CN102279195A - LED chip appearance visual inspection method - Google Patents
LED chip appearance visual inspection method Download PDFInfo
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- CN102279195A CN102279195A CN2011100981600A CN201110098160A CN102279195A CN 102279195 A CN102279195 A CN 102279195A CN 2011100981600 A CN2011100981600 A CN 2011100981600A CN 201110098160 A CN201110098160 A CN 201110098160A CN 102279195 A CN102279195 A CN 102279195A
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Abstract
The invention discloses an LED chip appearance visual inspection method. The method comprises the following steps of: placing LED chips below a CCD (Charge Coupled Device) camera, and imaging all the LED chips; judging boundary range and background area of each chip by a system according to a digital value of each image, and obviously distinguishing a product and a background in a colour compensation manner; and judging gold and non-gold blocks in the boundary of each chip, and obviously distinguishing extension and range of an electrode wire in the colour compensation manner; comparing the electrode wire in the boundary of each chip by the system according to a type of a standard gold electrode wire module, and marking (1) or (2) according to severity degree of a crack; and drawing all the boundaries of the chips by the system according to an identification result, if the electrode wire is normal, no mark exists in the boundary, and if the electrode wire is abnormal, (1) or (2) is marked in the boundary according to the crack. By adopting the method disclosed by the invention, the problem that manual identification by naked eyes is difficult to judge whether the electrode wire of an LED high-power chip is broken, identification efficiency is improved, and accuracy of identification is enchanced.
Description
Technical field
The present invention relates to a kind of led chip outward appearance visual inspection method.
Background technology
One, the necessity of led chip outward appearance visual inspection
Because led chip needs (to go through etch, high temperature, HIGH PRESSURE TREATMENT, cutting, grinding, the some survey of liquid medicine through hundreds of procedures to the processing procedure of single chips via epitaxial wafer .... etc.), and need through several artificial upset (make electrode surface towards glued membrane or the back side towards glued membrane), so all chips after can not guaranteeing to finish all belong to non-defective unit, in case the impaired area of led chip outward appearance (electrode district and luminous zone) is (bad as scratch, pollution, cutting ... Deng) cross senior general and have a strong impact on luminescence efficiency and the life-span of LED, even cause encapsulation back breaking phenomena.
Led chip cuts into the particle chip of about 7mil-50mil again through epitaxial growth (sheet), with diameter is that the chip that the epitaxial wafer of 2 English inch cuts into every 7mil calculates, every area approximates 0.01778cm square, and need doubly beginning with microscope amplification 20-40, whether its outward appearance of plinth identification is impaired clearly.
Because the led chip processing procedure is complicated and changeable, the degree of difficulty that causes outward appearance to judge more can't replace with machinery and equipment fully, so need the bad order product to be absorbed with the absorption system with after very manually utilizing naked eyes (through microscope) identification to add the judgement of intelligence.
Two, the difficulty of high-capacity LED chip outward appearance visual inspection
General low power led chip dimensioned area is approximately 49 mil
2-240 mil
2, usually with the energising of 5mA-20mA electric current, the about 0.064W of peak power; The high-power die area is approximately 900mil
2-2500mil
2, with 150mA or the energising of 330mA electric current, power is about 0.5W or 1W usually.
In order to increase the light-emitting zone of led chip, the powered electrode area generally all is controlled at 7mil
2-19.5mil
2, when chip area is excessive, for the planar flows of guiding electric current to reach maximum luminous efficiency, need to increase the layout of electrode wires, and big more its electrode wires of area need arrange manyly more, could allow the maximum illumination effect of led chip performance.
Electrode and electrode wires major part are synthetic with gold and platinum, general electrode wires width is about between 0.8mil-1.2mil, whether it ruptures still quite painstakingly 40 times microscopically identifications, so do identification as a lot of high-power die of electrode wires with artificial naked eyes, not only error rate is high and expend man-hour.
Three, the identification of mistake will cause great loss
The LED high-power die is mainly used in illumination, requiring of its quality is high, every market price of 1 watt chip is about 1-1.5 yuan, the market price of every the Lamp in encapsulation back is about 1 dollar, so as because the artificial judgment mistake, to cause the loss of direct yield (money) to " mistake choose ", " leakage is chosen " will cause downstream (client's) loss, and then influence company's reputation.
Summary of the invention
The object of the present invention is to provide a kind of led chip outward appearance visual inspection method,, improve identification efficient, increase the correctness of identification to solve the difficult identification problem whether artificial naked eyes rupture for LED high-power die electrode wires.
To achieve these goals, solution of the present invention is:
A kind of led chip outward appearance visual inspection method, operation steps is as follows:
The first step with the led chip (thousands of approximately of quantity) that sticks on the glued membrane, is placed on one or more groups CCD camera lens below, and behind adjustment lens focus and the sidelight source, camera lens promptly carries out a capture to whole led chips;
As the image of obtaining for many group CCD camera lenses, then system is integrated into it single image automatically, makes it the image of obtaining as single CCD camera lens;
In second step, system carries out color analysis, color compensation, logic determines:
The bounds and the background area of every chips are judged according to the digital value of image by system, and obviously distinguish product and background in the color compensation mode;
Gold and the non-gold block in the border of every chips judged by system according to the digital value of image, and obviously distinguishes the extension and the scope of electrode wires in the color compensation mode;
The pattern of system's establishing criteria gold electrode wire module is compared to the electrode wires in every border, and indicates (1) or (2) according to the order of severity of fracture;
In the 3rd step, identification result is printed:
System draws all chip boundaries (black surround) according to identification result, as the normal no any sign in the black surround then of electrode wires, unusually then indicates (1) or (2) according to breaking degree in this black surround as electrode wires.
After adopting such scheme, the present invention's beneficial functional compared with prior art is:
Prior art, low-power LED chip major part does not have electrode wires, partly the backlight of area the greater (as 10X20,10X23,10X24 specification) also has only a strip electrode line with strip, its Manual Visual Inspection PPH (pcs/h) is 25K-35K approximately, it denys to rupture that very thin electrode wires need careful identification could judge under 40 power microscopes not to have, thus single strip electrode line to the about 25-35% of the influence of identification efficient about.
The high-capacity LED chip is because of the luminescence efficiency requirement, 1 watt of chip with 45 X, 45 mil is an example, approximately have the configuration of 8-12 strip electrode line, its PPH will be low to moderate 2K, and can't guarantee correct identification very, following lighting demand will need the LED high-power die of huge quantity, so just need huge manpower, and expection will cause the critical shortage of manpower.
The present invention carries out disposable capture to LED high-power die in the 7cm X 7cm scope individually or simultaneously with single group or compound many group CCD cameras, again the pixel in the capture is carried out color analysis, color compensation, logic determines, to go out product and background area respectively, again all LED high-power die of product area are distinctly judged, to confirm whether electrode wires ruptures, estimate processing power with artificial cooperating equipment, the about 90K of its PPH, its efficient is about 50 times of independent artificial treatment speed.
Description of drawings
Fig. 1 is led chip electrode wires standard form figure;
Fig. 2 is the led chip electrode figure that broken string is arranged;
Fig. 3 is the led chip electrode figure that the PN electrode wires intersects.
Embodiment
One, electrode wires identification process and principle
1.1 carry out once to sticking to LED high-power die on the glued membrane (general chip distribution area not can greater than 7cm X 7cm) that (single group CCD camera produces 1, and 4 groups of CCD cameras produce 4 images that image can overlap with single group or compound many group CCD cameras (being generally 1,4,9 or 16 group) .... capture by that analogy).
1.1.1, then directly carry out color analysis, the color compensation of next stage and handle as the image of obtaining for single group CCD camera.
1.1.2 as be 4 overlapping images that 4 groups of CCD cameras are obtained, then need to carry out picture mosaic to these 4 images, make the effect of the single image of obtaining as single group camera.
1.1.3 as be that then identical with the 4 groups of CCD cameras mode of the image obtained of 9 groups or 16 groups of CCD cameras is handled.
1.2 earlier the view data that collects is carried out color analysis, color compensation processing, to distinguish chip boundary scope and glued membrane background block.
1.2.1 color analysis: the view data that will obtain (pixel dot) is resolved, and its data are by indicating with 100-0 respectively to dark (black) to shallow (white), and calculating 100-21 by empirical value is the product image, and 0-20 is a background image.
1.2.2 color compensation is handled:
1.2.2.1 with the image of 0-20 all with 0(white) fill, with the pixel of the 100-21 of contiguous 0-20 100(black with 5 dot) to fill and form near foursquare closed black surround, the pixel that is coated by 5 dot black surrounds then keeps original pixel value.
Represent that with 50 remainder is represented with 0 (white), to distinguish the electrode wires and the non-electrode wires block of product in black surround 1.2.2.2 will keep the data in the golden yellow zone of original pixel value.
1.3 data comparison and logic determines
1.3.1 need elder generation that the standard form image information of single LEDs chip is prestored in the system before the identification, and direction, length, the section of basic point position, pattern, scope and the extension electrode line of the electrode of record standard chip (the P utmost point and the N utmost point).As Fig. 1, common property is given birth to the P utmost point (P-P; P-1; P-21; 21-22 ... .27-28 etc.) 10 sections, the N utmost point (N-N; N-3; N-41; 41-42 ... .45-46 etc.) 8 sections.
1.3.2 identification principle: the principle of analog transmissions fly bomb, with P, N basic point is transmitting station, with gold part (as the line segment section traffic direction of Fig. 1) is the standard movement track, carry out man-to-man section comparison by in kind with standard module: judge according to the section that middle orbit in kind extended to whether the electrode wires (1) that the P or the N utmost point extend produces interruption, (2) produce the section position that interrupts, whether does the track of (3) P and N intersect (track intersects the phenomenon that will be short-circuited)?
1.3.3 will finish the data of all led chips of color analysis, color compensation is begun to compare with regard to running orbit with standard module by P, N basic point, during comparison such as certain section appearance (white 0) rather than (golden 50) just can be judged and rupture or damaged (fracture has appearred in P utmost point 22-23 section as Fig. 2); The bifurcated that occurs separately having more as P, N line segment district (as the 27-28 section of the P utmost point of Fig. 3, having more bifurcated with the 45-46 section of the N utmost point) can predicate crossing.
1.3.4 according to gold interrupt, damaged, interruption or defect location, damaged area to be to judge this led chip whether conformance with standard or standard compliant grade?
Two, system equipment of the present invention
2.1 image capture equipment
This equipment is as being one group of capture equipment, then comprise a CCD(or CMOS), one take the photograph phase camera lens, one group of sidelight source, one group of backlight, CCD(or CMOS) camera lens links to obtain the led chip image with taking the photograph mutually, and sidelight source and backlight provide product to take the photograph the light source of phase time.
Annotate: this equipment then needs four (or 9,16) CCD(or CMOS as being four groups of (or 9 groups, 16 groups) capture equipment) and four (or 9,16) take the photograph the phase camera lens.
2.2 image processing and logic determines equipment
This equipment comprises a PC, a TFT LCD display and is installed on PC interior Windows system and associative operation software.
2.3 printing device
Any laser or ink-jet printer that the graphical analysis result can be printed.
Three, operation steps of the present invention
3.1 will stick to the led chip (thousands of approximately of quantity) on the glued membrane, be placed on one or more groups CCD camera lens below, behind adjustment lens focus and the sidelight source, camera lens promptly carries out a capture to whole led chips.
3.2 as for organizing the image that the CCD camera lenses are obtained, then system is integrated into it single image automatically, makes it the image of obtaining as single CCD camera lens more.
3.3 system carries out color analysis, color compensation, logic determines:
3.3.1 the bounds and the background area of every chips are judged according to the digital value of image by system, and obviously distinguish product and background in the color compensation mode.
3.3.2 gold and non-gold block in the border of every chips are judged by system according to the digital value of image, and obviously distinguish the extension and the scope of electrode wires in the color compensation mode.
3.3.3 the pattern of system's establishing criteria gold electrode wire module (as shown in Figure 1) is compared to the electrode wires in every border (as shown in Figures 2 and 3), and indicates (1) or (2) according to the order of severity of fracture.
3.4 identification result is printed:
System draws all chip boundaries (black surround) according to identification result, as the normal no any sign in the black surround then of electrode wires, unusually then indicates (1) or (2) according to breaking degree in this black surround as electrode wires.
Claims (1)
1. led chip outward appearance visual inspection method is characterized in that operation steps is as follows:
The first step with the led chip that sticks on the glued membrane, is placed on one or more groups CCD camera lens below, and behind adjustment lens focus and the sidelight source, camera lens promptly carries out a capture to whole led chips;
As the image of obtaining for many group CCD camera lenses, then system is integrated into it single image automatically, makes it the image of obtaining as single CCD camera lens;
In second step, system carries out color analysis, color compensation, logic determines:
The bounds and the background area of every chips are judged according to the digital value of image by system, and obviously distinguish product and background in the color compensation mode;
Gold and the non-gold block in the border of every chips judged by system according to the digital value of image, and obviously distinguishes the extension and the scope of electrode wires in the color compensation mode;
The pattern of system's establishing criteria gold electrode wire module is compared to the electrode wires in every border, and indicates (1) or (2) according to the order of severity of fracture;
In the 3rd step, identification result is printed:
System draws all chip boundaries according to identification result, as the normal no any sign in the border then of electrode wires, unusually then indicates (1) or (2) according to breaking degree in this border as electrode wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100981600A CN102279195A (en) | 2011-04-18 | 2011-04-18 | LED chip appearance visual inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100981600A CN102279195A (en) | 2011-04-18 | 2011-04-18 | LED chip appearance visual inspection method |
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| CN102279195A true CN102279195A (en) | 2011-12-14 |
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| CN2011100981600A Pending CN102279195A (en) | 2011-04-18 | 2011-04-18 | LED chip appearance visual inspection method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105301013A (en) * | 2015-11-05 | 2016-02-03 | 苏州威盛视信息科技有限公司 | LCD bare chip detection unit framework and detection method |
| CN106653955A (en) * | 2015-11-02 | 2017-05-10 | 上海博恩世通光电股份有限公司 | Identification chip and manufacturing method thereof |
| CN109596629A (en) * | 2017-09-30 | 2019-04-09 | 天津天星电子有限公司 | A kind of LED product detection device |
| CN111715561A (en) * | 2020-06-28 | 2020-09-29 | 厦门理工学院 | Detection device and method for Micro-LED display substrate |
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| JP2006162427A (en) * | 2004-12-07 | 2006-06-22 | Toshiba Corp | Method and device for inspecting led chip |
| JP2006284308A (en) * | 2005-03-31 | 2006-10-19 | Toshiba Corp | Visual examination method of semiconductor device |
| CN101995223A (en) * | 2009-08-25 | 2011-03-30 | 比亚迪股份有限公司 | Chip appearance detection method and system |
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| JP2006162427A (en) * | 2004-12-07 | 2006-06-22 | Toshiba Corp | Method and device for inspecting led chip |
| JP2006284308A (en) * | 2005-03-31 | 2006-10-19 | Toshiba Corp | Visual examination method of semiconductor device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653955A (en) * | 2015-11-02 | 2017-05-10 | 上海博恩世通光电股份有限公司 | Identification chip and manufacturing method thereof |
| CN106653955B (en) * | 2015-11-02 | 2019-02-01 | 上海博恩世通光电股份有限公司 | A kind of identification chip and preparation method thereof |
| CN105301013A (en) * | 2015-11-05 | 2016-02-03 | 苏州威盛视信息科技有限公司 | LCD bare chip detection unit framework and detection method |
| CN109596629A (en) * | 2017-09-30 | 2019-04-09 | 天津天星电子有限公司 | A kind of LED product detection device |
| CN111715561A (en) * | 2020-06-28 | 2020-09-29 | 厦门理工学院 | Detection device and method for Micro-LED display substrate |
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Application publication date: 20111214 |