CN102297880A - Apparatus and method of producing heating oxygen sensor - Google Patents
Apparatus and method of producing heating oxygen sensor Download PDFInfo
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- CN102297880A CN102297880A CN2010105394533A CN201010539453A CN102297880A CN 102297880 A CN102297880 A CN 102297880A CN 2010105394533 A CN2010105394533 A CN 2010105394533A CN 201010539453 A CN201010539453 A CN 201010539453A CN 102297880 A CN102297880 A CN 102297880A
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Abstract
The invention relates to an apparatus and a method of producing a heating oxygen sensor. The method includes the steps of placing a material layer to one side of a heater of a nonconductive substrate material to form a heating loop, placing the material layer to one sensing side of the nonconductive substrate material to form an oxygen sensor, cutting the nonconductive substrate material into individual sensing elements, wherein each sensing element is provided with a plurality of brazing pads, placing a fusing agent to the brazing pads, arranging prefabricated sheets to approach the brazing pads; drying the fusing agent and pasting the fusing agent to the prefabricated sheets, positioning preassembled wiring harness to tightly connect with the prefabricated sheets, and brazing the wiring harness to the brazing pads so as to couple the wiring harness to the sensing elements.
Description
Technical field
Relate generally to of the present invention is used for air-fuel (air to fuel) measured sensor, and relates to modifying device and the method that is used to produce the heated type lambda sensor especially.
Background technology
Lambda sensor in the modern gasoline engine is used to determine the fuel-air mixed ratio of engine exhaust.The binding engine control computer is used, and this " feedback " loop is used to constantly to adjust fuel-air mixed and reaches stoichiometric balance, and toxic emission is minimized.
In using the motor vehicle fuel control system of air/fuel than lambda sensor, the actual air in the mixed gas is by detecting oxygen and unburned gas (CO, the H in the waste gas
2, HC) concentration measure, and air/fuel is fed back to fuel flow rate control circuit (or program) than the information indication of (below be abbreviated as A/F), and this fuel flow rate control circuit (or program) and then control fuel flow rate make mixed gas keep target A/F.Fuel Petroleum in the mixed gas is called stoichiometry A/F by the A/F of perfect combustion.
Automobile under various environmental baselines and that load variations is very big in advancing, so A/F must be according to condition and the load suitably control in very wide scope of advancing.For example, A/F must be controlled to control to poorness (lean) A/F for light load, controls to (rich) A/F more than needed and then is stoichiometry A/F for the zone of having activated three-way catalyst (3-way catalyzer) for heavy load and low temperature.Be to have described a kind of this quasi-resistance type sensor in the U.S. Patent No. 4,535,316 of " heated type titania lambda sensor " at exercise question.
Titania is to have the semiconductor material that quantity depends on the lattice imperfection of temperature T and the oxygen partial pressure in surrounding semi-conductive gaseous environment (PO2).Lattice keeps near-complete under the exhaust conditions of poorness, and a large amount of oxygen rooms and titania ion space is arranged in that condition more than needed is next.These lattice imperfections within semiconductor are thereby that electronics is discharged into the alms giver that conduction band reduces resistance.Semi-conductive resistance R
TCan by under establish an equation and measure:
R
T∝ [PO2 (giving up)]
nExp (E/KT)
Wherein E is an energy of activation, and K is Boltzmann (Boltzmann) constant, and n is approximately equal to 1/4 in interested temperature range.
As what find out, the reference dividing potential drop of oxygen there is not dependence by this ratio.When switching between operation more than needed and poorness in 350～800 ℃ temperature range, the resistance variations of 3～5 order of magnitude amplitudes is typical.
In operation, when with titania element R
TBe placed into and have at TiO
2In the time of within the Rc that inserts between element and the ground wire and the bleeder circuit of compensating resistor, the output voltage V o that records across Rc by under establish an equation and provide:
Vo＝[Rc/(R
T+R
C)]Vin
Wherein Vin is an input voltage.Compensating resistance Rc is chosen as the centre (Rc=[R of the logarithmic scale between the resistance value more than needed and poorness of titania element ideally
T(having more than needed) R
T(poorness)]
1/
2).Be close to (input voltage) that near-zero when this allows output signal by poor waste gas changes to when having more than needed waste gas expires value, thus simulation ZrO
2The switching characteristic of sensor.
Though aspect the value of selecting Rc some dirigibilities being arranged, if selected resistance remains on TiO
2At least one order of magnitude amplitude and the sensing switch that under its lean limit, then can keep on the limit more than needed of element.But because the resistance of TiO2 element varies with temperature, a fixed resistance value finding out on typical 200 ℃～850 ℃ operating temperature range that makes the sensor function maintenance be in waste gas fully is impossible.
The temperature dependency of titania sensing element can be by utilizing the changes in resistance can follow the tracks of titanium dioxide film variohm or compensate by the titania element being maintained at fixing temperature (this will allow the resistor of use fixed value).
When using variohm, variohm is the thermistor that changes that be complementary and negative temperature coefficient that be arranged in waste gas with the temperature and resistance of titania sensing element.In order to use the resistor of fixed value, be necessary the titania sensing element is heated to the maximum temperature that expectation is produced by waste gas.Because fixed resister does not need to be arranged in waste gas stream, thereby can use the thick-film resistor cheaply that can buy on the market.
This type of sensor has been used in the bigger engine (for example, automobile).It is believed that since production difficulty and we simply " in proportion " dwindle the fact that automobile sensor is used in less engine, thereby the analog sensor that is used for less engine is not also developed.Sensor breaks and premature failure if this type of automobile sensor by scaled to the reduced size that uses in less engine simply, then has.
And, the lambda sensor that in displacement gasoline engine (for example employed those engines of motorcycle), uses need with the different performance characteristics of in bigger motor car engine, using of those engines.Rotations per minute (" RPM ") rising faster and fall time are arranged in the middle of this type of performance characteristics, engine temperature changes fast, and in single shaft higher engine luggine level.In addition, this type of sensor should be arranged ideally and make it more near puffer.
Therefore, however needed be to satisfy the size of puffer and the lambda sensor that performance index can also be produced economically.
Summary of the invention
In response to these and other problem, in one embodiment, have in a kind of like this mode that satisfies little petrolic performance and layout standard and come miniaturization and the sensor that designs.This miniaturization than simply scaled be used for motor car engine require than large sensor higher.If scaled simply this type of automobile sensor has then that sensor breaks and premature failure.
For example, in a kind of method of producing sensor, comprising: conductive layer is put on non-conductive substrate material heating device one side to form heating circuit; (overcoat) puts on heating circuit with first overcoat; Second overcoat is put on heating circuit; Solidify (cure) conductive layer; Sensor pattern is printed on sensor one side of baseplate material to form at least two sensor electrodes and to be connected figure; Titania (titania) layer is printed on the connection figure on the sensor ends that is positioned baseplate material; Be formed for the connection of heating circuit; Printing is used for the soldering weld pad (brazing pad) that heating circuit connects; Be formed for the connection of sensor electrode and form third electrode; Printing is used for the soldering weld pad that sensor connects; To seal (seal) and put on sensor electrode; Honeycomb seal is put on sensor electrode; Honeycomb seal is put on the well heater loop; Resistive layer between the formation sensor electrode is to set up two fixed resisters; Cover glaze layer (over glaze layer) with first and put on resistive layer; Adjust the resistance value of described two fixed resisters; Cover the glaze layer with second and put on resistive layer; Baseplate material is carried out laser scribing (laserscribing); Baseplate material is cut the row that list (singulate) becomes predetermined quantity; Catalyzer is put on the sensor side of baseplate material; And the row of baseplate material cut single individual sensor element that becomes.
In addition, for each individual sensing element, above method can also comprise: (flux) puts on the soldering weld pad with flux; Layout is adjacent to the prefabricated film of soldering weld pad; Make the flux drying so that flux is adhered to prefabricated film; Locating pre-assembled wiring bundle (wire harness) makes it be next to (next to) prefabricated film; The wiring bundle is brazed in the soldering weld pad so that the wiring bundle is coupled to sensing element.
These and other feature, and advantage will more be expressly understood from the following detailed description of carrying out in conjunction with the accompanying drawings.To notice that importantly these accompanying drawings are not to mean representative unique aspect of the present invention.
Description of drawings
Fig. 1 is the isometric view that combines the lambda sensor of various features of the present invention.
Fig. 2 is the synoptic diagram that the lambda sensor that the exemplary embodiment of reciprocating internal combustion engine assembles is shown.
Fig. 3 shows well heater one side of the sensing element that can use in the sensor of Fig. 1.
Fig. 4 shows sensor one side of the sensing element that can use in the sensor of Fig. 1.
Fig. 5 a is the circuit diagram of the sensing element of Fig. 3 and 4.
Fig. 5 b is the chart that the output voltage of sensing element under 857 ℃ temperature of exhaust conditions poor and more than needed is shown.
Fig. 5 c is the chart that the output voltage of sensing element under 536 ℃ temperature of exhaust conditions poor and more than needed is shown.
Fig. 6 is the isometric drawing that shows the sensing element of well heater one side.
Fig. 7 is the isometric drawing of sensing element at assembly process.
Fig. 8 a is the isometric drawing that shows the terminal that is adjacent to lead-in wire.
Fig. 8 b is the top view of terminal and lead-in wire.
Fig. 8 c shows and is soldered to terminal to form the lead-in wire of terminal-connector assembly.
Fig. 8 d is the top view that is coupled to the sensing element of three terminal-connector assemblies.
Fig. 8 e shows that how these three terminal assemblies attach to the isogonism detail drawing of sensor at the link of sensing element.
Fig. 9 shows the sensor at assembly process.
Figure 10 shows the sensor at assembly process.
Figure 11 a illustrates the top cut-open view that the assembling sensor of well heater one side of sensing element dissects.
Figure 11 b illustrates the isometric cross-sectional view that the assembling sensor of well heater one side of sensor element dissects.
Figure 12 a illustrates the top cut-open view that the assembling sensor of sensor one side of sensing element dissects.
Figure 12 b illustrates the isometric cross-sectional view that the assembling sensor of sensor one side of sensing element dissects.
Figure 13 a and 13b show the material layer that comprises sensing element.
Figure 14 a, 14b and 14c show the process of making sensing element and sensor.
Embodiment
Well-known element provides in order to avoid the present invention is fogged because of non-essential details under the situation that does not have detailed description.With regard to most of, be omitted obtaining complete understanding of the present invention institute unnecessary details, because this type of details is well known to those skilled in the art.The details relevant with control circuit described herein or mechanism has been omitted, because this type of control circuit is well known to those skilled in the art.
With reference now to Fig. 1,, the isometric drawing of the lambda sensor 100 that combines various features of the present invention is arranged in Fig. 1.Go out as shown, lambda sensor 100 comprises that guard shield 102 is with protection sensing element (not illustrating) in Fig. 1.Guard shield 102 has a plurality of openings 104 and passes through guard shield to allow gas.Guard shield 102 is coupled to canister or shell 106.Container 106 has screw thread 108 to be coupled to the opening of gas outlet (not shown).Sensor 100 is designed to couple with gas outlet and makes sensor ends 110 charge into the inside of gas outlet and link 112 outwards stretches from the outside of gas outlet.Metal washer 114 is set up the sealing between sensor 100 and the gas outlet.Many wiring 116 are stretched out from link 112.As what will explain hereinafter, many wiring 116 are logical with voltage source, electronics ground wire (electronic ground) and electronic control component (not shown) Electricity Federation.
Sensor is varying sized for littler of to be used in less engine.For example, the total length of sensor 100 can be little of 49.2mm in certain embodiments.Diameter can be in the scope of 12.70mm.In certain embodiments, guard shield 102 outstanding length can be in the scope of 10.56mm.
With reference now to Fig. 2,, in Fig. 2, provides the exemplary embodiment of reciprocating internal combustion engine 202.Gas outlet 204 is coupled to the manifold 206 of engine 202.Gas outlet 204 is designed waste gas is sent to environment on every side from engine 202.Part sensor 100 is charged in the gas outlet 204 and is designed to detect oxygen content in the waste gas.As what hereinafter will explain in more detail, voltage source 210 gives sensor 100 power supplies.Sensor 100 and then input signal is supplied to electronic control unit 212.Electronic control unit 212 recently reacts the air supplied-combustion gas of engine 202 operation institutes by control to input signal.
Correct air-fuel ratio can help to keep and toxic emission is minimized.In certain embodiments, thus sensor 100 and do not rely on exhaust gas temperature and, can be arranged in the arbitrfary point of pipeline 204 away from the minimum turbulent flow of having of exhaust manifold (for example lower Reynolds number).
Fig. 3 shows well heater one side of the sensing element 300 that can be used in the sensor 100 (Fig. 1).Sensing element 300 is preferably aluminium oxide (alumina) and is formed by flat substrate 302.Substrate 302 has first or link 304 and second or sensor ends 306.Go out as shown, the width of substrate is broads at link 306.In certain embodiments, the width of substrate 302 remains unchanged up to the position 307 along its length.307 to the position 309 from the position, and the width of substrate is reduced to width smaller gradually.Thereby the width of substrate 302 reduces at sensor ends 306 places.And, during production run, slotted or chamfering such as the corner in corner 311.The profile that substrate 302 diminishes gradually and the corner of chamfering reduce thermal stress in the production and the operating period of sensor.Thus, prolonged the life-span of sensing element 300 significantly.
The tape 308 of conductive material (for example platinum) is printed on the surface 310 as thick film.Tape 308 forms continuous loop 312 and is stretched over sensor ends 306 and turns back to link 304 from link 304.Tape 308 has constant basically width and reaches position 313 up to it towards the sensor ends 306 of substrate.In the position 313, the width of tape 308 is reduced to form stratie figure 314.Conductive material in heating element figure 314 has the high positive temperature coefficient (PTC) of resistance, for example is value 3.8 * 10 for platinum
-3/ ℃.
Figure 314 is designed such that most basically heat energy results from the sensor ends 306 of substrate 302.In certain embodiments, figure 314 is selected such that 650 ℃～900 ℃ the temperature band that produces the desired temperature range of conduct during power operation by 14 volts the UNICOM in loop 312.
Fig. 4 shows second or sensor one side 402 of the sensing element 300 in the sensor 100 that can be used in Fig. 1.
The electrode that comprises three of conducting metal thick film conduction bands 404,406 and 408 is applied in the sensor surface 402 of substrate 302.Metal film preferably has heat-resisting quantity (for example platinum).
The first conducting metal band 404 traverses the most of length of substrate 302 from the link 304 of substrate near the figure 410 the sensor ends 306 that is printed on substrate.Band 404 is electrically connected to first fixed resister 412 with figure 410.First fixed resister 412 is positioned near the link 304 of substrate 302 and is electrically connected to weld pad 414.Weld pad 414 is designed to voltage source (not shown) Electricity Federation logical.First fixed resister 412 has reduced the voltage of being given figure 410 ends by voltage source supplies.
But the second conducting metal band 406 traverse substrate from the link 304 of substrate 302 to first band, the 404 substantially parallel most of length that do not contact the figure 410 of first band.One end of second band 406 is electrically connected to the weld pad 416 that is suitable for being electrically connected to the engine electronic control unit (not shown).
The 3rd conducting metal band 408 traverses to the weld pad 418 of link 304 location that are right after substrate 302 from a side of second resistor 420.Weld pad 418 is designed to be electrically connected to the electronics ground wire.Band 404,406 never contacts each other with 408.
Fine grained titanium dioxide film (not shown) is applied on the figure 410 to be formed on the variable resistor path between first and second band.Titanium dioxide film be porous and when being exposed to waste gas, have with the oxygen proportion in the waste gas and change the resistance change.Therefore titanium dioxide film has formed the variable resistor path between first and second band.It is relevant with the oxygen content in the waste gas and depend on temperature that electric current flows through the resistance of titanium dioxide film.But temperature dependency is cancelled by the resistance heated of the figure on the opposite sides of substrate basically.
As what will explain with reference to figure 5 hereinafter, when waste gas is had more than needed, then titania resistance is low and electric current is high relatively, has caused the relative high voltage drop across second resistor 420 that records between described second band 406 and the 3rd band 408.Under poor air-fuel condition, titania resistance is high relatively, thereby has reduced the voltage drop between second band 406 and the 3rd band 408.Conducted the input signal that is used to operate the electronic control unit of the input air-fuel ratio that controls to engine by second band 406 and weld pad 416 conducts across the voltage drop of second resistor 420.
Under some operating conditions or after the outer time delay in the running time, can predict the carbon that is present in waste gas and can be deposited on the not heating zone of aluminium base.If enough coke build-ups, then electrical short may take place between band 404,406 and 408, thereby this provides incorrect input signal can for electronic control unit (not illustrating in Fig. 4).In order to prevent short circuit, can apply non-porous dielectric coating (for example aluminosilicate glass glaze) to cover the contact conductor between titanium dioxide film and resistor 412 and 420.Equally similar glass glaze is put on the well heater loop 312 on well heater one side of substrate 302 (referring to Fig. 3).
Glass glaze helps to protect heating element and prolong its life-span when standing automobile exhaust gas.These glaze coatings can be used as slurry and use the thick-film printed technology to apply, and wherein this slurry forms non-porous dielectric layer in high-temperature roasting (firing) back.
In addition, the both sides that the overcoat of porous can be put on substrate 302 then add protection by formed heating element of figure 314 (Fig. 3) and the titanium dioxide film on figure 410 with other.This porous layer prevents by the wearing and tearing of the thick film due to the particle in the waste gas and prevents that the pollutant in the waste gas directly is deposited on the titanium dioxide film surface.Overcoat has enough porositys to allow waste gas to arrive the zone of figure 410 for suitable sensing capabilities.Such porous cover layer can be by being incorporated into alumina particles to come together to make and alumina particles can use the thick-film printed technology to apply in having the matrix of borosilicate glass.
In addition, the response time of raising titanium dioxide film may be favourable for some application.This can be by finishing on the surface that catalyzer (for example platinum) is put on the titanium dioxide granule in the sensing membrane.
Though fixed resister 412 and 420 illustrates as intactly being attached to substrate 302, can predict these resistors and can be away from substrate and caused and be used for electronically controlled operation signal maintenance and can operate.。
The circuit diagram 500 of sensing element 300 is shown in Fig. 5 a.Reference element has also been discussed in Fig. 3 and 4.Therefore, below discussing should be referring to Fig. 3,4 and 5a: as what discussed before, exist voltage source 210.Voltage source 210 is typically 12 volts battery supply.But, consider there is the alternator charging system that voltage can change or be that vehicle makes required any voltage between 11～16 volts.Electric current is transmitted to weld pad 318 and 414 by lead-in wire or wiring 502.Weld pad 318 is connected with the well heater loop 312 (equally referring to Fig. 3) of impelling heat energy to result from the figure 314 of well heater one side of sensing element 300.Typically, the temperature in the graph area 314 time is maintained at 650～900 ℃ when the waste gas stream that sensor 300 is arranged in the gas outlet (not shown) of the temperature with 200～850 ℃.
The resistor 412 that is electrically connected to weld pad 414 is to make the electric current of being supplied have the such value less than 10 milliamperes value.This electric current is to make the heat energy in the titanium dioxide film 506 be produced as minimum.In addition, resistor 412 and 420 is selected such that the total voltage that produces as signal typically changes between 0～900 millivolt in titanium dioxide film 506.The oxygen content of electric current in waste gas that flows through titania thick film 506 during near poor value (promptly approaching the oxygen content of air) near zero (0.3ma), same approaching zero by weld pad 416 simultaneously to the consequential signal voltage that lead-in wire 508 conducts to the electronic control unit (not shown).
Lead-in wire 510 is electrically connected to weld pad 316 and 418 so that electronics ground wire 512.
The oxygen content of electric current in waste gas that flows through titanium dioxide film 506 during near zero (more than needed, that is, 10-12 is to 10-18 atmospheric pressure) near 4-6ma.Under exhaust conditions more than needed and have specified 14V power input, be supplied to the voltage signal of electronic control unit to be typically 900 millivolts.Fig. 5 b is the chart that the output voltage of exhaust conditions under 857 ℃ temperature poor and more than needed is shown.Fig. 5 c is the chart that the output voltage of exhaust conditions under 536 ℃ temperature poor and more than needed is shown.
The assembling sensor:
The mode of assembling sensor 100 will be discussed now.Fig. 6 illustrates well heater one side of sensing element and the isometric drawing of three weld pads 316,317 and 318 sensing elements 300.Opposite weld pad 418,416 and 414 is on the opposite side of sensing element 300 and not shown in this view.Flux can be put on the link 304 of sensing element 300 now and on weld pad.Flux can be the composition of boric acid, petroleum fraction, potassium fluoborate and potassium fluoride.After having arranged flux, soldering prefabricated component (brazing preform) 702 is located in around the link 304 of sensing element, as shown in Figure 7.Prefabricated component 702 materials are silver-bearing copper cazins.Substrate is become dry makes the flux drying in soldering prefabricated component (blaze preform).
Fig. 8 a, 8b and 8c show the details that is electrically connected to the terminal 800 that wiring or lead-in wire (for example going between 502) design in Fig. 8 for two opposite soldering pads (for example weld pad 316 and 418) with sensing element (not illustrating).Fig. 8 a illustrates and the isometric drawing of the 502 contiguous terminals 800 that go between.Fig. 8 b is the top view of terminal 800 and lead-in wire 502.Fig. 8 c shows and is welded in terminal 800 to form the lead-in wire 502 of terminal connections assembly 804.
As directed, terminal 800 comprises the clip that is formed by copper beryllium band.Band is comprised the clip of three sections with formation from bending on one's body.Connect two opposite soldering pads that sections 806 is designed to hold the sensing element (not shown).Elongating sections 808 is designed to will go between or wiring is connected to terminal 800 via welding technology.Connecting sections 806 and elongating between the sections 808, exist interstitial segment 810.Be positioned on the exterior face of interstitial segment 810 is retaining clip 812.The slight biasing of interstitial segment 810 allows retaining clip 812 on assembly process remains in terminal 800 position within the ceramic isolators (not shown).
Fig. 8 d is the top view of the sensing element 300 that couples with three terminal-connector assemblies.But because viewing angle, thereby to have only two terminal- connector assemblies 804 and 814 be visible.Fig. 8 e illustrates how terminal assemblies 804,814 and 816 attaches to sensor 300 at link 304 isogonism detail drawing.Thereby terminal-connector assembly 804 makes weld pad 316 and weld pad 418 (not shown)s be coupled to wiring 510.Terminal-lead assemblies 814 makes weld pad 317 and weld pad 416 (not shown)s be coupled to lead-in wire 508 and terminal-connector assembly 816 makes weld pad 318 and weld pad 414 (not shown)s be coupled to lead-in wire 502.
Terminal-connector assembly is brazed in the weld pad of sensing element.Welding is that metal bond technology calking thus (filler) metal or alloy is heated to the temperature of fusion more than 450 ℃ and is distributed between two or more parts of being close to by capillary action.Impelled a little on its temperature of fusion during at the caulking metal of welding in the prefabricated component when atmosphere that is fit to or flux protection.Then, the thin layer of caulking metal and underlying metal interacts (common name is soaked) and is cooled off rapidly to form sealed engagement then.According to definition, the temperature of fusion of brazing alloy is lower than the temperature of fusion that material engages.Sensor module can be cleaned then so that sensor module is prepared and all the other sensor element assemblings.
Terminal-connector assembly 804,814 and 816 is located within as shown in Figure 9 the ceramic isolators shell 902 then.In case connector assembly is located within the ceramic isolators shell 902, retaining clip (for example retaining clip 812) just remains in original position with connector assembly.Lead-in wire 502,508 and 510 is by the rear portion of ceramic isolators shell 902 and by teflon (Teflon) end plate 904.
As shown in figure 10, long-neck ceramics insulator 1002 provides support and shell for most of sensor element 300.Long-neck shell 1002 is formed by alumina ceramics composite.Opening 1004 in the sensor ends of long-neck shell 1002 allows the sensor ends 306 of sensing element 300 to be projected into outside the long-neck shell, as shown in figure 10.Ceramic isolators 902 does not provide support and shell for a part of terminal-connector assembly 804,814 and 816 (illustrating) in Figure 10.
Referring now to Figure 11 a, 11b, 12a and 12b.Figure 11 a is the top cut-open view that the assembling sensor 100 of well heater one side of demonstration sensing element 300 dissects.Figure 11 b is the isometric cross-sectional view that the sensor 100 of well heater one side of demonstration sensing element 300 dissects.Similarly, Figure 12 a is the top cut-open view that shows that the assembling sensor 100 of sensor one side of sensing element 300 dissects.Figure 12 b is the isometric cross-sectional view that the assembling sensor 100 of sensor one side of demonstration sensing element 300 dissects.
The sensor 100 of assembling has the nickel-plated steel shell 106 that attaches to the pipeline (not shown) by screw thread 108.When mounted, metal washer 114 has been set up the sealing (Fig. 2) between sensor 100 and the gas outlet 204.The link of shell 106 is curled in around the teflon end plate 904 with Seal end plate with blocks moisture.Guard shield 102 is attached to shell 106 and avoids destroying with protection sensing element 300.Sensing element 300 is located within the long-neck ceramics insulator 1002.The link of sensing element 300 is kept putting in place by the copper beryllium terminal assemblies 804,814 that is positioned the soldering within the ceramic isolators shell 902 and 816.Chamber 1008 is poured into ceramic bond (ceramic cement) further terminal assemblies is remained within the ceramic isolators shell 902.Teflon end plate 904 has been protected them when many lead-in wires 116 are drawn from sensor 100 cements.
The opening 104 that heating guard shield 102 has sufficient amount makes that the waste gas stream around sensor 100 of being sampled is instant basically.Because the temperature in figure 410 districts is maintained between 650～900 ℃, so the unique variable in sensor operation is the impedance of the electric current that flow through titanium dioxide film graph area 410 on relevant with the oxygen content in the waste gas.Thereby sensor 100 can directly be used for providing input signal to obtain to help to satisfy the desired air-fuel ratio of various pure air requirements to electronic control unit 212 (Fig. 2).
Make sensing element:
As previously described, production can be satisfied the sensing element needs new technology (new and processes) of the physical size limitations required than puffer.A kind of this class technology that is used to make sensing element 300 has been shown in Figure 14 a, 14b and 14c.Also will be with reference to Figure 13 a and 13b that the material layer that comprises sensing element 300 is shown.
In step 1406, conductive layer 1317 is put on well heater one side of substrate 1302.In order to finish this step, platinum conductor layer 1317 uses the silk screen printing technology to apply according to predetermined figure.Predetermined figure can be as in the loop of above describing with reference to figure 3 312 and the description of figure 314.After having applied platinum, dry platinum within the predetermined time and under the predetermined temperature.In certain embodiments, the schedule time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃.Baseplate material then peak value under predetermined temperature (peaking at apredetermined temperature) roasting preset time so that platinum conductor layer 1317 to be set.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, the schedule time is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1408, first overcoat (overcoat layer) 1318 is formed.In this exemplary embodiment, overcoat 1318 can be non-porous dielectric coating (for example aluminosilicate glass glaze).Layer 1318 uses thick film technology to print.Allow layer 1318 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time with cured layer 1318.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, predetermined temperature is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1410, second overcoat 1319 is formed.In this exemplary example, overcoat 1319 can be non-porous dielectric coating (for example aluminosilicate glass glaze).Layer 1319 uses thick film technology to print.Allow layer 1319 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature range are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time with cured layer 1318.In certain embodiments, the schedule time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1412, baseplate material then peak value at predetermined roasting temperature preset time with curing conductive layer (platinum conductor layer 1317).In certain embodiments, preset time is that 61～75 minutes and predetermined temperature are 1284～1568 ℃.In this exemplary embodiment, preset time is that 68 hours and predetermined temperature are 1426 ℃.
In step 1414, sensor one side that baseplate material 1316 is turned to substrate is used for so that other layer is put on sensor surface one side.
In step 1416, sensor pattern layer 1324 is put on sensor one side of baseplate material 1302.In order to finish this step, platinum China ink layer 1324 uses the silk screen printing technology to apply according to predetermined figure.Predetermined figure can be as the description that is formed on above with reference to figure 4 described figures 410 and band 404 and 406.After having applied the platinum China ink, dry platinum China ink within the predetermined time and under the predetermined temperature.In certain embodiments, preset time is that 2.5～4.5 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is that 3.5 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time so that sensor pattern layer 1324 to be set.In certain embodiments, preset time is that 51～63 hours and predetermined temperature are 1125～1375 ℃.In this exemplary embodiment, preset time is that 57 hours and peak temperature are 1250 ℃.
In step 1418, titania sensor layer 1325 is applied in the sensor ends of substrate 1316.As described above, titanium dioxide layer 1325 serves as the conductor of sensor to form the resistance that is directly proportional with oxygen level.The titania sensor material is formed by titania powder and titanium tetrachloride (Tetanium Tetracloride).After having applied titania sensor layer 1325, within the predetermined time and under the predetermined temperature dry it.In certain embodiments, Yu Ding temperature is that 7～9 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value under predetermined temperature dry preset time so that titania sensor layer 1325 to be set.In certain embodiments, preset time is that 47 to 57 hours and predetermined temperature are 990～1210 ℃.In this exemplary embodiment, preset time is that 52 hours and peak temperature are 1100 ℃.
In step 1420, electrode sealant 1329 is formed.In this exemplary example, sealant 1329 can be non-porous dielectric coating (for example alumina powder of slurry form).Layer 1329 uses thick film technology to print.Allow layer 1329 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time to solidify sealant 1329.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1422, the first honeycomb seal layer 1330 is formed.In this exemplary example, the first honeycomb seal layer 1330 can be made by the matrix (matrix) of alumina particle and borosilicate glass.Layer 1330 uses thick film technology to print.Allow layer 1330 dry preset time under predetermined temperature then.In certain embodiments, the schedule time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time to solidify the first honeycomb seal layer 1330.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 828～1012 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 920 ℃.
In step 1424, the second honeycomb seal layer 1331 is formed.In this exemplary example, the second honeycomb seal layer 1331 can be made by the matrix of alumina particle and borosilicate glass.The second honeycomb seal layer 1331 uses thick film technology to print.Allow layer 1331 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature range are 100 ℃ ± 20.Baseplate material then peak value at predetermined temperature roasting preset time to solidify the second honeycomb seal layer 1331.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 828～1012 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 920 ℃.
In step 1426, well heater one side that baseplate material 1316 rotates back into substrate puts on heater surfaces one side with the layer that other is added.
In step 1428, form heater and connect the support between platinum conductor layer 1317 and the solder pad 1321 to be provided and to be electrically connected.In order to finish this step, use the silk screen printing technology that silver-colored platinum conductive ink layer 1320 is put on substrate and a part of conductor layer 1317 according to predetermined figure.Predetermined figure can be three bands as shown in figure 13.After having applied silver-colored platinum conductive ink layer 1320, within the predetermined time and under the predetermined temperature dry it.In certain embodiments, preset time is that 6～7 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time so that silver-colored platinum layer 1320 to be set.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1430, soldering weld pad 1321 is formed on the silver layer 1320.In order to finish this step, silver-colored platinum conductive ink applies as layer 1321.Use the silk screen printing technology that silver-colored platinum conductive ink is put on a part of conductor layer 1320 according to predetermined figure.Predetermined figure 1321 can be three bands as shown in figure 13.After having applied silver-colored platinum conductive ink, within the predetermined time and under the predetermined temperature dry it.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time so that soldering weld pad 1321 to be set.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1432, sensor one side that baseplate material 1316 rotates back into substrate puts on sensor surface one side with the layer that other is added.
In step 1434, form sensor and connect the support between platinum conductor layer 1324 and the soldering weld pad 1328 to be provided and to be electrically connected.In order to finish this step, use the silk screen printing technology that ground floor silver platinum conductive ink 1326 is put on substrate and a part of trace layer 1324 according to predetermined figure.Predetermined figure can be three bands shown in Figure 13 b.After having applied silver-colored platinum conductive ink, within the predetermined time and under the predetermined temperature dry it.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is 8 minutes and predetermined temperature 100 ℃ ± 20.Baseplate material then peak value under predetermined temperature dry preset time so that silver layer 1320 to be set.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 855 ℃.
Use the silk screen printing technology that other outer field silver-colored platinum conductive ink 1327 is put on the layer 1326 desirable thickness and support are provided for soldering weld pad 1328 according to predetermined figure.Predetermined pattern can be three bands shown in Figure 13 b.After having applied silver-colored platinum conductive ink, within the predetermined time and under the predetermined temperature dry it.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value under predetermined temperature dry preset time so that silver layer 1320 to be set.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1436, soldering weld pad 1328 is formed on a part of silver-colored platinum layer 1327.In order to finish this step, silver-colored platinum conductive ink applies as layer 1328.Use the silk screen printing technology that silver-colored platinum conductive ink is put on the part of layer 1327 according to predetermined figure.Predetermined figure 1321 can be three bands as shown in figure 13.After having applied silver-colored platinum conductive ink, within the predetermined time and under the predetermined temperature dry it.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value under predetermined temperature dry preset time so that soldering weld pad 1321 to be set.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 769～941 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 855 ℃.
In step 1438, well heater one side that baseplate material 1316 rotates back into substrate puts on heater surfaces one side with the layer that other is added.
In step 1440, the first honeycomb seal layer 1322 is formed on well heater one side of substrate.In this exemplary embodiment, the first honeycomb seal layer 1322 can be made by the matrix of alumina particle and borosilicate glass.Layer 1322 uses thick film technology to print.Allow layer 1322 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value under predetermined temperature dry preset time to solidify the first honeycomb seal layer 1322.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 828～1012 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 920 ℃.
In step 1442, the second honeycomb seal layer 1323 is formed on well heater one side of baseplate material 1316.In this exemplary example, the second honeycomb seal layer 1323 can be made by the matrix of alumina particle and borosilicate glass.The second honeycomb seal layer 1323 uses thick film technology to print.Allow layer 1323 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material then peak value at predetermined roasting temperature preset time to solidify the second honeycomb seal layer 1323.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 828～1012 ℃.In this exemplary embodiment, preset time is that 35 minutes and predetermined peak temperature are 920 ℃.
In step 1444, sensor one side that baseplate material 1316 rotates back into substrate puts on sensor surface one side with the layer that other is added.
In step 1446, resistive layer is printed to be formed on above with reference to figure 4 described two resistors.In order to finish this step, the metalfilmresistor layer applies two resistors are formed on the contact conductor between contact conductor and sensor connector layer 1326 and 1327 as layer 1332.Metal film applies according to predetermined pattern as shown in figure 13.After having applied metal film, within the predetermined time and under the predetermined temperature dry it.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～120 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material peak value then solidifies preset time so that soldering weld pad 1321 to be set under predetermined temperature.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 779～951 ℃.In this exemplary embodiment, preset time is that the temperature of 35 minutes and peak value is 865 ℃.
In step 1448, first covers glaze layer 1333 is formed.In this exemplary example, overcoat 1333 can be non-porous dielectric coating (for example alumina silicate glass glaze).Layer 1333 uses thick film technology to print.Allow layer 1333 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material peak value then covers glaze layer 1333 at predetermined roasting temperature preset time to solidify first.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 500～600 ℃.In this exemplary embodiment, preset time is that 35 minutes and peak temperature are 550 ℃.
In step 1450, the resistance value of two resistors in the resistive layer 1332 is adjusted.The value of resistor is at first measured to determine resistance value with laser equipment.If the value of resistor so just uses laser trimming (laser trimming) technology that resistor is down finely tuned to predetermined value more than predetermined resistance value.
In case resistor values is within the acceptable scope, then in step 1452, forms second and cover glaze layer 1334.In this exemplary example, overcoat 1334 can be non-porous dielectric coating (for example alumina silicate glass glaze).Layer 1334 uses thick film technology to print.Allow layer 1334 dry preset time under predetermined temperature then.In certain embodiments, preset time is that 7～9 minutes and predetermined temperature are 80～100 ℃.In this exemplary embodiment, preset time is that 8 minutes and predetermined temperature are 100 ℃ ± 20.Baseplate material peak value then covers glaze layer 1334 at predetermined roasting temperature preset time to solidify second.In certain embodiments, preset time is that 31～39 minutes and predetermined temperature are 500～600 ℃.In this exemplary embodiment, preset time is 550 ℃ of 35 minutes and peak temperatures.
At this point, baseplate material can be formed within the individual sensing element.In step 1454, baseplate material is by laser scribing or cutting.In step 1456, baseplate material is cut singly embarked on journey then so that handle.In one embodiment, material is cut single one-tenth 20 row.
Catalyzer can be put on capable sensor side (step 1458) now.Catalyzer can be titania tetrachloride or ammonia (Titania Tetracloride or Ammonia).Thereby the hydrocarbon reaction in catalyzer and the waste gas stream and, the response time of improving the titania film sensors is to change oxygen concentration.In certain embodiments, catalyzer can be used as instillation solution and applies.After having applied catalyzer, catalyzer can be at room temperature dry.
After catalyzer drying, in step 1460, the row of baseplate material can be cut single individual sensing element of one-tenth or circuit then, sensing element 300 for example described above.
Below provide description about embodiments of the invention for explanation and purpose of description.This is not the form of ownership of the present invention that meant limit or the present invention is defined in disclosed precise forms.Many combinations, modification and change are possible according to above instruction.The embodiment that describes that do not have that has exchanged element still is within the scope of the present invention.Be intended to scope of the present invention and be not limited to this detailed description, but be defined in the claims that invest this.
Claims (30)
1. method of producing the oxygen sensing element said method comprising the steps of:
A. conductive layer is put on non-conductive substrate material heating device one side with the formation heating circuit,
B. first overcoat is put on described heating circuit,
C. second overcoat is put on described heating circuit,
D. solidify described conductive layer,
E. sensor one side that sensor pattern is printed on described baseplate material to be forming at least two sensor electrodes and to be connected figure,
F. titanium dioxide layer is printed on the described connection figure on the sensor ends that is positioned at described baseplate material,
G. be formed for the connection of described heating circuit,
H. print the soldering weld pad that is used for the heating circuit connection,
I. be formed for the connection of described sensor electrode and form third electrode,
J. print the soldering weld pad that described sensor connects,
K. sealing is put on described sensor electrode,
L. honeycomb seal is put on described sensor electrode,
M. honeycomb seal is put on described well heater loop,
N. form resistive layer between the described sensor electrode setting up two fixed resisters,
O. cover the glaze layer with first and put on described resistive layer,
P. adjust the resistance value of described two fixed resisters,
Q. cover the glaze layer with second and put on described resistive layer,
R. described baseplate material is carried out laser scribing,
S. described baseplate material is cut the row of single one-tenth predetermined quantity,
T. catalyzer is put on the described sensor side of described baseplate material, and
U. the described row of baseplate material is cut the individual sensor element of single one-tenth.
2. method according to claim 1, wherein for each individual sensing element, described method also comprises:
Flux is put on described soldering weld pad,
Be adjacent to described soldering bond pad arranged prefabricated film,
Dry described flux to be adhering to described prefabricated film with described flux,
Be right after described prefabricated film and place pre-assembled wiring bundle,
Described wiring bundle is brazed in described soldering weld pad so that described wiring bundle is coupled to described sensing element.
3. method according to claim 1 wherein puts on conductive layer non-conductive substrate material heating device one side and comprising with the described step (a) that forms heating circuit:
Use the silk screen printing technology to print the platinum conductive layer according to predetermined figure,
Make described platinum conductive layer drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value so that described platinum conductive layer to be set.
4. according to the described method of arbitrary claim in the above claim, the described step (b) that wherein first overcoat is put on described heating circuit comprising:
Use thick film technology to print described first overcoat,
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value so that described first overcoat to be set.
5. according to the described method of arbitrary claim in the above claim, the described step (c) that wherein second overcoat is put on described loop comprising:
Use thick film technology to print described second overcoat,
Make described second overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value so that described second overcoat to be set.
6. according to the described method of arbitrary claim in the above claim, the described step (d) of wherein solidifying described conductive layer comprises that the roasting second predetermined roasting time is to solidify described platinum conductive layer under the condition that makes described substrate be positioned at the second predetermined sintering temperature at peak value.
7. according to the described method of arbitrary claim in the above claim, wherein sensor pattern is printed on sensor one side of described baseplate material and comprises with the described step (e) that is connected figure to form at least two sensor electrodes:
Sensor pattern is printed on the described substrate with the platinum China ink according to predetermined figure,
Make described first overcoat drying second under the second predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the 3rd predetermined sintering temperature roasting the 3rd predetermined roasting time at peak value so that described sensor pattern layer to be set.
8. according to the described method of arbitrary claim in the above claim, the described step (f) that wherein titanium dioxide layer is printed on the described connection figure on the sensor ends that is positioned described baseplate material comprising:
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the 4th predetermined sintering temperature roasting the 4th predetermined roasting time at peak value so that described titanium dioxide layer to be set.
9. according to the described method of arbitrary claim in the above claim, the described step (g) that wherein is formed for the connection of described heating circuit comprising:
Silver-colored articulamentum is printed on the part of described baseplate material and described conductive layer according to predetermined figure,
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value to solidify described silver-colored articulamentum.
10. according to the described method of arbitrary claim in the above claim, the described step (h) of wherein printing the soldering weld pad that is used for described heating circuit connection comprising:
Use silver-colored platinum conductive ink that described soldering weld pad is printed on the described silver-colored articulamentum according to predetermined figure,
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value to solidify described silver-colored articulamentum.
11., wherein be formed for the sensor connection of described sensing electrode and the described step (i) of formation third electrode and comprise according to the described method of arbitrary claim in the above claim:
According to predetermined figure the first silver medal articulamentum is printed on the part of described baseplate material and described conductive layer,
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value solidifying described silver-colored articulamentum,
According to predetermined figure the second silver medal articulamentum is printed on the described first silver medal articulamentum,
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time, and
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value to solidify described silver-colored articulamentum.
12. according to the described method of arbitrary claim in the above claim, the described step (j) of wherein printing the soldering weld pad that is used for described sensor connection comprising:
Use silver-colored platinum conductive ink that described soldering weld pad is printed on the described silver-colored articulamentum according to predetermined figure,
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value to solidify described silver-colored articulamentum.
13. according to the described method of arbitrary claim in the above claim, the described step (k) that wherein sealing is put on described sensor electrode comprising:
According to predetermined figure sealant is printed on the described contact conductor layer,
Make described first overcoat drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value to solidify described silver-colored articulamentum.
14. according to the described method of arbitrary claim in the above claim, the described step (l) that wherein honeycomb seal is put on described sensor electrode comprising:
Be printed on the described contact conductor layer according to the first honeycomb seal layer of predetermined figure alumina particle and borosilicate glass,
Make described first honeycomb seal layer drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material peak value under the condition of the first predetermined sintering temperature roasting first predetermined roasting time solidifying the described first honeycomb seal layer,
Be printed on the described first honeycomb seal layer according to the second honeycomb seal layer of predetermined figure alumina particle and borosilicate glass,
Make described second honeycomb seal layer drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value to solidify the described second honeycomb seal layer.
15. according to the described method of arbitrary claim in the above claim, the described step (m) that wherein honeycomb seal is put on described well heater loop comprising:
Be printed on the described heating circuit layer according to the first honeycomb seal layer of predetermined figure alumina particle and borosilicate glass,
Make described first honeycomb seal layer drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value solidifying the described first honeycomb seal layer,
Be printed on the described first honeycomb seal layer according to the second honeycomb seal layer of predetermined figure alumina particle and borosilicate glass,
Make described second honeycomb seal layer drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the first predetermined sintering temperature roasting first predetermined roasting time at peak value to solidify the described second honeycomb seal layer.
16. according to the described method of arbitrary claim in the above claim, the resistive layer that wherein forms between the described sensor electrode comprising with the described step (n) of setting up two fixed resisters:
According to predetermined figure the metallic resistance layer is printed on and goes up between the described electrode layer forming two resistors,
Make described resistive layer drying first under the first predetermined baking temperature be scheduled to drying time,
Make described baseplate material be positioned under the condition of the 5th predetermined sintering temperature roasting the 5th predetermined roasting time at peak value to solidify described resistive layer.
17., wherein form the first described step (o) of covering the glaze layer and comprising according to the described method of arbitrary claim in the above claim:
Cover the glaze layer according to predetermined figure with first and be printed on the described heating circuit layer,
Make described first to cover glaze layer dry first predetermined drying time under the first predetermined baking temperature,
Make described baseplate material be positioned under the condition of the 6th predetermined sintering temperature roasting the 6th predetermined roasting time at peak value and cover the glaze layer to solidify described first.
18. according to the described method of arbitrary claim in the above claim, the described step (p) of wherein adjusting the described resistance value of described resistor comprising:
Value by checking resistor with the resistance value of laser equipment measurement resistor and
If need then use laser trimming technology that resistor is finely tuned to predetermined value.
19., wherein form the second described step (q) of covering the glaze layer and comprising according to the described method of arbitrary claim in the above claim:
Cover the glaze layer according to predetermined figure with second and be printed on described first and cover on the glaze layer,
Make described second to cover glaze layer dry first predetermined drying time under the first predetermined baking temperature, and
Make described baseplate material be positioned under the condition of the 6th predetermined sintering temperature roasting the 6th predetermined roasting time at peak value and cover the glaze layer to solidify described second.
20., also comprise making described baseplate material forward described sensor one side to continue to apply the material layer that adds in addition from described well heater one rollover according to the described method of arbitrary claim in the above claim.
21., also comprise making described baseplate material forward described well heater one side to continue to apply the material layer that adds in addition from described sensor one rollover according to the described method of arbitrary claim in the above claim.
22. according to the described method of arbitrary claim in the above claim, be that 6～9 minutes and the described first predetermined baking temperature are 80～120 ℃ the wherein said first predetermined drying time.
23. according to the described method of arbitrary claim in the above claim, be that 2.5～4.5 minutes and the described second predetermined baking temperature are 80～120 ℃ the wherein said second predetermined drying time.
24. according to the described method of arbitrary claim in the above claim, the wherein said first predetermined roasting time is that 30～40 minutes and the described first predetermined sintering temperature are 835～875 ℃.
25. according to the described method of arbitrary claim in the above claim, the wherein said second predetermined roasting time is that 61～75 minutes and the described second predetermined sintering temperature are 1284～1568 ℃.
26. according to the described method of arbitrary claim in the above claim, the wherein said the 3rd predetermined roasting time is that 51～63 hours and the described the 3rd predetermined sintering temperature are 1125～1375 ℃.
27. according to the described method of arbitrary claim in the above claim, the wherein said the 4th predetermined roasting time is that 47～57 hours and the described the 4th predetermined sintering temperature are 990～1210 ℃.
28. according to the described method of arbitrary claim in the above claim, the wherein said the 5th predetermined roasting time is that 31～39 minutes and the described the 5th predetermined sintering temperature are 779～951 ℃.
29. according to the described method of arbitrary claim in the above claim, the wherein said the 6th predetermined roasting time is that 31～39 minutes and the described the 6th predetermined sintering temperature are 500～600 ℃.
30., also comprise the described flux of removing contiguous described soldering weld pad according to the described method of arbitrary claim in the above claim.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35933010P | 2010-06-28 | 2010-06-28 | |
| US61/359,330 | 2010-06-28 |
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| CN102297880A true CN102297880A (en) | 2011-12-28 |
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|---|---|---|---|
| CN2010105394533A Pending CN102297880A (en) | 2010-06-28 | 2010-11-10 | Apparatus and method of producing heating oxygen sensor |
| CN2010206012423U Expired - Lifetime CN202041489U (en) | 2010-06-28 | 2010-11-10 | Oxygen sensor |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010206012423U Expired - Lifetime CN202041489U (en) | 2010-06-28 | 2010-11-10 | Oxygen sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106990137A (en) * | 2017-03-13 | 2017-07-28 | 英吉森安全消防系统（上海）有限公司 | A kind of novel pyrolytic particle sensor |
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| 郭明光: ""钛酸锶厚膜氧传感器的制备和性能研究"", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
| 黄海琴: ""片式氧传感器微观结构表征和性能研究"", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106990137A (en) * | 2017-03-13 | 2017-07-28 | 英吉森安全消防系统（上海）有限公司 | A kind of novel pyrolytic particle sensor |
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Application publication date: 20111228 |