CN102277576A - Electric-contact metal protectant - Google Patents
Electric-contact metal protectant Download PDFInfo
- Publication number
- CN102277576A CN102277576A CN2010101935677A CN201010193567A CN102277576A CN 102277576 A CN102277576 A CN 102277576A CN 2010101935677 A CN2010101935677 A CN 2010101935677A CN 201010193567 A CN201010193567 A CN 201010193567A CN 102277576 A CN102277576 A CN 102277576A
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- solvent
- protection agent
- metal protection
- lubricant
- electrically contact
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- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to an electric-contact metal protectant, in particular to a surface protectant mainly used for electronic elements, and a preparation method thereof. The protectant is prepared from 3.0-8.0% of film former, 2.5-5.0% of organic corrosion inhibitor, 1.5-3.0% of soldering flux, 2.5-5.0% of lubricant, and the balance of solvent through mixing and heating. The selected materials are environment-friendly materials, so that no environment pollution is caused during production preparation and utilization. The protectant composition disclosed by the invention is tightly bonded with a metal surface, has the advantages of abrasion resistance, lubricity, rust resistance, mildew resistance and strong corrosion resistance, has an excellent contact electroconductivity at the same time of not influencing the welding performance and a metal appearance, makes an electronic and electric element maintain a good insulation or electroconductive state in work, cannot cause instantaneous arc spark due to poor contact to burn down a circuit, and can be widely applied to electronic and electric elements, connectors, aluminum alloy electroconductive oxidation and surface protection for gold and silver jewelleries.
Description
Technical field
The present invention relates to a kind of anticorrosive metal organic film protective material of environmental protection, hard contacts such as the gold and silver surface that is chiefly directed to electrical and electronic component generates the anticorrosion film coating of one deck, has the characteristic that both insulate and conduct electricity.
Background technology
Metal and intermetallic, because of contact produces friction, make the metallic surface very easily be exposed among the air because of wearing and tearing, scratching, particularly in the abominable atmospheric environment of humidity, easier because of electrochemical reaction, cause metal to be corroded and destroyed, make it because of loose contact, cause the moment arc spark, cause fault, burn electronics when more serious.Yet the reliability of electronics largely depends on the electrical-contact element reliability of (comprising switch member, connector assembly, potentiometer etc.).But as electrical-contact element, the most frequently used metal or coating as: gold and silver, copper, tin etc. are operated under the natural climate, very easily wear and tear and corrode because of contact friction, thereby influence contact reliability and life-span, and this class component is used extensively, quantity is big, just the key of ditch circuit passband.Therefore,, be subjected to domestic and international people's extensive attention day by day, further proposed highly reliable, long-life requirement for the reliability and the quality control of electronics.
Summary of the invention
The selected material of the present invention is environment-friendly materials, can not produce environment in producing preparation and using and pollute.Provide a kind of when not influencing welding property and metal appearance, have good contact conductivity, suppress electric arc and produce, wear-resisting, lubricated, antirust, mildew-resistant, etch resistant properties are strong, can form the solid film coating composition of combining closely with the metallic surface, and preparation method thereof.
Protective material composition of the present invention is made up of following raw materials by weight percent:
Filmogen 3g-8g/100ml
Organic inhibitor 2.5g-5g/100ml
Soldering flux 1.5g-3.0g/100ml
Lubricant 2.5g-5.0g/100ml
The solvent surplus
Described filmogen is one or more composite the forming of described material in thiazolinyl, alkynyl, hydroxyl, carboxyl, the methyl class silicone resin.
Described organic inhibitor is one or more composite the forming of described material in phenyl, methyl class triazole, the tetrazole.
Described soldering flux structure is C19H29COOH, and its composition mainly is made up of 70-85% sylvic acid and 10-15% piperinic acid.
Described lubricant is that described material is composite forms in palmityl alcohol or the octadecanol one or more.
Described solvent is the alcohols material solvent, can be that in Virahol, butanols, ethanol, the ethylene glycol one or more use simultaneously.
The invention has the advantages that:
1. stablize electric property: make electric element keep good insulation performance or conduction state at work, it can not caused the moment arc spark, and cause fault because of loose contact.
2. enhancing etch resistant properties: electric element after this protective material is handled or metal preserve and use in the supercoat that can combine closely with metallic surface formation, have splendid anti-variable color, antirust, mildew-resistant, anticorrosion properties.
3. welding property and metal appearance: color and luster that can also fine maintenance metal itself when not influencing the electronic product welding property can play a very good protection to the prolonged preservation of gold and silver jewellery.
4. excellent lubricating properties: after the protection of this protective material, can effectively reduce metallic surface frictional force, reduce wearing and tearing, prolong the work-ing life of electronic and electrical equipments such as connector, switch, plug.
5. selected material is environment-friendly materials, all can not produce environment in producing preparation and using and pollute.
Embodiment
Narrate two embodiments of the invention below
Embodiment one: the protective material of preparation 1000L.
Carry out the proportioning of each component in following ratio: filmogen is organic hydroxy silicate resin (30Kg), organic inhibitor is benzo tetrazole (25Kg), soldering flux is rosin compound (25Kg), lubricant is palmityl alcohol (25Kg), surplus is a solvent, presses ethanol (40%) and butanols (60%) proportioning.
Process for preparation is:
1. above-mentioned filmogen and above-mentioned 1/5 solvent are poured in the reactor;
2. be heated to 40-50 ℃;
3. add above-mentioned organic inhibitor, above-mentioned soldering flux and above-mentioned lubricant, kept constant temperature 20～30 minutes;
4. after being cooled to room temperature, add balance solvent and stirring;
5. get final product discharging after stirring, bottling.
Embodiment two: the protective material of preparation 1000L.
Carry out the proportioning of each component in following ratio: filmogen is that phenyl silicone resin and organic hydroxy silicate resin were by 1: 1 proportional arrangement (80Kg), organic inhibitor is benzotriazole (35Kg), soldering flux is rosin compound (30Kg), lubricant is that palmityl alcohol and octadecanol were by 1: 1 proportional arrangement (35Kg), surplus is a solvent, presses ethanol (50%) and butanols (50%) proportioning.
Process for preparation is:
1. 1/3 of above-mentioned filmogen, above-mentioned organic inhibitor, above-mentioned lubricant and above-mentioned solvent poured in the reactor;
2. be heated to 40-50 ℃;
3. the adding soldering flux kept constant temperature 20～30 minutes and stirring;
4. adding balance solvent;
5. get final product discharging after being cooled to room temperature, bottling.
Claims (7)
1. electrically contact the metal protection agent, it is characterized in that, by filmogen, organic inhibitor, soldering flux, lubricant and solvent composition, its proportioning is:
1. the shared weight ratio of filmogen is 3.0%～8.0%;
2. the shared weight ratio of organic inhibitor is 2.5%～5.0%;
3. the shared weight ratio of soldering flux is 1.5%～3.0%;
4. the shared weight ratio of lubricant is 2.5%～5.0%
5. surplus is a solvent.
2. according to the right 1 described preparation method who electrically contacts the metal protection agent, it is characterized in that, carry out according to following step:
1. filmogen, organic inhibitor, lubricant are poured in the reactor by proportion of production, and added 1/3～1/5 solvent of turnout;
2. be heated to 40 ℃～50 ℃;
3. add soldering flux, kept constant temperature 20～30 minutes;
4. after being cooled to room temperature, add balance solvent and stirring;
5. get final product discharging after stirring, bottling.
3. electrically contact the metal protection agent and it is characterized in that according to right 1 is described: said filmogen is one or more composite the forming of described material in thiazolinyl, alkynyl, hydroxyl, carboxyl, the methyl class silicone resin.
4. electrically contact the metal protection agent and it is characterized in that according to right 1 is described: said organic inhibitor is one or more composite the forming of described material in phenyl, methyl class triazole, the tetrazole.
5. electrically contact the metal protection agent and it is characterized in that according to right 1 is described: said soldering flux, its composition mainly are made up of 70-85% sylvic acid and 10-15% piperinic acid.
6. electrically contact the metal protection agent and it is characterized in that according to right 1 is described: said lubricant, described material is composite forms in palmityl alcohol or the octadecanol one or more.
7. electrically contact the metal protection agent and it is characterized in that according to right 1 is described: said solvent is hydrocarbon or catenanes organic solvent, one or more in Virahol, butanols, ethanol, the ethylene glycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101935677A CN102277576A (en) | 2010-06-08 | 2010-06-08 | Electric-contact metal protectant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101935677A CN102277576A (en) | 2010-06-08 | 2010-06-08 | Electric-contact metal protectant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102277576A true CN102277576A (en) | 2011-12-14 |
Family
ID=45103300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101935677A Pending CN102277576A (en) | 2010-06-08 | 2010-06-08 | Electric-contact metal protectant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102277576A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103726056A (en) * | 2013-12-26 | 2014-04-16 | 张文博 | Method for preparing water-soluble molecular self-assembly film type metal protective agent |
| CN104689971A (en) * | 2015-03-19 | 2015-06-10 | 重庆新原港科技发展有限公司 | Protection method based on electron tunneling effect |
| CN106498383A (en) * | 2016-11-04 | 2017-03-15 | 江西保太有色金属集团有限公司 | A kind of red copper arranges environment-friendly type fastness processing method |
| CN112510464A (en) * | 2020-12-23 | 2021-03-16 | 重庆新原港科技发展有限公司 | Application of electronic depth protective agent in improving wear resistance of connector |
| CN112700926A (en) * | 2020-12-23 | 2021-04-23 | 重庆新原港科技发展有限公司 | Coating method and application of electronic depth protective agent |
| CN112725775A (en) * | 2020-12-24 | 2021-04-30 | 福达合金材料股份有限公司 | Protective agent for reducing contact resistance of magnetic latching relay and application thereof |
-
2010
- 2010-06-08 CN CN2010101935677A patent/CN102277576A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103726056A (en) * | 2013-12-26 | 2014-04-16 | 张文博 | Method for preparing water-soluble molecular self-assembly film type metal protective agent |
| CN103726056B (en) * | 2013-12-26 | 2015-10-21 | 张文博 | The protectant preparation method of a kind of water soluble molecules self-assembled film shaped metal |
| CN104689971A (en) * | 2015-03-19 | 2015-06-10 | 重庆新原港科技发展有限公司 | Protection method based on electron tunneling effect |
| CN104689971B (en) * | 2015-03-19 | 2016-04-13 | 重庆新原港科技发展有限公司 | A kind of means of defence based on electron tunneling effect |
| CN106498383A (en) * | 2016-11-04 | 2017-03-15 | 江西保太有色金属集团有限公司 | A kind of red copper arranges environment-friendly type fastness processing method |
| CN112510464A (en) * | 2020-12-23 | 2021-03-16 | 重庆新原港科技发展有限公司 | Application of electronic depth protective agent in improving wear resistance of connector |
| CN112700926A (en) * | 2020-12-23 | 2021-04-23 | 重庆新原港科技发展有限公司 | Coating method and application of electronic depth protective agent |
| CN112725775A (en) * | 2020-12-24 | 2021-04-30 | 福达合金材料股份有限公司 | Protective agent for reducing contact resistance of magnetic latching relay and application thereof |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111214 |