CN102285130B - Manufacturing process for conductive carrying belt of electronic element - Google Patents
Manufacturing process for conductive carrying belt of electronic element Download PDFInfo
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- CN102285130B CN102285130B CN201110120358.4A CN201110120358A CN102285130B CN 102285130 B CN102285130 B CN 102285130B CN 201110120358 A CN201110120358 A CN 201110120358A CN 102285130 B CN102285130 B CN 102285130B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 48
- 239000012530 fluid Substances 0.000 claims abstract description 46
- 229920000642 polymer Polymers 0.000 claims abstract description 21
- 239000002994 raw material Substances 0.000 claims abstract description 19
- 238000009966 trimming Methods 0.000 claims abstract description 6
- 238000004080 punching Methods 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 27
- 239000004793 Polystyrene Substances 0.000 claims description 14
- 229920002223 polystyrene Polymers 0.000 claims description 14
- 239000012528 membrane Substances 0.000 claims description 8
- 239000000498 cooling water Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 30
- 230000008569 process Effects 0.000 abstract description 12
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 2
- 239000013067 intermediate product Substances 0.000 abstract 2
- 239000006229 carbon black Substances 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 229920001447 polyvinyl benzene Polymers 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 238000012856 packing Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 238000005253 cladding Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/02—Combined thermoforming and manufacture of the preform
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0011—Combinations of extrusion moulding with other shaping operations combined with compression moulding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0017—Combinations of extrusion moulding with other shaping operations combined with blow-moulding or thermoforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/08—Deep drawing or matched-mould forming, i.e. using mechanical means only
- B29C51/082—Deep drawing or matched-mould forming, i.e. using mechanical means only by shaping between complementary mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
The invention relates to a manufacturing process for a carrying belt of an electronic element. A manufacturing process for a conductive carrying belt of the electronic element comprises the following steps in turn: (1) making a polymer raw material into a film fluid and adopting a convex-concave mould to process the film fluid into a carrying belt intermediate product with a pocket, wherein the polymer raw material is the mixture of 70-90% of general polyvinyl benzene and 10-30% of graphitized carbon black by mass percent; and the temperature for processing the film fluid with the convex-concave mould is controlled within a temperature range of 210 DEG C to 230 DEG C, and (2) punching and trimming the carrying belt intermediate product, thereby acquiring an end product of the conductive carrying belt of the electronic element. The manufacturing process for the conductive carrying belt of the electronic element has the advantages that the energy consumption of production is low, the length and the thickness both can be adjusted randomly, the production efficiency and the product quality are high, the conductivity is excellent, especially, the tensile strength is high, and the use temperature and the heat deformation temperature are greatly promoted.
Description
Technical field
The present invention relates to a kind of manufacture craft of electronic component bearing band, especially a kind of manufacture craft of conductive carrying belt of electronic element.
Background technology
In whole electronic product industrial chain, the production of packing electronic component transportation carrying belt occupies an extremely important ring.Packing electronic component transportation carrying belt, not only for semiconductor integrated circuit electronic devices and components provide the medium that loads and transport, be the more important thing is the requisite important materials of surface mount by realizing follow-up high speed, automation.Be accompanied by invention and the development of surface mounting technology, the packing forms of semiconductor integrated circuit changes to surface-adhered type from traditional pins type gradually, and semiconductor electronic component carrying belt also arises at the historic moment thereupon, and become gradually a ring of crucial importance that connects upstream and downstream industrial chain.Along with the development of semiconductor integrated circuit manufacturing technology, semiconductor electronic component changes to high integration and miniaturization gradually, and surface mounting technology also more and more requires high-speed and pinpoint accuracy.These have all proposed requirements at the higher level to the production technology of carrying belt.High efficiency, the trend that integrated, high accuracy becomes the development of carrying belt production technology gradually.At present, packing electronic component transportation carrying belt production technology is mainly take traditional two-part Batch Process technology as main.The polymer sheet that polymer raw materials is prepared into certain thickness, width and length is first paragraph technique, polymer raw materials is mainly granules of polystyrene, polymer sheet is rolled into plate-like, and the conventional length of monovolume polymer sheet is 480 meters, and monovolume polymer sheet is the longest is at present 1000 meters.Owing to being subject to the restrictions such as quality control, transportation, packing, the supply of polymer sheet is mainly controlled by the U.S., Europe and Japanese supplier, because the length of monovolume sheet material is fixed, in follow-up production process, once there is quality flaw, entire volume sheet material will be scrapped completely.Second segment technique is sheet material to be carried out to uncoiling, heating, plastic uptake make carrier band pocket, cooling, punching, trimming, coiling, packing, finally makes carrying belt finished product, and existing production equipment mostly is step plastic suction forming apparatus.Prior art, as CN201020244183.9, discloses a kind of roller-type carrier tape forming machine with cam structure, utilizes three unique cams of same driven by motor to realize the action of three different directions, has guaranteed the coordinative coherence of motion; CN200520026049.0 discloses a kind of carrier tape forming machine, main adopt by main shaft, connected be provided with absolute value rotary encoder and Programmable Logic Controller carries out production control; CN02294901.1, discloses a kind of electronic element packaging transport bearing belt forming machine, comprises feed mechanism, shaping mechanism, trimming mechanism, punch mechanism, receiving mechanism; CN200480015023.4, a kind of embossed carrier tape manufacturing installation is disclosed, have with other process equipments and combine, make other technical process, as moulding, filler, with packing bearing belt can be in a comprehensive technical process feature: CN200410038366.4 in sequence, disclose a kind of carrier band forming method and device thereof, shaping mould comprises the first die holder and the second die holder, has two shaping moulds; Above-mentioned technology is mainly to improve for the equipment in the second segment technique of two stage process.Conventional production efficiency is 250 meters of products per hour.Prior art, as CN200320128985.3, discloses a kind of dark type cell carried belt forming mould, comprises upper die and lower die; It can produce sidewall wall thickness uniformly dark type cell carried belt product relative to bottom thickness.CN200520113816.1, discloses a kind of difficulty of processing and has greatly reduced, and production flexibility is large, for a separate type briquetting roller mould going out on multiple carrier band forming machine.Above-mentioned technology is mainly to have made improvement for mould, what adopt is also the second segment of the production technology of two-part, the sheet material heating liking part of processing, by the part that needs moulding carrier band pocket is heated, in formed product process, drawing and forming is carried out in thermoplastic part.The wall thickness of carrier band pocket will be far smaller than the original thickness of sheet material due to stretched, reduce the intensity of moulding carrier band pocket.Prior art is as US 7771187, US20040253333, and WO/2004/089760, US20090133367, US 20020100257, US7320772 discloses the certain methods of improving former.US5800772 discloses improvement moulding process.JP06286763, JP2001163354, JP10272684 discloses the certain methods of improving moulding carrier band pocket shape.Prior art is carried out improved method as US5992639 discloses for carrier band pocket intensity, carries out the enhancing of carrier band pocket bottom by injection molding mode, and this technical matters is loaded down with trivial details, injection moulding carrier band pocket production efficiency is low.Above-mentioned domestic and international published patent relates generally to carrier band pocket former to second segment in two-period form technique, carrier band pocket moulding process etc. and improves.
The making of existing electronic component bearing band all adopts two-period form technique, polymer raw materials need to be prepared into sheet material, and general forming temperature is between 110 ℃～300 ℃; By high temperature, cladding is heated in air-heater more than 300 ℃ again, make cladding fully softening close to flowable state, carry out again processing and forming, owing to using Hot-blast Heating environment in this technique, be open, and for batch (-type) processing heat dissipates fast, therefore in heating cladding process, need higher temperature, and after cooling forming, again heat making carrier band pocket at electronic component bearing band, the product quality making is low, specifically precision is low, shrink rate variance, tensile strength is poor, and use and heat distortion temperature are low.
In sum, existing electronic component bearing band all adopts two-period form production technology, carrier band pocket in the corresponding second segment technique of carrier band pocket former is made, all adopt step device fabrication, in order to prevent thermoplastic material cooled sclerosis, need step stopping, after one section of production is over, regeneration is given birth to one section, at present also not with forming machine integrated, that the electronic component bearing band with carrier band pocket is produced in serialization.Existing two-period form carrying belt manufacturing process exists production cost high, the low problem of product quality making.
Summary of the invention
The making the object of the invention is in order to solve existing electronic component bearing band all adopts two-period form technique, production cost is high, the problem that product quality is low, a kind of tensile strength integrated, that serialization is produced is disclosed good, the manufacture craft of the conductive carrying belt of electronic element with carrying belt pocket that use and heat distortion temperature are high.
In order to realize above-mentioned goal of the invention, the present invention has adopted following technical scheme:
A kind of manufacture craft of conductive carrying belt of electronic element, comprise the steps: that successively (1) make film fluid by polymer raw materials, by convex concave mould, film fluid is processed into the middle product of carrying belt with pocket, described polymer raw materials is the mixture of general polystyrene and conductive black, in mass ratio, general polystyrene 70%-90%, conductive black 10%-30%; Convex concave mould is controlled between 210 ℃～230 ℃ the temperature of processing film; (2) product in the middle of carrying belt are carried out to punching and trimming, obtain conductive carrying belt of electronic element finished product.
As preferably, by extruder, polymer raw materials is made to film fluid, convex concave mould move in the same way with extruder membrane direction and translational speed identical with extruder membrane speed, convex concave mould is clamped film fluid and is processed into product in the middle of carrying belt with pocket.When mobile, convex concave mould is relative with film fluid static, guarantees the accuracy of moulding carrying belt pocket.
As preferably, cooling-water duct and inflatable mouth are set respectively on convex concave mould; When convex concave mould is clamped film fluid, air-breathing by inflatable mouth, be clipped in Film Flow body on convex concave mould and form carrying belt pocket, convex concave mould and on film fluid synchronizedly in the same way to cooling-water duct water filling, lower the temperature when mobile; When convex concave mould unclamps film, by inflatable mouth, blow, product and convex concave mould in the middle of molded pocket good carrying belt are departed from.
Further, convex concave mould comprises that punch, punch transverse moving mechanism, punch vertically move platform, punch base, die, die transverse moving mechanism, die and vertically move platform and die base, the shape correspondence of punch and die, punch and die position are corresponding with extruder film outlet port; Punch vertically moves platform and is arranged on punch base, and punch vertically moves platform and move up and down along punch base, and punch is arranged on punch by punch transverse moving mechanism and vertically moves on platform; Die vertically moves platform and is arranged on die base, and die vertically moves platform and move up and down along die base, and die is arranged on die by die transverse moving mechanism and vertically moves on platform; Between the protrusion die head of punch and the recess of die, leave gap, punch vertically moves platform and die vertically moves the speed that vertically moves of platform and the film extruded velocity of extruder film outlet port is corresponding; Inflatable mouth on described punch is towards the protrusion die head of punch, and the inflatable mouth on die is towards the recess of die; Between protrusion die head by punch and the recess of die, the size in gap can be controlled the wall thickness of carrying belt carrier band pocket.
Further, under extruder film outlet port, and there is spacing between punch and die and extruder film outlet port in the position of punch and die.Extruder film outlet port extrusion film fluid, punch and die carry out pocket making to film fluid between the two, film fluid simultaneously, punch and die be synchronized moving down simultaneously, after carrying belt pocket completes, punch and die move up to originally fast in extruder film outlet port and protruding, film fluid between die carries out pocket making, be that spacing between punch and die and extruder film outlet port is for integrated, the time that provides is provided in serialization, the concrete distance of spacing can be by the length of punch and die, and film fluid, the difference of the factors such as the flow velocity of punch and die and adjusting.
Further, described punch transverse moving mechanism and die transverse moving mechanism are all cylinders.
Further, described punch vertically moves platform and moves up and down by the guide rail being arranged on punch base, and die vertically moves platform and moves up and down by the guide rail being arranged on die base.
Further, described punch vertically moves platform and moves up and down by the screw rod being arranged on punch base, and die vertically moves platform and moves up and down by the screw rod being arranged on die base.
Further, protrusion die head on described punch is the multiple of longitudinal arrangement, and on each protrusion die head, inflatable mouth is all set, the recess on described die is the multiple of longitudinal arrangement, the protrusion die head quantity on punch and arrangement position are corresponding with the recess coupling on die.
Adopted the manufacture craft of a kind of conductive carrying belt of electronic element of technique scheme, by convex concave mould, directly film fluid is processed into the middle product of carrying belt with pocket, add the temperature of Film Flow body in man-hour between 210 ℃～230 ℃, can high efficiency, the production conductive carrying belt of electronic element of integrated, serialization, the film fluid in said temperature interval is processed to the product tensile strength performance making best, use and heat distortion temperature are high, and electric conductivity is good; Relative 110 ℃ above 210 ℃ product tensile strength performance boosts 50% that following temperature is produced, are used and heat distortion temperature improves 10%, and electric conductivity promotes 10%; Relative 230 ℃ above 270 ℃ product tensile strength performance boosts 40% that following temperature is produced, energy consumption at least reduces by 30%, and electric conductivity is better.Compared with the electronic component bearing band of producing with traditional two-period form technique, intermittent apparatus, the advantage of the manufacture craft of this conductive carrying belt of electronic element is that energy consumption is low, length, thickness can be adjusted arbitrarily, production efficiency and product quality are high, conduct electricity very well, especially tensile strength is high, and use and heat distortion temperature improve greatly.
The specific embodiment
Below the present invention is described further.
Embodiment 1
A kind of manufacture craft of conductive carrying belt of electronic element, comprise the steps: that successively (1) make film fluid by polymer raw materials, by convex concave mould, film fluid is processed into the middle product of carrying belt with pocket, described polymer raw materials is the mixture of general polystyrene and conductive black, in mass ratio, general polystyrene 70%, conductive black 30%; Convex concave mould is controlled at 215 ℃ of left and right to the temperature of processing film; (2) product in the middle of carrying belt are carried out to punching and trimming, obtain conductive carrying belt of electronic element finished product.
Above-mentioned steps is made film fluid by extruder by polymer raw materials in (1), convex concave mould move in the same way with extruder membrane direction and translational speed identical with extruder membrane speed, convex concave mould is clamped film fluid and is processed into product in the middle of carrying belt with pocket.When mobile, convex concave mould is relative with film fluid static, guarantees the accuracy of moulding carrying belt pocket.Cooling-water duct and inflatable mouth are set respectively on convex concave mould, when convex concave mould is clamped film fluid, air-breathing by inflatable mouth, the Film Flow body being clipped on convex concave mould forms carrying belt pocket, convex concave mould and on film fluid synchronizedly in the same way to cooling-water duct water filling, lower the temperature when mobile, by water filling, lower the temperature the temperature of convex concave mould is down between 40 ℃-120 ℃, prevent that convex concave mould is in the overheated phenomenon of lower generation that works long hours, and then cause sizing, the problems such as the demoulding has some setbacks, also accelerated the cooling of moulding pocket, sizing speed, improved production efficiency, all moulding pockets carry out machine-shaping and have also guaranteed the quality stability of product under a stationary temperature, when convex concave mould unclamps film, by inflatable mouth, blow, product and convex concave mould in the middle of molded pocket good carrying belt are departed from.
Convex concave mould comprises that punch, punch transverse moving mechanism, punch vertically move platform, punch base, die, die transverse moving mechanism, die and vertically move platform and die base, the shape correspondence of punch and die, punch and die position are corresponding with extruder film outlet port; Punch vertically moves platform and is arranged on punch base, and punch vertically moves platform and move up and down along punch base, and punch is arranged on punch by punch transverse moving mechanism and vertically moves on platform; Die vertically moves platform and is arranged on die base, and die vertically moves platform and move up and down along die base, and die is arranged on die by die transverse moving mechanism and vertically moves on platform; Between the protrusion die head of punch and the recess of die, leave gap, by the size in gap, can control the wall thickness of carrying belt carrier band pocket.Punch vertically moves platform and die vertically moves the speed that vertically moves of platform and the film extruded velocity of extruder film outlet port is corresponding; Inflatable mouth on described punch is towards the protrusion die head of punch, and the inflatable mouth on die is towards the recess of die.
Under extruder film outlet port, and there is spacing between punch and die and extruder film outlet port in the position of punch and die.Extruder film outlet port extrusion film fluid, punch and die carry out pocket making to film fluid between the two, film fluid simultaneously, punch and die be synchronized moving down simultaneously, after carrying belt pocket completes, punch and die move up to originally fast in extruder film outlet port and protruding, film fluid between die carries out pocket making, be that spacing between punch and die and extruder film outlet port is for integrated, the time that provides is provided in serialization, the concrete distance of spacing can be by the length of punch and die, and film fluid, the difference of the factors such as the flow velocity of punch and die and adjusting.
Inflatable mouth mainly contains two effects, and one is when film fluid is clipped in the gap location between protrusion die head and the recess of die of punch, air-breathing by insufflation channel, is convenient to the moulding fast of carrying belt pocket; Another is blown by inflatable mouth after being the moulding of carrying belt pocket, can be easily and fast that carrying belt is separation with die with punch.Above-mentioned punch transverse moving mechanism and die transverse moving mechanism are all cylinders, and punch vertically moves platform and moves up and down by the guide rail being arranged on punch base, and die vertically moves platform and moves up and down by the guide rail being arranged on die base.Protrusion die head on punch is the multiple of longitudinal arrangement, and on each protrusion die head, inflatable mouth is all set, and the recess on described die is the multiple of longitudinal arrangement, and the protrusion die head quantity on punch and arrangement position are corresponding with the recess coupling on die.Above-mentioned punch vertically move the move mode of platform on punch base and die vertically move the move mode of platform on die base can be various, for example also can realize and moving up and down by screw rod, or by gear drive, the alternate manner such as pneumatic.
Use procedure is as follows: in the time of between film fluid process punch and die, punch transverse moving mechanism and the action of die transverse moving mechanism, controlling respectively punch and die moves and realizes punch and die is connected, film fluid is clipped between punch and die, is wherein clipped in the gap location between protrusion die head and the recess of die of punch; Then air-breathing to the inflatable mouth on punch and die, under the common getter action of the inflatable mouth of the recess towards die on inflatable mouth and the die at the protrusion die head place towards punch on punch, the Film Flow body that is clipped in the gap location between protrusion die head and the recess of die of punch forms carrying belt pocket, and by the size in gap, can control the wall thickness of carrying belt carrier band pocket; Punch and die vertically move platform and die by punch respectively and vertically move platform control and move down, the translational speed of punch and die is identical, and the translational speed of punch and die is identical with extruder membrane speed, punch, die are relative with membrane fluid film static, guarantee the accuracy of moulding carrying belt pocket; In punch and die moving process, by cooling-water duct water filling, punch and die are carried out to cooling down, make carrying belt moulding fast; After carrying belt moulding, punch transverse moving mechanism and the action of die transverse moving mechanism, control respectively punch and die separately, the inflatable mouth on punch and die is blown simultaneously, molded good carrier band pocket is deviate from from the protrusion die head of punch and the recess of die; Punch and die vertically move platform and die by punch respectively and vertically move the platform control reset that moves up fast, repeat above-mentioned action.
The products such as PG-22, PG-33 that above-mentioned general polystyrene can Shi Qimei company be produced, PG-383, PG-383M, or the product such as the DOW Chemical 666H, 158K, the 165H that Yang Zi BASF AG produces that produce; Conductive black 10%-30%, conductive black can be the products such as Cabot Co.,Ltd VXC72R, the VXC72, the BP2000 that produce, or the PRINTEX XE2-B that produces of goldschmidt chemical corporation, PRINTEX L6, the products such as HIBLAXK 40B2.By above-mentioned convex concave mould, once can make 25 pockets of moulding, the distance of each pocket center line and adjacent pocket center line is 8mm, and the total length of punch and die is 200mm, and the spacing between convex concave mould and extruder film outlet port is 2mm.Film fluid is the flow-like film of high temperature, high fluidity, and the flowing velocity of film fluid is 15 ms/min, and it is consistent with liquid film flow speed that convex concave mould moves down speed.The THICKNESS CONTROL of film fluid is between 0.1mm-0.5mm, and the thickness of final finished is accurately controlled by the gap between punch and die, and the width of electronic component bearing band is 8mm.
Embodiment 2
A kind of manufacture craft of conductive carrying belt of electronic element, processing step is identical with embodiment 1 completely, difference is that in polymer raw materials, general polystyrene is different with conductive black usage ratio, in mass ratio, general polystyrene 80%, conductive black 20%, convex concave mould is controlled at 220 ℃ of left and right to the temperature of processing film.The flowing velocity of film fluid is 18 ms/min, and it is consistent with liquid film flow speed that convex concave mould moves down speed.
Embodiment 3
A kind of manufacture craft of conductive carrying belt of electronic element, processing step is identical with embodiment 1 completely, unique difference is that in polymer raw materials, general polystyrene is different with conductive black usage ratio, in mass ratio, general polystyrene 90%, conductive black 10%, convex concave mould is controlled at 225 ℃ of left and right to the temperature of processing film.The flowing velocity of film fluid is 22 ms/min, and it is consistent with liquid film flow speed that convex concave mould moves down speed.
Following table is the Data Comparison of 3 embodiment of traditional product and this patent.
Above-mentioned 3 embodiment are only preferably embodiment of the present invention, the present invention produces electronic component bearing band with respect to traditional two-period form technique, intermittent apparatus, this technique can be integrated, the production conductive carrying belt of electronic element of serialization, so production temperature significantly reduces with respect to the production temperature of existing second segment technique, Energy Intensity Reduction more than 50%, the product that the hot strength of product is produced than traditional handicraft simultaneously has at least improved 60%, more durable.
Following table is the Data Comparison under the different processing temperatures of film fluid.
As seen from the above table, add the temperature of Film Flow body in man-hour between 215 ℃～225 ℃, the product tensile strength performance that processing makes is best, and use and heat distortion temperature are the highest, electric conductivity the best.
The temperature that the middle product of carrying belt with pocket add Film Flow body in man-hour is under normal circumstances controlled between 110 ℃～270 ℃ all can; temperature is lower than 110 ℃; raw-material granules of polystyrene cannot fully plastify; and raw-material granules of polystyrene fully plasticizing can cause process equipment torque force overload, equipment can autostop.Temperature is during higher than 270 ℃, and plastic grain cannot continuous film forming, easily causes carrying belt fracture, just cannot produce continuously the step shutdown of needs.The raw material of above-mentioned formula rate are added to the temperature of Film Flow body in man-hour between 210 ℃～230 ℃, the product tensile strength performance making is best, use and heat distortion temperature are the highest, electric conductivity the best, the product tensile strength performance of producing with respect to 110 ℃ of above 210 ℃ of following temperature approximately promotes 50%, use and heat distortion temperature improves approximately 10%, electric conductivity promotes about 10%; The relative 230 ℃ approximately liftings 40% of product tensile strength performance that above 270 ℃ following temperature are produced, energy consumption at least reduces by 30%, and electric conductivity is better.
Claims (7)
1. the manufacture craft of a conductive carrying belt of electronic element, it is characterized in that comprising the steps: successively that (1) make film fluid by polymer raw materials, by convex concave mould, film fluid is processed into the middle product of carrying belt with pocket, described polymer raw materials is the mixture of general polystyrene and conductive black, in mass ratio, general polystyrene 70%-90%, conductive black 10%-30%; Convex concave mould is controlled between 210 ℃～230 ℃ the temperature of film fluid processing; (2) product in the middle of carrying belt are carried out to punching and trimming, obtain conductive carrying belt of electronic element finished product; Described step (1) is, by extruder, polymer raw materials is made to film fluid, convex concave mould move in the same way with extruder membrane direction and translational speed identical with extruder membrane speed, convex concave mould is clamped film fluid and is processed into product in the middle of carrying belt with pocket; Cooling-water duct and inflatable mouth are set respectively on described convex concave mould; When convex concave mould is clamped film fluid, air-breathing by inflatable mouth, the Film Flow body being clipped on convex concave mould forms carrying belt pocket, convex concave mould and on film fluid synchronizedly in the same way to cooling-water duct water filling, lower the temperature when mobile, by water filling, lower the temperature the temperature of convex concave mould be down between 40 ℃-120 ℃; When convex concave mould unclamps film, by inflatable mouth, blow, product and convex concave mould in the middle of molded pocket good carrying belt are departed from.
2. the manufacture craft of a kind of conductive carrying belt of electronic element according to claim 1, it is characterized in that convex concave mould comprises that punch, punch transverse moving mechanism, punch vertically move platform, punch base, die, die transverse moving mechanism, die and vertically move platform and die base, the shape correspondence of punch and die, punch and die position are corresponding with extruder film outlet port; Punch vertically moves platform and is arranged on punch base, and punch vertically moves platform and move up and down along punch base, and punch is arranged on punch by punch transverse moving mechanism and vertically moves on platform; Die vertically moves platform and is arranged on die base, and die vertically moves platform and move up and down along die base, and die is arranged on die by die transverse moving mechanism and vertically moves on platform; Between the protrusion die head of punch and the recess of die, leave gap, punch vertically moves platform and die vertically moves the speed that vertically moves of platform and the film extruded velocity of extruder film outlet port is corresponding; Inflatable mouth on described punch is towards the protrusion die head of punch, and the inflatable mouth on die is towards the recess of die.
3. the manufacture craft of a kind of conductive carrying belt of electronic element according to claim 2, is characterized in that the position of punch and die is under extruder film outlet port, and has spacing between punch and die and extruder film outlet port.
4. the manufacture craft of a kind of conductive carrying belt of electronic element according to claim 2, is characterized in that described punch transverse moving mechanism and die transverse moving mechanism are all cylinders.
5. the manufacture craft of a kind of conductive carrying belt of electronic element according to claim 2, it is characterized in that described punch vertically moves platform and moves up and down by the guide rail being arranged on punch base, die vertically moves platform and moves up and down by the guide rail being arranged on die base.
6. the manufacture craft of a kind of conductive carrying belt of electronic element according to claim 2, it is characterized in that described punch vertically moves platform and moves up and down by the screw rod being arranged on punch base, die vertically moves platform and moves up and down by the screw rod being arranged on die base.
7. the manufacture craft of a kind of conductive carrying belt of electronic element according to claim 2, it is characterized in that the protrusion die head on described punch is multiple protrusion die heads of longitudinal arrangement, and on each protrusion die head, inflatable mouth is all set, recess on described die is multiple recesses of longitudinal arrangement, and the protrusion die head quantity on punch and arrangement position are corresponding with the recess coupling on die.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110120358.4A CN102285130B (en) | 2011-05-10 | 2011-05-10 | Manufacturing process for conductive carrying belt of electronic element |
| PCT/CN2012/072200 WO2012152114A1 (en) | 2011-05-10 | 2012-03-12 | Manufacturing process for conductive carrying belt of electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110120358.4A CN102285130B (en) | 2011-05-10 | 2011-05-10 | Manufacturing process for conductive carrying belt of electronic element |
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| CN102285130A CN102285130A (en) | 2011-12-21 |
| CN102285130B true CN102285130B (en) | 2014-05-07 |
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| CN201110120358.4A Active CN102285130B (en) | 2011-05-10 | 2011-05-10 | Manufacturing process for conductive carrying belt of electronic element |
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| WO (1) | WO2012152114A1 (en) |
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| CN102285130B (en) * | 2011-05-10 | 2014-05-07 | 浙江洁美电子科技股份有限公司 | Manufacturing process for conductive carrying belt of electronic element |
| CN106113150A (en) * | 2016-07-06 | 2016-11-16 | 成都格虹电子科技有限责任公司 | A kind of carrier band moulding technique |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1317119C (en) * | 2005-05-23 | 2007-05-23 | 陕西和平科技实业股份有限公司 | Method for producing ultrathin strap of trickle irrigation |
| CN101450518A (en) * | 2007-12-06 | 2009-06-10 | 株式会社理光 | Carrier tape production device, element insertion device and element supply device |
| CN101475721A (en) * | 2009-01-13 | 2009-07-08 | 浙江三和塑料有限公司 | Antistatic plastic for SMT carrier band, and preparation and use thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102285130B (en) * | 2011-05-10 | 2014-05-07 | 浙江洁美电子科技股份有限公司 | Manufacturing process for conductive carrying belt of electronic element |
-
2011
- 2011-05-10 CN CN201110120358.4A patent/CN102285130B/en active Active
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2012
- 2012-03-12 WO PCT/CN2012/072200 patent/WO2012152114A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1317119C (en) * | 2005-05-23 | 2007-05-23 | 陕西和平科技实业股份有限公司 | Method for producing ultrathin strap of trickle irrigation |
| CN101450518A (en) * | 2007-12-06 | 2009-06-10 | 株式会社理光 | Carrier tape production device, element insertion device and element supply device |
| CN101475721A (en) * | 2009-01-13 | 2009-07-08 | 浙江三和塑料有限公司 | Antistatic plastic for SMT carrier band, and preparation and use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102285130A (en) | 2011-12-21 |
| WO2012152114A1 (en) | 2012-11-15 |
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Address after: 313300, Zhejiang Anji Huzhou Economic Development Zone Sunshine Industrial Zone Zhejiang Jie Mei Electronic Technology Co., Ltd. Applicant after: Zhejiang Jiemei Electronic & Technology Co., Ltd. Address before: 313300, Zhejiang Anji Huzhou Economic Development Zone Sunshine Industrial Zone Zhejiang Jie Mei Electronic Technology Co., Ltd. Applicant before: Zhejiang Jiemei Electronic and Technology Co., Ltd. |
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