overlap joints (splicing) are located to be designed to the plane and also can be designed to step surface, can both play good limit effect.In brief, a pair of side wall overlap joint (splicing) of opposite face locates to be designed to the step mating surface, and adjacent with it a pair of opposite face side wall overlap joint (splicing) is located to be designed to step surface and also can be designed to the plane.Four side walls form a ring frame by overlap joint (splicing) back, locate to be designed to step surface at overlap joint (splicing) equally when the ring frame cooperates with base plate and are beneficial to installing and locating.After tabular spare and accessory parts are finished by overlap joint (splicing) assembling, carry out soldering to obtain a whole housing, again housing is gone between and the sintering of input and output accessory such as high frequency assembly, at last housing is electroplated just to have formed and satisfy the metal-packaged shell finished product that air-tightness requires.
Air-tightness metal-packaged shell housing of the present invention is formed by the tabular spare and accessory parts assembling and soldering of polylith, the advantage of the tabular spare and accessory parts overlap joints of polylith (splicing) is to make that air-tightness metal-packaged shell housing can be to be made of similar sheet material, also can be to constitute by the inhomogeneity sheet material, the shell product that processes like this can have the denominator of multiple material concurrently, make air-tightness metal-packaged shell various aspects of performance excellent more, reach the purpose that fully utilizes material to greatest extent.If tabular spare and accessory parts material and scolder do not soak into, then can carry out the nickel preplating processing earlier and carry out soldering again, to satisfy the demand of shell production technology to tabular spare and accessory parts material.
The present invention by the housing that forms by soldering then of overlap joint (splicing) assembling between the sheet material have compact conformation, air-tightness good, save cost and function such as enhance productivity, especially be fit to large scale, have the batch process of the electric circuit metal package casing that air-tightness requires to process.Compare the present invention to have processing method many with the processing technology of common metal package casing, working (machining) efficiency height, stock utilization height, advantage such as the wasting of resources is few.
Description of drawings
Fig. 1 is a kind of syndeton schematic diagram between four framed side wallboards among the present invention;
Fig. 2 is the another kind of syndeton schematic diagram between four framed side wallboards among the present invention;
Fig. 3 is the syndeton schematic diagram of four framed side wallboards and base plate;
Fig. 4 is an overall structure schematic diagram of the present invention;
Fig. 5 is the decomposition texture schematic diagram of Fig. 4.
Embodiment
Air-tightness metal-packaged shell housing of the present invention comprises base plate 1 and ring frame, wherein encircle frame and be made of four framed side wallboards 2, and four framed side wallboards connects in twos by ledge structure; The docking mode of four framed side wallboards is: a pair of two relative framed side wallboards are provided with first step structure 3, and another is provided with and first step structure 3 corresponding second step structures 4 two relative framed side wallboards, as shown in Figure 1; Perhaps in four framed side wallboards, a pair of two relative framed side wallboards are provided with ledge structure 5, and another is a slab construction 6 to two relative framed side wallboards, as shown in Figure 2.Housing base plate 1 is provided with the 3rd ledge structure 8 that connects with base plate in the bottom of four framed side wallboards simultaneously, as shown in Figure 3 for having the flat board of boss structure 7; Housing base plate 1 also can be the surface plate structure, and this moment, the bottom of four framed side wallboards also was planar structure.Air-tightness metal-packaged shell of the present invention, locate to process the step syndeton at tabular spare and accessory parts overlap joints (splicing), the processing and implementation scheme has various ways, promptly can take line cutting, mill processing methods such as processing or punching out and process separately tabular spare and accessory parts, also can fully utilize multiple processing method and process jointly, to reach the purpose of technology optimum.Because spare and accessory parts processing mainly is plate, only need processing spare and accessory parts overlap joints (splicing) to locate step surface, the tabular spare and accessory parts that process are assembled according to mode illustrated in Figure 5 put into the soldering graphite jig after finishing, go into scolder and scolder is fixed in overlap joint (splicing) disposal then, the structure that whole assembling is finished is placed into and carries out the soldering sintering in the sintering furnace at last.The parameter setting of sintering furnace will meet corresponding sintering and brazing technology requirement.Remove mould after sintering is finished and to obtain soldering all-in-one-piece metal shell as shown in Figure 4.Further, after the housing soldering is integral, launch again housing is gone between and the double sintering soldering work of input and output accessory such as high frequency assembly, to form air-tightness metal-packaged shell semi-finished product, next the air-tightness metal-packaged shell semi-finished product that sintering is finished are electroplated and can be obtained air-tight packaging shell final products.
Air-tightness metal-packaged shell housing of the present invention can have the denominator of multiple material concurrently, makes air-tightness metal-packaged shell various aspects of performance excellent more, reaches the purpose that fully utilizes material to greatest extent.If tabular spare and accessory parts material and scolder do not soak into, then can carry out nickel preplating processing carrying out again soldering earlier to tabular spare and accessory parts material, to satisfy the demand that shell is produced, simultaneously, the present invention by the housing that forms by soldering then of overlap joint (splicing) assembling between the sheet material have compact conformation, air-tightness good, save cost and function such as enhance productivity, especially be fit to large scale, have the batch process of the electric circuit metal package casing that air-tightness requires to process.
Claims (4)
1. an air-tightness metal-packaged shell housing comprises base plate and ring frame, and it is characterized in that: described ring frame is made of four framed side wallboards, and described four framed side wallboards connect in twos by ledge structure.
2. air-tightness metal-packaged shell housing as claimed in claim 1, it is characterized in that: in described four framed side wallboards, a pair of two relative framed side wallboards are provided with the first step structure, and another is provided with and the corresponding second step structure of ledge structure two relative framed side wallboards.
3. air-tightness metal-packaged shell housing as claimed in claim 1 is characterized in that: in described four framed side wallboards, a pair of two relative framed side wallboards are provided with ledge structure, and another is a slab construction to two relative framed side wallboards.
4. air-tightness metal-packaged shell housing as claimed in claim 1 is characterized in that: described base plate is the flat board with boss structure, and the bottom of described four framed side wallboards is provided with the 3rd ledge structure that connects with base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102677554A CN102299116A (en) | 2011-09-13 | 2011-09-13 | Airtight metal packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102677554A CN102299116A (en) | 2011-09-13 | 2011-09-13 | Airtight metal packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102299116A true CN102299116A (en) | 2011-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102677554A Pending CN102299116A (en) | 2011-09-13 | 2011-09-13 | Airtight metal packaging shell |
Country Status (1)
| Country | Link |
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| CN (1) | CN102299116A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766829A (en) * | 2014-01-06 | 2015-07-08 | 三菱电机株式会社 | Semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2757498Y (en) * | 2004-12-01 | 2006-02-08 | 富士康(昆山)电脑接插件有限公司 | Electronic card shell package structure |
| CN101346060A (en) * | 2007-07-10 | 2009-01-14 | Abb股份公司 | Sealing arrangement |
| CN201393351Y (en) * | 2009-03-17 | 2010-01-27 | 苏州大方特种车辆有限公司 | Encapsulation of controller |
| CN201590969U (en) * | 2009-12-24 | 2010-09-22 | 天津市欣乐电子有限公司 | Housing with shielding property |
-
2011
- 2011-09-13 CN CN2011102677554A patent/CN102299116A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2757498Y (en) * | 2004-12-01 | 2006-02-08 | 富士康(昆山)电脑接插件有限公司 | Electronic card shell package structure |
| CN101346060A (en) * | 2007-07-10 | 2009-01-14 | Abb股份公司 | Sealing arrangement |
| CN201393351Y (en) * | 2009-03-17 | 2010-01-27 | 苏州大方特种车辆有限公司 | Encapsulation of controller |
| CN201590969U (en) * | 2009-12-24 | 2010-09-22 | 天津市欣乐电子有限公司 | Housing with shielding property |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766829A (en) * | 2014-01-06 | 2015-07-08 | 三菱电机株式会社 | Semiconductor device |
| CN104766829B (en) * | 2014-01-06 | 2017-12-01 | 三菱电机株式会社 | Semiconductor device |
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Application publication date: 20111228 |