CN102280679A - Integrated waveguide of metallization slotted substrate - Google Patents
Integrated waveguide of metallization slotted substrate Download PDFInfo
- Publication number
- CN102280679A CN102280679A CN201010202678XA CN201010202678A CN102280679A CN 102280679 A CN102280679 A CN 102280679A CN 201010202678X A CN201010202678X A CN 201010202678XA CN 201010202678 A CN201010202678 A CN 201010202678A CN 102280679 A CN102280679 A CN 102280679A
- Authority
- CN
- China
- Prior art keywords
- metal patch
- substrate
- integrated waveguide
- metal
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 238000001465 metallisation Methods 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 62
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
Landscapes
- Waveguides (AREA)
Abstract
The invention relates to the technical field of waveguide structures of radio frequency and microwave millimeter waves, and provides an integrated waveguide of a metallization slotted substrate. The integrated waveguide of the metallization slotted substrate comprises a substrate, a first metal patch and a second metal patch, wherein the first metal patch and the second metal patch are respectively positioned on the frontage or back side of the substrate; the frontage and the back side are in parallel mutually; two strip-type slots which are in parallel mutually are arranged between the frontage and the back side; and a metal layer is coated on the inner wall of each slot, and is used for connecting the first metal patch with the second metal patch. The integrated waveguide of the metallization slotted substrate has the advantages of low loss, high antijamming capability, low manufacturing cost, small volume and the like, and is easy to design and integrate.
Description
Technical field
The present invention relates to radio frequency and microwave and millimeter wave waveguiding structure technical field, relate in particular to a kind of metallization slotted substrate integrated waveguide.
Background technology
In existing radio frequency and microwave, the design of millimeter wave passive device, rectangular waveguide is used widely as a kind of guided wave structure formed having obtained of function admirable.The profile of rectangular waveguide is a rectangle box body, and material is a metal, and some nonmetal mediums can be filled in the middle part.Its defective is that volume is big, processing cost is high, not easy of integration.Continuous development along with technology, the substrate integration wave-guide that emerged in recent years, keeping on the basis of the wave-guiding characteristic similar to rectangular waveguide, can adopt the printed circuit board technology of standard to process, make significant improvement at production cost, volume and aspect planar circuit integrated.But existing substrate integration wave-guide adopts the plated-through hole design, be specially the through hole that two rows are provided with at interval is set on substrate, and at through-hole wall metallizing layer, in order to transmission radio frequency, microwave or millimeter wave.Its transmission characteristic is similar to the traditional rectangular waveguide but also incomplete same, owing to plated-through hole is set in distance, thereby has the leaky wave effect, has increased radiation loss.
Summary of the invention
Main purpose of the present invention is to provide a kind of metallization slotted substrate integrated waveguide, is intended to reduce leaky wave, reduces radiation loss.
The invention provides a kind of metallization slotted substrate integrated waveguide, comprise substrate, first metal patch and second metal patch, described first metal patch or second metal patch lay respectively at the front or the back side of described substrate, described front and back is parallel to each other, be provided with two parallel mutually bar shaped flutings between the two sides, the inwall of described fluting is coated with metal level, and described first metal patch is connected with second metal patch.
Preferably, the slot vertical described front or the back side of described bar shaped.
Preferably, the shape of described second metal patch and size and described substrate back or positive consistent.
Preferably, the material of described first metal patch, second metal patch comprises at least: copper, silver or golden.
Metallization slotted substrate integrated waveguide provided by the present invention, on substrate, offer two parallel mutually bar shaped flutings, the inwall of this fluting is coated with metal level, first metal patch, second metal patch lay respectively at the two sides of substrate, and link to each other by fluting inwall metal level, thereby have consistent transmission characteristic with rectangular waveguide.Avoid the space between the plated-through hole in the existing substrate integration wave-guide, can reduce the leaky wave effect, reduced radiation loss; And because integrated wave guide structure of the present invention upper and lower, left and right all have metal to cover, antijamming capability is stronger than existing substrate integration wave-guide; In addition, the present invention uses the metallization fluting to realize complete integrated waveguide vertical metal sidewall, its propagation characteristic is consistent with the traditional rectangular waveguide of inner filled media, can use the method for designing of traditional rectangular waveguide fully, carry out quick somewhat complex design, also can be on substrate integrated various circuit, thereby also have advantages such as existing substrate integration wave-guide processing cost is low, volume is little, easy of integration.
Description of drawings
Fig. 1 is a metallization slotted substrate integrated wave guide structure schematic diagram in an embodiment of the invention.
The realization of the object of the invention, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Fig. 1 shows the structure of metallization slotted substrate integrated waveguide in an embodiment of the invention.As shown in Figure 1, this metallization slotted substrate integrated waveguide comprises substrate 10, first metal patch 20 and second metal patch 30, described first metal patch 20 or second metal patch 30 lay respectively at the front 11 or the back side 12 of described substrate 10, described positive 11 and the back side 12 be parallel to each other, be provided with two parallel mutually bar shaped flutings 13 between the two sides, the inwall of described fluting 13 is coated with metal level, and described first metal patch 20 is connected with second metal patch 30.
The shape of substrate 10 can be for square, and its material can be PCB (Printed Circuit Board, printed circuit board (PCB)) substrate.Two surfaces that first metal patch 20, second metal patch 30 are divided into substrate 10 also link to each other by the metal level of fluting 13, thereby present embodiment metallization slotted substrate integrated waveguide can constitute a square box body, the outside of this square box body is that the first metal layer 20 and second metal level, 30 sidewalls are fluting 13 inwall metal levels, inner filled media substrate 10, in fact to be used to transmit the profile of radio frequency identical with rectangular waveguide, thereby can obtain the transmission characteristic consistent with rectangular waveguide, can use the method for designing of traditional rectangular waveguide fully and carry out quick somewhat complex design.The present invention's slotted substrate integrated waveguide that metallizes has been avoided the space between the plated-through hole in the existing substrate integration wave-guide, can effectively avoid the leaky wave effect, reduces radiation loss; In addition because the material of substrate 10 is the PCB substrate, also can be on substrate 10 integrated various circuit, thereby also have advantages such as processing cost is low in the substrate integration wave-guide, volume is little, easy of integration.
Bar shaped fluting 13 can be provided with perpendicular to the front 11 of substrate 10, quantity can be two, and spacing can be provided with according to the method for designing of tranmitting frequency with reference to the traditional rectangular waveguide, for example in one embodiment, it is 1mm that groove width can be set, and spacing between any two is 25mm.The method for designing of traditional rectangular waveguide is known by those skilled in the art, does not give unnecessary details at this.
In one embodiment, first metal patch 20 can be between positive 11 liang of bar shapeds fluting 13, by covering copper or coating processes and substrate 10 applyings.The material of first metal patch 20 can be copper, can use the front of covering process for copper and substrate 10 11 in the PCB manufacturing process to fit, and first metal patch 20 and the metal level of fluting 13 are joined; Also can first metal patch 20 and substrate 10 be fitted, but need the metal level of first metal patch 20 with fluting 13 joined by in the front of substrate 10 11 glue coated.With reference to Fig. 2, the two ends of first metal patch 20 also can be provided with input 21 and output 22, so that I/O radio frequency or microwave signal.Second metal patch 20 can be positioned at substrate 10 back sides 12, and its shape is consistent with the back side 12 of described substrate 10 with size, also can be by covering copper or coating processes and the back side 12 applyings.
In another embodiment, the material of first metal patch 20 and second metal patch 30 also can be silver or gold.First metal patch 20 can be positioned at the back side 12 of substrate 10, and accordingly, 30 of second metal patches are positioned at the back side 11 of substrate 10.
In the foregoing description, because upper and lower, left and right all have metal to cover, thereby the metallize antijamming capability of slotted substrate integrated waveguide of the present invention is stronger than existing substrate integration wave-guide.
In addition, because existing substrate integration wave-guide adopts plated-through hole, its transmission characteristic is similar to the traditional rectangular waveguide but also incomplete same, can not use the method for designing of rectangular waveguide fully, reaching precise design need be by the numerical simulation of electromagnetic field all-wave, but electromagnetic field all-wave numerical simulation at present greatly influences product design speed for the especially complicated substrate integration wave-guide circuit design simulation of substrate integrated wave guide structure inefficiency.And the present invention's slotted substrate integrated waveguide that metallizes uses the metallization fluting to realize complete integrated waveguide vertical metal sidewall, its propagation characteristic is consistent with the traditional rectangular waveguide of inner filled media, can use the method for designing of traditional rectangular waveguide fully, compare with existing substrate integration wave-guide, design efficiency improves greatly.
Below only be the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (4)
1. metallization slotted substrate integrated waveguide, it is characterized in that, comprise substrate, first metal patch and second metal patch, described first metal patch or second metal patch lay respectively at the front or the back side of described substrate, described front and back is parallel to each other, be provided with two parallel mutually bar shaped flutings between the two sides, the inwall of described fluting is coated with metal level, and described first metal patch is connected with second metal patch.
2. metallization slotted substrate integrated waveguide as claimed in claim 1 is characterized in that, described bar shaped the slot vertical described front or the back side.
3. metallization slotted substrate integrated waveguide as claimed in claim 2 is characterized in that, the shape of described second metal patch and size and described substrate back or positive consistent.
4. as each described metallization slotted substrate integrated waveguide in the claim 1 to 3, it is characterized in that the material of described first metal patch, second metal patch comprises at least: copper, silver or golden.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010202678XA CN102280679A (en) | 2010-06-13 | 2010-06-13 | Integrated waveguide of metallization slotted substrate |
| PCT/CN2010/077957 WO2011157022A1 (en) | 2010-06-13 | 2010-10-21 | Substrate integrated waveguide (siw) with metal grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010202678XA CN102280679A (en) | 2010-06-13 | 2010-06-13 | Integrated waveguide of metallization slotted substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102280679A true CN102280679A (en) | 2011-12-14 |
Family
ID=45105957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010202678XA Pending CN102280679A (en) | 2010-06-13 | 2010-06-13 | Integrated waveguide of metallization slotted substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102280679A (en) |
| WO (1) | WO2011157022A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244581A (en) * | 2015-07-30 | 2016-01-13 | 东南大学 | Rectangular waveguide-trapezoid height reduction transition-substrate integrated waveguide converter and assembling method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9923255B2 (en) | 2015-11-06 | 2018-03-20 | Apollo Microwaves Ltd. | Cross-guide coupler with main waveguide arm and substrate integrated waveguide (SIW) secondary arm |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1376746B1 (en) * | 2002-06-27 | 2006-08-23 | Siemens Mobile Communications S.p.A. | Tuneless rectangular dielectric waveguide filter |
| CN1877903A (en) * | 2006-07-10 | 2006-12-13 | 东南大学 | Hemi-membrane substrate integrated waveguide |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6185354B1 (en) * | 1998-05-15 | 2001-02-06 | Motorola, Inc. | Printed circuit board having integral waveguide |
| SE522650C2 (en) * | 2000-10-31 | 2004-02-24 | Ericsson Telefon Ab L M | Device on a circuit board and method for manufacturing such a device |
| CN201383535Y (en) * | 2009-04-01 | 2010-01-13 | 惠州市硕贝德通讯科技有限公司 | Rectangular waveguide-substrate integrated waveguide signal conversion and power divider |
-
2010
- 2010-06-13 CN CN201010202678XA patent/CN102280679A/en active Pending
- 2010-10-21 WO PCT/CN2010/077957 patent/WO2011157022A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1376746B1 (en) * | 2002-06-27 | 2006-08-23 | Siemens Mobile Communications S.p.A. | Tuneless rectangular dielectric waveguide filter |
| CN1877903A (en) * | 2006-07-10 | 2006-12-13 | 东南大学 | Hemi-membrane substrate integrated waveguide |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244581A (en) * | 2015-07-30 | 2016-01-13 | 东南大学 | Rectangular waveguide-trapezoid height reduction transition-substrate integrated waveguide converter and assembling method thereof |
| CN105244581B (en) * | 2015-07-30 | 2019-01-18 | 东南大学 | Rectangular waveguide-is trapezoidal to subtract high transition-substrate integration wave-guide converter and its assemble method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011157022A1 (en) | 2011-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104092028B (en) | Suppress the balanced feeding difference slot antenna of common-mode noise | |
| CN202633488U (en) | Resonance type substrate integrated waveguide power synthesizer | |
| CN103650243A (en) | Antenna | |
| CN100449864C (en) | Substrate integrated waveguide comb-shaped power distributor | |
| CN100418263C (en) | Hemi-membrane substrate integrated waveguide | |
| CN107154531B (en) | Millimeter wave array antenna with substrate integrated cavity | |
| CN1838478A (en) | Microwave millimeter-wave substrate integrated waveguide medium resonator antenna | |
| CN102709658A (en) | Half mode double-ridge substrate integrated waveguide with transitional balanced micro-strip lines | |
| CN102394365A (en) | Filtering antenna with horizontal polarization orientation plane | |
| CN202275943U (en) | Horizontal polarization orientation planar filtering antenna | |
| CN103647123B (en) | Half mode substrate integration waveguide horizontal symmetrical filter | |
| CN103022707A (en) | Planar horn antenna with impedance calibration function | |
| CN101394016A (en) | Four strip line splitter and producing method thereof | |
| CN102280679A (en) | Integrated waveguide of metallization slotted substrate | |
| CN202259650U (en) | Highly miniaturized substrate integrated waveguide resonator | |
| CN201663220U (en) | Delay line of substrate integrated waveguide structure | |
| CN2914356Y (en) | Half-die substrate integrated waveguide directional coupler coupling continuously | |
| CN2914354Y (en) | Half-die substrate integrated waveguide | |
| CN201503917U (en) | Broadband microwave and millimeter wave communication antenna | |
| CN100388556C (en) | Chip-integrated waveguide 180-degree 3-db oriented coupler | |
| CN103594812B (en) | Thin substrate broadband difference-beam planar horn antenna | |
| CN101834339A (en) | Substrate integrated wave guide structure delay line | |
| CN2886832Y (en) | Medium resonator antenna | |
| CN2914357Y (en) | Half-die substrate integrated waveguide 180-degree three-decibel directional coupler | |
| CN101533959A (en) | Half-module substrate integrated waveguide leaky-wave antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111214 |