CN102299084A - Plastic packaging die and upper lead strip and lower lead strip therein - Google Patents
Plastic packaging die and upper lead strip and lower lead strip therein Download PDFInfo
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- CN102299084A CN102299084A CN201010207595XA CN201010207595A CN102299084A CN 102299084 A CN102299084 A CN 102299084A CN 201010207595X A CN201010207595X A CN 201010207595XA CN 201010207595 A CN201010207595 A CN 201010207595A CN 102299084 A CN102299084 A CN 102299084A
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Abstract
The invention relates to a plastic packaging die and an upper lead strip and a lower lead strip therein. The plastic packaging die comprises the upper lead strip (1) and the lower lead strip (2) for sealing a tube pin (3) of a device in the plastic packaging process of the device; the upper surface of the lower lead strip is provided with a lead slot (20) for accommodating the tube pin; and the upper lead strip is provided with a strip protrusion (10) at the position relative to the lead slot in the lower lead strip, so that the protrusion seals the lead slot from the top and the upper lateral surface of the lead slot when the upper lead strip is pressed on the lower lead strip. The plastic packaging die has the advantages that: the upper and lower lead strips in the plastic packaging die have opposite inserted structures, and the upper lead strip is provided with the protrusion part at the corresponding position of the tube pin and just pressed on the front side of the tube pin of the device during closing, so that a material is not leaked at the front side and the reverse side, and no residual plastic packaging material is left on the tube pin of the device. In addition, the precision requirement for the tube pin is low on selection of the lead frame, so that the manufacturing cost of the lead frame can be reduced.
Description
Technical field
The present invention relates to the integrated circuit encapsulation, more particularly, relate to a kind of plastic package die that is used for the components and parts of encapsulated semiconductor or integrated circuit.
Background technology
In the components and parts of semiconductor and IC use, generally require on the pin residual quantity of plastic packaging material the least possible.If device pin and side plastic packaging material are residual more, can cause rosin joint and loose contact.If the device pin plastic packaging is residual serious, then need to spray water with high pressure and the method for washover material is removed, this has increased manufacturing cost virtually, and result is undesirable.
Figure 1A and Figure 1B are depicted as and go up the lead-in wire bar 1 and the structural representation of lead-in wire bar 2 down in the plastic package die of prior art.Wherein, Figure 1A is the schematic diagram of closure state; Figure 1B is the structural representation of separated position.Shown in Figure 1B, the upper surface of following lead-in wire bar 2 is provided with the lead-in wire groove that is used for containment device pin 3, and the height of the height of groove and device pin 3 is suitable.Last lead-in wire bar 1 lower surface is the plane.This plastic package die, pin are put into the lead-in wire groove, have bigger gap 24 between the sidewall of pin and lead-in wire groove.Because the flat bottom surface of last lead-in wire bar 1 directly is pressed on the device pin, when plastic package die and framework cooperate tension the time, the easy beading of device pin; And when plastic package die and framework cooperated pine the time, plastic packaging material easily flows into the lead-in wire groove location, makes to have residual plastic packaging material on the device pin behind the plastic packaging.
Therefore in design, the components and parts plastic package die to semiconductor and integrated circuit requires just very high with cooperating of framework.But if plastic package die is pursued little matched in clearance simply, the easy again beading of device pin causes potential safety hazard.
Summary of the invention
The technical problem to be solved in the present invention is, cooperates with lead frame at the plastic package die of prior art to require highly, and occurs pin beading or the residual many defectives of plastic packaging material easily, and a kind of plastic package die that can the air locking pin in the plastic packaging process is provided.
Another technical problem that the present invention will solve is, plastic package die at prior art cooperates requirement high with lead frame, and the residual many defectives of pin beading or plastic packaging material appear easily, provide a kind of in can the plastic package die of air locking pin in the plastic packaging process on lead-in wire bar and lead-in wire bar down.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of plastic package die, comprise being used on the pin of the described device of device plastic packaging process sealing lead-in wire bar and lead-in wire bar down, the upper surface of the described bar of lead-in wire down is provided with the lead-in wire groove that holds described pin; The described lead-in wire bar of going up is provided with the strip projection with respect to the lead-in wire groove position on the described lead-in wire bar down, and when making on last lead-in wire bar is pressed in down the lead-in wire bar, described projection seals described lead-in wire groove from the end face and the upper side of described lead-in wire groove.
In plastic package die of the present invention, the height sum of the degree of depth of described lead-in wire groove and the thickness of described pin and described projection is complementary.
In plastic package die of the present invention, described lead-in wire groove comprises bottom land part and slot-open-section, the shape of cross section of described bottom land part and the shape of cross section and the size of size and described pin are complementary, and the shape of cross section and the size of the shape of cross section of described slot-open-section and size and described projection are complementary.
In plastic package die of the present invention, described slot-open-section is gradually wide successively from down to up, forms guiding surface in lead-in wire groove both sides.
In plastic package die of the present invention, described guiding surface is that plane and top have chamfering.
In plastic package die of the present invention, described guiding surface is cambered surface or plane.
In plastic package die of the present invention, the height of described bottom land part is corresponding with the thickness of described pin, and the height of described slot-open-section is corresponding with the height of described projection.
The present invention solves another technical scheme that its technical problem adopts: construct and go up lead-in wire bar and lead-in wire bar down in a kind of plastic package die, it is used for the pin at device plastic packaging process air locking, and the upper surface of the described bar of lead-in wire down is provided with the lead-in wire groove that holds described pin; The described lead-in wire bar of going up is provided with the strip projection with respect to the lead-in wire groove position on the described lead-in wire bar down, and when making on last lead-in wire bar is pressed in down the lead-in wire bar, described projection seals described lead-in wire groove from the end face and the upper side of described lead-in wire groove.
In the lead-in wire bar and the bar that goes between down, the height sum of the degree of depth of described lead-in wire groove and the thickness of described pin and described projection is complementary in plastic package die of the present invention.
Lead-in wire bar and down in the lead-in wire bar in plastic package die of the present invention, described lead-in wire groove comprises bottom land part and slot-open-section, the shape of cross section of described bottom land part and the shape of cross section and the size of size and described pin are complementary, and the shape of cross section and the size of the shape of cross section of described slot-open-section and size and described projection are complementary; Described slot-open-section is gradually wide successively from down to up, forms guiding surface in lead-in wire groove both sides.
Implement the present invention, have following beneficial effect: because the upper and lower lead-in wire bar in the plastic package die has inserting structure, on go between bar in the device pin corresponding position for the part of projection, when closure, just be pressed onto the device pin front, positive and negative is flash not.In addition, because die joint has formed the convex-concave shape, make the exhaust groove face avoid the flash shortcoming that overlaps with the device pin face, the die joint that has also solved the plastic package die of prior art overlaps the defective that causes the die joint buildup and puncture easily when causing using with a certain front of device pin, guaranteed noresidue plastic packaging material on the device pin.Have again, also need not be too high selecting for use of lead frame to the required precision of pin, can reduce the manufacturing cost of lead frame.
In addition, the degree of depth of the lead-in wire groove on the following lead-in wire bar is increased on the basis of device pin thickness again, and slot-open-section is provided with guiding surface, makes things convenient for device pin can import to easily in the lead-in wire groove of little gap, and is difficult for beading.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Figure 1A goes up the lead-in wire bar and the structural representation of lead-in wire bar closure state down in the plastic package die of prior art;
Figure 1B goes up the lead-in wire bar and the structural representation of lead-in wire bar separated position down in the plastic package die of prior art;
Fig. 2 A is according to the structural representation of going up lead-in wire bar and following lead-in wire bar closure state in the plastic package die of the present invention;
Fig. 2 B is according to the structural representation of going up lead-in wire bar and following lead-in wire bar separated position in the plastic package die of the present invention;
Fig. 3 A is according to the partial enlarged drawing of going up lead-in wire bar and following lead-in wire bar closure state in the plastic package die of the present invention;
Fig. 3 B is according to the partial enlarged drawing of going up lead-in wire bar and following lead-in wire bar separated position in the plastic package die of the present invention;
Fig. 4 A is the schematic diagram of the cross section of going up the projection in the lead-in wire bar of plastic package die according to an embodiment of the invention;
Fig. 4 B is the schematic diagram of the cross section of the lead-in wire groove in the following lead-in wire bar of plastic package die according to an embodiment of the invention;
Fig. 5 A is the schematic diagram of the cross section of going up the projection in the lead-in wire bar of plastic package die according to another embodiment of the present invention;
Fig. 5 B is the schematic diagram of the cross section of the lead-in wire groove in the following lead-in wire bar of plastic package die according to another embodiment of the present invention.
Embodiment
Fig. 2 A is according to the structural representation of going up lead-in wire bar and following lead-in wire bar closure state in the plastic package die of the present invention; Fig. 2 B is according to the structural representation of going up lead-in wire bar and following lead-in wire bar separated position in the plastic package die of the present invention.Shown in Fig. 2 A and Fig. 2 B, on go between bar 1 and comprise 16 encapsulation positions in the lead-in wire bar 2 down, each encapsulation position can encapsulate a device.Upper and lower lead-in wire bar has the structure to inserting, that is to say, with respect to the lead-in wire groove position of the bar that goes between down, on the bar that goes between be provided with bossing, when closed this bossing just in time block the slot-open-section of lead-in wire groove, from the top and the upper side groove that will go between seal up.Though in the embodiment shown in Fig. 2 A and the 2B, there are three lead-in wire grooves each encapsulation position, correspondingly each device has three pins, the invention is not restricted to this.In the practical application, can be according to the size of plastic package die and the quantity of device pin, the lead-in wire groove of the suitable quantity on the encapsulation position of design suitable quantity and each the encapsulation position.
Fig. 3 A be according in the plastic package die of the present invention go up the lead-in wire bar and down lead-in wire bar closure state partial enlarged drawing; Fig. 3 B is according to the partial enlarged drawing of going up lead-in wire bar and following lead-in wire bar separated position in the plastic package die of the present invention.Shown in Fig. 3 A and 3B, be provided with the lead-in wire groove 20 of containment device pin 3 at the upper surface of the bar 2 that goes between down; Be provided with projection 10 at last lead-in wire bar 1 with respect to lead-in wire groove 20 positions on the described lead-in wire bar 2 down, this projection 10 is strip (extending laterally from the inboard of last lead-in wire bar), corresponding with the shape and size of lead-in wire groove 20, make when upper and lower lead-in wire bar is closed the slot-open-section of should projection 10 just in time blocking the groove that goes between, thereby from the top and the upper side groove that will go between seal up so that in device plastic packaging process, surround the pin of device.The height h1 sum of the degree of depth h2 of lead-in wire groove 20 and the thickness h 3 of device pin 3 and projection 10 is complementary.In an embodiment of the present invention, the degree of depth h2 of lead-in wire groove 20 equals the thickness h 3 of device pin 3 and the height h1 sum of projection 10, i.e. h2=h1+h3.In other embodiments, the degree of depth h2 of lead-in wire groove 20 is higher than the device pin plane, and can suitably adjust height according to actual operating position.
In an embodiment of the present invention, the slot-open-section of lead-in wire groove 20 also is provided with guiding surface 21, can import to easily in the lead-in wire groove 20 of little gap to make things convenient for device pin 3.Accordingly, the inclined-plane 11 that projection 10 also is designed to and the slot-open-section of the groove 20 that goes between is complementary.
Fig. 4 A is the schematic diagram of the cross section of going up the projection 10 in the lead-in wire bar of plastic package die according to an embodiment of the invention; Fig. 4 B is the schematic diagram of the cross section of the lead-in wire groove 20 in the following lead-in wire bar of plastic package die according to an embodiment of the invention.Shown in Fig. 4 B, lead-in wire groove 20 comprises bottom land part 2a and slot-open-section 2b, and slot-open-section 2b is gradually wide successively from the bottom to top, forms guiding surface 21 in lead-in wire groove 20 both sides.The shape of cross section and the size of the shape of cross section of bottom land part 2a and size and pin 3 are complementary; Correspondingly, the shape of cross section and the size of the shape of cross section of slot-open-section 2b and size and projection 10 are complementary.In the present embodiment, guiding surface 21 is that plane and top have chamfering, and slot-open-section 2b is from bottom to top gradually wide successively, forms the up big and down small dish degree of lip-rounding, and correspondingly, the cross section of projection 10 also is the dish degree of lip-rounding.The height h2a of bottom land part 2a is corresponding with the thickness h 3 of pin 3, and the height h2b of slot-open-section 2b is corresponding with the height h1 of projection 10.
Fig. 5 A is the schematic diagram of the cross section of going up the projection 10 in the lead-in wire bar of plastic package die according to another embodiment of the present invention; Fig. 5 B is the schematic diagram of the cross section of the lead-in wire groove 20 in the following lead-in wire bar of plastic package die according to another embodiment of the present invention.Be that with Fig. 4 A and 4B illustrated embodiment difference in the present embodiment, guiding surface 21 is planes, slot-open-section 2b is gradually wide successively from the bottom to top, forms up big and down small trapezoidally, and correspondingly, the cross section of projection 10 is also for trapezoidal.
In another embodiment of the present invention, guiding surface 21 is cambered surfaces, and slot-open-section 2b is from bottom to top gradually wide successively, forms the up big and down small dish degree of lip-rounding, and correspondingly, the cross section of projection 10 also is the dish degree of lip-rounding.
To sum up, the present invention a kind of plastic package die is provided, wherein, the bar that goes between down has the structure to inserting, the bar that goes between down lead-in wire notch is increased on the basis of device pin thickness again, and bigger guiding gradient is arranged, to make things convenient for device pin can import to easily in the lead-in wire groove of little gap, and be difficult for beading, last lead-in wire bar is the part of projection in the device pin corresponding position, when closure, just be pressed onto the device pin front, guarantee not flash of positive and negative, and die joint formed the convex-concave shape, the exhaust groove face has been avoided the flash shortcoming that overlaps with the device pin face like this, also solved die joint in the past and overlapped the defective that causes the die joint buildup and puncture easily when causing using with a certain front of device pin, also need not be too high selecting for use of lead frame to the required precision of pin, reduce the manufacturing cost of lead frame.
Claims (10)
1. a plastic package die comprises the upward lead-in wire bar (1) and the bar (2) that goes between down that are used at the pin (3) of the described device of device plastic packaging process sealing, and the described upper surface that goes between bar down is provided with the lead-in wire groove (20) that holds described pin; It is characterized in that, the described lead-in wire bar of going up is provided with strip projection (10) with respect to the lead-in wire groove position on the described lead-in wire bar down, when making on last lead-in wire bar is pressed in down the lead-in wire bar, described projection seals described lead-in wire groove from the end face and the upper side of described lead-in wire groove.
2. plastic package die according to claim 1 is characterized in that, the degree of depth of described lead-in wire groove (h2) is complementary with the thickness (h3) of described pin and height (h1) sum of described projection.
3. plastic package die according to claim 1, it is characterized in that, described lead-in wire groove comprises bottom land part (2a) and slot-open-section (2b), the shape of cross section of described bottom land part and the shape of cross section and the size of size and described pin are complementary, and the shape of cross section and the size of the shape of cross section of described slot-open-section and size and described projection are complementary.
4. plastic package die according to claim 3 is characterized in that, described slot-open-section is gradually wide successively from down to up, forms guiding surface (21) in lead-in wire groove both sides.
5. plastic package die according to claim 4 is characterized in that, described guiding surface is that plane and top have chamfering.
6. plastic package die according to claim 4 is characterized in that, described guiding surface is cambered surface or plane.
7. plastic package die according to claim 7 is characterized in that, the height (h2a) of described bottom land part is corresponding with the thickness (h3) of described pin, and the height of described slot-open-section (h2b) is corresponding with the height (h1) of described projection.
8. go up lead-in wire bar and lead-in wire bar down in the plastic package die, it is used for the pin (3) at device plastic packaging process air locking, and the described upper surface of lead-in wire bar (2) down is provided with the lead-in wire groove (20) that holds described pin; It is characterized in that, the described lead-in wire bar (1) of going up is provided with strip projection (10) with respect to the lead-in wire groove position on the described lead-in wire bar down, when making on last lead-in wire bar is pressed in down the lead-in wire bar, described projection seals described lead-in wire groove from the end face and the upper side of described lead-in wire groove.
9. the upward lead-in wire bar in the plastic package die according to claim 8 and the bar that goes between down is characterized in that the thickness (h3) of the degree of depth of described lead-in wire groove (h2) and described pin and height (h1) sum of described projection are complementary.
10. the upward lead-in wire bar in the plastic package die according to claim 8 and the bar that goes between down, it is characterized in that, described lead-in wire groove comprises bottom land part (2a) and slot-open-section (2b), the shape of cross section of described bottom land part and the shape of cross section and the size of size and described pin are complementary, and the shape of cross section and the size of the shape of cross section of described slot-open-section and size and described projection are complementary; Described slot-open-section is gradually wide successively from down to up, forms guiding surface (21) in lead-in wire groove both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010207595 CN102299084B (en) | 2010-06-23 | 2010-06-23 | Plastic packaging die and upper lead strip and lower lead strip therein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010207595 CN102299084B (en) | 2010-06-23 | 2010-06-23 | Plastic packaging die and upper lead strip and lower lead strip therein |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102299084A true CN102299084A (en) | 2011-12-28 |
| CN102299084B CN102299084B (en) | 2012-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010207595 Expired - Fee Related CN102299084B (en) | 2010-06-23 | 2010-06-23 | Plastic packaging die and upper lead strip and lower lead strip therein |
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| Country | Link |
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| CN (1) | CN102299084B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465441A (en) * | 2013-09-17 | 2013-12-25 | 铜陵建西精密部品有限责任公司 | Tooth-shaped insert for packaging lead frame |
| CN104051280A (en) * | 2013-03-11 | 2014-09-17 | 飞思卡尔半导体公司 | Die sleeve |
| CN114557145A (en) * | 2019-09-30 | 2022-05-27 | 西门子股份公司 | Housing for an electronic module and production thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168123A (en) * | 1999-12-09 | 2001-06-22 | Seiko Epson Corp | Semiconductor device, method for manufacturing the same, apparatus for manufacturing the same, circuit board and electronic equipment |
| CN2906918Y (en) * | 2006-05-11 | 2007-05-30 | 乐山—菲尼克斯半导体有限公司 | Flash-free plastic capsulation mold for semiconductor device |
-
2010
- 2010-06-23 CN CN 201010207595 patent/CN102299084B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168123A (en) * | 1999-12-09 | 2001-06-22 | Seiko Epson Corp | Semiconductor device, method for manufacturing the same, apparatus for manufacturing the same, circuit board and electronic equipment |
| CN2906918Y (en) * | 2006-05-11 | 2007-05-30 | 乐山—菲尼克斯半导体有限公司 | Flash-free plastic capsulation mold for semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051280A (en) * | 2013-03-11 | 2014-09-17 | 飞思卡尔半导体公司 | Die sleeve |
| CN104051280B (en) * | 2013-03-11 | 2018-06-08 | 恩智浦美国有限公司 | Die sleeve |
| CN103465441A (en) * | 2013-09-17 | 2013-12-25 | 铜陵建西精密部品有限责任公司 | Tooth-shaped insert for packaging lead frame |
| CN114557145A (en) * | 2019-09-30 | 2022-05-27 | 西门子股份公司 | Housing for an electronic module and production thereof |
| CN114557145B (en) * | 2019-09-30 | 2024-03-15 | 西门子股份公司 | Housing for an electronic module and production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102299084B (en) | 2012-12-12 |
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