CN102297737B - 压力传感器空腔结构及其制作方法 - Google Patents
压力传感器空腔结构及其制作方法 Download PDFInfo
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- CN102297737B CN102297737B CN 201010208751 CN201010208751A CN102297737B CN 102297737 B CN102297737 B CN 102297737B CN 201010208751 CN201010208751 CN 201010208751 CN 201010208751 A CN201010208751 A CN 201010208751A CN 102297737 B CN102297737 B CN 102297737B
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CN 201010208751 CN102297737B (zh) | 2010-06-24 | 2010-06-24 | 压力传感器空腔结构及其制作方法 |
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CN 201010208751 CN102297737B (zh) | 2010-06-24 | 2010-06-24 | 压力传感器空腔结构及其制作方法 |
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CN102297737A CN102297737A (zh) | 2011-12-28 |
CN102297737B true CN102297737B (zh) | 2013-06-12 |
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CN 201010208751 Active CN102297737B (zh) | 2010-06-24 | 2010-06-24 | 压力传感器空腔结构及其制作方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102338681B (zh) * | 2010-07-29 | 2013-03-13 | 上海华虹Nec电子有限公司 | 平面型硅压力传感器及其制造方法 |
CN110054145B (zh) * | 2019-04-11 | 2022-08-16 | 无锡韦感半导体有限公司 | Mems器件及其制造方法 |
CN111024007B (zh) * | 2019-12-24 | 2022-01-25 | 浙江清华柔性电子技术研究院 | 触觉传感器及机械手 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1058298A (zh) * | 1990-07-19 | 1992-01-29 | 涂相征 | 一种硅膜电容压力传感器及其制造方法 |
CN1487275A (zh) * | 2003-06-25 | 2004-04-07 | 哈尔滨工业大学 | 相变式自检测压力传感器及其制作方法 |
JP3629185B2 (ja) * | 2000-06-15 | 2005-03-16 | 株式会社日立製作所 | 半導体センサ及びその製造方法 |
CN201297972Y (zh) * | 2008-11-24 | 2009-08-26 | 河南理工大学 | 压力传感器 |
CN101551284A (zh) * | 2009-04-22 | 2009-10-07 | 江苏英特神斯科技有限公司 | 基于硅硅直接键合的压力传感器及其制造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1140820A (ja) * | 1997-07-18 | 1999-02-12 | Denso Corp | 半導体力学量センサの製造方法 |
US20080160659A1 (en) * | 2006-12-29 | 2008-07-03 | Russell William Craddock | Pressure transducer diaphragm and method of making same |
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2010
- 2010-06-24 CN CN 201010208751 patent/CN102297737B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1058298A (zh) * | 1990-07-19 | 1992-01-29 | 涂相征 | 一种硅膜电容压力传感器及其制造方法 |
JP3629185B2 (ja) * | 2000-06-15 | 2005-03-16 | 株式会社日立製作所 | 半導体センサ及びその製造方法 |
CN1487275A (zh) * | 2003-06-25 | 2004-04-07 | 哈尔滨工业大学 | 相变式自检测压力传感器及其制作方法 |
CN201297972Y (zh) * | 2008-11-24 | 2009-08-26 | 河南理工大学 | 压力传感器 |
CN101551284A (zh) * | 2009-04-22 | 2009-10-07 | 江苏英特神斯科技有限公司 | 基于硅硅直接键合的压力传感器及其制造方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131216 |
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Effective date of registration: 20131216 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |